2016, Amkor Technology, Inc.

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2 Standardization of Packaging for the Internet of Things Adrian Arcedera l VP of MEMS and Sensor Products 2

3 About Amkor Technology Amkor Technology, Inc. is one of the world's largest and most accomplished providers of state-of-the-art packaging design, assembly and test services. Founded in 1968, Amkor is a strategic partner to leading semiconductor companies and electronics OEMs. Our operational base encompasses over 5.8M ft 2 of volume production, development, sales and support services in Asia, Europe and the United States. Our solutions enable our customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and, where required, their packaging technology innovator. 3

4 The Internet of Things IC Insights ($96B) 2018 $57.6B Value Segmentation Services 60% $15.4B Hardware 16% $11.5B Software 12% $11.5B 12% Semiconductors 4

5 The Building Blocks of the Internet of Things Internet Of Things 5

6 Current Discrete Packaging for IoT Connectivity Memory Power Management Microprocessor & Microcontroller MEMS & Sensor SOIC/TSSOP * QFN/TQFP * Laminate CSP * WLCSP * Note: *Limited Compatibility 6

7 General IoT Packaging Requirements Low cost Low power RF requirements (shielding) Scalable to high volume manufacturing Small package size Discrete solution Integrated solution Stimulus delivery 7

8 The Packaging Challenge Stimulus Delivery MEMS are NOT ICs! MEMS Micro Electro Mechanical Systems are tiny structures created in the silicon designed to respond to various stimuli from the real world Source: Yole 2014 MEMS Industry Report No standard process (CMOS, BiCMOS ) No p-n junction for MEMS And as a consequence, NO ROADMAP Bell Labs, US nm Technology Sandia s, Micromachine (MEMS) Courtesy Sandia National Laboratories SUMMiT Technologies 8

9 Accel/Gyro Magnetic Microphone Temperature/ Humidity Pressure/ Altimeter Gas Gesture IR RF/BAW/ Saw/Oscillator Bio/Med MEMS and Sensor Packaging Requirements Wafer Handling Stimulus Delivery Die Attach Options Interconnect Options *TSV, TGV is at foundry level. Capped Wafer Handling Stealth Dicing Package Port Hole (Top) Package Port Hole (Bottom) Low Modulus DA Thermal DA Low CTE Substrates Multi Die-Stacked Multi Die-SBS Flipstack Multi Sensor Wirebond Au Stud Bump Flip Chip TSV* Copper Pillar + COW 9

10 Accel/Gyro Magnetic Microphone Temperature/ Humidity Pressure/ Altimeter Gas Gesture IR RF/BAW/ Saw/Oscillator Bio/Med MEMS and Sensor Packaging Requirements Package Protection Cavity Fill/ Die Coat Overmolded Leadframe Overmolded Laminate Lidded Package Lidded + Molded Package Bio-compatible Lid Exposed Die Non-Ferromagnetic Port Hole Filter EMI Shielding Black Die Coating Clear Die Mold Gel Fill 10

11 Vertical Height Packaging Technologies and Material Sets are the Performance Differentiator Series1 Series2 Series

12 Standard Platforms Enable Faster Development for MEMS/Sensor Discrete Packaging 12

13 Evolution Towards Standardization for MEMS/Sensor Packaging Overmolded Exposed Die Surface Cavity Package SOIC QFN Laminate LGA/ FPBGA 13

14 Today s Sensor Clusters 14

15 Adding IoT Blocks to MEMS/Sensor Package Connectivity Bluetooth Radio LGA Package Pkg Size ~ 3mm sq MEMS/Sensor Inertial Sensor LGA Package Pkg Size ~ 3.5 mm sq IOT Package 8-bit ucontroller LGA Package Pkg Size ~ 5 mm sq Microcontroller LGA Package Pkg Size ~ 6 mm sq 15

16 Adding IoT Blocks to MEMS/Sensor Package Cavity Package Hybrid Cavity Package QFN Laminate LGA/ FPBGA 16

17 Discrete vs. Integrated IoT Solutions Prospects Integrated Smaller body size, smaller motherboard space Packaging cost reduction Less complex SMT process Less inventory (for IoT blocks) Potential Concerns Known good IoT block/components MEMS/Sensor die stress management Compounded yield, multi test and sensor trimming Prospects Discrete Widely available, existing assembly and test infrastructure Flexible sources of IoT blocks/components Known good IoT block/component binning Potential Concerns Larger motherboard space Limited package size reduction 17

18 What will you integrate? Connectivity + Memory + Microprocessor/ Microcontrollers Power Management + MEMS/ Sensors = = IoT Standard package platforms will help speed up integration and monetize IoT. 18

19 In Summary Integration is happening at the front-end to complete the building blocks of IoT The discrete packaging solutions are available today, but Integration and the IoT module assembly is needed to push IoT into more applications MEMS/Sensor device packaging standardization can be applied to IoT module assembly to offer a single package solution without sacrificing performance. Standard IoT platforms = faster development Faster introduction of new products IoT monetization 19

20 Q & A 20

21 Contact Amkor for Further Information Shanghai Sales Office Zhangjiang Hi Tech Park 2889 Jinke Road Room #504, Bld E, Chamtime Square Pudong, Shanghai China Corporate Headquarters 2045 East Innovation Circle Tempe, AZ USA Tel: Tel:

22 Thank You 22