TGC2610-SM 10 GHz 15.4 GHz Downconverter

Transcription

1 Applications VSAT Point-to-Point Radio Test Equipment & Sensors -pin 5x5 mm QFN package Product Features Functional Block Diagram RF Frequency Range: 15. GHz IF Frequency: DC GHz LO Frequency: 19 GHz LO Input Power: to dbm Input IP3: dbm Conversion Gain: db Noise Figure:.5 db Package Dimensions: 5. x 5. x 1.3 mm General Description The TriQuint is a Ku-Band Image Reject Downconverter. The operates over an RF frequency range of to 15. GHz and LO from to 19 GHz with IF outputs from DC to GHz. This part is designed using TriQuint s phemt production process. The integrates an LNA, and image reject mixer driven by an LO buffer amplifier. It typically provides an Input IP3 of dbm at 5 dbm input power per tone and has a conversion gain of db and noise figure of.5 db or less. The is available in a low-cost, surface mount lead 5x5 mm QFN package and is ideally suited for Point-to-Point Radio, and Ku-Band VSAT Ground Terminal applications. Pin Configuration Pin No. Label 1,,,, 7,,,, 15,,,, 1,, 3, 5, GND, 7, 3 RF IN 5 VGX 9 LO IN, 11 NC 13 VDLO 17 IFOUT_LSB 19 IFOUT_USB VDLNA Lead-free and RoHS compliant. Evaluation Boards are available upon request. Ordering Information Part No. ECCN Description GHz 15. GHz EAR99 Downconverter Standard T/R size = 5 pieces on a 7 reel Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

2 Absolute Maximum Ratings Parameter VDLNA VDLO IDRF IDLO Rating V V ma 15 ma VGX V Power Dissipation, Pdiss 1.7 W RF Input Power, CW, T = 5 C dbm Channel Temperature, Tch C Mounting Temperature (3 sec) C Storage Temperature -5 to 5 C Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions Parameter Min Typ Max Units Operating Temperature Range C VDRF 3 5 V IDRF ma VDLO 3 5 V IDLO 71 ma VGX See Note LO Input Power dbm Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Note: VGX is connected to 3 ohm resistor to ground Electrical Specifications Test conditions unless otherwise noted: : IF Input Power = - dbm, LO Input Power = dbm, VDLO = V, IDLO = 5 ma, VDRF = V, IDRF = 5 ma. Parameter Conditions Min Typ Max Units RF Frequency Range 15. GHz LO Frequency Range 19 GHz IF Frequency Range GHz LO Input Power dbm Drain Current, LO (IDLO) 7 ma Drain Current, RF (IDRF) 9 ma Conversion Gain db Input Third Order Intercept Point (IIP3) dbm Image Rejection (IMR) db Noise Figure db Notes: 1. Preliminary Datasheet: Rev C -- - of 17 - Disclaimer: Subject to change without notice

3 Specifications Thermal and Reliability Information Parameter Conditions Rating Thermal Resistance, θ JC, measured to back of package Tbase = 5 C θ JC = 75.5 C/W Channel Temperature (Tch), and Median Lifetime (Tm) Tbase = 5 C Vd = V Id = ma LO Power = dbm Pdiss =. W Tch = 133 C Tm = 1.E+9 Hours Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

4 Typical Performance IF Input Power = -5 dbm, VDLO = V, IDLO = 5 ma, VDRF = V, IDRF = 5 ma. Data taken with external IF hybrid. Conversion Gain vs. RF vs. IF Conversion Gain vs. RF vs. IF Conversion Gain vs. RF vs. LO Power Conversion Gain vs. RF vs. LO Power dbm dbm dbm dbm dbm dbm Conversion Gain vs. IF vs. RF Conversion Gain vs. IF vs. RF.5GHz 13.5GHz 15.5GHz GHz 1 15GHz Preliminary Datasheet: Rev C -- - of 17 - Disclaimer: Subject to change without notice

5 RF-IF Isolation (db) RF-IF Isolation (db) LO-RF Isolation (db) LO-RF Isolation (db) LO-IF Isolation (db) LO-IF Isolation (db) Typical Performance IF Input Power = -5 dbm, VDLO = V, IDLO = 5 ma, VDRF = V, IDRF = 5 ma. Data taken with external IF hybrid LO to IF Isolation vs. RF LO to RF Isolation vs. RF LO to IF Isolation vs. RF LO to RF Isolation vs. RF RF to IF Isolation vs. RF vs. IF RF to IF Isolation vs. RF vs. IF Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

6 Input P1dB Compression Pt (dbm) Input P1dB Compression Pt (dbm) Input Third Order Intercept Point (dbm) Input Third Order Intercept Point (dbm) Input Third Order Intercept Point (dbm) Input Third Order Intercept Point (dbm) Typical Performance IF Input Power = -5 dbm, VDLO = V, IDLO = 5 ma, VDRF = V, IDRF = 5 ma. Data taken with external IF hybrid Input IP3 vs. RF vs. IF Input IP3 vs. RF vs. LO Power dbm dbm dbm Input IP3 vs. RF vs. IF Input IP3 vs. RF vs. LO Power dbm dbm dbm Input P1dB Compression Pt. vs. RF vs. IF -3 Input P1dB Compression Pt. vs. RF vs. IF Preliminary Datasheet: Rev C -- - of 17 - Disclaimer: Subject to change without notice

7 Image Rejection (db) Image Rejection (db) Typical Performance IF Input Power = -5 dbm, VDLO = V, IDLO = 5 ma, VDRF = V, IDRF = 5 ma. Data taken with external IF hybrid Image Rejection vs. RF vs. IF Conversion Gain vs. RF vs. Temperature IF=, 5 C 5 C - C Image Rejection vs. RF vs. IF Conversion Gain vs. RF vs. Temperature IF=, 5 C 5 C - C Conversion Gain vs. RF vs. Temperature IF=, 5 C 5 C - C Conversion Gain vs. RF vs. Temperature IF=, 5 C 5 C - C Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

8 Noise Figure (db) Noise Figure (db) IF Return Loss (db) LO Return Loss (db) RF Return Loss (db) Typical Performance IF Input Power = -5 dbm, VDLO = V, IDLO = 5 ma, VDRF = V, IDRF = 5 ma. Data taken with external IF hybrid. LO Return Loss vs. Frequency 5 C RF Return Loss vs. Frequency 5 C IF Return Loss vs. Frequency 5 C IF Port 1 IF Port Noise Figure vs. RF vs. IF Noise Figure vs. RF vs. IF Preliminary Datasheet: Rev C -- - of 17 - Disclaimer: Subject to change without notice

9 Typical Performance IF Input Power = - dbm, VDLO = V, IDLO = 71 ma, VDRF = V, IDRF = ma, LO Power = dbm. Data taken with external IF hybrid. Spur Tables Spur tables are M f LO + N f RF mixer spurious products for - dbm RF input power. Desired IF is at 1LO 1RF. All values in dbc below the IF output power level. M x N Spurious Outputs for LSB, IF =. GHz M x f LO N x f RF M x N Spurious Outputs for USB, IF =. GHz M x f LO N x f RF Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

10 Pin Configuration and Description Pin No. Label Description 1,,,, 7,,,, 15,,,, 1,, 3, 5,, 7, GND Internal Grounding; must be grounded on PCB. 3 RF IN RF Input matched to 5 ohms, AC Coupled. 5 VGX Mixer Gate Voltage. Bias network is required; see Application Circuit on page 11 as an example. 9 LO IN LO Input, matched to 5 ohms, AC coupled., 11 NC No internal connection; must be grounded on PCB. 13 VDLO LO Drain Voltage. Bias network is required; see Application Circuit on page 11 as an example. 17 IFOUT_LSB IF Output matched to 5 ohms, DC coupled. 19 IFOUT_USB IF Output matched to 5 ohms, DC coupled. VDLNA LNA Drain Voltage. Bias network is required; see Application Circuit on page 11 as an example. Preliminary Datasheet: Rev C -- - of 17 - Disclaimer: Subject to change without notice

11 Application Circuit VDLNA C9 1 uf C.1 uf C3 pf RF Input off board VGX C1 3 Ohm pf C.1 uf YYWW XXXX X1 R Ohm R1 5 Ohm IF Output LSB C7 1 uf LO Input C pf C5.1 uf C 1 uf X1 R 5 Ohm R3 Ohm USB IF Output VDLO Bias-up Procedure Bias-down Procedure Turn VDLO to V Turn off RF and LO signals Turn VDLNA to V Turn VDLNA to V VGX is connected to 3 ohm resistor to ground Turn VDLO to V Apply LO and RF signals Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

12 Application Circuit PC Board Layout Board material is RO3. thickness with ½ oz copper cladding. For further technical information, refer to the Product Information page. Bill of Material Ref Des Value Description Manufacturer Part Number C1, C, C3 pf Cap,, 5V, 5%, NPO various C, C5, C.1 µf Cap, 3, 5V, 5%, COG various C7, C, C9 1 µf Cap, 5, 5V, 5%, X5R various U1 Ku-Band Downconverter TriQuint LSB Configuration R1 5 ohm Res,,.5W, 5%, SMD various R ohm Res,,.1W, SMD various R, R3 DNP X1 -Way 9 Power combiner/splitter Mini-circuit QCN-5+ or QCN-5+ Preliminary Datasheet: Rev C -- - of 17 - Disclaimer: Subject to change without notice

13 Mechanical Information Package Marking and Dimensions All dimensions are in millimeters. The will be marked with the YYWW designator and a lot code marked below the part designator. The YY represents the last two digits of the year the part was manufactured, the WW is the work week, and the XXXX is an autogenerated number. This package is lead-free/rohs-compliant with a copper alloy base (CDA19), and the plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum C reflow temperature) and tin-lead (maximum 5 C reflow temperature) soldering processes. Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

14 Mechanical Information PCB Mounting Pattern.5.5 Notes: 1. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended.. Ground vias are critical for the proper performance of this device. Vias should have a final plated thru diameter of.5 mm (. ). Preliminary Datasheet: Rev C -- - of 17 - Disclaimer: Subject to change without notice

15 Tape and Reel Information Standard T/R size = 5 pieces on a 7 reel. Vendor Tek-Pak Material Vendor P/N QFN5X 5F-L5 Length (A) Cavity (mm) Width (B) Depth (K) Pitch (P1) Distance Between Centerline (mm) Length Width direction Direction (P) (F) Carrier Tape (mm) Width (W) Cover Carrier (mm) Width (W) Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

16 Product Compliance Information ESD Sensitivity Ratings Caution! ESD-Sensitive Device ESD Rating: Class 1B Value: 5 V and < V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD-A1 MSL Rating MSL Rating: Level 3 Test: C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD- Solderability Compatible with both lead-free ( C maximum reflow temperature) and tin/lead (5 C maximum reflow temperature) soldering processes. Package lead plating: NiPdAu. RoHs Compliance This part is compliant with EU /95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C 15 H Br ) Free PFOS Free SVHC Free Recommended Solder Temperature Profile Preliminary Datasheet: Rev C -- - of 17 - Disclaimer: Subject to change without notice

17 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: Tel: Fax: For technical questions and application information: Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Preliminary Datasheet: Rev C of 17 - Disclaimer: Subject to change without notice

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