Vesper VM1000 Piezoelectric MEMS Microphone

Transcription

1 Vesper VM1000 Piezoelectric MEMS Microphone MEMS report by Sylvain Hallereau February rue la Noue Bras de Fer NANTES - FRANCE info@systemplus.fr System Plus Consulting Vesper VM1000 Microphone 1

2 Table of Contents 4 o Executive Summary o Reverse Costing Methodology Company Profile 8 o Vesper o AAC Technologies o VM1000 Characteristics 15 of the o Methodology o Package 18 Package Views & Dimensions Package Pin Out Package Opening & Wire Bonding Process Package Cross-Section o ASIC Die 30 View, Dimensions & Marking Delayering Main Blocks Identification Cross-Section Process Characteristics o MEMS Die 41 View, Dimensions & Marking Sensing Areas Details Cavity Cross-Section Cantilever Cross-Section Process Characteristics o Comparison o Global Overview o ASIC Front-End Process o ASIC Wafer Fabrication Unit o MEMS Process Flow o MEMS Wafer Fabrication Unit o Packaging Process Flow o Package Assembly Unit 88 of the cost analysis o Yields Explanation & Hypotheses o ASIC Die 93 ASIC Front-End Cost ASIC Back-End 0 : Probe Test & Dicing ASIC Wafer & Die Cost o MEMS Die 96 MEMS Front-End Cost MEMS Back-End 0 : Probe Test & Dicing MEMS Front-End Cost per process steps MEMS Wafer & Die Cost o Component 101 Back-End : Packaging Cost Back-End : Packaging Cost per Process Steps Back-End : Final Test Cost VM1000 Component Cost Estimated Price Analysis 106 Company services System Plus Consulting Vesper VM1000 Microphone 2

3 Executive Summary o Executive Summary o Reverse Costing Methodology o Glossary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Vesper VM1000 Microphone. The VM1000 is an analog piezoelectric MEMS Microphone optimized for smartphone and IoT devices. With dimensions of 3.76 x 2.95 x 1 mm, it can be integrated in smartphone and wearable electronic. Key technical features of the new device include a sensitivity of -38dBV, an esnr of 64 db, an analog output interface and a low current consumption to 145µA. The VM1000 operates with a supply voltage range of 1.6V to 3.6V. The VM1000 is IP68 microphone, waterproof (15m Depth, 7 Days Exposure) and dust proof (0.6μm Silica, Blowing Dust) System Plus Consulting Vesper VM1000 Microphone 3

4 0.96mm 2.95mm o Package o ASIC Die o MEMS Die o Comparison Package View & Dimensions Package: LGA 5-pin Dimensions: 3.76 x 2.95 x 0.96mm Pin Pitch: 0.8mm 3.76mm Marking: 6A25 Build A Package Top View Package Bottom View Package Side View 2017 System Plus Consulting Vesper VM1000 Microphone 4

5 xxmm ASIC View & Dimensions xxmm o Package o ASIC Die o MEMS Die o Comparison Die Area: xxmm² (xx x xxmm) Nbof PGDW per 8-inch wafer: xxxx Pad number: 4 o Connected: 4 ASIC Die Overview 2017 System Plus Consulting Vesper VM1000 Microphone 5

6 xx mm o Package o ASIC Die o MEMS Die o Comparison MEMS View & Dimensions xxmm Die Area: xxmm² (active area) (xx x xxmm) Nbof PGDW per 8-inch wafer: xxxx Pad number: 2 o Connected: 2 MEMS Die Overview 2017 System Plus Consulting Vesper VM1000 Microphone 6

7 MEMS View o Package o ASIC Die o MEMS Die o Comparison 2017 System Plus Consulting Vesper VM1000 Microphone 7

8 MEMS Cross Section o Package o ASIC Die o MEMS Die o Comparison 2017 System Plus Consulting Vesper VM1000 Microphone 8

9 MEMS Sensor Process Flow 1/3 XX XX o Global Overview o ASIC Front-End Process o MEMS Front-End Process o Packaging Process Top side Top side XX deposition XX seed layer deposition Top side 2017 System Plus Consulting Vesper VM1000 Microphone 9

10 ASIC Front-End Cost o Supply o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost 2017 System Plus Consulting Vesper VM1000 Microphone 10

11 Component Cost o Supply o Yields o ASIC Wafer & Die Cost o MEMS Wafer & Die Cost o Back-End Cost o Component Cost 2017 System Plus Consulting Vesper VM1000 Microphone 11

12 Related Reports o Company services o Related Reports o Feedbacks o Contact o Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MEMS & SENSORS Knowles MEMS Microphone Apple iphone 7 Plus STMicroelectronics MEMS Microphone Apple iphone 7 Plus Goertek-Infineon MEMS Microphone Apple iphone 7 Plus InvenSense ICS43432 MEMS Microphone Wolfson WM7121 & WM7132 MEMS Microphones MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT MEMS & SENSORS Sensors for Cellphones and Tablets 2016 PATENT ANALYSIS - KNOWMADE MEMS MEMS Microphone Patent Infringement 2017 System Plus Consulting Vesper VM1000 Microphone 13

13 Contact PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ TOKYO YOLE KK o Company services o Related Reports o Feedbacks o Contact o Legal GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer Nantes FRANCE sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2017 System Plus Consulting Vesper VM1000 Microphone 14