Agilent HSMx-C120/C177/C197/C265 High Performance Chip LEDs Data Sheet

Transcription

1 Agilent HSMx-C12/C177/C197/C265 High Performance Chip LEDs Data Sheet Description These chip type LEDs utilize Aluminium Indium Galium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 65 nm Orange, 626 nm Red and 639 nm Deep Red. All packages are binned by both color and intensity, except for red and deep red color. These ChipLEDs come either in low profile top emitting packages (HSMx-C177/C197), in a side emitting package (HSMx-C12) or in a reverse mount package (HSMx-C265). The right angle ChipLED is suitable for applications such as LCD back lighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. The reverse mount ChipLED is suitable for space saving. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4 units per reel for HSMx- C12/C177/C197 and 3 units per reel for HSMx-C265. These packages are compatible with IR soldering process. Features High brightness AlInGaP material 85 or 63 industry standard footprint with.4 mm height for top emitting packages Also available in right angle emitting and reverse mounting packages Diffused optics Operating temperature range of 3 C to +85 C Compatible with IR soldering Available in 4 colors Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications Membrane switch indicator LCD backlighting Push button backlighting Front panel indicator Symbol backlighting Keypad backlighting Microdisplays Small message panel signage Device Selection Guide Dimensions (mm) [1,2] Amber Red Orange Deep Red Package Description 1.6 x.6 x 1. HSMA-C12 HSMC-C12 HSML-C12 Untinted, Non-diffused 2. x 1.25 x.4 HSMA-C177 HSMC-C177 HSML-C177 HSMT-C177 Untinted, Diffused 1.6 x.8 x.4 HSMA-C197 HSMC-C197 HSML-C197 HSMT-C197 Untinted, Diffused 3.4 x 1.25 x 1.1 HSMA-C265 HSMC-C265 HSML-C265 HSMT-C265 Untinted, Non-diffused

2 Package Dimensions CATHODE MARK LED DIE CATHODE MARK LED DIE.4 (.16) 1.25 (.49) 2. (.79).62 (.25).8 (.31) 1.6 (.63) POLARITY POLARITY DIFFUSED EPOXY.4 (.16) DIFFUSED EPOXY.4 (.16) PC BOARD.16 (.6) PC BOARD CATHODE LINE.16 (.6) CATHODE LINE.3 ±.15 (.12 ±.6).4 ±.15 (.16 ±.6).4 ±.15 (.16 ±.6) 1.1 (.43) MIN. SOLDERING TERMINAL.7 (.28) MIN. SOLDERING TERMINAL HSMx-C197 HSMx-C177 LED DIE CATHODE MARK (ANODE MARK FOR HSMH-C12) LED DIE 3.4 (.134) CATHODE MARK (ETCHED).3 (.12) 1.25 (.49) 1.6 (.63).6 (.24) GREEN SOLDER MASK POLARITY CLEAR EPOXY 1.2 (.47) POLARITY UNDIFFUSED EPOXY 1.2 (.47) PC BOARD 1. (.39) 1.1 (.43) PC BOARD 1.1 (.43).5 (.2).3 (.12) CATHODE LINE CATHODE LINE 3.3 (.12).5 ±.15 (.2 ±.6).5 ±.15 (.2 ±.6) SOLDERING TERMINAL HSMx-C12 SOLDERING TERMINAL HSMx-C265 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. 2

3 Absolute Maximum Ratings at T A = 25 C Parameter HSMx-Cxxx Units DC Forward Current [1] 25 ma Peak Pulsing Current [2] 1 ma Power Dissipation 6 mw Reverse Voltage (I R = 1 µa) 5 V LED Junction Temperature 95 C Operating Temperature Range 3 to +85 C Storage Temperature Range 4 to +85 C Soldering Temperature See reflow soldering profile (Figures 8 & 9) Notes: 1. Derate linearly as shown in Figure Pulse condition of 1/1 duty and.1 ms width. Electrical Characteristics at T A = 25 C Forward Voltage Reverse Breakdown Capacitance C Thermal V F (Volts) V R (Volts) (pf), V F =, I F = 2 I R = 1 µa f = 1 MHz Rθ J PIN ( C/W) Part Number Typ. Max. Min. Typ. Typ. HSMA-C HSMA-C177/ HSMA-C HSMC-C HSMC-C177/ HSMC-C HSML-C HSML-C177/ HSML-C HSMT-C177/ HSMT-C V F Tolerance: ±.1 V 3

4 Optical Characteristics at T A = 25 C Luminous Color, Viewing Luminous Intensity Peak Dominant Angle Efficacy I V (mcd) Wavelength Wavelength 2 θ 1/2 η 2 ma [1] λ peak (nm) λ d [2](nm) Degrees [3] (lm/w) Part Number Color Min. Typ. Typ. Typ. Typ. Typ. HSMA-C12 Amber HSMA-C177/197 Amber HSMA-C265 Amber HSMC-C12 Red HSMC-C177/197 Red HSMC-C265 Red HSML-C12 Orange HSML-C177/197 Orange HSML-C265 Orange HSMT-C177/197 Deep Red HSMT-C265 Deep Red Notes: 1. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λ d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4

5 Color Bin Limits Orange Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A B C D E F Tolerance: ± 1 nm Amber Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A B C D E F Tolerance: ±.5 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Bin ID Min. Max. A B C D E F G H J K L M N P Q R S T U V W X Y Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 5

6 RELATIVE INTENSITY % AS DEEP AS AS AMBER RED AS RED 6 ORANGE WAVELENGTH nm I F FORWARD CURRENT ma 1 AS AlInGaP V F FORWARD VOLTAGE V LUMINOUS INTENSITY (NORMALIZED AT 2 ma) AS AMBER AS ORANGE, RED, and DEEP RED I F FORWARD CURRENT ma Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. I F MAX MAXIMUM FORWARD CURRENT ma HSMx-C12/177/197 HSMx-C T A AMBIENT TEMPERATURE C RELATIVE INTENSITY ANGLE Figure 4. Maximum forward current vs. ambient temperature. RELATIVE INTENSITY ANGLE Figure 5. Relative intensity vs. angle for HSMx-C12. 6

7 RELATIVE INTENSITY % ANGLE Figure 6. Relative intensity vs. angle for HSMx-C177/ RELATIVE INTENSITY % TEMPERATURE C 1 SEC. MAX. 23 C MAX. 4 C/SEC. MAX. OVER 2 MIN. 4 C/SEC. MAX. 3 C/SEC. MAX. ANGLE TIME Figure 7. Relative intensity vs. angle for HSMx-C265. Figure 8. Recommended reflow soldering profile. CENTERING BOARD 1 to 2 SEC. 1.2 (.47) TEMPERATURE 255 C (+5/-) 217 C 3 C/SEC. MAX C MAX. 12 SEC. 6 C/SEC. MAX. 6 to 15 SEC. 1.2 (.47).9 (.35) 1.2 (.47) Figure 1. Recommended soldering pattern for HSMx-C177. TIME * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX. CENTERING BOARD.8 (.31) Figure 9. Recommended Pb-free reflow soldering profile..8 (.31).7 (.28).8 (.31) NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 11. Recommended soldering pattern for HSMx-C197. 7

8 .4 (.16).4 (.16) 2.2 (.87) DIA. PCB HOLE.15 (.6).8 (.31) 1.2 (.47).8 (.31).7 (.28) CENTERING BOARD 1.4 (.55) 2.3 (.91) 1.4 (.55) 1.25 (.49) Figure 12. Recommended soldering pattern for HSMx-C12. Figure 13. Recommended soldering pattern for HSMx-C265. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. 8. ± 1. (.315 ±.39) Ø 13.1 ±.5 (Ø.516 ±.2) 1.5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Figure 15. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 8

9 4. (.157) 1.5 (.59) CATHODE DIM. C.2 ±.5 (.8 ±.2) 1.75 (.69) DIM. A 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) HSMx-C12 POSITION IN CARRIER TAPE DIM. A DIM. B 2. ±.5 (.79 ±.2) 4. (.157) USER FEED DIRECTION PART NUMBER HSMx-C12 SERIES HSMx-C177 SERIES HSMx-C197 SERIES COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (.4) 1.9 (.75) 2.3 (.91) 1.8 (.71) DIM. B ±.1 (.4) 1.15 (.45) 1.4 (.55).95 (.37) CARRIER TAPE DIM. C ±.1 (.4).8 (.31).6 (.24).6 (.24) DIM. B HSMx-C12 R.5 ±.5 (.2 ±.2) 4. (.157) 1.5 (.59) CATHODE DIM. C.2 ±.5 (.8 ±.2) 1.75 (.69) DIM. A 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B 2. ±.5 (.79 ±.2) 4. (.157) PART NUMBER USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (.4) DIM. B ±.1 (.4) COVER TAPE DIM. C ±.1 (.4) HSMx-C265 SERIES 3.7 (.146) 1.45 (.57) 1.3 (.51) CARRIER TAPE Figure 16. Tape dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. 9

10 END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 16, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS Figure 17. Tape leader and trailer dimensions. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 3 6% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 6 ± 5 C for 2 hours. For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (8) or (916) Europe: +49 () China: Hong Kong: (+65) India, Australia, New Zealand: (+65) Japan: (+81 3) (Domestic/International), or (Domestic Only) Korea: (+65) Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) Taiwan: (+65) Data subject to change. Copyright 24 Agilent Technologies, Inc. Obsoletes EN April 22, EN