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1 9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) info@systemplus.fr - website : March Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 1
2 Glossary 1. Overview / Introduction Executive Summary Reverse Costing Methodology 2. STMicroelectronics Company Profile STMicroelectronics Profile MEMS Accelerometer Portfolio LIS3DH Characteristics LIS3DH Block Diagram STMicroelectronics Business Model 3. Apple ipod Nano 6G Teardown Table of Contents 5. Manufacturing Process Flow MEMS Sensor Masses Removed MEMS Cross-Section MEMS Process Characteristics Physical Data Summary 5. Manufacturing Process Flow Global Overview ASIC Process Flow Description of the ASIC Wafer Fabrication Unit MEMS Process Overview MEMS Sensor Process Flow MEMS Cap Process Flow MEMS Wafer Bonding Process Flow Description of the MEMS Wafer Fabrication Unit 4. Physical Analysis Synthesis of the Physical Analysis 6. Cost Analysis Physical Analysis Methodology Synthesis of the Cost Analysis Package Characteristics & Markings (LIS3DH) Main Steps of Economic Analysis Package Characteristics & Markings (A2L) Yields Explanation Package Pin-Out Yields Hypotheses Package X-Ray Die per wafer & Probe Test Package Cross-Section ASIC Front-End : Hypotheses Device Structure ASIC Front-End Cost Package Opening (LIS3DH) ASIC Back-End 0 : Probe Test, Backgrinding & Dicing Package Opening (A2L) ASIC Die Cost ASIC Dimensions (LIS3DH) MEMS Front-End : Hypotheses ASIC Dimensions (A2L) MEMS Front-End Cost ASIC Markings MEMS Front-End Cost per Process Steps ASIC Bond Pads MEMS Front-End : Equipment Cost per Family ASIC MIM Capacitors MEMS Front-End : Material Cost per Family ASIC Delayering MEMS Back-End 0 : Probe Test & Dicing ASIC Cross-Section MEMS Die Cost (Front End + Back End 0) ASIC Process Characteristics Back-End 1 : Packaging Cost (LIS3DH / A2L) MEMS Dimensions (LIS3DH) Back-End 1 : Final test & Calibration Cost MEMS Dimensions (A2L) LIS3DH Component Cost (FE + BE 0 + BE 1) MEMS Markings A2L Component Cost (FE + BE 0 + BE 1) MEMS Bond Pads Opening MEMS Bond Pads 7. Estimated Manufacturer Price Analysis MEMS Cap Opening Definition of Prices MEMS Cap Manufacturer Financial Ratios MEMS Sealing Frame LIS3DH Estimated Manufacturer Price MEMS Comparison with Previous Generation LIS3DH Estimated Selling Price MEMS Sensor Optical Overview A2L Estimated Manufacturer Price MEMS Sensor SEM Overview A2L Estimated Selling Price MEMS Sensor X/Y Axes MEMS Sensor Z Axis Conclusion by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 2
3 STMicroelectronics Profile LIS3DH Overview: Courtesy of STMicroelectronics 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 3
4 Apple ipod Nano 6G Teardown The LIS3DH is the official reference of the 3-Axis accelerometer integrated in the Apple ipod nano 6G, and labeled A2L". ipod nano 6G 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 4
5 Apple ipod Nano 6G Teardown Front view Back view Display removed 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 5
6 2.0mm Packages Characteristics & Markings 3.0mm Two references are analyzed: STMicro LIS3DH: 3.0x3.0x1.0mm Package STMicroelectronics standard component Package Marking: C3H Apple A2L: 2.0x2.0x1.0mm Package Apple ipod Nano 6G component Package Marking: A2L 3.0mm 2.0mm A2L LIS3DH 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 6
7 Device Structure The schematic diagram below is based on the observations made during this study and detailed in the next slides. ASIC MEMS Cap MEMS Sensor 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 7
8 MEMS Cap Opening Cavity MEMS Cap X/Y Axes Z Axis MEMS Sensor A cavity in the Cap is etched only above the Z-axis of the sensor by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 8
9 MEMS - Cross-Section Cross-section Overview Wire bonding (Au) Bond pad (Au) Markings (Au) Cap/Sensor bonding interface (Au) Cap Sensor MEMS Cross-Section Optical View 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 9
10 Sensor Process Flow Sensor wafer Gold bond pads (lift-off patterning) Oxide 1 Gold Polysilicon 2 Si Substrate Oxide 2 Polysilicon 1 Gold Polysilicon 2 Sensor wafer Trench Etch (DRIE) Oxide 1 Oxide 2 Polysilicon 1 Gold Polysilicon 2 Sensor wafer Release (HF vapor etching) Oxide 1 Oxide 2 Polysilicon by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 10
11 Main steps of economic analysis Front-End ASIC Front-End Cost MEMS Front-End Cost Back-End 0 Probe Test Cost Backgrinding & Dicing Cost Probe Test Cost Dicing Cost Back-End 1 Packaging Cost Final Test Cost Component Cost LIS3DH / A2L We perform the economic analysis of the ASIC with the IC Price+ software. We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 11
12 ASIC Die Cost (Front-End + Back-End 0) 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 12
13 MEMS Front-End Cost 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 13
14 LIS3DH Component Cost (FE + BE 0 + BE 1) 2011 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro LIS3DH / Apple A2L 3-Axis MEMS Accelerometer 14
21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :
21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr November 2012 - Version 1 Written by: Romain FRAUX DISCLAIMER :
9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :
9 rue Alfred Kastler - BP 10748-44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr January 2012 Written by: Maher SAHMIMI DISCLAIMER :
Electronic Costing & Technology Experts
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9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :
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9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :
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