Data Sheet. HDSP-573x Seven Segment Displays for High Light Ambient Conditions. Description. Features

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1 HDSP-x Seven Segment Displays for High Light Ambient Conditions Data Sheet High Efficiency Red: HDSP-900 Series Yellow: HDSP-00/-10/-0/-00 Series Description The HDSP-900 and HDSP-00/-10/-0/-00 are. mm, 10.9 mm/1. mm/0. mm high efficiency red and yellow displays designed for use in high light ambient condition. The four sizes of displays allow for viewing distances at,,, and 10 meters. These seven segment displays utilize large junction high efficiency LED chips made from GaAsP on a transparent GaP substrate. Due to the large junction area, these displays can be driven at high peak current levels needed for high ambient conditions or many character multiplexed operation. These displays have industry standard packages, and pin configurations and ±1 overflow display are available in all four sizes. These numeric displays are ideal for applications such as Automotive and Avionic Instrumentation, Point of Sale Terminals, and Gas Pump. Features High light output Typical intensities of up to.0 mcd/seg at 100 ma pk 1 of duty factor Capable of high current drive Excellent for long digit string multiplexing Four character sizes. mm, 10.9 mm, 1. mm, and 0. mm Choice of two colors High Efficiency Red Yellow Excellent character appearance Evenly lighted segments Wide viewing angle Gray body for optimum contrast Categorized for luminous intensity; Yellow categorized for color Use of like categories yields a uniform display IC compatible Mechanically rugged

2 Devices Part No. HDSP- Color Description 00 Yellow. mm Common Anode Left Hand Decimal A 01. mm Common Anode Right Hand Decimal B 0. mm Common Cathode Right Hand Decimal C 0. mm Universal Overflow ±1 Right Hand Decimal D 10 Yellow 10.9 mm Common Anode Left Hand Decimal E mm Common Anode Right Hand Decimal F mm Common Cathode Right Hand Decimal G mm Universal Overflow ±1 Right Hand Decimal H 1 Yellow 1. mm Common Anode Right Hand Decimal I 1. mm Common Cathode Right Hand Decimal J 1. mm Overflow ±1 Common Anode K 1.1 mm Overflow ±1 Common Cathode L 900 High Efficiency Red 0. mm Common Left Hand Decimal M mm Common Anode Right Hand Decimal N mm Common Cathode Right Hand Decimal O mm Common Cathode Left Hand Decimal P mm Universal Overflow ±1 Right Hand Decimal Q 00 Yellow 0. mm Common Left Hand Decimal M mm Common Anode Right Hand Decimal N 0 0. mm Common Cathode Right Hand Decimal O 0 0. mm Universal Overflow ±1 Right Hand Decimal Q Note: Universal pinout brings the anode and cathode of each segment s LED out to separate pins. See internal diagrams D and H. Package Drawing Absolute Maximum Ratings (All Products) Parameter Symbol Yellow/High Efficiency Red Units Average Power per Segment or DP (T A = C) 10 mw Peak Forward Current per Segment or DP (T A = C) 1 (Pulse Width = 0.1 ms) ma DC Forward Current per Segment [] or DP (T A = C) 0 mw Operating Temperature T O -0 to C Storage Temperature T S -0 to C Reverse Voltage per segment or DP V R.0 V Wavesolder Temperature (1.9mm [1/1 inch] below body) 0 C for secs Note: 1. See Figure 1 to establish pulsed operating conditions. Derate maximum DC current above T A = C at 0.0 ma/ C per segment, see Figure.

3 Package Dimensions (HDSP-00 Series) FUNCTION Pin A -00 B -01 C -0 D p NO CONN. [] NO CONN. [] p ANODE-f ANODE-g p p p Package Dimensions (HDSP-10 Series) FUNCTION Pin E -10 F -11 G -1 H p NO CONN. [] NO CONN. [] p ANODE-f NO CONN. [] p ANODE-g CATHODE [] p p

4 Package Dimensions (HDSP-0 Series) Pin K -,d,b, DP CATHODE DP,d, DP,d [] FUNCTION L -,d,b, DP ANODE DP,b, DP,d [] Package Dimensions (-900/-00 Series) FUNCTION Notes: 1. Dimensions in millimeters and inches.. All untoleranced dimensions are for reference only.. Redundant anodes.. Unused dp position. Pin M 900/00 p. See Internal Circuit Diagram.. Redundant Cathodes.. For HDSP-10/-1/-00 Series product only.. See part number table for LMDP and RMDP designation. N 901/01 NO CONN. p O 90/0 ANODE-f NO CONN. p ANODE-g P 90 ANODE-f p ANODE-g Q 90/0 p p p

5 Internal Circuit Diagram (HDSP-00 Series) Internal Circuit Diagram (HDSP-10 Series) Internal Circuit Diagram (HDSP-0 Series)

6 Internal Circuit Diagram (HDSP-900/-00 Series) Electrical/Optical Characteristics at T A = C Parameter Luminous Intensity/Segment [1, ] (Digit Average) Sym. Device HDSP- Min. Typ. Max. Units Test Condition I V cd 100 ma Pk 1 of Duty Factor cd 0 ma DC Peak Wavelength PEAK 900 nm 00/10/ nm 0/00 cd cd 100 ma Pk; 1 of Duty Factor 0 ma DC Dominant Wavelength [,] d 900 nm (Digit Average) 00/10/ 0/ nm Forward Voltage/Seg or D.P. V F All Devices.. V I F = 100 ma Reverse Current/Seg or D.P. I R All Devices 100 A V R =.0 V Temp. Coeff. of V F /Seg or D.P. V F / C All Devices 1.1 mv/ C I F = 100 ma Thermal Resistance LED R J-PIN 00/10 C/W/Seg Junction-to-Pin 0 C/W/Seg 900/00 C/W/Seg Notes: 1. Case temperature of the device immediately prior to the intensity measurement is C.. The digits are categorized for luminous intensity with the intensity category designated by a letter on the side of the package.. The dominant wavelength, d, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.. The yellow displays are categorizes as to dominant wavelength with the category designated by a number adjacent to the intensity category letter.

7 Figure 1. Maximum Allowed Peak Current vs. Pulse Duration. Figure. Maximum Allowable DC Current per Segment vs. Ambient Temperature. Figure. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Segment Current. Figure. Peak Forward Segment Current vs. Peak Forward Voltage. Figure. Relative Luminous Intensity vs. DC Forward Current.

8 Electrical These display devices are composed of eight light emitting diodes, with light from each LED optically stretched to form individual segments and a decimal point. The devices utilize LED chips which are made from GaAsP on a transparent GaP substrate. These display devices are designed for strobed operation. The typical forward voltage values, scaled from Figure, should be used for calculating the current limiting resistor value and typical power dissipation. Expected maximum V F values, for the purpose of driver circuit design and maximum power dissipation, may be calculated using the following V F MAX models: V F MAX =.1 V + I PEAK (1. ) For: I F 0 ma V F MAX = 1.9 V + I DC (1. ) For: 10 ma I F 0 ma Temperature derated strobed operating conditions are obtained from Figures 1 and. Figure 1 relates pulse duration (t p ), refresh rate (f), and the ratio of maxi mum peak current to maxi mum dc current (I PEAK MAX/I DC MAX). Figure presents the maximum allowed dc current vs. ambient temperature. Figure 1 is based on the principle that the peak junc tion temperature for pulsed operation at a specified peak current, pulse duration and refresh rate should be the same as the junction temperature at maximum DC operation. Refresh rates of 1 khz or faster minimize the pulsed junction heating effect of the device resulting in the maximum possible time average luminous intensity. The time average luminous inten sity can be calculated knowing the average forward current and relative efficiency characteristic, PEAK, of Figure. Time average luminous intensity for a device case temperature of C, I V ( C), is calculated as follows: I AVG I V ( C) = [ ] [ PEAK ] [I V DATA SHEET ] 0 ma Example: For HDSP-00 series PEAK = 1.00 at I PEAK = 100 ma. For DF = 1/: 0 ma I V ( C) = [ ] [1.00] [. mcd] 0 ma =. mcd/segment The time average luminous inten sity may be adjusted for operat ing junction temperature by the following exponential equation: I V (T J ) = I V ( C) e [k(t J + C)] where T J = T A + P D J-A Device / C -00/-10/-0/ / C Mechanical These devices are constructed utilizing a lead frame in a standard DIP package. The LED dice are attached directly to the lead frame. Therefore, the cathode leads are the direct thermal and mechanical stress paths to the LED dice. The absolute maximum allowed junction temperature, T J MAX, is 10 C. The maximum power ratings have been established so that the worst case V F device does not exceed this limit. Worst case thermal resistance pin-to-ambient is 00 C/W/ Seg when these devices are soldered into minimum trace width PC boards. When installed in a PC board that provides R PIN-A less than 00 C/W/Seg these displays may be operated at higher average currents as shown in Figure. Optical The radiation pattern for these devices is approximately Lam bertian. The luminous sterance may be calculated using one of the two following formulas. I v (cd) L V (cd/m ) = A (m ) I v (cd) L V (footlamberts) = A (ft ) Device Area/Seg. mm Area/Seg. in / K

9 Contrast Enhancement The objective of contrast enhance ment is to optimize dis play readability. Adequate contrast enhancement can be achieved in indoor applications through luminous contrast techniques. Luminous contrast is the observed brightness of the illuminated segment compared to the brightness of the surround. Appropriate wavelength filters maximize luminous contrast by reducing the amount of light reflected from the area around the display while transmitting most of the light emitted by the segment. These filters are described further in Application Note 101. Chrominance contrast can further improve display readability. Chrominance contrast refers to the color difference between the illuminated segment and the surrounding area. These displays are assembled with a gray package and untinted encapsulating epoxy in the segments to improve chrominance contrast of the ON segments. Additional contrast enhancement in bright ambients may be achieved by using a neutral density gray filter such as Panelgraphic Chromafilter Gray 10, or M Light Control Film (louvered film). For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright Avago Technologies. All rights reserved. Obsoletes 9-1EN AV0-EN - June, 010

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