SEMICONDUCTOR TECHNOLOGY -CMOS-

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Erick Lindsey
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1 SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada

Currently, 1000M transistors can be integrated.

2 What is semiconductor and LSIs Huge number of transistors can be integrated in a small Si chip. The size of the chip is roughly the size of nails. Currently, 1000M transistors can be integrated times integration comparing to 20 yrs ago. The cost of the chip is roughly same. All electronic equipments are powered by LSIs. PCs, Cellular phones, 3D graphics, Internet.

3 PC mother board Large Scale Integration

4 SONY PLAYSTATION 2 MAINBOARD Rendering LSI Graphics LSI High Speed Memory Direct RDRAM

5 Mobile Phone Mainboard Memory, Logic, Analog

6 iphone5 Battery LCD Display Electronic Board Body

7 Electronic Board (front side) 1 LSI Computer Wireless Communication LSI

8 Electronic Board (back side) WLAN LSI Sound Codec LSI Analog LSI Flash Memory

9 Key device is LSI INTEL Pentium III module

10 This is a packaged LSI -Pentium III 300MHz Cache LSI- 20 mm 15 mm

11 Si chip is molded in the package. 2 million transistor Chip is connected to the pins thru wires.

12 6 inches Si wafer

13 8 inches Si wafer Hundreds of Chips on a Si Wafer

14 Several hundreds of chips are fabricated on a wafer simultaneously.

Chip photo - Motion Estimation Chip for HDTV camera - 9.

15 Chip photo - Motion Estimation Chip for HDTV camera mm 8.6 mm Your small finger s nail size. 200M transistors.

16 Scanning Electron Microscope photo - Cross-section of the LSI micron

17 Structure Of CMOS LSI Isolation PN-Isolation, Local oxidation Si Substrate Bulk, epitaxial, SOI Well Structure N-type well in P-type Substrate Latch Up PNP Bipolar Transistor and NPN Bipolar Transistor Fabrication Process Technology

18 Cross-section of the LSI Metal wiring Poly-silicon Poly-silicon N+ N+ P+ P+ N-type MOS transistor P-type MOS transistor N-type well P-type Si substrate Si wafer

19 Advanced Process Development Transistor module (FEP) 65nm Lithography(VUV, EPL) Mask Multi-level Metalization Module (BEP) SiGe/Metal gate High κ Gate insulator Low Resistance Ultra shallow junction Low stress Shallow Trench Isolation Fine Cu interconnect Low κ interdielectric CMPplanarization Low Resistance Contact with High Aspect ratio

20 LSI integration trend - Moore s law - Number of transistors on a chip 10B 1B 100M 10M 1M 100K 10K 1K 81 DVD player Wide-TV, PHS phone DVD-ROM DVD-RAM CHANNEL LENGTH (MICRON) Digital HDTV receiver DVD recorder The number of transistors are increasing by 58% per year. - Moore s Law Source: SEMATEC

21 Communications and Consumer Products Drive Semiconductor 45% Cellular Phones CAGR % ( ) 40% 35% 30% 25% 20% 15% Application Market Growth Video Camera Switching & LAN Advanced Desktop PC and Workstation Automotive Applications/GPS Smart Cards/Kiosks Portable Computing HDTV Set-Top DVD Box Player Internet Game Consoles Multimedia PC Digital Camera Smart Appliance-Phone 1st Generation 2nd Generation 3rd Generation 10% 5% Color TV Car Radio Semiconductor Industry Sources: Applied Materials Corporate Marketing estimates, Dataquest 0% 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 50% 55% SC Content (As % of Equipment Cost)

22 FABRICATION PROCESS ISSUES

23 Ultra Clean Room

24 Basic LSI process Layer Deposition SEM photo of Logic LSIs M7 lithography M6 M5 etching M4 M3 M2 M1 cleaning

25 Light Source Lens A Mask Lens A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A Si Wafer Stage Y Projection X

26 Packaging & Test Wafer Wafer Test Remove Process defect Chips Functional Test,DC Test Testing Assembly Flow scribing Chips Mounting Bonding Enclosing marking Final Test I Pre Test Functional Test,DC/AC Test Burn-In Ex.)Vcc:7V,Temp.:125, 24~42hrs Final Test II Shipping Test Functional Test(at Speed),DC/AC Test Sample

27 Large Scale Integration NMOS, PMOS and Wiring All Logic Function can be made Memory Element Can be made Billions of Transistors and wiring make LSI!

28 CMOS NOT (Inverter)

29 CMOS NAND と NOR A B f A B f

30 Classification Of LSI 1. Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA 2. Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory) 3. Analog LSI: ADC, DAC, Filter, Amplifier Micro Processor (PC s central processing Unit) Perform Digital computation according to the program in Memory Integration in 7000 times in 25 years, (Moor s Law) Clock Speed : 700 times in 25 years Memory LSI: Dynamic Random Access Memory: Main memory for Computer, 4-times density in 4 years Static Random Access Memory : work memory for mobile equipments Flash Memory : Nonvolatile memory, Digital Camera Storage Analog LSI: Used for interface, high speed RF interface, Analog to Digital Conversion, Digital to Analog Conversion

31 Analog to Digital Conversion Analog to Digital Sample the analog wave Convert to Digital format in Binary Continuous time Same as f(t) to An ADC LSI Discrete time

32 Chip photo 1 SoC Flash Memory

33 Chip photo 2 Mobile Digital TV receiver

SEMICONDUCTOR TECHNOLOGY -CMOS-

SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada 2011/12/19 1 What is semiconductor and LSIs Huge number of transistors can be integrated in a small Si chip. The size of the chip is roughly the size of nails.