Maintenance/ Discontinued

Transcription

1 A/D, D/C Converters for Image Signal Processing MN6570F, MN6570TF, and MN6570EF Low Power 8-Bit, 3-Channel CMOS D/A Converters for Image Processing Overview The MN6570F, MN6570TF, and MN6570EF are highspeed 8-bit, 3-channel CMOS digital-to-analog converters with maximum conversion rates of 35 MSPS, 40 MSPS, and 40 MSPS, respectively. They use both a matrix cell and weighted current technology. The three channels use separate clock signals, so they may be used as totally independent D/A converters. Features Maximum conversion rate: MN6570F: 35MSPS (min.) MN6570TF and MN6570EF: 40 MSPS (min.) Linearity error: ±0.2 LSB (typ.) Differential linearity error: ±0.2 LSB (typ.) Power supply voltage: V CC = 5.0±0.5 V Power consumption: MN6570F: 340 mw (typ.) MN6570TF and MN6570EF: 190 mw (typ.) Full scale current: MN6570F: 13 ma (typ.) MN6570TF and MN6570EF: 5 ma (typ.) Applications Digital television Digital video equipment Digital image processing equipment Pin Assignment DB4 DB3 DB2 DB1 CLKB DV SS DV DD DG8 DG7 DG6 DG DB5 DB6 DB7 DB8 AV SS AV SS I OB N.C. I OG N.C. I OR DG4 DG3 DG2 DG1 CLKG DV SS DV DD DR8 DR7 DR6 DR5 (TOP VIEW) QFP044-P VIB COMP V REF I REF AV DD AV DD CLKR DR1 DR2 DR3 DR4 includes following four Product lifecycle stage. SDJ00014BEM 1

2 MN6570F, MN6570TF, MN6570EF A/D, D/C Converters for Image Signal Processing Block Diagram R REF C COMP (MSB)DR1 14 DR2 13 DR3 12 DR4 DR DR6 9 DR7 8 (LSB)DR8 CLKG 5 4 (MSB)DG1 3 DG2 DG3 2 1 DG4 44 DG5 43 DG6 DG (LSB)DG (MSB)DB1 DB DB3 34 DB4 33 DB5 32 DB6 31 DB7 30 (LSB)DB V REF I REF COMP I OR I OG I OB R OUT R OUT R OUT AV DD AV DD AV SS AV SS DV DD DV DD DV SS DV SS VIB N.C. N.C. + CLKR CLKB Decoder Decoder Decoder Latch Latch Latch Latch Latch Latch + Matrix Cell Current Source Weighted Current Cell Matrix Cell Weighted Current Cell Matrix Cell Weighted Current Cell includes following four Product lifecycle stage. 2

3 A/D, D/C Converters for Image Signal Processing MN6570F, MN6570TF, MN6570EF Pin Descriptions Pin No. Symbol Function Description 1 DG4 G signal digital input 2 DG3 G signal digital input 3 DG2 G signal digital input 4 DG1 G signal digital input (MSB) 5 CLKG G signal sampling clock 6 DV SS Ground for digital circuits 7 DV DD Power supply for digital circuits 8 DR8 R signal digital input (LSB) 9 DR7 R signal digital input 10 DR6 R signal digital input 11 DR5 R signal digital input 12 DR4 R signal digital input 13 DR3 R signal digital input 14 DR2 R signal digital input 15 DR1 R signal digital input (MSB) 16 CLKR R signal sampling clock 17 AV DD Power supply for analog circuits 18 AV DD Power supply for analog circuits 19 I REF Full scale adjustment resistor 20 V REF Reference voltage input 21 COMP Phase compensation 22 VIB Capacitor connection 23 I OR R signal analog current output 24 N.C. No connection 25 I OG G signal analog current output 26 N.C. No connection 27 I OB B signal analog current output 28 AV SS Ground for analog circuits 29 AV SS Ground for analog circuits 30 DB8 B signal digital input (LSB) 31 DB7 B signal digital input 32 DB6 B signal digital input 33 DB5 B signal digital input 34 DB4 B signal digital input 35 DB3 B signal digital input 36 DB2 B signal digital input 37 DB1 B signal digital input (MSB) 38 CLKB B signal sampling clock 39 DV SS Ground for digital circuits includes following four Product lifecycle stage. 40 DV DD Power supply for digital circuits 3

4 MN6570F, MN6570TF, MN6570EF A/D, D/C Converters for Image Signal Processing Pin Descriptions (continued) Pin No. Symbol Function Description 41 DG8 G signal digital input (LSB) 42 DG7 G signal digital input 43 DG6 G signal digital input 44 DG5 G signal digital input Absolute Maximum Ratings Ta=25 C Parameter Symbol Rating Unit Power supply voltage for digital circuits DV DD 0.3 to +7.0 V Power supply voltage for analog circuits AV DD 0.3 to +7.0 V Input voltage V I DV SS 0.3 to DV DD +0.3 V Output voltage V O AV SS 0.3 to AV DD +0.3 V Operating ambient temperature T opr 20 to +70 *1 / 20 to +75 *2 / 30 to 85 *3 C Storage temperature T stg 55 to +125 C Recommended Operating Conditions V DD =AV DD =DV DD =5.0V, V SS =AV SS =DV SS =0V, Ta=25 C Parameter Symbol min typ max Unit Power supply voltage V DD V Reference MN6570F V REF voltage MN6570TF/EF Reference MN6570F R REF resistance MN6570TF/EF External compensation capacitor C COMP µf Output load MN6570F R OUT resistance MN6570TF/EF *1 MN6570F *2 MN6570TF *3 MN6570EF Digital input "H" level V IH 2.4 V DD V voltage "L" level V IL V SS 0.8 V Clock "H" level pulse width t WH 10 ns "L" level pulse width t WL 10 ns includes following four Product lifecycle stage. V Ω Ω 4

5 A/D, D/C Converters for Image Signal Processing MN6570F, MN6570TF, MN6570EF Electrical Characteristics MN6570F DV DD =AV DD =5.0V, DV SS =AV SS =0V, Ta=25 C Parameter Symbol Conditions min typ max Unit Power supply current I DD V DD =5.0V, t CLK =35MHz, R OUT =75Ω, Output amplitude =1 V, ma T=25 C Resolution RES 8 bit Linearity error E L V DD =5.0V, R OUT =75Ω ±0.2 ±0.5 LSB Differential linearity error E D R REF =430Ω ±0.2 ±0.5 LSB Full scale current I FS V REF =2.3V 13 ma Setup time t S 8 ns Hold time t H 8 ns Settling time t ST V DD =5.0V, R OUT =75Ω ns Maximum conversion speed F C(max.) R REF =430Ω V REF =2.3V MSPS Analog output delay t d 5 ns MN6570TF, MN6570EF Parameter Symbol Conditions min typ max Unit Power supply current I DD V DD =5.0V, t CLK =40MHz, R OUT =400Ω, Output amplitude =2V, ma T=25 C Resolution RES 8 bit Linearity error E L V DD =5.0V, R OUT =400Ω ±0.2 ±0.5 LSB Differential linearity error E D R REF =1100Ω ±0.2 ±0.5 LSB Full scale current I FS V REF =2.42V 5 ma Setup time t S 8 ns Hold time t H 8 ns Settling time t ST V DD =5.0V, R OUT =400Ω ns R REF =1100Ω Maximum conversion speed F C(max.) V REF =2.42V MSPS Analog output delay time t d 5 ns includes following four Product lifecycle stage. 5

6 MN6570F, MN6570TF, MN6570EF A/D, D/C Converters for Image Signal Processing Timing Chart CLK t WH t WL 2.4V Data Analog Output (Settling waveform) t S Dn-1 Dn Dn+1 t d t ST t H ±1/2LSB An t d t ST ±1/2LSB 0.8V includes following four Product lifecycle stage. 6

7 A/D, D/C Converters for Image Signal Processing MN6570F, MN6570TF, MN6570EF Package Dimensions (Unit:mm) QFP044-P ± ± (1.0) ± Seating plane (1.0) 0.1± ± ± ± ± ± ±0.2 Note) The package of this product will be changed to the following lead-free type (QFP044-P-1010E). 0 to 10.0 includes following four Product lifecycle stage. 7

8 MN6570F, MN6570TF, MN6570EF A/D, D/C Converters for Image Signal Processing New Package Dimensions (Unit: mm) QFP044-P-1010E (Lead-free package) 12.30± ± (1.00) ± (1.00) ± ± ± ± ±0.30 Seating plane ± to ±0.20 includes following four Product lifecycle stage. 8

9 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. includes following four Product lifecycle stage.