SPECIFICATION SIPLACE HF SPECIFICATION High-Flexibility SMD Placement System

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1 SPECIFICATION SIPLACE HF SPECIFICATION High-Flexibility SMD Placement System

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3 High-Flexibility SMD Placement System SIPLACE HF Contents 3 High-Flexibility SMD Placement System 3 Contents 3 Machine Description 5 Overview 5 Technical Data 7 Line Concept 8 Description 8 Placement Heads 9 Head Modularity 9 12-Segment Collect & Place Head for High-Speed Placement 10 6-Segment Collect&Place Head for High-Speed IC Placement 11 Collect&Place Heads 12 Technical Data 12 TwinHead for high-precision IC placement 13 Technical Data 14 Nozzle Changers (Collect & Place Heads) 15 Nozzle changers (TwinHead) 16 Technical Data 17 PCB Conveyor 18 Single conveyor 18 Technical Data 19 Dual conveyor 20 Technical Data 21 PCB Barcode for Product-Controlled Production (Option) 22 Component Feeding 23 Component Changeover Table 23 Technical Data 24 Tape Feeders 25 Bulk case feeder 26 Dummy Feeders 27 Manual Trays 28 Matrix Tray Changer 29 Technical Data 30 Technical Data 32 Connections 32 Dimensions and set-up conditions 34 Placement system s center of gravity 35 Maneuvering radii 36 MTC dimensions and set-up conditions 36 Transport and Delivery Configuration 37 Sample Configuration 38

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5 Machine Description Overview 5 Innovation Linear drives on every gantry faster acceleration and braking of X and Y gantries higher placement rate Gantry extensions constructed from carbon fiber composite, 5 times lighter than steel and twice as rigid increased speed and accuracy TwinHead places two components at the same time using the Pick & Place principle increased speed when placing large components greater flexibility due to broader range of components TwinHead component vision camera with 50 mm x 40 mm field of view maximum speed together with more reliable recognition of even complex components such as CCGA or flip chip Description The SIPLACE HF placement system is particularly suitable for applications that demand a high level of flexibility and utmost precision. Two placement methods are used: the Collect & Place method for high-speed placement of standard components ( see diagram on page 6) the Pick & Place method for fast placement of special fine-pitch and super-fine pitch components The HF/placement system has two gantries driven by linear motors. The gantries can be quickly and accurately positioned in the X and Y directions. There is a placement head on each gantry. The following placement head configurations are possible: Placement areas 1 and 2 12-segment Collect & Place head or 6-segment Collect & Place head or TwinHead The head modularity principle allows the placement heads to be reconfigured to suit changing requirements. The moving head picks up the components from their stationary feeder, and places them on the PCB, which is also stationary. This proven SIPLACE principle has many advantages: Short down times for refilling or splicing Even the smallest components (e.g. 0201) are picked up reliably The components cannot slip on the PCB Minimal traversing paths High flexibility, cost-effectiveness and set-up reliability guarantee that the SIPLACE HF placement system will be highly productive. The minimal down times increase utilization, thus further increasing productivity.

6 6 Machine Description Overview Upgrade The following options are available to extend the machine's functionality: Additional component changeover tables increase machine utilization since set-up times can be reduced by carrying out preliminary set-up off the machine. The dual conveyor also increases machine utilization by eliminating nonproductive PCB transport times. Automatic nozzle changers speed up and optimize the nozzle configuration process. PCB barcode scanners allow the production set-up to be changed over when triggered by a new product. Component barcode scanners optimize the setup and refill checks. Large and sensitive finepitch components can be supplied in trays by two matrix tray changers. The productivity lift implements the concept of parallel placement, and thus improves the ratio between productive and non-productive times. Placement principle Collect&Place

7 Machine Description Technical Data 7 Types of placement head SIPLACE TwinHead (TH) 6-segment Collect&Place head (C&P6) 12-segment Collect&Place head (C&P12) Number of gantries 2 Placement rate (benchmark) Range of components Placement area 1 Placement area 2 C&P12 C&P12 28,000 comp./h C&P12 C&P6 23,300 comp./h C&P6 C&P6 18,600 comp./h C&P12 TH 17,700 comp./h C&P6 TH 13,000 comp./h TH TH 7,400 comp./h 0.6 x 0.3 mm² (0201) to 85 x 85 mm² / 125 x 10 mm² max. 200 x 125 mm² (with restrictions) Component height C&P12: 6 mm C&P6: 8.5 mm TH: 25 mm (larger heights on request) Placement accuracy C&P12: ± 60 µm standard, ± 55 µm DCA, ± 0.7 / (4 σ) C&P6: ± 60 µm standard, ± 55 µm DCA, ± 0.3 / (4 σ) TH: ± 35 µm standard, ± 30 µm FC, ± 0.07 / (4 σ) PCB format (LxW) PCB thickness Feeding capacity Component feeding Feeder module types Single conveyor 50 x 50 mm² to 450 x 508 mm² 50 x 80 mm² to 610 x 508 mm² ("Long board" option) Dual conveyor 50 x 50 mm² to 450 x 250 mm² 50 x 80 mm² to 610 x 250 mm² ("Long board" option) Dual conveyor in single conveyor mode 50 x 50 mm² to 450 x 450 mm² 50 x 80 mm² to 610 x 450 mm² ("Long board" option) mm (thicker PCBs on request) 180 tracks, width 8 mm (60 3 x 8 mm S feeder) 120 tracks, width 8 mm (60 2 x 8 mm S feeder) 60 tracks, width 12 or 16 mm (60 12/16 mm S feeder) 40 tracks, width 24 or 32 mm (40 24/32 mm S feeder) 28 tracks, width 44 mm (28 44 mm S feeder) 24 tracks, width 56 mm (24 56 mm S feeder) 20 tracks, width 72 mm (20 72 mm S feeder) 16 tracks, width 88 mm (16 88 mm S feeder) 4 component changeover tables with tape roll holders and integral waste containers 15 slots, 30 mm wide, per changeover table or up to 2 matrix tray changers, rather than component changeover tables Tapes, bulk cases, stick magazines, application-specific OEM feeders, surftape feeders (8, 12, 16 mm), manual trays Compressed air connection MPa (5-10 bar), 3/4" 350 st. l/min (C&P/TH) Power supply 3 x 208/230 VAC ± 5 %, 50/60 Hz, 3 x 32 A 3 x 380/400/415 VAC ± 5 %, 50/60 Hz, 3 x 16 A 6.5 kw total power Space required (L x W) Weight 2380 x 2515 mm² / 6.01 m² 3800 kg (basic machine), 4700 kg (full configuration with feeders)

8 8 Line Concept Description Innovation Modularity, flexibility the line can easily be adapted to suit production requirements Compactness, high power density less space required for increased placement rate Description The SIPLACE HF is fully compatible with other SIPLACE systems. This compatibility enables a production line to be configured from identical and different modules. If production requirements change, the individual placement systems can be quickly and easily recombined. The SIPLACE family has exactly the right placement system, whatever the output requirements: SIPLACE HF placement systems cover the SMD spectrum of components from 0201 to 125 x 10 mm² with a high placement rate. The SIPLACE HS-60 is a super high-speed placement system for processing components ranging from 0201 through to 18.7 x 18.7 mm². The SIPLACE S-27 HM is a high-speed system for placing components from 0201 to 32 x 32 mm². System SIPLACE SMD placement lines Placement modules SIPLACE HF / SIPLACE HS-60 / SIPLACE S-27 HM / F5 HM Peripheral modules Input/output stations, screen printers, soldering ovens, inspection stations, etc, available from Siemens L&A Component range 0201 to 85 x 85 mm² / 125 x 10 mm² max. 200 x 125 ² mm² (with restrictions) PCB conveyor Single and dual conveyor with automatic width adjustment unit Placement rate Depends how modules are connected in series Space required 4 m² per S module, 6 m² per HF module, 6.5 m² per HF/3 module, 7.5 m² per HS module The flexible SIPLACE F5 HM system places large ICs, flip chips, bare dies and exotic components (OSC). It has a component range of 0201 to 55 x 55 mm². SIPLACE set-up optimization is a tool for increasing the line's productivity. The software calculates individual set-ups for individual products, individual set-ups for different products and family set-ups for different products. The program data can be exchanged between the individual lines - even for different machine configurations.

9 Placement Heads Head Modularity 9 Innovation TwinHead picks up two components at the same time using the Pick & Place principle increased speed when placing large components greater flexibility due to broader range of components Head modularity A simple placement head change adapts the machine to the current production requirements Reconfiguration kit Local placement head change Description One particular advantage of the SIPLACE family is its head modularity, which opens up the following opportunities for HF machines: Placement areas 1 and 2 12-segment Collect & Place head or 6-segment Collect & Place head or TwinHead If you order a SIPLACE HF placement system, you can choose between a 6-segment C&P head, a 12-segment C&P head or a TwinHead. The placement system will be configured and supplied as per your order. There is also a reconfiguration kit if you wish to change the placement head locally. This package contains the appropriate nozzle changers, assembly parts, cables, etc, in addition to the placement head. Head modularity provides an easy way to match the placement system to your production needs without having to invest in additional machines.

10 10 Placement heads 12-Segment Collect & Place Head for High-Speed Placement Innovation Compact construction Low centrifugal forces on the components Same cycle time for all components Placement rate does not depend on the component size High-speed placement of components ranging from 0201 to 18.7 x 18.7 mm² Description The 12-segment Collect & Place head works on the Collect & Place principle. This means that, within each cycle, twelve components are picked up by the placement head, are optically centered on the way to the board and are rotated into the required placement angle. Lastly, the component is placed gently and accurately on the board. The twelve nozzles on SIPLACE Collect &Place heads turn about a horizontal axis, in contrast to conventional chip shooters. The compact construction has the following advantages: the centrifugal forces acting on the components are much lower than with conventional chip shooters The cycle time of the Collect & Place head is the same for all components, which means that the placement rate is not dependent on the component size. Checking and self-learning functions The reliability of the Collect & Place head is increased by various checking and selflearning functions. For example, vacuum checks at the nozzles indicate whether the component was picked up or set down correctly. A fiducial mark on the feeder is used to determine the precise component pick-up position on the feeder. A camera on the placement head (component vision module) determines the precise angle of each component on the nozzle. Any deviations from the required pick-up position are corrected before placement takes place. The package form is also checked. and the component is not placed if the geometric data thus determined differs from the programmed data. The vertical axis for picking up and placing the component works in sensor stop mode, in which differences in height during pick-up and any unevenness of the PCB Reject component DR axis: Star rotation Z axis Pick up or place component surface are compensated during placement. A component sensor may be installed on the C&P head in order to increase placement reliability. This sensor checks the edge ratio in addition to the presence of the component at the nozzle. DCA option The 12-segment Collect& Place head can optically center and place components from 0.6 x 0.3 mm² to 13 x 13 mm² using the optional DCA vision module. The DCA vision module optimizes the speed and accuracy when placing flip-chips and bare dies (values in table on page 12). Component vision module DP axis Rotate component to placement angle Pull off or insert sleeve

11 Placement heads 6-Segment Collect&Place Head for High- Speed IC Placement 11 Innovation High-speed placement of ICs Components up to 32 x 32 mm² Description The 6-segment Collect & Place head also works on the Collect & Place principle. With the standard component vision module, the HF machine places components with an edge length of up to 32 mm both fast and accurately. It is therefore ideal for use with products containing a large proportion of ICs. Reject component, pull off or insert sleeve Component vision module DP axis Rotate component to placement angle DR axis: Star rotation Z axis Pick up or place component DCA option The 6-segment Collect& Place head can optically center and place components from 0.6 x 0.3 mm² to 13 x 13 mm² using the optional DCA vision module. The DCA vision module optimizes the speed and accuracy when placing high-speed flip-chips and bare die components. The values are shown in the table on page 12. Checking and self-learning functions The checking and self-learning functions described on page 10 for the 12-segment Collect&Place head also apply to the 6-segment Collect & Place head.

12 12 Placement heads Collect&Place Heads Technical Data 12-segment Collect&Place head (standard vision module) 12-segment Collect&Place head (DCA vision module) 6-segment Collect&Place head (standard vision module) 6-segment Collect&Place head (DCA vision module) Component range Component specifications max. height min. lead pitch min. bump pitch min. ball bump min. dimensions max. dimensions max. weight Programmable placement force 0201 to PLCC44, BGA, µbga, flip-chip, TSOP, QFP, SO to SO32, DRAM 6 mm 0.5 mm 0.35 mm 0.2 mm 0.6 x 0.3 mm² 18.7 x 18.7 mm² 2 g 0201 to flip-chip, bare die 6 mm 0.4 mm 0.2 mm 0.11 mm 0.6 x 0.3 mm² 13 x 13 mm² 2 g 0603 to 32 x 32 mm² 0201 to flip-chip, bare die 8.5 mm 0.5 mm 0.56 mm 0.32 mm 1.6 x 0.8 mm² 32 x 32 mm² 5 g 8.5 mm 0.4 mm 0.2 mm 0.11 mm 0.6 x 0.3 mm² 13 x 13 mm² 5 g 2.4 N N 2.4 N N 2.4 N N 2.4 N N Nozzle types 9 xx 9 xx 8 xx, 9 xx 8 xx, 9 xx X/Y accuracy ± 60 µm/4 σ ± 55 µm/4 σ ± 60 µm/4 σ ± 55 µm/4 σ Angular accuracy ± 0.7 /4 σ ± 0.7 /4 σ ± 0.3 /4 σ ± 0.3 /4 σ

13 Placement heads TwinHead for high-precision IC placement 13 Innovation The TwinHead places two components at the same time using the Pick & Place method Increased speed when placing large components Greater flexibility due to broader range of components placed gently and accurately on the board. In addition to the vacuum nozzles specially developed for the TwinHead, the placement head can also use the nozzles for the Pick&Place head. Collect &Place head nozzles can also be used. Checking and self-learning functions The TwinHead's reliability can be further increased with various checking and selflearning functions. For example, vacuum checks at the nozzles indicate whether the component was picked up or set down correctly. High-resolution, intelligent vision modules, such as the fine-pitch and flipchip vision modules, identify and correct minute deviations from the desired component position, thus guaranteeing a correct placement position. The vision modules are permanently fixed to the machine frame. The component package form is also checked, and the component is not placed if the geometric data thus determined differs from the programmed data. A force sensor measures and monitors the specified component placement forces. How the TwinHead works Description This sophisticated placement head consists of two placement heads of the same type coupled together (twin head). Both heads work using the Pick&Place principle. The TwinHead is suitable for processing particularly difficult or large components. Two components are picked up by the placement head, optically centered on the way to the placement position and rotated into the necessary placement angle. The components are then DP axis Z axis Nozzle

14 14 Placement heads TwinHead for high-precision IC placement Technical Data Optical centering with Fine-pitch vision module Flip-chip vision module Component range Component specifications max. height min. lead pitch min. bump pitch min. ball bump min. dimensions max. dimensions max. weight Programmable placement force Nozzle types 0603 to SO, PLCC, QFP, BGA, special components, bare dies, flip-chips 25 mm (larger heights on request) 0.4 mm 0.56 mm 0.32 mm 1.6 x 0.8 mm² 50 x 40 mm² (single measurement) For use with two nozzles 50 x 50 mm² or 69 x 10 mm² For use with one nozzle: 85 x 85 mm² or 125 x 10 mm² max. 200 x 125 mm² (with restrictions) 100 g 0201 to SO, QFP, sockets, plugs, BGA, special components, bare dies, flip-chips, shields 25 mm (larger heights on request) 0.25 mm 0.14 mm 0.08 mm 0.6 x 0.3 mm² 8 x 8 mm² (single measurement) 100 g 0.5 N - 15 N * 0.5 N - 15 N * 5 xx (standard) 4 xx + adapter 8 xx + adapter 9 xx + adapter 5 xx (standard) 4 xx + adapter 8 xx + adapter 9 xx + adapter Nozzle spacing on the 70.8 mm 70.8 mm two Pick&Place heads X/Y accuracy ± 35 µm/4 σ ± 30 µm/4 σ Angular accuracy 0.07 / 4 σ 0.07 / 4 σ *) A special nozzle is needed for forces < 1 N

15 Placement heads Nozzle Changers (Collect & Place Heads) 15 Innovation Nozzle changers increase the flexibility of placement heads when processing different components nozzle configuration can be quickly modified for new placement jobs accurate nozzle seat minimizes radial eccentricity defective nozzles are quickly replaced Description Up to 6 nozzle changers can be installed for the 6-segment or 12-segment Collect & Place heads (C&P6 or C&P12): Location 1: 2 nozzle changers (NC 6 or NC 12) Location 2: 1 nozzle changer (NC 6 or NC 12) Location 3: 2 nozzle changers (NC 6 or NC 12) Location 4: 1 nozzle changer (NC 6 or NC 12) Nozzle changer for the 12-segment Collect&Place head (NC12) Nozzle changer for the 6-segment Collect&Place head (NC6) Magazine for 12 type 9xx nozzles Magazine for 6 type 8xx nozzles Magazine for 6 type 9xx nozzles

16 16 Placement heads Nozzle changers (TwinHead) The nozzle changer (NCTH) for the TwinHead (TH) can be installed at location 1 and location 3. The supporting plate can hold up to 12 magazines for standard or special nozzles. Magazine for 1 special nozzle, gripper Magazine for 2 standard nozzles Position of the nozzle changers NCTH TH PCB NC6/NC12 PCB C&P12/C&P6 NC12 / NC12 or NC6 / NC6

17 Placement heads Nozzle changers Technical Data 17 Nozzle changers for the 12-segment Collect&Place head Dimensions (length x width x height) 449 x 62.7 x 77.7 mm³ Number of magazines min. 1 / max. 5, each with 12 nozzle holders Number of nozzle holders min. 12 / max. 60 Nozzle types 9 xx Nozzle change time < 200 ms per nozzle Compressed air connection 0.48 MPa (4.8 bar) Nozzle changers for the 6-segment Collect&Place head Dimensions (length x width x height) 448 x x 97.7 mm³ Number of magazines min. 1 / max. 6, each with 6 nozzle holders Number of nozzle holders min. 6 / max. 36 Nozzle types 8 xx, 9 xx Nozzle change time < 200 ms per nozzle Compressed air connection 0.48 MPa (4.8 bar) Nozzle changers for the SIPLACE TwinHead Dimensions (length x width x height) 448 x 68.5 x 49 mm³ Number of magazines min. 4 / max. 12 Number of nozzle holders min. 7 / max. 20 Nozzle types 4 xx with adapter 5 xx (standard) 9 xx with adapter Special nozzle, gripper Nozzle change time < 2 s per nozzle

18 18 PCB Conveyor Single conveyor Innovation The PCB is clamped from below for placement distance between the PCB and placement head is always constant placement rate does not depend on the PCB thickness fiducial contours are always sharply displayed improved PCB fiducial centering The width adjustment unit has a dedicated control circuit independent of other machine components faster and easier to adjust Description For placement, the PCB is clamped from below. The distance between the top of the PCB and the placement head thus remains unchanged for each PCB, and is no longer dependent on the thickness of the PCB. The placement rate is thus also independent of the PCB thickness. Since the distance between the PCB surface and the PCB camera remains the same, the PCB camera is always focussed on the PCB surface with the same level of sharpness. The PCB fiducial contours are optimally mapped on the CCD chip of the PCB camera. The inline PCB conveyor system quickly adapts to a wide range of PCB widths. The setting is made using the placement program or via the station software menu. The width of the PCB conveyor is monitored by an integral control circuit. The transport height can be modified, thus allowing the machines to be integrated into lines with a transport height of 830, 900, 930 or 950 mm. The PCB conveyors can communicate with the individual machines via the SMEMA interface. The fixed transport side can be located on the left or right for both the dual conveyor and the single conveyor. With this conveyor, the fixed side can be easily switched from right to left or vice versa. Movement and clamping of the PCBs are monitored and controlled by sensors. When the board has reached the placement area and passed the light barrier, it is braked. A laser light barrier determines the position of the board. As soon as the circuit board has reached its target position, the conveyor belt is stopped and the board is clamped from the underside. The placement process then starts immediately. Output conveyor Intermediate conveyor Input conveyor Placement area 2 Placement area 1

19 PCB conveyor Single conveyor Technical Data 19 Fixed conveyor side PCB format Standard (length x width) "Long board" option PCB thickness Standard Max. PCB warpage PCB weight Clearance on PCB underside Standard Option Component-free PCB handling edge PCB changeover time PCB positioning accuracy PCB transport height Type of interface Ink spot recognition Automatic width adjustment Right or left 50 x 50 mm² to 450 x 508 mm² 50 x 80 mm² to 610 x 508 mm² 0.3 mm to 4.5 mm (± 0,2 mm) (thicker PCBs on request) Up: 6 mm - PCB thickness Down: 0.3 mm + PCB thickness max. 3 kg 25 mm ± 0.2 mm max. 40 mm ± 0.2 mm 3 mm < 2.5 s ± 0.5 mm 830mm ± 15mm (standard) 900mm ± 15mm (optional) 930mm ± 15mm (optional) 950mm ± 15mm (SMEMA: optional) SMEMA / SIEMENS possible possible

20 20 PCB conveyor Dual conveyor Innovation As for single conveyor Plus: The dual conveyor can be configured online to create a single conveyor no mechanical conversion work required Reduced down times increased production throughput Description The PCB dual conveyor can greatly increase throughput with shorter down times - depending on the placement program. It allows two PCBs to be carried simultaneously (synchronously) or alternately (asynchronously) through the placement machine. In asynchronous mode, only one PCB in a transport track is processed. At the same time, another PCB in the second transport track is moved into the placement position. This saves the full conveying time of one PCB, thus considerably increasing performance, particularly for PCBs with a short cycle time. The placement process starts as soon as one PCB is transported into the processing area. Asynchronous conveyor mode In synchronous mode, two PCBs are moved into the placement position at the same time. They are processed as a common panel. In this way, the top and bottom of a PCB can be processed on a single line, The proportion of non-productive time is reduced as two circuit boards are always conveyed simultaneously. Synchronous conveyor mode

21 PCB conveyor Dual conveyor Technical Data 21 Fixed conveyor side PCB format Standard (length x width) "Long board" option Dual conveyor in "single conveyor" mode Standard "Long board" option PCB thickness Standard Max. PCB warpage PCB weight Clearance on PCB underside Standard Option PCB transport height Type of interface Component-free PCB handling edge PCB changeover time PCB positioning accuracy Conveyor mode Components on each conveyor PCB width on each conveyor Ink spot recognition Automatic width adjustment Right or left 50 x 50 mm² to 450 x 250 mm² 50 x 80 mm² to 610 x 250 mm² 50 x 50 mm² to 450 x 450 mm² 50 x 80 mm² to 610 x 450 mm² 0.3 mm to 4.5 mm (± 0,2 mm) (thicker PCBs on request) Up: 6 mm - PCB thickness Down: 0.3 mm + PCB thickness max. 3 kg 25 mm ± 0.2 mm max. 40 mm ± 0.2 mm 830mm ± 15mm (standard) 900mm ± 15mm (optional) 930mm ± 15mm (optional) 950mm ± 15mm (SMEMA: optional) SMEMA / SIEMENS 3 mm < 2.5 s ± 0.5 mm synchronous or asynchronous same or different same or different synchronous: not possible, asynchronous: possible synchronous: not possible, asynchronous: possible

22 22 PCB conveyor PCB Barcode for Product-Controlled Production (Option) Label dimensions Recommended label colors Code types Laser scanner safety Stroke width (W): 0.19 < W 0.3 mm (corresponds to high and medium density), stroke length: 4 mm, length of the barcode template window: 90 mm Coding: black, dark green, dark blue, background: white, beige, yellow, orange (contrast ratio > 70% to DIN Code 39, Code 128 / EAN 128, Codabar, 2/5 IATA 2/5 industrial, 2/5 interleaved, UPC, EAN, Pharma Code, EAN Addendum (others available upon request), max. 25 digits, a barcode filter may be defined Laser diode 670 nm (red) / 1.2 mw Laser protection class 2, degree of protection IP65 PCB barcode reader Q [mm] 2D on top 390 1D on top 390 2D on bottom 430 1D on bottom 430 PCB barcode reader L [mm] 1D on top D on bottom Downstream machine PCB barcode reader PCB overshoot [mm] 2D on bottom (dual conveyor) 17 PCB barcode reader LQ [mm] RQ [mm] 2D on top 3 3 1D on top 3 3 2D on bottom 5 5 1D on bottom 5 5 PCB barcode scanner 1D on top PCB dimensions/conveyor LO [mm] RO [mm] 460 mm SC mm SC mm DC mm DC1, 450 mm SM mm DC mm DC2, 450 mm SM2 3 3 PCB barcode scanner 1D bottom PCB dimensions/conveyor LU [mm] RU [mm] 460 mm SC mm SC mm DC mm DC1, 450 mm SM mm DC mm DC2, 450 mm SM SC - Single conveyor, DC1/2 - Dual conveyor, track 1/2, SM1/2 - Dual conveyor in Single conveyor mode, track 1/2

23 Component Feeding Component Changeover Table 23 Innovation Automatic coupling and uncoupling Combined interface for both electrical and pneumatic connections Cables no longer have to be connected and disconnected manually Precise alignment particularly important for small components Easy to convert for other PCB transport heights Tape reel diameter from 7 up to 19 high flexibility Description Up to four component changeover tables may be coupled to the machine. Optionally, a matrix tray changer may be installed at locations 2 or 4. The component changeover tables are stand-alone modules that can be set up at an external set-up area with feeders. In this way, changes only interrupt the production process for a short time. The chassis runs smoothly and is easy to maneuver. There are pockets for holding set-up list print-outs on both sides of the component changeover table. The operator has unhindered access to the documents, even during production. The component feeder table has a capacity of up to 15 locations for 30 mm wide feeders. The total capacity with four component changeover tables is thus 180 x 8 mm tracks. Bulk case feeders and vibratory stick feeders may be set up in addition to the tape feeders. Dummy feeders are used at unassigned locations to protect the operators. The communication unit sends the necessary voltages and control signals to the feeders. The component feeders are at rest during the placement process, which means that components can be refilled (in sticks, for example) and tapes may be spliced without stopping the machine. An optional component barcode reader can be used to scan and check the barcodes on the tape reels, thus guaranteeing that the components are allocated to the correct tracks. Location 3 Location 4 Location 2 Location 1

24 24 Component feeding Component Changeover Table Technical Data Length x width Height PCB transport height Weight without feeder with feeders at every location with compressed air supply for bulk case feeder and adapter for the 3rd tape reel Reel diameter standard maximum 633 x 592 mm² 859 mm for 830 mm PCB transport height 929 mm for 900 mm PCB transport height 959 mm for 930 mm PCB transport height 979 mm for 950 mm PCB transport height 830 mm ± 15 mm (standard) 900 mm ± 15 mm (SMEMA) 930 mm ± 15 mm (SMEMA) 950 mm ± 15 mm (SMEMA) approx. 105 kg approx. 145 kg approx. 170 kg up to 432 mm (17 ) 483 mm (19 ) Feeder locations max. 15 Changeover time less than 1 min. Component feeder table Communication unit Centering Pocket for set-up list print-outs Tape container Waste container for pieces of used tape

25 Component feeding Tape Feeders 25 Technical data Packaging Model Locations Paper and blister tapes Blister tapes 2 x 8 mm S a) 3 x 8 mm S 3 x 8 mm S b) 12/16 mm S 24/32 mm S 1 x 44 mm S 1 x 56 mm S 1 x 72 mm S 1 x 88 mm S a) Fiducial for feeder position recognition; b) for 0201 and 0402 only; c) variable in 4 mm increments. Description Only 9 different feeder sizes are needed to feed tapes from 8 mm to 88 mm. Reels are kept in the tape container on the component changeover table. A cutting device Transport distance 2/4 mm 2/4 mm 2/4 mm 4/16 mm c) 4/40 mm c) 4/52 mm c) 4/68 mm c) 4/80 mm c) 4/88 mm c) Max. CO height 2.5 mm 2.5 mm 0.7 mm 14 mm Tape reels mm diameter (7" - 19") Feeder cycle S feeder up to 20 mm transport distance < 150 ms automatically cuts the used tape. SIPLACE feeders have short cycle times and highprecision pick-up positions. Even multiple products and small batch sizes are easy to handle since the feeders can be quickly changed over: Both the tape cycle increment and the use of tape materials are variable. SIPLACE feeders are suitable for both paper and plastic tapes. This represents a significant benefit in terms of both cost and logistics. A signal from the communication unit enables the feeders to automatically control the entire feeder sequence, including automatic strip take-up. The S feeders have shorter cycle times and can process tapes with a pocket pitch of 2 mm (8 mm S). The 8 mm S and 12/16 mm S also have a component cover. The feeders can also be used in other SIPLACE placement machines. 2 x 8 mm S 12/16 mm S 56 mm S 3 x 8 mm S 24/32 mm S 72 mm S 3 x 8 mm S mm S 88 mm S

26 26 Component feeding Bulk case feeder Technical data Bulk case feeder a) Packaging form Feeder rails Location Vibratory stick feeder, type 3 Number of tracks and width Location a) Fiducial for feeder position recognition Bulk case feeder Bulk case Chip 0402, CO height: 0.35 mm Chip 0402, CO height: 0.50 mm Chip 0603, CO height: 0.45 mm Chip 0603, CO height: 0.80 mm Chip 0805, CO height: 0.45 mm Chip 0805, CO height: 0.60 mm Chip 0805, CO height: 0.85 mm Chip 0805, CO height: 1.25 mm Micro-Melf: 1.05 ± 0.05 mm Mini-Melf: 1.4 ± 0.1 mm 1 location for 2 different component types with control circuit 3 x 9.5 mm 2 x 15 mm 1 x > 15 mm 1 x 30 mm 1 location Description The SIPLACE bulk case feeder processes bulk cases on two tracks. It feeds rectangular and round, passive components. The PCB magazines (bulk cases) are simply replaced for refilling - without stopping the machine. The module essentially consists of the basic element plus two feeder rails and PCB magazines to suit the component type and height. The components are separated and fed along the rails by compressed air. The principle of the fixed component pocket has proven most suitable, even when using bulk cases: the vibrations that occur with other placement machine concepts can greatly impair the component quality due to friction, for example. The stationary component feeder also has significant advantages with stick magazines: the universal vibratory stick feeder can be refilled during placement. Vibratory - stick feeder, type 3

27 Component feeding Dummy Feeders 27 The following dummy feeders may be used: SIPLACE dummy feeder for 1 location SIPLACE dummy feeder for 6-10 locations SIPLACE dummy feeder for locations Dummy feeder for 1 location Danger To ensure that your SIPLACE placement machine runs safely, a feeder must be assigned to every location on the component changeover table. If you do not have enough feeders, then you should use dummy feeders as space holders. Dummy feeder for locations Dummy feeder for 6-10 locations

28 28 Component feeding Manual Trays Technical data Sizes Max. tray height Parts JEDEC waffle tray Manual tray - possible positions 136 x 360 mm²; requires 5 locations 260 x 360 mm²; requires 9 locations 12.5 mm, including component Waffle tray carrier Tray holder Directly in the waffle tray carrier 136 mm wide Description The manual tray is a device for holding JEDEC trays used to supply components. The waffle trays are changed manually. The manual tray is placed on the component feeder table just like a feeder. There are two different versions of the waffle tray: one fills 5 locations, while the other takes up 9 locations on the component feeder table. On the SIPLACE HF, the manual tray is used at location 2 or location 4. This option is recommended if there are only a few types of component to be placed from a tray. Waffle tray Component feeder table Manual tray

29 Component feeding Matrix Tray Changer 29 Innovation Two mutually-independent magazine towers optional, programmable access to all waffle trays Capacity of up to 100 JEDEC trays production is not interrupted when the tray is changed Integral chassis easy to couple PCB transport height can be changed with just a few easy actions Description If components are supplied to the placement process in several waffle trays, we recommend an automatic magazine change using a matrix tray changer (MTC). The MTC set-up is precisely matched to the placement sequence in order to optimize the timings and distances traveled. Two towers with waffle trays move independently of one another in the vertical direction until the desired magazine is within range of the feed axis. The horizontal feed axis transports the waffle-pack tray from the tower into the access area of the placement head. The first magazine is made available as soon as a PCB moves onto the PCB conveyor, and valid panel and set-up data is available. All other magazine changes are carried out time-neutrally during the placement process. The magazines can be refilled without stopping the machine. Defective components are returned to the original tray. Tray supply 2 Tray supply 1 Feed axis 2 Feed axis 1

30 30 Component feeding Matrix Tray Changer Technical Data Tray supply 1 (XL) Tray supply 2 Dimensions length x width height Weight (basic equipment) Weight (fully equipped) 1305 x 600 mm² 1490 mm for 830 mm PCB transport height 1560 mm for 900 mm PCB transport height 1590 mm for 930 mm PCB transport height 1640 mm for 950 mm PCB transport height approx. 500 kg (with PCB magazines and waffle tray carriers) approx. 534 kg (with components) Weight (moving mass) approx. 80 kg approx kg PCB magazine size (L x W x H) x x 93.3 mm³ x x mm³ PCB magazine weight (fully equipped) (without waffle tray carrier) approx. 11 kg approx. 1.7 kg approx. 7.5 kg approx kg Weight of the waffle tray carrier 850 g 150 g Dimensions of the waffle tray carrier (L x W x H) x x 11.1 mm³ 371 x 146 x 10.1 mm³ Distance from PCB mag. to mag. 96 mm 135 mm Distance from level to level 12 mm 11.8 mm Vertical travel 444 mm (1st to 30th WTC * ) mm (1st to 40th WTC * ) Horizontal travel between outgoing and pick-up position approx. 647 mm approx. 638 mm Storage capacity 30 XL waffle-pack tray carriers with 60 JEDEC or 30 special magazines of maximum size 40 waffle tray carriers with 40 JEDEC waffle trays Changeover time (over 5 levels) approx. 2 sec approx. 1.5 sec Max. height of component and waffle tray, including tolerances all levels filled one level free two levels free 8.5 mm 19.5 mm 31.5 mm 8.5 mm 19.5 mm - Max. floor loading (fully equipped) per foot per roller 6.93 kg/cm² 356 kg/cm² *) Waffle tray carrier

31 Component feeding Matrix Tray Changer Technical Data 31 Electrical ratings Supply voltage Total power Rated current Fuses Rated power consumption of the largest consumer 3 x 400 VAC, 50 Hz (Europe) 3 x 208 VAC, 60 Hz (USA) 1.5 kw 2.7 A at 3 x 400 VAC 4.2 A at 3 x 208 VAC 3 x 16 A 2 A Noise emissions Maximum noise emissions 74 db (A) Permitted environmental factors Room temperature between 15 C and 35 C Atmospheric humidity % (No higher than 45% on average to prevent any possibility of condensation on the machine)

32 32 Technical Data Connections Electrical ratings Supply voltage Fuses Total connected load Total power Rated power consumption of the largest consumer Power failure 3 x 208 VAC ± 5 %; 50/60 Hz (for the U.S.A. version) 3 x 230 VAC ± 5 %; 50/60 Hz 3 x 380 VAC ± 5 %; 50/60 Hz 3 x 400 VAC ± 5 %; 50/60 Hz (Europe) 3 x 415 VAC ± 5 %; 50/60 Hz 3 x 32 A (3 x 208 VAC / 3 x 230 VAC) 3 x 16 A (3 x 380 VAC / 3 x 400 VAC / 3 x 415 VAC) 11.1 kva 6.5 kw 8.4 A max. 20 msec Compressed air specifica- tion p min p max 0.5 MPa = 5.0 bar 1.0 MPa = 10 bar Connection 3/4" Compressed air consumption 350 st. l/min (C&P * / TH ** ), 450 st. l/min (2 x C&P * ), 300 st. l/min (2 x TH ** ) Particle size 0.1 µm Particle density Maximum oil content (class 1) 0.1 mg/m³ Particle density 0.01 mg/m³ Pressure dewpoint (class 4) Dewpoint + 3 * Collect & Place head ** TwinHead

33 Technical Data Connections 33 Power connector 5 x 6 mm² cable with CEKON plug 5 x 32 A PC and LAN connection SMEMA interface Compressed air connection

34 34 Technical Data Dimensions and set-up conditions Length with both extension kits with one extension kit with no extension kits Width of basic machine with monitor with tilted, fold-down keyboard Weight of basic machine Weight, machine fully equipped 2380 mm 2103 mm 1826 mm 2515 mm 2614 mm plus 132 mm for each keyboard 3800 kg 4700 kg Footprint 6.01 m² Specific floor loading with 6 machine feet 3 machine feet Load per unit area of the foundation Height of the machine with main fault indicator for PCB transport height of: 830 mm 900 mm 930 mm 950 mm Machine ground clearance for PCB transport height of: 830 mm 900 mm 930 mm 950 mm Maximum noise emissions 75.3 N/cm² N/cm² min kg/m² up to 1955 mm up to 2025 mm up to 2055 mm up to 2075 mm 120 mm 190 mm 220 mm 240 mm 74 db (A) Room temperature between 15 C and 35 C Atmospheric humidity 30 to 75 % (no higher than 45% on average to prevent any possibility of condensation on the machine)

35 Technical Data Dimensions and set-up conditions Placement system s center of gravity 35

36 36 Technical Data Maneuvering radii MTC dimensions and set-up conditions

37 Technical Data Transport and Delivery Configuration 37 Transport dimensions and weight Length Width Height Weight Means of transport A fork-lift truck with the following specification will be needed to carry the machine in its crate: Fork length Lifting power Clear fork width Machine weight and floor loading Weight of basic machine Weight (fully equipped) Vibration limits 2404 mm 2790 mm 1600 mm 4287 kg (ready for dispatch) min mm min kg min. 350 mm 3800 kg 4700 kg Footprint 6.01 m² Number of machine feet 6 Load per unit area of the foundation min kg/m² Specific floor loading per foot for 6 machine feet for 3 machine feet Third-octave spectral value of the vibration speed Hz v max value on the time curve 75.3 N/cm² N/cm² v < 250 µm/s v max < 1.5 mm/s Description The placement machine is supplied in a wooden crate, mounted on a stable wooden pallet. Configuration when delivered The extension kit on the PCB input side and the computer unit are disconnected from the basic machine. All electrical cables to the basic machine are disconnected. Each track on the single or dual conveyor is set to a width of 136 mm. The input conveyors of the single and dual conveyor are dismantled. The electrical cables to the conveyor motors and light barriers are disconnected. Both keyboards are folded down vertically. The main fault indicator is dismantled. Engagement point for the fork-lift Engagement point for the fork-lift

38 38 Sample Configuration Services As a service, SIEMENS L&A can fully integrate the SIPLACE HF placement machine into your production line. With our extensive expertise and by using the right tools and equipment, we can ensure that the installation process runs smoothly and efficiently. However, this will require you to clarify the infrastructure aspects in advance and make any necessary changes at your production facility. Safety instructions Read the operating instructions before starting to set up and commission the placement machine. The applicable accident prevention regulations concerning the transportation of heavy goods must be followed. Component reject bin TH Nozzle changer TH Fine pitch vision module Flip chip vision module TH C&P12 Component changeover table with 15 locations Nozzle changer C&P12 Nozzle changer C&P12 5-part conveyor belt with automatic width adjustment from 50 mm to 508 mm (2 to 20 ) PCB transport direction

39 39

40 Siemens AG Logistics and Assembly Systems Electronics Assembly Systems Rupert-Mayer-Str. 44 D Munich Tel: Fax: Siemens Pte. Ltd. Logistics and Assembly Systems Electronics Assembly Systems The Siemens Centre, 60 MacPherson Road Singapore Tel: Fax: Siemens Dematic Electronics Assembly Systems Inc Northwoods Parkway, Suite 300 Norcross, GA 30071, USA Tel: SIPLACE Fax: Siemens Dematic China Ltd. Electronics Assembly Systems 20F Majesty Building, No. 138 Pu Dong Avenue, Shanghai P. R. China, Tel: Fax: The information in this brochure is merely a general description and lists performance features that will not necessarily be present as described in the specific application, or that may be modified if the product is further developed. The desired performance features are only binding if expressly agreed when the contract is concluded. Siemens AG Internet: Edition HF-e Order no. A10002-P141-T1-X-7600 We reserve the right to make changes. Printed in Germany

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