Data Sheet. HSMx-A4xx-xxxxx SMT LED Surface Mount LED Indicator

Transcription

1 HSMx-A4xx-xxxxx SMT LED Surface Mount LED Indicator Data Sheet Description Avago Power PL-4 is an extension of our PL 2 SMT LEDs. The package can be driven at higher current due to its superior package design. The product is able to dissipate heat more efficiently compared to the conventional PL-2 SMT LEDs. In proportion to the increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PL-2 SMT LEDs. These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of environmental conditions. This higher reliability makes them suitable for use under harsh environment and conditions like automotive. In addition, they are also suitable to be used in electronic signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. There are a variety of colors and various viewing angles (3, 6 and 12 ) available in these SMT LEDs. Ideally, the 3 parts are suitable for light piping where focused intensities are required. As for the 6 and 12, they are most suitable for automotive interior and exterior lighting and electronic signs applications. Features Industry standard PL-4 High reliability LED package High brightness using AlInGaP and InGaN dice technologies High optical efficiency Higher ambient temperature at the same current possible compared to PL-2 Available in full selection of colors Super wide viewing angle at 12 Available in 8mm carrier tape on 7-inch reel ompatible with both IR and TTW soldering process JEDE MSL 2a High reliability LED package due to enhanced silicone resin material for InGaN family Applications Interior automotive Instrument panel backlighting entral console backlighting abin backlighting Navigation and audio system Dome lighting Push button backlighting Exterior automotive Turn signals HMSL Rear combination lamp Puddle light Electronic signs and signals Interior full color sign Variable message sign Office automation, home appliances, industrial equipment Front panel backlighting Push button backlighting Display backlighting AUTION: HSMN-, HSMK-, HSMM-A4x-xxxxx LEDs are lass 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.

2 Package Dimensions 2.8 ± ± ±.2.1 TYP..8 ±.1 A ATHODE MARKING ±.1 NOTES: ALL DIMENSIONS IN mm. ELETRIAL ONNETION BETWEEN ALL ATHODES IS REOMMENDED. Device Selection Guide olor Part Number Min. I V (mcd) Max. I V (mcd) Test urrent (ma) Dice Technology Red HSM-A4-S3M AlInGaP HSM-A41-U8M AllnGaP Red Orange HSMJ-A41-T4M AlInGaP HSMJ-A41-U4M AlInGaP Orange HSML-A41-U4M AlInGaP Amber HSMA-A41-U45M AlInGaP Emerald Green HSME-A41-P4PM AlInGaP Blue HSMN-A4-S8QM InGaN HSMN-A4-S8PM InGaN HSMN-A4-S4QM InGaN Green HSMM-A4-U4QM InGaN HSMM-A4-V8QM InGaN Notes: 1. The luminous intensity I V, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. I V tolerance = ±12 %. 2

3 Part Numbering System HSM x 1 A x 2 x 3 x 4 x 5 x 6 x 7 x 8 x 9 Packaging Option olor Bin Selection Intensity Bin Select Device Specific onfiguration Package Type LED hip olor Absolute Maximum Ratings (T A = 25 ) Parameters HSM/J/L/A/E HSMZ/V/U HSMM/K/N D Forward urrent [1] 7 ma [3,4] 7 ma [3,4] 3 ma Peak Forward urrent [2] 2 ma 2 ma 9 ma Power Dissipation 18 mw 24 mw 114 mw Reverse Voltage Junction Temperature 11 Operating Temperature Storage Temperature 5 V 4 to +1 4 to +1 Notes: 1. Derate linearly as shown in figure Duty factor = 1%, Frequency = 1 khz. 3. Drive current between 1 ma and 7 ma is recommended for best long-term performance. 4. Operation at currents below 5 ma is not recommended. 3

4 Optical haracteristics (T A = 25 ) Peak Dominant Luminous Luminous Intensity/ Wavelength Wavelength Viewing Angle Efficacy η v [3] Total Flux Part λ PEAK (nm) λ D [1] (nm) 2θ 1/2 [2] (Degrees) (lm/w) I v (mcd)/φ v (mlm) olor Number Typ. Typ. Typ. Typ. Typ. Red HSM HSMZ Red Orange HSMJ HSMV Orange HSML Amber HSMA HSMU Yellow Green HSME Emerald Green HSME Green HSMM yan HSMK Blue HSMN Notes: 1. The dominant wavelength, λ D, is derived from the IE hromaticity Diagram and represents the color of the device. 2. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, I e in watts/steradian, may be calculated from the equation I e = I v /η v, where I v is the luminous intensity in candelas and η v is the luminous efficacy in lumens/watt. Electrical haracteristics (T A = 25 ) Forward Voltage Reverse Voltage V F I F = 5 ma V 1 µa Part Number Typ. Max. Min. HSM/J/L/A/E HSMZ/V/U Forward Voltage Reverse Voltage V F I F = 3 ma V 1 µa Part Number Typ. Max. Min. HSMM/K/N RELATIVE INTENSITY BLUE YAN GREEN EMERALD GREEN YELLOW GREEN AMBER ORANGE RED ORANGE RED WAVELENGTH nm Figure 1. Relative intensity vs. wavelength 4

5 FORWARD URRENT ma HSM/J/L/A/E HSMZ/V/U HSMM/K/N FORWARD VOLTAGE V Figure 2. Forward current vs. forward voltage RELATIVE INTENSITY (NORMALIZED AT 5 ma) FORWARD URRENT ma Figure 3. Relative intensity vs. forward current (AlInGaP) 8 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 3 ma) FORWARD URRENT ma Figure 4. Relative intensity vs. forward current (InGaN) MAXIMUM FORWARD URRENT ma /W 47/W 3/W AMBIENT TEMPERATURE MAXIMUM FORWARD URRENT ma /W 47/W 3/W AMBIENT TEMPERATURE DOMINANT WAVELENGTH nm URRENT ma InGaN GREEN InGaN YAN InGaN BLUE 35 Figure 5a. Maximum forward current vs. ambient temperature, derated based on T J max = 11 (AlInGaP) Figure 5b. Maximum forward current vs. ambient temperature, derated based on T J max = 11 (InGaN) Figure 6. Dominant wavelength vs. forward current InGaN devices RELATIVE INTENSITY ANGLE DEGREES Figure 7. Radiation pattern 5

6 2.6 (.13) X X.4 (.16) 1.1 (.43).5 (.2) Y 4.5 (.178) 1.5 (.59) Y DIMENSIONS IN mm (INHES). Figure 8a. Recommended soldering pad pattern SOLDER RESIST REPRESENTS ELETRIAL ONNETIVITY BETWEEN PADS 6.1 (.24) 2.8 (.11) X X.5 (.2) 2. (.79) Y 6. (.236) 3. (.118) 2. (.79) Y 1. (.39) DIMENSIONS IN mm (INHES). REPRESENTS ELETRIAL ONNETIVITY BETWEEN PADS Thermal Resistance Solder Pad Area (xy) 3 /W >16 mm 2 35 /W >12 mm 2 47 /W >8 mm 2 Figure 8b. Recommended soldering pad pattern (TTW) 6

7 TEMPERATURE /SE. MAX. 125 ± 25 MAX. 12 SE to 2 SE. 6 /SE. MAX. 6 to 15 SE. TIME Figure 9. Recommended Pb-free reflow soldering profile. Note: For detailed information on reflow soldering of Avago surface mount LEDs, refer to Avago Application Note AN 16 Surface Mounting SMT LED Indicator omponents. TEMPERATURE FLUXING 1 2 PREHEAT TURBULENT WAVE TIME SEONDS LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF P BOARD TOP SIDE OF P BOARD ONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 15 (1 PB) SOLDER WAVE TEMPERATURE = 245 AIR KNIFE AIR TEMPERATURE = 39 AIR KNIFE DISTANE = 1.91 mm (.25 IN.) AIR KNIFE ANGLE = 4 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFIIENTLY OOLED BEFORE EXERTING MEHANIAL FORE. Figure 1. Recommended wave soldering profile ID Note : Diameter "ID" should be bigger than 2.3mm Figure 11. Recommended Pick and Place Nozzle Size for InGaN Family 7

8 TRAILER OMPONENT LEADER 2 mm MIN. FOR Ø18 REEL. 2 mm MIN. FOR Ø33 REEL. 48 mm MIN. FOR Ø18 REEL. 96 mm MIN. FOR Ø33 REEL. A USER FEED DIRETION Figure 12. Tape leader and trailer dimensions Ø ±.1 2 ±.5 B 1.75 ± ±.1 A A 5.5 ± ± A 8 ±.1 Ø1 +.1 B.229 ± ±.1 VIEW B-B VIEW A-A ALL DIMENSIONS IN mm. Figure 13. Tape dimensions USER FEED DIRETION ATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation 8

9 Intensity Bin Select (X 5 X 6 ) Individual reel will contain parts from one half bin only. X 5 Min. Iv Bin X 6 Full Distribution 2 2 half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X half bins starting from X 5 2 Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) N N P P Q Q R R S S T T U U V V W W X X Tolerance of each bin limit = ± 12% olor Bin Select (X 7 ) Individual reel will contain parts from one full bin only. X 7 Full Distribution Z Y W V U T S Q P N M L K A and B only B and only and D only D and E only E and F only F and G only G and H only A, B and only B, and D only, D and E only D, E and F only E, F and G only F, G and H only 1 A, B, and D only 2 E, F, G and H only 3 B,, D and E only 4, D, E and F only 5 A, B,, D and E only 6 B,, D, E and F only 9

10 olor Bin Limits Blue Min. (nm) Max. (nm) A B D yan Min. (nm) Max. (nm) A B D Green Min. (nm) Max. (nm) A B D Emerald Green Min. (nm) Max. (nm) A B D olor Bin Limits Orange Min. (nm) Max. (nm) A B D E Red Orange Min. (nm) Max. (nm) A B Red Min. (nm) Max. (nm) Full Distribution Tolerance of each bin limit = ± 1 nm Packaging Option (X 8 X 9 ) Test Package Reel Option urrent Type Size M1 5 ma Top Mount 7 inch M2 3 ma Top Mount 7 inch Yellow Green Min. (nm) Max. (nm) E F G H Amber/ Yellow Min. (nm) Max. (nm) A B D E F Forward Voltage Bin Table For HSMZ/V/U A4xx-xxxxx only BIN MIN. MAX. VA VB V VD VE Tolerance of each bin limit = ±.1 1

11 Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per JEDE J-STD-2. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Refer to Avago Application Note AN 535 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use Unopen moisture barrier bag (MBB) can be stored at <4 /9% RH for 12 months. If the actual shelf life has exceeded 12 months and the HI indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. It is not recommended to open the MBB prior to assembly (e.g., for IQ). B. ontrol after opening the MBB The humidity indicator card (HI) shall be read immediately upon opening of MBB. The LEDs must be kept at <3 /6% RH at all times and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours.. ontrol of unfinished reel Unused LEDs need to be stored in sealed MBB with desiccant or in desiccator at <5% RH. D. ontrol of assembled boards If the PB soldered with the LEDs is to be subjected to other high temperature processes, the PB needs to be stored in sealed MBB with desiccant or in desiccator at <5% RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: 1% is Not blue and 5% HI indicator turns pink. The LEDs are exposed to conditions of >3 /6% RH at any time. The LEDs' floor life exceeds 672 hours. Recommended baking conditions: 6±5 for 2 hours. Handling Precautions The encapsulation material of the InGaN family product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. opyright Avago Technologies. All rights reserved. Obsoletes AV1-312EN AV2-479EN - March 2, 213

12 Mouser Electronics Authorized Distributor lick to View Pricing, Inventory, Delivery & Lifecycle Information: Avago Technologies: HSMM-A4-U4WM2 Broadcom Limited: HSMM-A4-U4QM2 HSMA-A41-U8M1 HSM-A41-U8M1 HSMM-A41-S4YM2 HSMN-A4-Q8QM2 HSMN- A4-R8PM2 HSMN-A41-P4QM2 HSMN-A41-P7QM2 HSMZ-A4-V3M1 HSMN-A4-S4QM2 HSMN-A4- S8PM2