Features. Applications. Part Number Color Package Description

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1 HSMF-C113 and HSMF-C115 Right Angle Tricolor Surface Mount ChipLEDs Data Sheet Description The HSMF-C113 / C115 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3 units per reel. The package is compatible with reflow soldering and binned by both color and intensity. Features Common anode Small 2.5 x 1. x 1. mm package Diffused optics Available in 8 mm tape on 7" diameter reels High brightness using and InGaN die technology Compatible with reflow soldering Applications Backlighting Status indicator Front panel indicator Office automation, home appliances, industrial equipment Device Selection Guide Part Number Color Package Description HSMF-C113 Red / Green / InGaN Blue Untinted, Diffused HSMF-C115 Red / InGaN Green / InGaN Blue Untinted, Diffused CAUTION: HSMF-C113 and HSMF-C115 LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.

2 Package Dimensions LED Dies 1. [.39] R.5 [.2] 2.5 [.98] 2.1 [.83].5 [.2] 1. [.39] Anode Mark.5 [.2] [.16].35 [.14].3 [.12].5 [.2].3 [.12].35 [.14].35 [.14].35 [.14] 1. All Dimensions in millimeteres (inches) 2. Tolerance is ±.1mm (±.4 in) unless otherwise specified POLARITY HSMF-C113 HSMF-C115 1 InGaN BLUE InGaN BLUE 2 3 RED RED 4 GREEN InGaN GREEN 2

3 Absolute Ratings at T A = 25 C Parameter Red Green InGaN Green InGaN Blue Units DC Forward Current [1,3] ma Power Dissipation [1] mw DC Forward Current [2] ma Power Dissipation [2 ] mw Reverse Voltage (I R = 1mA) V LED Junction Temperature C Operating Temperature Range -4 to +85 C Storage Temperature Range -4 to +85 C Soldering Temperature See IR soldering profile (Figure 6 & 7) 1. Applies when single LED is lit up. 2. Applies when all 3 LEDs are lit up simultaneously. 3. Derate linearly as shown in Figure Drive currents above 5 ma are recommended for best long term performance. Electrical Characteristics at T A = 25 C Part Number Forward Voltage VF (Volts) I F = 2mA Reverse Breakdown V R I R = 1mA Capacitance V F =, f = 1MHz Thermal Resistance Rq J-PIN ( C/W) Typ. Max. Min. Typ. Typ. Red Green InGaN Green InGaN Blue Vf tolerance : ±.1V Optical Characteristics at T A = 25 C Part Number Luminous Intensity I V [1] 2mA Peak Wavelength l peak (nm) Color, Dominant Wavelength l d [2] (nm) Viewing Angle 2q 1/2 [3] (Degrees) Luminous Efficacy h V (lm/w) Min. Typ. Typical Typical Typical Typical Red Green InGaN Green InGaN Blue The luminous intensity I V is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, λ d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. 3

4 CAUTION: 1. The above optical performance specifications are valid in the case when single LED is lit up. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than 1 LED is lit. 3. Please refer to Avago Technologies Application Brief AB D-7 for additional details / explanation on driving the part in parallel circuit. Light Intensity (I V ) Bin Limits [1] Intensity (mcd) A B C D E F G H J K L M N P Q R S T Tolerance : ±15% 1. Bin categories are established for classifi-cation of products. Products may not be available in all categories. Please contact your Avago Technologies representative for information on current available bins. Red Color Bin Limits [1] Dom. Wavelength (nm) Tolerance : ±1nm Green Color Bin Limits [1] Dom. Wavelength (nm) A B C D E Tolerance : ±1nm InGaN Green Color Bin Limits [1] Dom. Wavelength (nm) A B C D Tolerance : ±1nm InGaN Blue Color Bin Limits [1] Dom. Wavelength (nm) A B C D Tolerance : ±1nm 1. Bin categories are established for classifi-cation of products. Products may not be available in all categories. Please contact your Avago Technologies representative for information on current available bins. 4

5 RELATIVE INTENSITY InGaN Blue InGaN Green WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. Green Red IF - FORWARD CURRENT - ma Red Green InGaN Green & Blue LUMINOUS INTENSITY (NORMALIZED AT 2mA) InGaN V F - FORWARD VOLTAGE - VOLTS Figure 2. Forward current vs. forward voltage I F - FORWARD CURRENT - ma Figure 3. Luminous intensity vs. forward current. IF MAX - MAX. FORWARD CURRENT - ma T A - AMBIENT TEMPERATURE - C Figure 4. forward current vs. ambient temperature. RELATIVE INTENSITY Figure 5. Relative intensity vs. angle DEGREES ( ) InGaN Blue & InGaN Green Red 5

6 TEMPERATURE C 1 SEC. MAX. 23 C MAX. 4 C/SEC. MAX. 4 C/SEC. MAX. -3 C/SEC. TEMPERATURE 217 C 2 C 15 C C 3 C/SEC. MAX. 3 C/SEC. MAX. 1-3 SEC. 6 C/SEC. MAX. OVER 2 MIN SEC. 1 SEC. MAX. TIME Figure 6. Recommended reflow soldering profile. TIME Figure 7. Recommended Pb-free reflow soldering profile. (Acc. to J-STD-2C).4.85 EMITTING DIRECTION Figure 8. Recommended soldering land pattern. 1. All dimensions are in millimeters (inches). 2. Tolerance is ±.1mm (±.4in.) unless otherwise specified. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling orientation. 6

7 8. ± 1. (.315 ±.39) 1.5 ± 1. (.413 ±.39) Ø 13.1 ±.5 (Ø.516 ±.2) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Figure 1. Reel dimensions. 4. [.157] 1.5 [.59] 1.75 [.69] DIM. C [SEE TABLE 1].254 ±.5 [.1 ±.2] DIM. A [SEE TABLE 1] 3.5 ±.5 [.138 ±.2] 8. ±.3 [.315 ±.12] ANODE DIM. B [SEE TABLE 1] 2. ±.5 [.79 ±.2] Figure 11. Tape dimensions. 4. [.157] 1. All dimensions are in millimeters (inches). 2. Tolerance is ±.1mm (±.4in.) unless otherwise specified. USER FEED DIRECTION PART NUMBER HSMF-C113 HSMF-C115 DIM. A ±.1 (.4) COVER TAPE DIM. B ±.1 (.4) CARRIER TAPE DIM. C ±.1 (.4) 2.75 (.18) 1.2 (.47) 1.2 (.47)

8 END START THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS Figure 12. Tape leader and trailer dimensions. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-16, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 3 6%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 1% when read at 23 ± 5 C. 2. Device expose to factory conditions <3 C/6%RH more than 672 hours. Recommended baking condition: 6±5 C for 2 hours. For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright Avago Technologies. All rights reserved. Obsoletes EN AV2-611EN - April 9, 21

9 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Avago Technologies: HSMF-C113 HSMF-C115

Features. Applications

Features. Applications HSMF-C118 TriColor ChipLED Data Sheet Description The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging