2016, Amkor Technology, Inc.

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2 Standardization of Packaging for the Internet of Things Adrian Arcedera l VP of MEMS and Sensor Products 2

3 About Amkor Technology Amkor Technology, Inc. is one of the world's largest and most accomplished providers of state-of-the-art packaging design, assembly and test services. Founded in 1968, Amkor is a strategic partner to leading semiconductor companies and electronics OEMs. Our operational base encompasses over 5.8M ft 2 of volume production, development, sales and support services in Asia, Europe and the US. Our solutions enable our customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and, where required, their packaging technology innovator. 3

4 The Internet of Things IC Insights ($96B) 2018 $57.6B Value Segmentation Services 60% $15.4B Hardware 16% $11.5B Software 12% $11.5B 12% Semiconductors 4

5 The Building Blocks of the Internet of Things Internet of Things 5

6 General IoT Packaging Requirements Low cost Low power RF requirements (shielding) Scalable to high volume manufacturing Small package size Discrete solution Integrated solution Stimulus delivery 6

7 Current Discrete Packaging for IoT Connectivity Memory Power Management Microprocessor & Microcontroller MEMS & Sensor SOIC/TSSOP * QFN/TQFP * Laminate CSP * WLCSP * Note: *Limited Compatibility 7

8 What makes MEMS and Sensor Packaging Different? 8

9 Growth and Adoption of Automotive MEMS Sensors The role of government regulations in the MEMS market Fuel Economy Improvements Airbags Tire Pressure Monitoring Electronic Stability Control Pedestrian/ Collision Avoidance? 1970 s 1980 s 1990 s 2000 s 2010 s 2020 s 9

10 Rapid Growth in Consumer MEMS Color Inkjet iphone iphone 4 Samsung S4/iPhone 5S Wearables Nintendo Wii iphone 3GS Samsung S3 Samsung S5 <

11 The Packaging Challenge Stimulus Delivery MEMS are NOT ICs! MEMS Micro Electro Mechanical Systems are tiny structures created in the silicon designed to respond to various stimuli from the real world Source: Yole 2014 MEMS Industry Report No standard process (CMOS, BiCMOS ) No p-n junction for MEMS And as a consequence, NO ROADMAP Bell Labs, US nm Technology Sandia s, Micromachine (MEMS) Courtesy Sandia National Laboratories SUMMiT Technologies 11

12 MEMS and Sensor Packaging Requirements Accel/Gyro Magnetic Microphone Wafer Capped Wafer Handling Handling Stealth Dicing Stimulus Package Port Hole (Top) Delivery Package Port Hole (Bottom) Low Modulus DA Thermal DA Low CTE Substrates Die Attach Multi Die-Stacked Options Multi Die-SBS FlipStack Multi Sensor Wirebond Au Stud Bump Interconnect Flip Chip Options TSV* Copper Pillar + COW *TSV, TGV is at foundry level. Temperature/ Humidity Pressure/ Altimeter Gas Gesture IR RF/BAW/Saw/ Oscillator Bio/Med 12

13 MEMS and Sensor Packaging Requirements Package Protection Cavity Fill/ Die Coat Accel/Gyro Magnetic Microphone Temperature/ Humidity Overmolded Leadframe Overmolded Laminate Lidded Package Lidded + Molded Package Bio-compatible Lid Exposed Die Non-Ferromagnetic Port Hole Filter EMI Shielding Black Die Coating Clear Die Mold Gel Fill Pressure/ Altimeter Gas Gesture IR RF/BAW/Saw/ Oscillator Bio/Med 13

14 MEMS Capping/Interconnect Trend MEMS Wafer Capping Inter-connection Packaging Bare Die Hermetic Packaging MEMS Device Silicon Cap Glass Cap Thin Film Capping (RnD Stage) 3D Functional Cap Through Silicon Vias Through Glass Vias Cavity Packaging Overmolded CSP/MLF Pre-Mold/Cavity TBD Overmolded CSP Cavity CSP Chip on Chip WLCSP *TSV, TGV is at foundry level. 14

15 MEMS Packaging Complexity Wire type, loop radius and gauge? Molded-in stress? Leaded or not? Overmolded or cavity package? Wirebond or flip-chip? Stacked die or side-by-side? EMI shielding? Encapsulation? Die attach material? Laminate or leadframe? How/what to test? 15

16 Materials Help Manage Die Stress Modulus - MPa Die Attach Adhesives Epoxy - C Film Epoxy - NC Silicone1 Silicone2 S1 Principal Stress - MPa Substrate Thickness/Material Thin Thick FR5 Ceramic FR5-1 FR5-2 From material datasheets From simulation results 16

17 Packaging Technologies and Material Sets are the Performance Differentiator Vertical Height Series1 Series2 Series

18 MEMS/Sensor Package Standardization 19

19 Standard Platforms Enable Faster Development for MEMS/Sensor Discrete Packaging 20

20 Evolution Towards Standardization for MEMS/Sensor Packaging Overmolded Exposed Die Surface Cavity Package SOIC QFN Laminate LGA/FPBGA 21

21 Cost vs. Performance Comparison Low Package Cost Ceramic Package High Overmolded Exposed Die Pre-Mold & Cavity High Die Top Stress Low 22

22 Market Acceptance SOIC QFN Laminate LGA/FPBGA Overmolded Exposed Die Surface Widely accepted in the automotive market Cavity package used in automotive pressure sensors Cavity Package Smaller footprint than SOIC, well suited for consumer market Available wettable flank enables more automotive applications Small size and design flexibility make it favorable for sensor fusion and IoT applications for the consumer market Laminate + cavity package provides very good flexibility Gaining traction in automotive markets 23

23 Today s Sensor Clusters 24

24 Sensor Fusion Trend MEMS Wafer Capping Inter-connection Packaging MEMS Sensors Capped, Uncapped Sensors 3D Functional Cap Flip Chip, Stacked Wirebond, Side by Side, Stacked Through Silicon Vias Chip on Chip Overmolded CSP Cavity Packaging Overmolded CSP Cavity CSP WLCSP *TSV, TGV is at foundry level. 25

25 Adding IoT Blocks to MEMS/Sensor Package Connectivity Bluetooth Radio LGA Package Pkg Size ~ 3mm sq MEMS/Sensor Inertial Sensor LGA Package Pkg Size ~ 3.5 mm sq IOT Package 8-bit Microcontroller LGA Package Pkg Size ~ 5 mm sq Microcontroller LGA Package Pkg Size ~ 6 mm sq 26

26 Adding IoT Blocks to MEMS/Sensor Package Cavity Package Hybrid Cavity Package MLF /QFN Laminate LGA/FPBGA 27

27 Discrete vs. Integrated IoT Solutions Prospects Integrated Smaller body size, smaller motherboard space Packaging cost reduction Less complex SMT process Less inventory (for IoT blocks) Potential Concerns Known good IoT block/components MEMS/Sensor die stress management Compounded yield, multi test and sensor trimming Prospects Discrete Widely available, existing assembly and test infrastructure Flexible sources of IoT blocks/components Known good IoT block/component binning Potential Concerns Larger motherboard space Limited package size reduction 28

28 In Summary Integration is happening at the front-end to complete the building blocks of IoT The discrete packaging solutions are available today, but Integration and the IoT module assembly is needed to push IoT into more applications MEMS/Sensor device packaging standardization can be applied to IoT module assembly to offer a single package solution without sacrificing performance Standard IoT platforms = faster development Faster introduction of new products IoT monetization 29

29 What will you integrate? Connectivity Power Management + Memory + Microprocessor/ Microcontrollers + MEMS/ Sensors = = IoT 30

30 Next Steps to Standard Packaging and Test Standard package platforms will help speed up integration and monetize IoT What will you integrate? Standard Packaging for IoT What are the priority MEMS / Sensor devices? Will it be MEMS + Connectivity or MEMS + Microcontroller + Connectivity? Etc. Standard Pre-mold Package Outlines? Special features needed - Antenna? Shielding? Tester and Handler Development How can we minimize Test time and reduce the number of insertion? 31

31 Thank You 32

32 Contact Amkor for Further Information San Jose Sales Office 25 Metro Drive Suite 700 San Jose, CA USA Corporate Headquarters 2045 East Innovation Circle Tempe, AZ USA Tel: Tel:

33 Q & A 34