FUJITSU Component Wireless module

Transcription

1 FUJITSU Component Wireless module Bluetooth Smart Module MBH7BLZ Datasheet Rev DEC 15, 2014 The above Product is designed, developed and manufactured as contemplated for general use, including without limitation, general office use, personal use, household use, and ordinary industrial use, but is not designed, developed and manufactured as contemplated (1)for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite), hereinafter referred to as "High Safety Required Use". You shall not use this Product without securing the sufficient safety or reliability required for the High Safety Required Use. If you wish to use this Product for High Safety Required Use, please consult with our sales representatives in charge before such use. Fujitsu Component Limited All specifications are preliminary which may be changed without any prior notice

2 1. Summary Features Applicable Standard Block Diagram Electrical Characteristics General Features Absolute Maximum Rating Recommendable Operating Condition Operating Temperature Operating Voltage (Using Internal LDO Regulator) I/O Terminal Characteristics Memory Flash Memory RAM Internal kHz RC Oscillator External kHz Crystal Oscillator Power Management Current Consumption General radio characteristics Transmitter Specifications Receiver sensitivity Receiver specifications Interface Specification Debugger Interface SoftDevice Pin Description Pin assignment and Pin Description Pin State on Reset Internal Circuit Diagram Mechanical Characteristics Appearance and Dimensions Marking

3 9-3. Recommended Land Pattern Appearance specification Recommended Reflow Profile Storage Conditions Packing Specification in shipment Carrier Tape Appearance and Dimensions Reel Appearance and Dimensions Taping Direction and Packing Quantity Tape Reel Strength Bar code label Package Revision History

4 1. Summary This datasheet applies to the Bluetooth Smart Module MBH7BLZ Features This product is surface-mount module compliant with Bluetooth Specification Version 4.1, and is possible to communicate in an ISM(Industrial Scientific Medical) band. You can develop and embed your own application code in this module by using software development kit(sdk) and software stack provided by Nordic Semiconductor, whose RF SoC our module based on. The followings are the key features. Bluetooth Specification Version 4.1 (Single mode Low Energy radio) Compliant Nordic Semiconductor nrf51822 based All GPIO pins(gpio_0 to GPIO_30) of nrf51822 are assigned to this module (Possible to use them as SPI, TWI, UART and ADC) Complete Bluetooth protocol stack provide by Nordic Semiconductor Power Supply: 1.9~3.6V * Please refer to the section 5-3 for details. RoHS Compliant Surface mount type Small footprint ( 10.5mm x 9.2mm x 1.6mm ) The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by FUJITSU COMPONENT LIMITED is under license. Other third-party brands and names are the property of their respective owners

5 3. Applicable Standard Bluetooth Specification Version 4.1 QDID: ARIB STD-T66 Radio Act(Japan) Certification No. 007-AB0237 *Certification has been acquired specifying antennas. If you want to get the certification using other antennas, please contact our local sales. * Don't rewrite the SoftDevice from Nordic Semiconductor website. If rewrote it, the certification might become disabled by the radio law of each country. Please contact our local sales for details. 4. Block Diagram MBH7BLZ01 VDD GPIO SWDCLK SWDIO/nRESET nrf51822 Crystal Matching Component RF 16MHz - 5 -

6 5. Electrical Characteristics 5-1. General Features Bluetooth Specification Version 4.1 Compliant Carrier Frequency: 2400MHz ~ MHz Modulation: GFSK Symbol Rate: 1Mbps Data Rate: 1Mbps Channel: 40ch Channel Spacing: 2MHz Output power: +4 dbm max - 6 -

7 5-2. Absolute Maximum Rating Items Symbol Min Max Unit Supply voltage (VDD) VDD V Supply voltage (GND) GND - 0 V Supply voltage (I/O) VIO -0.3 VDD+0.3 V Storage Temperature Tstg C 5-3. Recommendable Operating Condition Operating Temperature Items Symbol Min Typ Max Unit Operating Temperature Topr C Operating Voltage (Using Internal LDO Regulator) Items Symbol Min Typ Max Unit VDD VDD V * Supply power to VDD pin, and VDD1.8 pin should be floating I/O Terminal Characteristics Items Symbol Min Typ Max Unit Input high voltage V IH 0.7VDD - VDD V Input low voltage V IL GND - 0.3VDD V Output high voltage (std. drive, 0.5 ma) V OH VDD VDD V Output high voltage (high-drive, 5 ma) V OH VDD VDD V Output low voltage (std. drive, 0.5 ma) V OL GND V Output low voltage (high-drive, 5 ma) V OH GND V Pull-up resistance R PU kω Pull-down resistance R PD kω - 7 -

8 5-5. Memory Flash Memory Flash Size Page Size Number of Pages 256kByte 1024Byte 256 Items Max Unit Endurance write/erase cycles Retention 10 years at 40 C Number of times an address can be written between erase cycles 2 times RAM RAM Size Block Start address Size Block0 0x kByte 16kByte Block1 0x kByte 5-6. Internal kHz RC Oscillator Description Symbol Min. Typ. Max. Unit Nominal frequency fnom,rc32k khz Frequency tolerance ftol,rc32k ±2 % Frequency tolerance (Calibration interval 4s) ftol,cal,rc32k ±250 ppm Run current IRC32k μa Startup time tstart,rc32k 100 ms 5-7. External kHz Crystal Oscillator Description Symbol Min. Typ. Max. Unit Crystal frequency fnom,x32k khz Frequency tolerance, Bluetooth low energy applications ftol,x32k,ble ±250 ppm Load capacitance CL,X32k 12.5 pf Shunt capacitance C0,X32k 2 pf Equivalent series resistance RS,X32k kω Drive level PD,X32k 1 μw Input capacitance on XL1 and XL2 pads Cpin 4 pf Run current for khz crystal oscillator IX32k μa Startup current for khz crystal oscillator ISTART,X32k μa Startup time for khz crystal oscillator tstart,x32k s Note: This product embedding kHz RC Oscillator, external kHz Crystal Oscillator is not necessarily required. It is possible to add external kHz Crystal Oscillator satisfying above-mentioned specification to increase accuracy of clock, or to reduce power consumption

9 5-8. Power Management Description Symbol Min. Typ. Max. Units Time Reset is active from VDD reaches 1.7 V with 1 μs rise time tpor, 1μs ms Time Reset is active from VDD reaches 1.7 V with 50 ms rise time tpor, 50 ms ms Current in SYSTEM-OFF, no RAM retention IOFF 0.4 μa Current in SYSTEM-OFF mode 8 kb SRAM retention IOFF, 8 k 0.6 μa Current in SYSTEM-OFF mode 16 kb SRAM retention IOFF, 16 k 0.8 μa OFF to CPU execute transition current IOFF2ON 400 μa OFF to CPU execute toff2on μs SYSTEM-ON base current ION 2.3 μa Current drawn by 1V2 regulator I1V2 290 μa Startup time for 1V2 regulator t1v2 2.3 μs Current drawn by 1V7 regulator I1V7 90 μa Startup time for 1V7 regulator t1v μs * Power Management are guaranteed as SoC (nrf51822) Current Consumption Ta=25±2 C Description Symbol Min. Typ. Max. Units TX only run P OUT = +4 dbm I TX,+4dBm 16 ma TX only run P OUT = 0 dbm I TX,0dBm 10.5 ma TX only run P OUT = -4 dbm I TX,-4dBm 8 ma TX only run P OUT = -8 dbm I TX,-8dBm 7 ma TX only run P OUT = -12 dbm I TX,-12dBm 6.5 ma TX only run P OUT = -16 dbm I TX,-16dBm 6 ma TX only run P OUT = -20 dbm I TX,-20dBm 5.5 ma TX only run P OUT = -30 dbm I TX,-30dBm 5.5 ma TX startup current (*1) I START,TX 7 ma RX only run current I RX 13 ma RX startup current (*2) I START,RX 8.7 ma Run current for 16 MHz crystal oscillator I X16M 470 ua khz RC oscillator Run current I RC32k ua SYSTEM-ON base current with 16 kb RAM enabled I ON 2.6 ua Current drawn by 1V2 regulator and 16 MHz XOSC when both are on at the same time I 1V2XO ua Current drawn by 1V7 regulator I 1V7 105 ua Run current at bps I UART115k 220 ua Run current at 1200 bps I UART1k2 210 ua Current consumption in addition to IRX RSSI CURRENT 250 ua *1) Average current consumption (at 0 dbm TX output power) for TX startup (130 μs), and when changing mode from RX to TX (130 μs). *2) Average current consumption for RX startup (130 μs), and when changing mode from TX to RX (130 μs)

10 5-10. General radio characteristics Ta=25±2 C Items Condition Min Typ Max Unit Operating frequencies 2MHz channel spacing MHz PLL programming resolution 1 MHz Frequency deviation ±225 ±250 ±275 khz Transmitter Specifications Ta=-25 C~75 C Items Condition Min Typ Max Unit Output power dbm Step size of RF power control 4 db RF power control range db 20 db bandwidth for modulated carrier khz 1st Adjacent Channel Transmit Power 1MHz -20 dbc 2nd Adjacent Channel Transmit Power 2MHz -40 dbc Maximum consecutive transmission time 16 ms f0-fn 50kHz (n=2,3,4 k) khz Carrier frequency offset and drift f1-f0 20kHz khz fn-fn-5 n=6,7,8 k 20kHz khz Receiver sensitivity Ta=-25 C~75 C Items Condition Min Typ Max Unit Maximum received signal strength < 0.1% PER 0 dbm Receiver sensitivity Ideal transmitter -93 dbm Dirty transmitter -91 dbm Receiver specifications Ta=25±2 C Items Condition Min Typ Max Unit C/I co-channel db 1st ACS, C/I 1 MHz db 2nd ACS, C/I 2 MHz db RX selectivity ACS, C/I (3+n) MHz offset [n = 0, 1, 2,...] db lmage blocking level db Adjacent channel to image blocking level (±1 MHz) db RX intermodulation IMD performance, 3rd, 4th and 5th offset channel dbm

11 6. Interface Specification 6-1. Debugger Interface Serial wire Debug (SWD) interface is composed of two lines; SWDCLK pin and SWDIO pin. RESET is a pin provided as a SWDIO functions. RESET pin is used as SWDIO in debugger interface mode, and the reset function is disabled as far as it is in the mode. 7. SoftDevice This product permits use of the following Softdevice. s110_nrf51822_7.0.0_softdevice.hex

12 8. Pin Description 8-1. Pin assignment and Pin Description <TOP View> MBH7BLZ Internal connection with I/O Description / nrf51822 External Connection No Name No Name 1 GND - VSS - Ground 2 VDD DEC2 - Should be floating 3 GND - VSS - Ground 4 GPIO_17 25 P0.17 I/O General purpose I/O pin 5 GPIO_19 27 P0.19 I/O General purpose I/O pin 6 GPIO_18 26 P0.18 I/O General purpose I/O pin 7 GPIO_20 28 P0.20 I/O General purpose I/O pin 8 GPIO_16 22 P0.16 I/O General purpose I/O pin 9 GPIO_15 21 P0.15 I/O General purpose I/O pin 10 GPIO_14 20 P0.14 I/O General purpose I/O pin 11 GPIO_13 19 P0.13 I/O General purpose I/O pin 12 GPIO_12 18 P0.12 I/O General purpose I/O pin 13 GPIO_27 46 P0.27/AIN1/XL1 I/O General purpose I/O pin Connection for khz crystal oscillator or external khz crystal reference. 14 GPIO_26 45 P0.26/AIN0/XL2 I/O General purpose I/O pin Connection for khz crystal oscillator. 15 GND - VSS - Ground 16 GPIO_21 40 P0.21 I/O General purpose I/O pin 17 GPIO_22 41 P0.22 I/O General purpose I/O pin 18 GPIO_23 42 P0.23 I/O General purpose I/O pin 19 GPIO_24 43 P0.24 I/O General purpose I/O pin 20 GPIO_6 10 P0.06/AIN7/AREF1 I/O General purpose I/O pin 21 GPIO_5 9 P0.05/AIN6 I/O General purpose I/O pin 22 GPIO_4 8 P0.04/AIN5 I/O General purpose I/O pin 23 GPIO_3 (U_RX) 7 P0.03/AIN4 I/O General purpose I/O pin 24 GPIO_2 (U_CTS) 6 P0.02/AIN3 I/O General purpose I/O pin 25 GPIO_1 (U_TX) 5 P0.01/AIN2 I/O General purpose I/O pin 26 GPIO_0 (U_RTS) 4 P0.00/AREF0 I/O General purpose I/O pin 27 GND - VSS - Ground 28 VDD 1,12 VDD - Power supply 29 GND - VSS - Ground

13 MBH7BLZ Internal connection with I/O Description / nrf51822 External Connection No Name No Name 30 GPIO_25 44 P0.25 I/O General purpose I/O pin 31 GPIO_29 48 P0.29 I/O General purpose I/O pin 32 GPIO_28 47 P0.28 I/O General purpose I/O pin 33 GPIO_30 3 P0.30 I/O General purpose I/O pin 34 GPIO_7 11 P0.07 I/O General purpose I/O pin 35 GPIO_8 14 P0.08 I/O General purpose I/O pin 36 GPIO_9 15 P0.09 I/O General purpose I/O pin 37 GPIO_10 16 P0.10 I/O General purpose I/O pin 38 GPIO_11 17 P0.11 I/O General purpose I/O pin 39 SWDIO/nRESET 23 SWDIO/nRESET I System reset. (Input must be low for > 0.2μs.) Also HW debug and flash programming 40 SWDCLK 24 SWDCLK I HW debug and flash programming 41 GND - VSS - Ground 42 GND - VSS - Ground 43 GND - VSS - Ground 44 GND - VSS - Ground 45 GND - VSS - Ground 46 GND - VSS - Ground 47 GND - VSS - Ground 48 GND - VSS - Ground 49 GND - VSS - Ground 50 GND - VSS - Ground 51 RF 31,32 ANT1/ANT2 RF I/O RF Input/Output 52 GND - VSS - Ground 53 GND - VSS - Ground 54 GND - VSS - Ground 55 GND - VSS - Ground 56 GND - VSS - Ground

14 8-2. Pin State on Reset No Name State 4 GPIO_17 Input with disconnect input buffer 5 GPIO_19 Input with disconnect input buffer 6 GPIO_18 Input with disconnect input buffer 7 GPIO_20 Input with disconnect input buffer 8 GPIO_16 Input with disconnect input buffer 9 GPIO_15 Input with disconnect input buffer 10 GPIO_14 Input with disconnect input buffer 11 GPIO_13 Input with disconnect input buffer 12 GPIO_12 Input with disconnect input buffer 13 GPIO_27 Input with disconnect input buffer 14 GPIO_26 Input with disconnect input buffer 16 GPIO_21 Input with disconnect input buffer 17 GPIO_22 Input with disconnect input buffer 18 GPIO_23 Input with disconnect input buffer 19 GPIO_24 Input with disconnect input buffer 20 GPIO_6 Input with disconnect input buffer 21 GPIO_5 Input with disconnect input buffer 22 GPIO_4 Input with disconnect input buffer 23 GPIO_3 (U_RX) Input with disconnect input buffer 24 GPIO_2 (U_CTS) Input with disconnect input buffer 25 GPIO_1 (U_TX) Input with disconnect input buffer 26 GPIO_0 (U_RTS) Input with disconnect input buffer 30 GPIO_25 Input with disconnect input buffer 31 GPIO_29 Input with disconnect input buffer 32 GPIO_28 Input with disconnect input buffer 33 GPIO_30 Input with disconnect input buffer 34 GPIO_7 Input with disconnect input buffer 35 GPIO_8 Input with disconnect input buffer 36 GPIO_9 Input with disconnect input buffer 37 GPIO_10 Input with disconnect input buffer 38 GPIO_11 Input with disconnect input buffer 39 SWDIO/nRESET Pull-up 40 SWDCLK Pull-down

15 8-3. Internal Circuit Diagram

16 9. Mechanical Characteristics 9-1. Appearance and Dimensions Unit: mm 9-2. Marking Product code: BLZ01 Identification number Lot number: 4 X 00 Serial number: 00 ~ Month: 1 ~ 9, X, Y, Z Year: The last digit of year Revision number: AA ~ Logo mark Example

17 9-3. Recommended Land Pattern Following land pattern is recommended for your board design. However, you may have to modify it according to your soldering conditions. In such case, please peform evaluation sufficiently. Unit: mm 10. Appearance specification Item Contents Criterion Shield Case Scratch No illegible character by scratch. Discoloration No illegible character by discoloration. PAD Foreign substance adhesion No foreign substance. (Gold-plated) Solder adhesion 25% or less of each Pad area. Marking Marking specification Identical to the marking written in approval specifications for each customer. Readability Legible

18 11. Recommended Reflow Profile Following profile is recommended for your reflow soldering. However, this profile may vary according to the density of components, package types of components, a solder material, or size of your printed circuit board, etc. Please perform evaluation sufficiently Temp. (degc) D3 D D1 T1 T2 50 Heating Preheat Soldering Cooling Time (Sec) *Note: Reflow soldering is recommended two times maximum. If your soldering conditions are different from our recommendation, please contact our local sales. No Item Temperature ( C) Time (sec) 1 Pre-heat D1: 140 to D2: 200 T1: 60 to Soldering D2: >= 200 T2: 80 max 3 Peak-Temp. D3: 250 C max

19 12. Storage Conditions Moisture Sensitivity Level: IPC/JEDEC Standard J-STD-020D Level 3 Handling of unopened moisture proof bag: It is recommended that the modules is stored at 30 C and < 60% RH, and is used within 6 months from the delivery date. Handling of opened moisture proof bag: The modules should be stored at 30 C and < 60% RH, and be used within 7 days after opening the bag. If it exceeds 7 days after opening, perform the baking process (at 125 C, 24 hours) before mounting. Do not store this modules in the environments exposed to shock or vibration. It may result in damage, malfunction, or deterioration of quality. D o not throw or drop cartons containing the modules during transportation. It may result in damage, malfunction, or deterioration of quality. Keep the modules in original packing condition until just before use. Store the modules at recommended storage condition. When deviated from the condition, check the appearance and function of the modules prior to use

20 13. Packing Specification in shipment Carrier Tape Appearance and Dimensions A B W F E P0 P1 P2 T Dimensions Tolerance +/-0.1 +/-0.1 +/-0.3 +/-0.1 +/-0.1 +/-0.1 +/-0.1 +/-0.1 +/-0.1 Unit: mm

21 13-2. Reel Appearance and Dimensions PS A B D C W1 W2 A B C D W1 W2 Dimensions Tolerance +/-2.0 +/-1.0 +/-0.2 +/-0.8 +/-1.0 +/-1.0 Unit : mm Taping Direction and Packing Quantity

22 13-4. Tape Reel Strength Bar code label RoHS Pb-free MSL3-22 -

23 13-6. Package Carrier tape Cover tape Reel Humidity Indicator Moisture proof bag Inner box Outer box Polystyrene+Styrenebutadiene Polyester Polystyrene+Carbon Paper PET/Al/PE 3Layer bag cardboard cardboard

24 14. Revision History Revision Contents change Date Rev Created first edition. JUN 14, 2013 Rev Section 5 was revised. Section 8-2 was revised. AUG 23, 2013 Rev Changed the description of high safety notice. SEP 30, 2013 Rev Section 3, 5 and 12-6 was revised. Added section 9. FEB 10, 2014 Rev Section 5 was revised. MAR 31, 2014 Rev Section 2, 5-3 and 7-1 was revised. JUL 9, 2014 Rev Section 5-6, 5-7 and 7-1 was revised. AUG 22, 2014 Rev Changed the version of Bluetooth Specification. Section 5-6 and 5-7: Added kHz oscillator specifications. Section 7: Added Revision of Softdevice. Section 3, 8-1 and 9-2 was revised. DEC 15,