WAH WANG HOLDINGS (HONG KONG) CO., LTD.

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1 Wah Wang Data Sheet for 5mm Super White LED 5C3 Series Angle: 2 Class: Q Part No: WW5C3SWQ4-N Address : Unit 8, 8 th Floor, Nanang Plaza, No.57 Hung To Road, Kwun Tong, Kowloon, Hong Kong Tel : ( line) Fa : Web Site : WW5C3SWQ4-N Version. Page of 5

2 Wah Wang Data Sheet For 5mm Super White LED 5C3 Series Angle 2 Class: Q Features Standard T- Diameter Tpe Package. General Purpose Leads Reliable and Rugged Absolute Maimum Ratings at Ta=25 Parameter MAX. Unit Power Dissipation mw Peak Forward Current ( / Dut Ccle,.ms Pulse Wide) ma Continuous Forward Current 2 ma Derating Linear From 5 C.4 ma/ C Reverse Voltage 5 V Operating Temperature Range Storage Temperature Range Lead Soldering Temperature [ 4mm(.57 ) From Bod] -4 C to +8 C -4 C to +8 C 26 C for 3 Seconds Package Dimensions 5.(.97) 5.6(.22) R2.5(.98) R3.4(.34).(.4).5(.2) 2.54(.) NOM. 8.6(.339).6 (.24) 25.4(.) MIN..5(.6)MIN 5.(.97).5(.2) Part Number Electrical Optical Characteristics at Ta=25 C Luminous Intensit Forward Voltage / V Source Iv / mcd Lens color at I at I F = 2mA (Note 5) F = 2mA Color Viewing Angle / Deg (Note 6) Min. Tp. Ma. Min. Tp. Ma. WW5C3SWQ4-N Water Clear White Reverse Voltage = 5V Reverse Current = 5µA Notes:. All dimensions are in millimeter. 2. Tolerance of measurement is ±.25mm(. ) unless others otherwise noted. 3. Protruded resin under flanges is.mm(.4 ) ma. 4. Lead spacing is measured where the leads emerge from the package. 5. Luminous intensit is measured with a light sensor and filter combination that approimates the CIE ee-response curve. Tolerance of measurement of luminous intensit is 5% 6. θ /2 is the off-ais angle at which the luminous intensit is half the aial luminous intensit. It use man parameters that correspond to the CIE 93 2 Tolerance of measurement of angle is 5 degree 7. Caution in ESD: Static Electricit and surge damages the LED. lt is recommended to use a wrist band or anti-electrostatic glove when handling the LED.All devices, equipment and machiner must be properl grounded. 8. X,Y, and Z are CIE93 2 values of Red, Green and Blue content of the measurement. Color Coordinates Measurement allowance is 9. Specifications are subject to change without notice. WW5C3SWQ4-N Version. Page 2 of 5

3 CIE Diagram b2 b4 b b3 c a.2 a * Color Coordinates Measurement allowance is ±. Color Ranks (Note 8) a a b b b3 b4 c Color Coordinates Measurement allowance is WW5C3SWQ4-N Version. Page 3 of 5

4 Tpical Characteristic for Super Bright White LED Forward Current vs. Chromaticit Coordinate ( D) Spectrum ma 5mA 2mA 5mA ma Relative Emission Intensit (a.u.) IF = 2mA Wavelength nm) Chromaticit Coordinate ( D) IFP = 2mA.33-3 C C C 5 C.3 85 C Directivit (Angle : 2 ) Relative Luminosit (a.u.).5 9 IF = 2mA 6 3 Radiation Angle Forward Current IFP (ma) Forward Voltage vs. Forward Current Relative Luminosit (a.u.) Forward Current vs. Relative Lumiinosit Dut Ratio vs. Allowable Forward Current Allowable Forward Current IFP (ma) Forward Voltage ( V ) Forward Current IFP (ma) Dut Ratio ( % ) Forward Voltage Relative Luminosit Allowable Forward Current Forward Voltage VF (V) :IFP=6mA 2:IFP=2mA 3:IFP=5mA Ambient Temperature Ta ( C ) Relative Luminosit (a.u.) IFP = 2mA Ambient Temperature Ta ( C ) Allowable Forward Current IFP (ma) Ambient Temperature ( C ) WW5C3SWQ4-N Version. Page 4 of 5

5 CAUTIONS- Super Bright White LED Because the White LEDs are make b combining Blue LEDs and special phosphors. Hence, the color of White LEDs is changed a little b an operation current. Care should be taken after due consideration when using LEDs. () Lead Forming a. At least 3mm from the base of the epo bulb should be keep when forming leads. b. Do not use the base of the leadframe as a fulcrum during lead forming. Lead forming should be done before soldering. c. Because the stress to the base ma damage the characteristics or it ma break the LEDs, do not appl an bending stress to the base of the lead d. When mounting the LEDs onto a PCB, the holes on the circuit board should be eactl aligned with the leads of the LEDs. Stress at the leads should be avoid when the LEDs are mounted on the PCB, because it causes damage to the epo resin and this will degrade the LEDs. (2) Storage a. The LEDs should be stored at stored at 3 C or less and 7%RH or less after being shipped and the storage life limits are 3 months. b. If the LEDs are stored more then 3 months, the can be stored for a ear in a sealed container with a nitrogen atmosphere and moisture absorbent material. c. Please avoid rapid transitions in ambient temperature, especiall, in high humidit environments where condensation can occur. (3) Static Electricit a. Static electricit or surge voltage damages the LEDs. b. It is recommended that a wristband or an anti-electrostatic glove be used when handling the LEDs. c. All devices, equipment and machiner must be properl grounded. d. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. e. Damaged LEDs will show some unusual characteristics such as the leak current remarkabl increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF>2.V at IF=.5mA) (4) Heat Generation a. Thermal design of the end product was most importance. Please consider the heat generation of the LED when making the sstem design. b. The thermal resistance of the circuit board and densit of LED placement on the board, as well as other components was the important factor affecting the coefficient of temperature increase per input electric power. It must be avoid intense heat generation and operate within the maimum ratings given in the specification. c. The operating current should be decided after considering the ambient maimum temperature of LEDs. (5) Cleaning a. It is recommended that isopropl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. b. Do not clean the LEDs b the ultrasonic. When it is absolutel necessar, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether an damage to the LEDs would occur. (6) Safet Guideline for Human Ees a. In 993, the International Electric Committee (IEC) issued a standard concerning laser product safet (IEC 825-).Since then, this standard has been applied for diffused light sources (LEDs) as well as lasers.in 998 IEC Edition. evaluated the magnitude of the light source. b. In 2 IC Amendment 2 converted the laser class into 7 classes for end products. c. Components are ecluded from this sstem. Products which contain visible LEDs are now classified as class. Products containing UV LEDs can be classified as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the energ emitted is high. For these sstems it is recommended to avoid long term eposure. It is also recommended to follow the ICE regulations regarding safet and labeling of products. (7) Soldering Condition for LED Lamps a Careful attention should be paid during soldering. b. Solder the LED no closer than 3mm from the base of the epo bulb. Soldering beond the base of the tie bar is recommender. c. Recommender soldering conditions Dip Soldering Soldering Pre-Heat Pre-Heat Time Solder Bath Temperature Dipping Time Dipping Position 2 C Ma 6 seconds Ma 26 C Ma seconds Ma No lower than 3 mm from the base of the epo bulb. Temperature Soldering Time Position 35 C Ma 3 seconds Ma No closer than 3 mm from the base of the epo bulb. d. Do not appl an stress to the lead particularl when heated. The LEDs must not be repositioned after soldering. After soldering the LEDs, the epo bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. Direct soldering onto a PC board should be avoided. Mechanical stress to the resin ma be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it is absolutel necessar, the LEDs ma be mounted in this fashion but the User will assume responsibilit for an problems. Direct soldering should onl be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. Wah Wang LEDs should not be soldered directl to double sided PC boards because the heat will deteriorate the epo resin. When it is necessar to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures ma cause failure of the LEDs. (8) Others a. Care must be taken to ensure that the reverse voltage will not eceed the absolute maimum rating when using the LEDs with matri drive. Keeping the Normal Forward to 2 ma. b. The LEDs described in this brochure are intended to be used for ordinar electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Wah Wang s sales staff in advance for information on the applications in which eceptional qualit and reliabilit are required, particularl when the failure or malfunction of the LEDs ma directl jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control sstems, automobiles, traffic control equipment, life support sstems and safet devices). IF R VF IF = V - VF R V c. User shall not reverse engineer b disassembling or analsis of the LEDs without having prior written consent from WahwWang. When defective LEDs are found, the User shall inform Wah Wang directl before disassembling or analsis. d. The formal specifications must be echanged and signed b both parties before large volume purchase begins. e. The appearance and specifications of the product ma be modified for improvement without notice. WW5C3SWQ4-N Version. Page 5 of 5