Data Sheet. HSMx-C280. Miniature ChipLED. Features. Description. Applications. Device Selection Guide
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1 HSMx-C28 Miniature ChipLED Data Sheet Description The HSMx-C28 ChipLEDs are designed to 42 (1. x.5 mm) industry standard footprint. They are extremely small in size and the low.4 mm height makes them very suitable for application in small portable hand held devices where real estate is a premium. Six different colors are available: green, red, yellow, amber, and deep red. All parts are color and intensity binned except red color. They come in 8 mm paper tape on a 7 inch diameter reel with 4 units per reel which makes them compatible for automatic placement. Device Selection Guide AS AlInGaP Product Number Color Package Description HSMA-C28 Amber Untinted, Diffused HSMC-C28 Red Untinted, Diffused HSMT-C28 Deep Red Untinted, Diffused Features Extremely small size (1. x.5 x.4 mm) 42 industry standard footprint Diffused optics Operating temperature range of 4 C to +85 C Compatible with IR soldering Available in 6 colors Available in 8 mm paper tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications LCD backlighting Push button backlighting Front panel indicator Symbol backlighting Keypad backlighting GaP Product Number Color Package Description HSMG-C28 Green Untinted, Diffused HSMS-C28 HER Untinted, Diffused HSMY-C28 Yellow Untinted, Diffused CAUTION: HSMx-C28 LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
2 Package Dimensions LED DIE CATHODE MARK.5 (.2) 1. (.4).25 (.1) DIFFUSED EPOXY PC BOARD.4 (.16) POLARITY CATHODE LINE.16 (.6).3 (.12).3 (.12).4 (.16) MIN. SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. 2
3 Absolute Maximum Ratings at T A = 25 C Parameter HSMA/C/T-C28 HSMG/S/Y-C28 Units DC Forward Current [1] 25 2 ma Power Dissipation 6 52 mw Reverse Voltage (I R = 1 μa) 5 5 V LED Junction Temperature C Operating Temperature Range 4 to to +85 C Storage Temperature Range 4 to to +85 C Soldering Temperature See IR soldering profile (Figure 6 & 7) Notes: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at T A = 25 C Forward Voltage Reverse Breakdown Capacitance C Thermal V F (Volts) V R (Volts) (pf), V F =, I F = 2 I R = 1 μa f = 1 MHz R J PIN ( C/W) Part Number Typ. Max. Min. Typ. Typ. HSMA-C HSMC-C HSMT-C HSMG-C HSMS-C HSMY-C Optical Characteristics at T A = 25 C Luminous Color, Viewing Luminous Intensity Peak Dominant Angle Efficacy I V (mcd) Wavelength Wavelength 2 1/2 2 ma [1] peak (nm) d [2] (nm) Degrees [3] (lm/w) Part Number Color Min. Typ. Typ. Typ. Typ. Typ. HSMA-C28 AS Amber HSMC-C28 AS Red HSMT-C28 AS Deep Red HSMG-C28 GaP Green HSMS-C28 HER HSMY-C28 GaP Yellow Notes: 1. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3
4 Color Bin Limits [1] Green Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A B C D E Tolerance: ± 1 nm. Yellow/Amber Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A B C D E F Tolerance: ± 1 nm. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Bin ID Min. Max. A B C D E F G H J K L M N P Q R S T U V W X Y Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 4
5 RELATIVE INTENSITY - % AS DEEP AS AS AMBER RED AS RED 6 ORANGE WAVELENGTH - nm RELATIVE INTENSITY 1. GaP GREEN HER.8 GaP YELLOW WAVELENGTH nm Figure 1a. Relative intensity vs. wavelength. Figure 1b. Relative intensity vs. wavelength I F FORWARD CURRENT ma 1 1 AS AlInGaP HER LPE GREEN GaP YELLOW LUMINOUS INTENSITY (NORMALIZED AT 2 ma) GaP LUMINOUS INTENSITY (NORMALIZED AT 2 ma) AS AMBER AS RED and DEEP RED V F FORWARD VOLTAGE V I F FORWARD CURRENT ma I F FORWARD CURRENT ma Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. I F MAX. MAXIMUM FORWARD CURRENT ma AS AlInGaP GaP Rq J-A = 6 C/W T A AMBIENT TEMPERATURE C RELATIVE INTENSITY % ANGLE Figure 4. Maximum forward current vs. ambient temperature. Figure 5. Relative intensity vs. angle. 5
6 1-3 SEC. TEMPERATURE C 1 SEC. MAX. 23 C MAX. 4 C/SEC. MAX. OVER 2 MIN. 4 C/SEC. MAX. 3 C/SEC. M TEMPERATURE 217 C 2 C 15 C C 3 C/SEC. MAX. 3 C/SEC. MAX SEC. 6 C/SEC. MAX. 1 SEC. MAX. TIME TIME (Acc. to J-STD-2C) Figure 6. Recommended reflow soldering profile. Figure 7. Recommended Pb-free reflow soldering profile. USER FEED DIRECTION.5 (.2) CATHODE SIDE.5 (.2).5 (.2).5 (.2) PRINTED LABEL Figure 8. Recommended soldering pattern for HSMx-C28. Figure 9. Reeling orientation. 8. ± 1. (.315 ±.39) Ø 13.1 ±.5 (Ø.516 ±.2) 1.5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Figure 1. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 6
7 DIM. C (SEE TABLE 1) 4. (.157) 1.5 (.59) CATHODE.23 ±.5 (.9 ±.2) 1.75 (.69) 3.5 ±.5 (.138 ±.2) DIM. A (SEE TABLE 1) 8. ±.3 (.315 ±.12) DIM. B (SEE TABLE 1) 4. (.157) USER FEED DIRECTION COVER TAPE CARRIER TAPE 2. ±.5 (.79 ±.2) PART NUMBER TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (±.4) DIM. B ±.1 (±.4) DIM. C ±.1 (±.4) HSMx-C28 SERIES 1.1 (.43).6 (.24).66 (.26) Figure 11. Tape dimensions. END START THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT PUNCHED PAPER TAPE SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY PUNCHED PAPER TAPE SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF PAPER TAPE AND/OR COVER TAPE. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. Figure 12. Tape leader and trailer dimensions. 7
8 Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-16, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 3 6%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 1% when read at 23 ± 5 C. 2. Device expose to factory conditions <3 C/6%RH more than 672 hours. Recommended baking condition: 6±5 C for 2 hours. For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright Avago Technologies. All rights reserved. Obsoletes EN AV2-62EN - February 3, 212
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