HSMx-A4xx-xxxxx. Data Sheet. SMT LED Surface-Mount LED Indicator. Description. Features. Applications

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1 Data Sheet HSMx-A4xx-xxxxx Description The Power PL-4 is an extension of our PL2 SMT LEDs. The package can be driven at higher current due to its superior package design. The product is able to dissipate heat more efficiently compared to the conventional PL-2 SMT LEDs. In proportion to the increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PL-2 SMT LEDs. These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of environmental conditions. This higher reliability makes them suitable for use under harsh environment and conditions like automotive. In addition, they are also suitable to be used in electronic signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. There are a variety of colors and various viewing angles (3, 6, and 12 ) available in these SMT LEDs. Ideally, the 3 parts are suitable for light piping where focused intensities are required. As for the 6 and 12, they are most suitable for automotive interior and exterior lighting and electronic signs applications. Features Industry standard PL-4 High reliability LED package High brightness using AlInGaP and InGaN dice technologies High optical efficiency Higher ambient temperature at the same current possible compared to PL-2 Available in full selection of colors Super wide viewing angle at 12 Available in 8-mm carrier tape on 7-inch reel ompatible with both IR and TTW soldering process JEDE MSL 2a High reliability LED package due to enhanced silicone resin material for InGaN family Applications Interior automotive Instrument panel backlighting entral console backlighting abin backlighting Navigation and audio system Dome lighting Push button backlighting Exterior automotive Turn signals HMSL Rear combination lamp Puddle light Electronic signs and signals Interior full color sign Variable message sign July 11, 218

2 Office automation, home appliances, industrial equipment Front panel backlighting Push button backlighting Display backlighting Figure 1: Package Dimensions SOURE 1 SOURE ± ± ±.2.1 TYP..8 ±.1 A A 3.2 ± ±.2.8 ±.3 ATHODE MARKING.7 ±.1 ATHODE MARKING.5 ±.1 NOTE: All dimensions in millimeters. Electrical connection between all cathodes is recommended. Device Selection Guide olor Part Number Min. I V (mcd) a Max. I V (mcd) Test urrent (ma) Dice Technology Red HSM-A4-S3M AlInGaP HSM-A41-U8M AlInGaP Red Orange HSMJ-A41-T4M AlInGaP HSMJ-A41-U4M AlInGaP Orange HSML-A41-U4M AlInGaP Amber HSMA-A41-U45M AlInGaP Emerald Green HSME-A41-P4PM AlInGaP Blue HSMN-A4-S8QM InGaN HSMN-A4-S8PM InGaN HSMN-A4-S4QM InGaN Green HSMM-A4-W8QM InGaN HSMM-A4-W8YM InGaN a. The luminous intensity I V, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. I V tolerance = ±12%. 2

3 Part Numbering System HSM x 1 A x 2 x 3 x 4 x 5 x 6 x 7 x 8 x 9 Packaging Option olor Bin Selection Intensity Bin Select Device Specific onfiguration Package Type LED hip olor Absolute Maximum Ratings (T A = 25 ) Parameters HSM/J/L/A/E HSMZ/V/U HSMM/N D Forward urrent a 7 ma b, c 7 ma b, c 3 ma Peak Forward urrent d 2 ma 2 ma 9 ma Power Dissipation 18 mw 24 mw 114 mw Reverse Voltage 5V Junction Temperature 11 Operating Temperature 4 to +1 Storage Temperature 4 to +1 a. Derate linearly as shown in Figure 6. b. Drive current between 1 ma and 7 ma is recommended for best long-term performance. c. Operation at currents below 5 ma is not recommended. d. Duty factor = 1%, Frequency = 1 khz. 3

4 Optical haracteristics (T A = 25 ) olor Part Number Peak Wavelength λ PEAK (nm) Typ. Dominant a Wavelength λ D (nm) Typ. Viewing Angle b 2Θ 1/2 (Degrees) Typ. Luminous Efficacy η c V (Im/ W) Typ. Luminous Intensity/Total Flux I V (mcd)/φ V (mim) Typ. Red HSM HSMZ Red Orange HSMJ HSMV Orange HSML Amber HSMA HSMU Yellow Green HSME Emerald Green HSME Green HSMM Blue HSMN a. The dominant wavelength, λ D, is derived from the IE hromaticity Diagram and represents the color of the device. b. Θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. c. Radiant intensity, I e in watts/steradian, may be calculated from the equation I e = I v /η v, where I v is the luminous intensity in candelas and η v is the luminous efficacy in lumens/watt. Electrical haracteristics (T A = 25 ) Forward Voltage V F (Volts) at I F = 5 ma Reverse Voltage V R at 1 µa Part Number Typ. Max. Min. HSM/J/L/A/E HSMZ/V/U Forward Voltage V F (Volts) at I F = 3 ma Reverse Voltage V R at 1 µa Part Number Typ. Max. Min. HSMM/N

5 Figure 2: Relative Intensity vs. Wavelength RELATIVE INTENSITY BLUE GREEN EMERALD GREEN YELLOW GREEN AMBER ORANGE RED ORANGE RED WAVELENGTH (nm) Figure 3: Forward urrent vs. Forward Voltage 8 7 Figure 4: Relative Intensity vs. Forward urrent (AlInGaP) FORWARD URRENT (ma) 6 HSM/J/L/A/E HSMZ/V/U HSMM/N RELATIVE INTENSITY (NORMALIZED AT 5 ma) FORWARD VOLTAGE (V) FORWARD URRENT (ma) Figure 5: Relative Intensity vs. Forward urrent (InGaN) 1.2 Figure 6: Maximum Forward urrent vs. Ambient Temperature, Derated Based on T J max = 11 (AlInGaP) 8 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 3 ma) MAXIMUM FORWARD URRENT (ma) /W 3 /W 47 /W AMBIENT TEMPERATURE ( ) FORWARD URRENT (ma) 5

6 Figure 7: Maximum Forward urrent vs. Ambient Temperature, Derated Based on T J max = 11 (InGaN) 35 Figure 8: Dominant Wavelength vs. Forward urrent InGaN Devices 54 MAXIMUM FORWARD URRENT (ma) /W 35 /W 47 /W AMBIENT TEMPERATURE ( ) DOMINANT WAVELENGTH (nm) 53 InGaN GREEN InGaN BLUE URRENT (ma) 35 Figure 9: Radiation Pattern RELATIVE INTENSITY ANGLE (DEGREES) 6

7 Figure 1: Recommended Soldering Pad Pattern 2.6 (.13) 1.1 (.43) X X.4 (.16).5 (.2) Y 4.5 (.178) 1.5 (.59) Y DIMENSIONS IN mm (INHES). SOLDER RESIST REPRESENTS ELETRIAL ONNETIVITY BETWEEN PADS Figure 11: Recommended Soldering Pad Pattern (TTW) 6.1 (.24) 2.8 (.11) X X.5 (.2) 2. (.79) Y 6. (.236) 3. (.118) 2. (.79) Y 1. (.39) DIMENSIONS IN mm (INHES). REPRESENTS ELETRIAL ONNETIVITY BETWEEN PADS 7

8 Figure 12: Recommended Pb-Free Reflow Soldering Profile TEMPERATURE /SE. MAX. 125 ±25 MAX. 12 SE to 2 SE. 6 /SE. MAX. 6 to 15 SE. TIME * THE TIME FROM 25 TO PEAK TEMPERATURE = 6 MINUTES MAX. NOTE: For detailed information on reflow soldering of surface-mount LEDs, refer to Application Note AN 16, Surface Mounting SMT LED Indicator omponents. Figure 13: Tape Leader and Trailer Dimensions TRAILER OMPONENT LEADER 2 mm MIN. FOR Ø18 REEL. 2 mm MIN. FOR Ø33 REEL. 48 mm MIN. FOR Ø18 REEL. 96 mm MIN. FOR Ø33 REEL. A USER FEED DIRETION 8

9 Figure 14: Tape Dimensions Ø ±.1 2 ±.5 B 1.75 ± ±.1 A A 5.5 ± ± A 8 ±.1 Ø1 +.1 B.229 ± ±.1 VIEW B-B VIEW A-A ALL DIMENSIONS IN mm. Figure 15: Recommended Pb-Free Reflow Soldering Profile USER FEED DIRETION ATHODE SIDE PRINTED LABEL 9

10 Bin Information Intensity Bin Select (X 5 X 6 ) Individual reel will contain parts from one half bin only. X 5 Min. I V Bin X 6 Full Distribution 2 2 half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X 5 2 Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) N N P P Q Q R R S S T T U U V V W W X X Y Y Z Z

11 olor Bin Select (X 7 ) Individual reel will contain parts from one half bin only. X 7 Full Distribution Z A and B only Y B and only W and D only V D and E only U E and F only T F and G only S G and H only Q A, B, and only P B,, and D only N, D, and E only M D, E, and F only L E, F, and G only K F, G, and H, only 1 A, B,, and D only 2 E, F, G, and H only 3 B,, D, and E only 4, D, E, and F only 5 A, B,, D, and E only 6 B,, D, E, and F only olor Bin Limits Blue Min. (nm) Max. (nm) A B D Emerald Green (ontinued) Min. (nm) Max. (nm) B D Yellow Green Min. (nm) Max. (nm) A B D Amber/Yellow Min. (nm) Max. (nm) A B D E F Orange Min. (nm) Max. (nm) A B D E Red Orange Min. (nm) Max. (nm) A B Green Min. (nm) Max. (nm) A B D Red Min. (nm) Max. (nm) Full Distribution NOTE: Tolerance of each bin limit = ±1 nm. Emerald Green Min. (nm) A Max. (nm) 11

12 Forward Voltage Bin Table For HSMZ/V/U A4xx-xxxxx only. Bin Min. Max. VA VB V VD VE Precautionary Notes Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. ompared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Special handling precautions need to be observed during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions for additional information. Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PBs together. Use an appropriate rack to hold the PBs. The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, has tested the following nozzle size to work well with this LED. However, due to the possibility of variations in other parameters, such as pick and place machine maker/ model and other settings of the machine, verify that the nozzle selected will not cause damage to the LED. ID OD ID = 1.7 mm OD = 3.5 mm Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 2arating per JEDE J-STD-2. Refer to Application Note AN535, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. Before use: An unopened moisture barrier bag (MBB) can be stored at < 4 /9% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HI) indicates that baking is not required, it is safe to reflow the LEDs per the original MSL rating. Do not open the MBB d prior to assembly (IQ for example). ontrol after opening the MBB: Read the HI immediately upon opening the MBB. Keep the LEDs at <3 /6% RH at all times and all high temperature-related processes, including soldering, curing, or rework, must be completed within 672 hours. ontrol for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or desiccator at <5% RH. ontrol of assembled boards: If the PB soldered with the LEDs is to be subjected to other high-temperature processes, store the PB in a sealed MBB with desiccant or desiccator at <5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours. Baking is required if the following conditions exist: The HI indicator is not BROWN at 1% and is AZURE at 5%. The LEDs are exposed to conditions of > 3 /6% RH at any time. The LED floor life exceeded 168 hours. 12

13 The recommended baking condition is: 6 ± 5º for 2 hours. Baking should only be done once. Storage: The soldering terminals of these LEDs are silver plated. If the LEDs are being exposed in an ambient environment for too long, the silver plating might be oxidized, thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in desiccator at <5% RH. Application Precautions The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. onstant current driving is recommended to ensure consistent performance. LEDs exhibit slightly different characteristics at different drive currents, which might result in larger variation their performance (meaning intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED. Do not use the LED in the vicinity of material with sulfur content, in environments of high gaseous sulfur compounds and corrosive elements. Examples of material that may contain sulfur are rubber gaskets, RTV (room temperature vulcanizing) silicone rubber, rubber gloves, and so on. Prolonged exposure to such environments may affect the optical characteristics and product life. Avoid rapid change in ambient temperatures, especially in high-humidity environments, because this will cause condensation on the LED. Although the LED is rated as IPx6 according toie6529: Degree of protection provided by enclosure, the test condition may not represent actual exposure during application. If the LED is intended to be used in outdoor or harsh environments, the LED must be protected against damages caused by rain water, dust, oil, corrosive gases, external mechanical stress, and so on. Thermal Management Optical, electrical and reliability characteristics of LED are affected by temperature. The junction temperature (T J ) of the LED must be kept below allowable limit at all times. T J can be calculated as below: T J = T A + R θj-a I F V Fmax where; T A = Ambient temperature ( ) R θj-a = Thermal resistance from LED junction to ambient ( /W) I F = Forward current (A) V Fmax = Maximum forward voltage (V) The complication of using this formula lies in T A and R θj-a. Actual T A is sometimes subjective and hard to determine. R θj-a varies from system to system depending on design and is usually not known. Another way of calculating T J is by using solder point temperature T S as follows: T J = T S + R θj-s I F V Fmax where; T S = LED solder point temperature as shown in the following figure ( ) R θj-s = Thermal resistance from junction to solder point ( /W) Source 1 Ts point (athode) Source 2 Ts point (athode) 13

14 T S can be measured easily by mounting a thermocouple on the soldering joint as shown in the preceding figure, while R θj-s is provided in the data sheet. User is advised to verify the TS of the LED in the final product to ensure that the LEDs are operated within all maximum ratings stated in the data sheet. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs bercause it may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment. 14

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