1.5 GHz to 4.5 GHz, GaAs, MMIC, Double Balanced Mixer HMC213BMS8E

Transcription

1 FEATURES Passive: no dc bias required Conversion loss: 1 db typical Input IP3: 21 dbm typical RoHS compliant, ultraminiature package: 8-lead MSOP APPLICATIONS Base stations Personal Computer Memory Card International Association (PCMCIA) transceivers Wireless local loops 1. GHz to 4. GHz, GaAs, MMIC, Double Balanced Mixer FUNCTIONAL BLOCK DIAGRAM GND 1 LO 2 GND 3 NIC 4 8 GND 7 RF 6 GND IF NOTES 1. NIC = NOT INTERNALLY CONNECTED. THESE PINS CAN BE CONNECTED TO RF/DC GROUND. PERFORMANCE IS NOT AFFECTED. Figure GENERAL DESCRIPTION The is an ultraminiature double balanced mixer in a plastic, 8-lead mini small outline package (MSOP). This passive monolithic microwave integrated circuit (MMIC) mixer is constructed of gallium arsenide (GaAs) Schottky diodes and novel planar transformer baluns on the chip. The device can be used as an upconverter, downconverter, biphase demodulator or modulator, or phase comparator. The consistent MMIC performance improves system operation and ensures regulatory compliance. Rev. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 916, Norwood, MA , U.S.A. Tel: Analog Devices, Inc. All rights reserved. Technical Support

2 TABLE OF CONTENTS Features... 1 Applications... 1 Functional Block Diagram... 1 General Description... 1 Revision History... 2 Specifications... 3 Absolute Maximum Ratings... 4 Thermal Resistance... 4 ESD Caution... 4 Pin Configuration and Function Descriptions... Interface Schematics... Typical Performance Characteristics... 6 Data Sheet Downconverter Performance...6 Upconverter Performance... 1 Isolation and Return Loss IF Bandwidth Downconverter Spurious and Harmonics Performance Theory of Operation Applications Information... 2 Typical Application Circuit... 2 Evaluation PCB Information... 2 Outline Dimensions Ordering Guide REVISION HISTORY 2/218 Revision : Initial Version Rev. Page 2 of 21

3 SPECIFICATIONS Ambient temperature (TA) = 2 C, IF = 1 MHz,, upper sideband. All measurements performed as a downconverter on the evaluation printed circuit board (PCB), unless otherwise noted. Table 1. Parameter Symbol Min Typ Max Unit Test Conditions/Comments FREQUENCY RANGE RF RF GHz LO Input LO GHz IF IF DC 1. GHz LO AMPLITUDE 9 13 dbm 1. GHz TO 4. GHz PERFORMANCE Downconverter IFOUT Conversion Loss 1 11 db Input Third-Order Intercept IP dbm Input 1 db Compression Point P1dB 11 dbm Upconverter IFIN IFIN = 1 MHz Conversion Loss 1 db Input Third-Order Intercept IP3 17 dbm Input 1 db Compression Point P1dB 8 dbm Isolation RF to IF 8 13 db LO to RF db LO to IF 23 3 db 1.7 GHz TO 3.6 GHz PERFORMANCE LO = 1 dbm Downconverter IFOUT Conversion Loss 1. db Input Third-Order Intercept IP3 19 dbm Input 1 db Compression Point P1dB 1. dbm Upconverter IFIN IFIN = 1 MHz Conversion Loss 9 db Input Third-Order Intercept IP3 12 dbm Input 1 db Compression Point P1dB 6 dbm Isolation RF to IF 13 db LO to RF 31 db LO to IF 27 db Rev. Page 3 of 21

4 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating RF Input Power 13 dbm LO Input Power 27 dbm IF Input Power 13 dbm IF Source/Sink Current 9 ma Reflow Temperature 26 C Continuous Power Dissipation, PDISS W (TA = 8 C, Derate.9 mw/ C Above 8 C) Maximum Junction Temperature 17 C Operating Temperature Range 4 C to +8 C Storage Temperature Range 6 C to + C Lead Temperature Range 6 C to + C Electrostatic Discharge (ESD) Sensitivity Human Body Model 2 V Field Induced Charged Device Model 12 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Data Sheet THERMAL RESISTANCE Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required. θja is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θjc is the junction to case thermal resistance. Table 3. Thermal Resistance Package Type θja θjc Unit RM C/W 1 See JEDEC standard JESD1-2 for additional information on optimizing the thermal impedance (PCB with 3 3 vias). ESD CAUTION Rev. Page 4 of 21

5 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND 1 8 GND LO GND 2 3 TOP VIEW (Not to Scale) 7 6 RF GND NIC 4 IF NOTES 1. NIC = NOT INTERNALLY CONNECTED. THESE PINS CAN BE CONNECTED TO RF/DC GROUND. PERFORMANCE IS NOT AFFECTED Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. Mnemonic Description 1, 3, 6, 8 GND Ground. Connect these pins to RF/dc ground. 2 LO Local Oscillator (LO) Port. This pin is ac-coupled and matched to Ω. 4 NIC Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected. IF Intermediate Frequency (IF) Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 9 ma of current or die malfunction and possible die failure can result. See Figure for the interface schematic. 7 RF Radio Frequency (RF) Port. This pin is ac-coupled and matched to Ω. INTERFACE SCHEMATICS GND Figure 3. GND Interface Schematic IF Figure. IF Interface Schematic LO RF Figure 4. LO Interface Schematic Figure 6. RF Interface Schematic Rev. Page of 21

6 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS DOWNCONVERTER PERFORMANCE IF OUT = 1 MHz, Upper Sideband 1 +8 C +2 C 4 C 1 LO = dbm Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures, Figure 1. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C LO = dbm Figure 8. Input IP3 vs. RF Frequency at Various Temperatures, Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 2 LO = dbm INPUT P1dB (dbm) 1 INPUT P1dB (dbm) Figure 9. Input P1dB vs. RF Frequency at Various Temperatures, Figure 12. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 6 of 21

7 IF OUT = 1 MHz, Lower Sideband 1 +8 C +2 C 4 C 1 LO = dbm Figure 13. Conversion Gain vs. RF Frequency at Various Temperatures, Figure. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 3 2 LO = dbm Figure 14. Input IP3 vs. RF Frequency at Various Temperatures, Figure 16. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 7 of 21

8 Data Sheet IF OUT = MHz, Upper Sideband 1 +8 C +2 C 4 C 1 LO = dbm Figure 17. Conversion Gain vs. RF Frequency at Various Temperatures, Figure 2. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 3 2 LO = dbm Figure 18. Input IP3 vs. RF Frequency at Various Temperatures, Figure 21. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 2 INPUT P1dB (dbm) 1 INPUT P1dB (dbm) Figure 19. Input P1dB vs. RF Frequency at Various Temperatures, LO = dbm Figure 22. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 8 of 21

9 IF OUT = MHz, Lower Sideband 1 +8 C +2 C 4 C 1 LO = dbm Figure 23. Conversion Gain vs. RF Frequency at Various Temperatures, Figure 2. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C LO = dbm Figure 24. Input IP3 vs. RF Frequency at Various Temperatures, Figure 26. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 9 of 21

10 Data Sheet UPCONVERTER PERFORMANCE IF IN = 1 MHz, Upper Sideband 1 +8 C +2 C 4 C 1 LO = dbm Figure 27. Conversion Gain vs. RF Frequency at Various Temperatures, Figure 3. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 3 2 LO = dbm Figure 28. Input IP3 vs. RF Frequency at Various Temperatures, Figure 31. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C LO = dbm INPUT P1dB (dbm) 1 INPUT P1dB (dbm) Figure 29. Input P1dB vs. RF Frequency at Various Temperatures, Figure 32. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 1 of 21

11 IF IN = 1 MHz, Lower Sideband 1 +8 C +2 C 4 C 1 LO = dbm Figure 33. Conversion Gain vs. RF Frequency at Various Temperatures, Figure 3. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 3 2 LO = dbm Figure 34. Input IP3 vs. RF Frequency at Various Temperatures, Figure 36. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 11 of 21

12 Data Sheet IF IN = MHz, Upper Sideband 1 +8 C +2 C 4 C 1 LO = dbm Figure 37. Conversion Gain vs. RF Frequency at Various Temperatures, Figure 4. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 3 2 LO = dbm Figure 38. Input IP3 vs. RF Frequency at Various Temperatures, Figure 41. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 2 LO = dbm INPUT P1dB (dbm) 1 INPUT P1dB (dbm) Figure 39. Input P1dB vs. RF Frequency at Various Temperatures, Figure 42. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 12 of 21

13 IF IN = MHz, Lower Sideband 1 +8 C +2 C 4 C 1 LO = dbm Figure 43. Conversion Gain vs. RF Frequency at Various Temperatures, Figure 4. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C Figure 44. Input IP3 vs. RF Frequency at Various Temperatures, LO = dbm Figure 46. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 13 of 21

14 ISOLATION AND RETURN LOSS LO TO RF ISOLATION (db) C +2 C 4 C Figure 47. LO to RF Isolation vs. RF Frequency at Various Temperatures, LO TO IF ISOLATION (db) C +2 C 4 C Figure 48. LO to IF Isolation vs. RF Frequency at Various Temperatures, LO TO RF ISOLATION (db) Data Sheet 1 LO = dbm Figure. LO to RF Isolation vs. RF Frequency at Various LO Power levels, TA = 2 C LO TO IF ISOLATION (db) LO = dbm Figure 1. LO to IF Isolation vs. RF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 2 2 RF TO IF ISOLATION (db) Figure 49. RF to IF Isolation vs. RF Frequency at Various Temperatures, RF TO IF ISOLATION (db) 1 LO = dbm Figure 2. RF to IF Isolation vs. RF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 14 of 21

15 LO = 1dBm LO RETURN LOSS (db) Figure 3. LO Return Loss vs. RF Frequency, TA = 2 C, LO = 1 dbm and 13 dbm IF RETURN LOSS (db) LO = dbm Figure. IF Return Loss vs. RF Frequency at Various LO Power Levels, LO at 2. GHz, TA = 2 C RF RETURN LOSS (db) LO = dbm Figure 4. RF Return Loss vs. RF Frequency at Various LO Power Levels, LO at 2. GHz, TA = 2 C Rev. Page of 21

16 Data Sheet IF BANDWIDTH DOWNCONVERTER LO = 1.8 GHz Upper sideband (low-side LO) C +2 C 4 C 1 LO = dbm IF FREQUENCY (GHz) Figure 6. Conversion Gain vs. IF Frequency at Various Temperatures, IF FREQUENCY (GHz) Figure 8. Conversion Gain vs. IF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C 3 2 LO = dbm IF FREQUENCY (GHz) Figure 7. Input IP3 vs. IF Frequency at Various Temperatures, IF FREQUENCY (GHz) Figure 9. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 16 of 21

17 LO = 4.4 GHz Lower sideband (high-side LO) C +2 C 4 C 1 LO = dbm IF FREQUENCY (GHz) Figure 6. Conversion Gain vs. IF Frequency at Various Temperatures, IF FREQUENCY (GHz) Figure 62. Conversion Gain vs. IF Frequency at Various LO Power Levels, TA = 2 C C +2 C 4 C IF FREQUENCY (GHz) Figure 61. Input IP3 at vs. IF Frequency at Various Temperatures, LO = dbm IF FREQUENCY (GHz) Figure 63. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 2 C Rev. Page 17 of 21

18 SPURIOUS AND HARMONICS PERFORMANCE Mixer spurious products are measured in dbc from either the RF pin or the IF pin output power level. N/A means not applicable. LO Harmonics, and all values in dbc below input LO level and measured at RF port. N/A means not applicable. Table. LO Harmonics at RF N LO Spur at RF Port (dbc) LO Frequency (GHz) Downconverter M N Spurious Outputs Spur values are (M RF) (N LO). RF = 3. GHz at 1 dbm, LO = 3.6 GHz at 13 dbm. Data Sheet N LO N/A M RF Upconverter M N Spurious Outputs Spur values are (M IFIN) + (N LO). IFIN = 1 MHz at 1 dbm, LO = 3.6 GHz at 13 dbm. M IF N LO N/A Rev. Page 18 of 21

19 THEORY OF OPERATION The is an ultraminiature, double balanced mixer that can be used as an upconverter or a downconverter from 1. GHz to 4. GHz. When used as a downconverter, the downconverts RF values between 1. GHz and 4. GHz to IF values between dc and 1. GHz. When used as an upconverter, the mixer upconverts IF values between dc and 1. GHz to RF between 1. GHz and 4. GHz Rev. Page 19 of 21

20 APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT Figure 64 shows the typical application circuit for the. The is a passive device and does not require any external components. The LO and RF pins are internally ac-coupled. The IF pin is internally dc-coupled. When IF operation to dc is not required, use of an external series capacitor of a value chosen to pass the necessary IF frequency range is recommended. When IF operation to dc is required, do not exceed the IF source and sink current rating specified in the Absolute Maximum Ratings section. LO HMC213B GND GND Figure 64. Typical Application Circuit RF IF Data Sheet EVALUATION PCB INFORMATION Use RF circuit design techniques for the PCB. Ensure that signal lines have Ω impedance. Connect the package ground leads directly to the ground plane (see Figure 6). Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 6 is available from Analog Devices, Inc., upon request. Table 6. Bill of Materials Item Description J1, J2, J3 PCB mount SMA RF connectors U1 PCB evaluation board on Rogers is the raw bare PCB identifier. Reference EV1HMC213BMS8 when ordering the complete evaluation PCB. Figure 6. Evaluation PCB Top Layer Rev. Page 2 of 21

21 OUTLINE DIMENSIONS PIN 1 IDENTIFIER COPLANARITY.1.6 BSC MAX 6 MAX.23.9 COMPLIANT TO JEDEC STANDARDS MO-187-AA Figure Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters ORDERING GUIDE Model 1 Temperature Range Moisture Sensitivity Level (MSL) Rating Package Description Package Option 4 C to +8 C MSL1 8-Lead Mini Small Outline Package [MSOP] RM-8 TR 4 C to +8 C MSL1 8-Lead Mini Small Outline Package [MSOP] RM-8 EV1HMC213BMS8 Evaluation PCB 1 The and TR are RoHS compliant parts. 1 The peak reflow temperature is 26 C. See Table 2 in the Absolute Maximum Ratings section B 218 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D /18() Rev. Page 21 of 21