HMC581LP6 / 581LP6E MIXERS - SMT. HIGH IP3 RFIC DUAL DOWNCONVERTER, MHz. Typical Applications. Features. Functional Diagram

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1 Typical Applications The HMC1LP6 / HMC1LP6E is ideal for Wireless Infrastructure Applications: GSM, GPRS & EDGE CDMA & W-CDMA Cellular / 3G Infrastructure Functional Diagram Features +26 dbm Input IP3 Low Single Input LO Drive: dbm 9 db Conversion Gain 13 db Noise Figure Single Positive Supply: 26 ma General Description The HMC1LP6 & HMC1LP6E are high linearity Dual Down Converter Receiver ICs that operate from - 96 MHz and deliver a +26 dbm input third order intercept point for UMTS & GSM applications. The passive mixer outputs and high dynamic range IF amplifi er inputs are positioned so that an external IF fi lter can be placed in series between them. The converter provides a gain of 9 db and typical single side band noise fi gure of 13 db. The IC operates from a single +V supply consuming 26 ma of current while requiring only dbm LO drive. The design requires no external baluns, no external matching and supports IF frequencies between and 3 MHz. Electrical Specifications, T A = +2 C, LO = dbm, Vdd = +V, IF = MHz* Parameter Min. Typ. Max. Units Frequency Range, RF - 96 MHz Frequency Range, LO MHz Frequency Range, IF - 3 MHz Conversion Gain 7 9 db Noise Figure (SSB) 13 db LO to RF Isolation 4 db LO to IF Isolation db RF to IF Isolation db IP3 (Input) dbm 1 db Compression (Input) 9. dbm Branch Isolation 4 db LO Drive Input Level (Typical) -4 to +4 dbm Supply Current (Idd for LO & IF) (IF bias resistor= 4.7 Ohms) 26 ma * Unless otherwise noted all measurements with low side LO & IF = MHz Alpha Road, Chelmsford, MA 124 Phone: Fax:

2 Conversion Gain vs. LO = dbm, IF = MHz LO = dbm - +2C +C -4C ISOLATION (db) RF TO IF LO TO RF LO TO IF Conversion Gain vs. LO Drive, IF = MHz - -4dBm -2dBm dbm +2dBm +4dBm Return LO = dbm RETURN LOSS (db) RF LO FREQUENCY (GHz) P1dB vs. LO = dbm, IF = MHz IF Bandwidth, LO = dbm 2 OUTPUT P1dB P1dB (dbm) - INPUT P1dB OUTPUT P1dB, +C OUTPUT P1dB, +2C OUTPUT P1dB, -4C INPUT P1dB, +2C INPUT P1dB, -4C INPUT P1dB, +C RESPONSE (db) CONVERSION GAIN RETURN LOSS IF FREQUENCY (GHz) * Unless otherwise noted all measurements with low side LO & IF = MHz. Alpha Road, Chelmsford, MA 124 Phone: Fax:

3 Input & Output IP3 vs. LO = dbm, IF = MHz 4 Input & Output IP3 vs LO Drive, IF = MHz 4 IP3 (dbm) OUTPUT IP3 INPUT IP3 IIP3, +2C IIP3, +C IIP3, -4C OIP3, +2C OIP3, +C OIP3, -4C IP3 (dbm) OIP3 IIP3 IIP3, -2dBm IIP3, dbm IIP3, +2dBm OIP3, -2dBm OIP3, dbm OIP3, +2dBm Input & Output IP2 vs. LO Drive, IF = MHz IP2 (dbm) OUTPUT IP2 INPUT IP2 IIP2, -2dBm IIP2, dbm IIP2, +2dBm OIP2, -2dBm OIP2, dbm OIP2,+2dBm Noise Figure vs. IF Frequency NOISE FIGURE (db) LO=7MHz LO=MHz LO=MHz LO=1MHz LO=MHz IF FREQUENCY (MHz) Branch Isolation RF1, LO = dbm -36 BRANCH ISOLATION (db) * Unless otherwise noted all measurements with low side LO & IF = MHz Alpha Road, Chelmsford, MA 124 Phone: Fax:

4 Conversion Gain vs. LO Drive IF = 7 MHz Conversion Gain vs. LO Drive, IF = MHz - -4dBm -2dBm dbm 2dBm +4dBm - -4dBm -2dBm dbm 2dBm +4dBm Conversion Gain vs. LO Drive, IF = MHz - -4dBm -2dBm dbm 2dBm +4dBm MxN IF Port nlo mrf xx RF Freq. =. - dbm LO Freq. =.7 dbm All values in dbc below IF power level (1RF - 1LO). Typical Supply Current vs. Vdd Harmonics of LO Vdd (LO + IF) Idd (ma) nlo RF Port Downconverter will operate over full voltage range shown above. LO Freq. (GHz) LO = dbm All values in dbc below input LO level measured at RF port. Alpha Road, Chelmsford, MA 124 Phone: Fax:

5 Absolute Maximum Ratings RF / IF Input (Vdd= +V) +13 dbm LO Drive (Vdd= +V) + dbm Vdd (LO or IF) +7 Vdc Channel Temperature C Continuous Pdiss (T = C) (derate 2. mw/ C above C) 1.64 W Thermal Resistance (channel to ground paddle) 39.6 C/W Storage Temperature -6 to + C Operating Temperature -4 to + C Outline Drawing ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Package Information NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 4. PAD BURR LENGTH SHALL BE.mm MAXIMUM. PAD BURR HEIGHT SHALL BE.mm MAXIMUM.. PACKAGE WARP SHALL NOT EXCEED.mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H1 HMC1LP6 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H1 HMC1LP6E RoHS-compliant Low Stress Injection Molded Plastic % matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 23 C [2] Max peak refl ow temperature of 26 C [3] 4-Digit lot number XXXX Alpha Road, Chelmsford, MA 124 Phone: Fax:

6 Pin Descriptions Pin Number Function Description Interface Schematic 1, 7 RF1, RF2 These pins are DC coupled and matched to Ohms. 2, 4, 6,,, 12, 14, 16, 1,, 22, 24, 26, 2 GND Backside of package has exposed metal ground slug that must also be connected to ground. 3 Vdd,, 19 N/C Power supply for the second stage LO amplifi er. One external bypass capacitor (1, pf) is required. 61 ma typical, 73 ma maximum. No connection. These pins may be connected to RF ground. Performance will not be affected. 9, 27 MIX IF2, MIX IF1 IF output from the mixers. This pin is DC coupled to the mixer. A low pass fi lter and blocking capacitor are required between mixer IF port and IF amplifi er. (See application circuit). 11, 2 AMP IF2, AMP IF1 Inputs to the IF amplifi ers. A low pass fi lter and blocking capacitor are required between mixer IF port and IF amplifi er. (See application circuit). 13, 23 IF2, IF1 Outputs of the IF amplifi ers and bias ports for the IF amplifi ers. A pull up inductor, resistor, and bypass capacitors are required. (See application circuit). IF1 = 71 ma typical, ma maximum. IF2 = 71 ma typical, ma maximum. 17 LO This pin is AC coupled and matched to Ohms. 21 Vdd LO Bias voltage for the fi rst stage of the LO amplifi er. A pull up inductor, resistor, and bypass capacitors are required. (See application circuit). 3 ma typical, 64 ma maximum. Alpha Road, Chelmsford, MA 124 Phone: Fax:

7 Evaluation PCB List of Materials for Evaluation PCB 1316 [1] Item Description J1 - J PCB Mount SMA RF Connector J6 - J9 DC Pins C1, C4 - C pf Chip Capacitor, 42 Pkg. C2, C3 7 pf Chip Capacitor, 42 Pkg. C11, C12, C13 pf Chip Capacitor, 42 Pkg. L1, L2 2 nh Chip Inductor, 63 Pkg. L3 22 nh Chip Inductor, 63 Pkg. L4, L 27 nh Chip Inductor, 63 Pkg. R1, R2 4.7 Ohm Resistor, 63 Pkg. The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A suffi cient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. R3 U1 PCB [2] 22 Ohm Resistor, 63 Pkg. HMC1LP6 / HMC1LP6E 69-2 Evaluation Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers Alpha Road, Chelmsford, MA 124 Phone: Fax:

8 Application Circuit Recommended Components Values (IF = DC - 3 MHz) C1, C4 - C pf C2, C3 7 pf C11, C12, C13 pf L1, L2 2 nh L3 22 nh L4, L 27 nh R1, R2 4.7 Ohm R3 22 Ohm Note: L4, C3 and L, C2 form low pass fi lters, these values may be changed for optimization of LO to IF isolation, depending on application frequency. C4 and C are DC blocks. Alpha Road, Chelmsford, MA 124 Phone: Fax: