MEMS Module STMEMSDQ-EVAL1

Transcription

1 STMicroelectronics MEMS Module STMEMSDQ-EVAL1 UM0152 USER MANUAL Rev 0.1 September 2005

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3 UM0152 USER MANUAL MEMS Module STMEMSDQ-EVAL1 Dedicated to upsd Evaluation Kit DK34XX Introduction The MEMS module STMEMSDQ-EVAL1 is designed for the evaluation of a MEMS (Micro-Electro- Mechanical System) application which can be used in a variety of vibration sensor and intelligent movement estimator situations, for example: Scrolling of documents, maps and images larger than the display window Web page browsing Menu navigation Gaming Context awareness Automatic portrait-landscape adaption Pedometer System wake-up Motion control The MEMS module contains only the most important parts necessary to test the functionality of the MEMS application. The module can be simply connected to the upsd evaluation kit DK34XX. The main features of the MEMS module include: Three LEDs and buttons for general purpose, driven from the main upsd board. 2.5V regulator on the module. LIS3LV02DQ Inertial Sensor chip Further documentation related to MEMS can be found on the website: Rev 0.1 September /8 7

4 1 General description UM General description The basic block diagram is shown in Figure 1. Figure 1. MEMS module Connector MEMS 2.5V Power Supply I2C / SPI Buttons LEDs 3.3V 1.1 Main features of the LIS3LV02DQ chip The STMEMSDQ-EVAL1 features an Inertial Sensor chip, LIS3LV02DQ, which is a low-voltage 3-axis vibration and movement sensor. The features of the chip include: 2.4V single supply operation, 1.8V compatible IOs, low power operation ~ 1mA I2C/SPI Digital output interfaces Motion activated interrupt source Factory trimmed device sensitivity and offset Embedded self test, High shock survivability QFN-28, ordering number: LIS3LV02DQ. 1.2 Main features of DK34XX - upsd evaluation kit upsd34xx, 3.3V regulator, step-up from batteries and caps, real-time clock. Dimensions 3 x 7 cm. USB connector, JTAG connector. 2/8

5 UM Board setup 2 Board setup The top silkscreen of the MEMS Module STMEMSDQ-EVAL1 is shown in Figure 2. Real photos of the assembly are shown in the Section 3. Figure 2. Detailed description of the MEMS Module STMEMSDQ-EVAL1 LEDs Supply: in=3.3v out = 2.5V MEMS Buttons 2.1 Buttons Table 1. Button description Button upsd signal denotation B5 P15 / Ai5 - port 1, bit 5 B6 P16 / Ai6 - port 1, bit 6 B7 P17 / Ai7 - port 1, bit 7 3/8

6 2 Board setup UM LEDs Table 2. The meaning of the LEDs LED upsd signal denotation D5 PB5 - port B, bit 5 D6 PB6 - port B, bit 6 D7 PB7 - port B, bit Connectors Table 3. The connector H30, H3, H10 and H1 pin out Signal denotation on the upsd pin out Position H30 H3 H10 H1 H30 H3 H10 H1 1 P4.7 P4.6 PB1 PB0 2 P4.5 P4.4 PB3 PB2 3 P4.3 P4.2 PB5 PB4 4 P4.1 P4.0 PB7 PB6 5 P3.0 P3.3 P1.6 RTSn 6 P3.2 P3.1 P V 7 P3.4 P3.5 P1.4 P1.5 8 P3.6 P3.7 P1.2 P1.3 9 P1.0 P1.1 4/8

7 UM MEMS module STMEMSDQ-EVAL1 + upsd DK34XX evaluation kit 3 MEMS module STMEMSDQ-EVAL1 + upsd DK34XX evaluation kit 3.1 Daughter and mother board images Both are connected together, however do not exceed the dimensions 7 x 4 cm. Figure 3. MEMS module STMEMSDQ-EVAL1 + upsd DK34XX evaluation kit 3.2 Design and layout guidelines To avoid any stress on the MEMS package or the PCB around it, do not use the central pad under the MEMS. In addition, note that care should be taken with other sources of stress such as the screw holes. 5/8

8 MEMS module STMEMSDQ-EVAL1 + upsd DK34XX evaluation kit UM Schematic The schematics for the MEMS module STMEMSDQ-EVAL1 are shown below: H30 H3 PC2 CS P P4.6 SDA_SDI SDO P P4.4 SCL_SPC P P4.2 P P4.0 P P3.3 RDYINT P P3.1 P P3.5 SDA_SDI P P3.7 SCL_SPC CON10 CON V RDYINT 6 7 NC VDD reserv ed RDY/INT NC NC 28 NC 27 NC 26 NC 25 NC 24 NC 23 NC 22 NC SDO SDA/SDI/SDO VDD_IO SCL/SPC CS NC NC reserv ed VDD reserv ed 17 CK 16 NC 15 U8 LIS3LV02DQ 2V4 CK PB5 PB7 P16 P17 H10 H1 VUSB PB1 1 1 PB0 PB3 2 2 PB2 PB5 3 3 PB4 CK PB7 4 4 PB6 PB6 Ai6 5 5 RSTn Ai7 6 6 V3.3 Ai4 7 7 Ai5 P15 Ai2 8 8 Ai3 Ai0 9 9 Ai CON10 CON10 SDO SDA_SDI 10 2V4 11 SCL_SPC 12 CS LE25_TO92 U11 LE25 3 Vin Vout 1 C2 100nF 2V4 C3 100nF 2V4 R37 4k7 R36 4k7 R34 4k7 SCL_SPC SDA_SDI CS R R R R17 10k R16 10k R15 10k 2V4 2V4 P17 P16 P15 C1 100nF C4 100nF L7 L6 L5 B7 B6 B5 PB7 PB6 PB5 Title Digital MEMS module Size Document Number Rev A Ludek Holoubek - EMMA Prague 0.1 Date: Tuesday, February 01, 2005 Sheet of Bill of materials The Bill of Materials for the MEMS Module STMEMSDQ-EVAL1 evaluation board is as follows: Item Quantity Reference Part 1 3 B5,B6,B7 Button 2 4 C1,C2,C3,C4 100nF 3 4 H1,H3,H10,H30 CON L5,L6,L7 DPB0 5 3 R15,R16,R17 10k 6 3 R25,R26,R R34,R36,R37 4k7 8 1 U8 LIS3LV02DQ 9 1 U11 LE25_TO92 6/8

9 UM Revision history 4 Revision history Date Revision Description of changes 13-Sep Initial release of document 7/8

10 UM0152 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8