Cree XLamp XP Family LEDs

Transcription

1 Cree XLamp X Family LEDs Soldering & handling CLD-A25 Rev 19A Introduction This application note applies to XLamp X Family LEDs, which have order codes in the following formats. XCxxx-xx-xxxx-xxxxxx XExxx-xx-xxxx-xxxxxx XGxxx-xx-xxxx-xxxxxx XLxxx-xx-xxxx-xxxxxxxxx This application note explains how XLamp X Family LEDs and assemblies containing these LEDs should be handled during manufacturing. lease read the entire document to understand how to properly handle XLamp X Family LEDs. Table of Contents Handling XLamp X Family LEDs...2 Circuit Board reparation & Layouts...5 Case Temperature (T s ) Measurement oint...5 Notes on Soldering XLamp X Family LEDs...6 Moisture Sensitivity...7 Low Temperature Operation...7 XLamp X Family LED Reflow Soldering Characteristics...8 Chemicals & Conformal Coatings...9 Assembly Storage & Handling Tape and Reel ackaging & Labels Copyright Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and XLamp are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at Cree, Inc Silicon Drive Durham, NC USA Tel:

2 Handling XLamp X Family LEDs Manual Handling Use tweezers to grab XLamp X Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not push on the lens. Do not apply more than 500 g of shear force directly onto the lens. Excessive force on the lens could damage the LED. CORRECT X WRONG Cree recommends the following at all times when handling XLamp X Family LEDs or assemblies containing these LEDs: Avoid putting mechanical stress on the LED lens. Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect the optical performance of the LED. Cree recommends always handling X Family LEDs with appropriate ESD grounding. Cree recommends handling X Family LEDs wearing clean, lint free gloves. Use tweezers with wide, not pointed, tips to grab XLamp X-L High Intensity LEDs at the base. CORRECT X WRONG 2

3 Handling XLamp X Family LEDs - Continued ick & lace Nozzle The following diagram shows an example of a pick & place tool to remove XLamp X-C, X-E and X-G LEDs from the factory tape & reel packaging. All dimensions in mm Tolerance: ±0.01 Ø 4 Ø Top View Ø Conical Side View The following diagram shows an example of a pick & place tool to remove XLamp X-E2, X-G2 and X-G3 LEDs from the factory tape & reel packaging. The nozzle is implemented in urethane. All dimensions in mm Tolerance: ± O O3.230 R Top View Side View 3

4 Handling XLamp X Family LEDs - Continued The following diagram shows an example of a pick & place tool to remove XLamp X-L High Density and X-L2 LEDs from the factory tape & reel packaging. Cree and several of Cree s customers have had good success using nozzles fabricated from 95a urethane. The following pick & place tool, designed in conjunction with Count On Tools, is specific to the X-L High Density and X-L2 LEDs. All dimensions in mm [in] Tolerance: ±0.025 [0.001] [ø0.145] [0.007] A [ø0.125] 118 A [ø0.040] SECTION A-A Top View Side View 5 [0.197] Side View The following diagram shows an example of a pick & place tool to remove XLamp X-L High Intensity LEDs from the factory tape & reel packaging. Cree recommends using a spring relieved pick and place nozzle with a spring constant of 0.05 lb ft (0.07 N m). Cree has had good success using nozzles fabricated from 95a urethane. The following pick & place tool is specific to the X-L High Intensity LED. All dimensions in mm Tolerance: ± Ø Top View Side View 4

5 Circuit Board reparation & Layouts rinted circuit boards (CBs) should be prepared and/or cleaned according to the manufacturer s specifications before placing or soldering XLamp X Family LEDs onto the CB. The diagram below shows the recommended CB solder pad layout for XLamp X Family LEDs. All dimensions in mm Recommended CB Solder ad Recommended Stencil attern (Hatched Area is Open) Case Temperature (T s ) Measurement oint XLamp X Family LED case temperature (T s ) should be measured on the CB surface, as close to the LED s thermal pad as possible. This measurement point is shown in the picture below. It is not required to use a solder footprint for the thermal pad that is larger than the XLamp X Family LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting T s measurement. 5

6 Notes on Soldering XLamp X Family LEDs XLamp X Family LEDs are designed to be reflow soldered to a CB. Reflow soldering may be done by a reflow oven or by placing the CB on a hotplate and following the reflow soldering profile listed on page 8. CORRECT X WRONG CORRECT Do not wave solder XLamp X Family LEDs. Do not hand solder XLamp X Family LEDs. Solder aste Type Cree strongly recommends using no clean solder paste with XLamp X Family LEDs so that cleaning the CB after soldering is not required. Cree uses Kester R276 solder paste internally. Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver). Solder aste Thickness The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil (102-μm) bond line, i.e., the solder joint thickness after reflow soldering. CORRECT X WRONG 6

7 Notes on Soldering XLamp X Family LEDs - continued After Soldering After soldering, allow XLamp X Family LEDs to return to room temperature before subsequent handling. remature handling of the device, especially around the lens, could result in damage to the LED. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial CBs after reflow. After shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the CB. Cleaning CBs After Soldering Cree recommends using no clean solder paste so that flux cleaning is not necessary after reflow soldering. If CB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IA). Do not use ultrasonic cleaning. Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MB) until immediately prior to soldering. Unopened MBs that contain XLamp LEDs do not need special storage for moisture sensitivity. Bare XLamp LEDs have a storage temperature range of -40 C to 100 C. However, the MB, reel, tape and box have a more limited storage temperature range. Once the MB is opened, XLamp X Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs in the original MB. Low Temperature Operation The minimum operating temperature of these XLamp components is -40 C. To maximize lifetime, Cree recommends avoiding applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 C. 7

8 XLamp X Family LED Reflow Soldering Characteristics In testing, Cree has found XLamp X Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used, and therefore it is the lamp or luminaire manufacturer s responsibility to determine applicable soldering requirements. Note that this general guideline may not apply to all CB designs and configurations of reflow soldering equipment. T Ramp-up t Critical Zone T L to T Temperature T L Ts max Ts min ts reheat t S Ramp-down 25 t 25 C to eak Time IC/JEDEC J-STD-020C rofile Feature Lead-Free Solder Average Ramp-Up Rate (Ts max to T p ) 1.2 C/second reheat: Temperature Min (Ts min ) 120 C reheat: Temperature Max (Ts max ) 170 C reheat: Time (ts min to ts max ) seconds Time Maintained Above: Temperature (T L ) 217 C Time Maintained Above: Time (t L ) seconds eak/classification Temperature (Tp) C Time Within 5 C of Actual eak Temperature (tp) Ramp-Down Rate Time 25 C to eak Temperature seconds 1-6 C/second 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. 8

9 Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree s Chemical Compatibility Application Note. The video at illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer. Recommended Chemicals In testing, Cree has found the following chemicals to be safe to use with XLamp X Family LEDs. Water Isopropyl alcohol (IA) Chemicals Tested as Harmful In general, subject to the specifics in Cree s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XLamp X Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp X Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) Methyl acetate or ethyl acetate (i.e., nail polish remover) Cyanoacrylates (i.e., Superglue ) Glycol ethers (including Radio Shack recision Electronics Cleaner - dipropylene glycol monomethyl ether) Formaldehyde or butadiene (including Ashland LIOBOND adhesive) Hermetically Sealing Luminaires For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically sealing LEDs in an enclosed space is not recommended. 9

10 Assembly Storage & Handling Do not stack CBs or assemblies containing XLamp X Family LEDs so that anything rests on the LED lens. Force applied to the LED lens may result in the lens being knocked off. CBs or assemblies containing XLamp X Family LEDs should be stacked in a way to allow at least 1-cm clearance above the LED lens. Do not use bubble wrap directly on top of XLamp X Family LEDs. Force from the bubble wrap can potentially damage the LED. CORRECT CORRECT X WRONG 10

11 Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. Except as noted, all dimensions in mm. X-C, X-E, X-E High Efficiency White, X-G, X-L High Density, X-L High Intensity, X-L2 User Feed Direction Cover Tape ocket Tape 7" 13mm X-E2, X-E2 Torch, X-G2, X-G3 Ø Ø61 ± 0.5 OD 7.5'' MEASURED AT HUB Ø MEASURED AT INSIDE EDGE 11

12 Tape and Reel - Continued X-C, X-E, X-G / / /.00 B 4.00 ± ±.10 CATHODE SIDE B 1.75 ± / ± Nominal Max 8.00 ±.10 ANODE SIDE 5.50 ±.10 T 0.30 ± ±0.05 Do.30 ±.10 Y ±0.05 (I) / / /-.00 REF Bo /-.00 Note: sprocket hole pitch cumulative tolerance ±0.2 mm SECTION B-B R0.2 TYICAL Ko SECTION Y-Y Y D1 1.5 MIN. R X-E High Efficiency White, X-E2, X-E2 Torch, X-G2, X-G3 T 0.30 ± ±0.05 Do Y ±0.05 (I) o 4.0 ±0.1 (II) CATHODE SIDE E ±0.1 REF Bo F(III) W Ao /- 0.1 Bo /- 0.1 Ko /-0.1 F 1 W / / /-0.1 SECTION Y-Y R0.2 TYICAL Ko Y D1 1.5 MIN. REF R 2.24 X 1 X REF 0.59 Ao ANODE SIDE (I) (II) (III) (IV) Measured from centerline of sprocket hole to centerline of pocket. Cumulative tolerance of 10 sprocket holes is ± Measured from centerline of sprocket hole to centerline of pocket. Other material available. SECTION X-X Ao /- 0.1 Bo /- 0.1 Ko /-0.1 F 1 W / / /-0.1 (I) (II) (III) (IV) Measured from centerline of sprocket hole to centerline of pocket. Cumulative tolerance of 10 sprocket holes is ± Measured from centerline of sprocket hole to centerline of pocket. Other material available. 12

13 Tape and Reel - Continued All dimensions in mm [in] X-L High Density, X-L [.079] [.157] o CATHODE SIDE Ø [.069] E1 OCKET SIZE Ao mm [.142"] Bo mm [.142"] Ko mm [.118"] 5.50 [.217]F [.472] NOMINAL [.142] Bo X-L High Density, Ø1.50 [.059] D1 MIN [.404] E [.484] MAX W ANODE SIDE 8.00 [.315] 3.00 [.118] Ko.30 [.012] T Anode Side [.142] Ao X-L High Intensity 4.00 [.157] o 2.00 [.079] 2 CATHODE SIDE Ø [ ]Do 1.75 [.069] E1 OCKET SIZE Ao mm [.146"] Bo mm [.146"] Ko mm [.047"] 5.50 [.217]F Ø 1.50 [.059] D1 MIN [.404] E [.472] NOMINAL [.484] MAX W [.146] Bo ANODE SIDE 8.00 [.315] 1.20 [.047] Ko.30 [.012] T Anode Side [.146] Ao 13

14 ackaging & Labels The diagrams below show the packaging and labels Cree uses to ship XLamp X Family LEDs. XLamp X Family LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel ackaged Reel Label with Cree Bin Code, Quantity, Reel ID Label with Cree Order Code, Quantity, Reel ID, O # Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, O # Label with Cree Bin Code, Quantity, Reel ID atent Label (on bottom of box) 14