Current status of Hamamatsu Si detectors mainly for High Energy Physics Experiments

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Current status of Hamamatsu Si detectors mainly for High Energy Physics Experiments HAMAMATSU PHOTONICS K.K. K.Yamamura S.Kamada* December 2017 Solid State Division

Outline 1/32 1. SSD (Silicon Strip Detector) for tracker of many HEP experiments 2. Development of large area PAD detector 3. APD(Avalanche Photo Diode) for LHC-CMS 4. MPPC (Multi Pixel Photon Counter) for HEP application 5. MPPC for medical application

Hamamatsu Si detectors for HEP 2/32 Particle detection Silicon Strip Detector(SSD) Silicon Pixel Detector Silicon PAD Detector SSSD DSSD PAD Photo detection Silicon Photo Diode(PD) Silicon Avalanche Diode(APD) Multi Pixel Photon Counter(MPPC ) APD MPPC

1. SSD (Silicon Strip Detector) for tracker of many HEP experiments 2. Development of large area PAD detector 3. APD(Avalanche Photo Diode) for LHC-CMS 4. MPPC (Multi Pixel Photon Counter) for HEP application 5. MPPC for medical application

Review of main SSDs made by Hamamatsu (~1999) 3/32 PROJECT DETECTOR TYPE size QTY. period MARKⅡ DC-SSSD 3type 3chip/4inch 44 1987 CLEOⅡ AC-DSSD 3type 1chip/4inch Pside: punch-through, Nside: poly-si & DML 2chip/4inch 122 1993~1994 DELPHI AC-DSSD 2type both-side: poly-si, Nside: DML 2chip/4inch 130 1993~1994 DELPHI up grade AC-SSSD, FOXFET 2chip/4inch 330 1994 NOMAD AC-SSSD, FOXFET 2chip/4inch 650 1996~1997 CLEOⅢ DC-DSSD, Pside: DML 2chip/4inch 550 1997~1999 CDF-SVX AC-DSSD 3type 1chip/4inch both-side: poly-si, Nside: DML 2chip/4inch 360 1997~1999 CDF-ISL AC-DSSD both-side: poly-si, Pside: stereo 1chip/4inch 550 1998~1999 PAMELA AC-DSSD Pside: punch-through, Nside: poly-si & DML 2chip/4inch 60 1997 KEK-B(BELLE) AC-DSSD both-side: poly-si, Nside: DML 2chip/4inch 180 1998 ZEUS AC-SSSD 3type, poly-si 1chip/4inch 950 1999

Review of main SSDs made by Hamamatsu (2000~) 4/32 PROJECT DETECTOR TYPE size QTY. period AGILE AC-SSSD, poly-si 1chip/6inch 500 2000 PAMELA DC-SSSD 1chip/6inch 300 2000 BELLE up grade AC-DSSD, both-side: poly-si 2chip/4inch 250 2000~2002 ATLAS AC-SSSD 6type, poly-si 1chip/4inch 15500 2001~2003 GLAST AC-SSSD, poly-si 1chip/6inch 11500 2001~2003 CMS AC-SSSD 14type, poly-si 1chip/6inch 24000 2003~2006 LHC-b AC-SSSD, poly-si 1chip/6inch 560 2005~2006 ALICE AC-SSSD 2type, poly-si 1chip/6inch 106 2005~2006 Phenix Strippixel, DML 3chip/6inch 600 2007 PP2PP AC-SSSD 2type, poly-si 1chip/6inch 120 2003~2007 FVTX AC-SSSD 2type, poly-si 3chip/6inch 450 2009~2010 ASTRO-H DC-DSSD, DC-PAD, Pside: DML 3chip/6inch 260 2007~2011 STAR-HFT AC-SSSD, poly-si 2chip/6inch 216 2012 HALL-B AC-SSSD(stereo) 3type, poly-si 1chip/6inch 434 2012 BELLE-II AC-DSSD, 2type, Poly-Si 1chip/6inch 265 2011~2014 DAMPE AC-SSSD, poly-si 1chip/6inch 768 2014

ATLAS-SSSDs 5/32 Poly-Si resistor Bias ring DC-PAD Guard ring AC-PAD provided from ATLAS experiment groups 1 Sensor on 4 inch wafer AC coupling-sssd 6 type of S8536 series

CMS-SSSDs 6/32 1 Sensor on 6 inch wafer S9153 S9154 series provided from CERN experiment groups

Fermi(GLAST)-SSSD 7/32 Total strip detectors:11,000pcs 8.95x8.95 mm 228μm pitch provided from GLAST experiment groups

Belle - DSSD 8/32 Double Side SSD (DSSD) from 6inch wafer P side N side provided from Belle experiment groups Belle-DSSD

1. SSD (Silicon Strip Detector) for tracker of many HEP experiments 2. Development of large area PAD detector 3. APD(Avalanche Photo Diode) for LHC-CMS 4. MPPC (Multi Pixel Photon Counter) for HEP application 5. MPPC for medical application

History of Hamamatsu Si wafer size 9/32 Wafer size φ1.5inch Φ2inch Φ3inch Φ4inch Φ6inch Φ8inch Production term 1972~1985 1975~1986 1983~1996 1987~2008 1998~ developing (1.5inch) (2inch) (3inch) (4inch) (6inch) (8inch)

Development of 8inch-PAD detector 10/32 Now Developing 6inch-PAD detector - 12 Polygon shape chip - 109 x Hexagonal PADs + α 8inch-PAD detector - Hexagonal shape chip - 217 x Hexagonal PADs + α

Development of 8inch-PAD detector 11/32 Our 1st Proto-type (target for CMS-HGCAL HL-LHC) - Size : 8 inch -Type : N+ in p (P-substrate and N-PAD) -Thickness : 3types Active 300μm Physical 300μm Active 200μm Physical 200μm Active 120μm Physical 300μm main sensor Test structures -Size of PAD :~ 1cm2 -Number of Hexagonal PAD : 217ch miniature diode 8inch wafer

Result-1 Guard-Ring I-V of Main Sensor 12/32 Champion data -300μm and 200μm type 1000V voltage tolerance, but higher dark current compared to 120μm-type or conventional 6inch. -120μm type 1000V voltage tolerance and low dark current.

Result-2 Channel I-V of Main Sensor 13/32 We measured IV curve of every channels with surrounded channels GND. Champion data 300μm type 200μm type 120μm type high dark channel (9ch) -300μm and 200μm type 1000V voltage tolerance, but higher dark current. -120μm type Some specific chs have higher dark. ( We almost know the cause)

Result-3 C-V curve of Mini Diode We measured CV curve of Mini Diode and estimated the full depletion voltage. GR 14/32 4.5mm PAD Full depletion voltage 300μm type : ~280V 200μm type : ~130V 120μm type : ~ 30V

Future prospect of 8inch wafer production 15/32 DC-type : PAD-detector, PIXEL Development stage ~2019 will be available 2020~ AC-type : AC coupled SSD Development stage 2020~2022 will be available 2023~

1. SSD (Silicon Strip Detector) for tracker of many HEP experiments 2. Development of large area PAD detector 3. APD(Avalanche Photo Diode) for LHC-CMS 4. MPPC (Multi Pixel Photon Counter) for HEP application 5. MPPC for medical application

CMS-APD 16/32 About 130,000 pieces of APD are used for CMS-ECAL provided from CERN experiment groups S8148 Spec.(Ta = 25 ) STD No active area breakdown voltage (VB) Operating Voltage (VR) Difference VB-VR Dark current at VR Capacitance at VR Quantum efficiency at VR, 430nm Passivation laye r Protective coating S8148 5 x 5 mm2 > 325 V 300-450 V > 25 V < 50 na 65-85 pf 75 ± 5% SiN Epoxy Resin

Characteristic required for the CMS-APD 17/32 APD is used in a high magnetic field require to operate at high magnetic field proton particle PbWO 4 crystal 65,000pcs Blue light Blue light from crystal is weak. require high blue sensitivity and low noise proton Radiation hit directly to APD. require high radiation tolerance (2E13 n-eq/cm 2 ) and less sensitive to incident radiation background APD 130,000pcs Signal APD needs large area to cover a crystal S8148 APD are controlled from outside the accelerator require low bias dependence and easy to control

1. SSD (Silicon Strip Detector) for tracker of many HEP experiments 2. Development of large area PAD detector 3. APD(Avalanche Photo Diode) for LHC-CMS 4. MPPC (Multi Pixel Photon Counter) for HEP application 5. MPPC for medical application

MPPC Technology Overview 18/32 What is an MPPC? - Multi-Pixel Photon Counter a new type of photon-counting device made up of multiple APD pixels operated in Geiger mode pixel Features - Small size / light weight - Room temperature operation - Low bias operation : ~40V - High gain: 10 5 to 10 6 - Excellent timing resolution - Insensitive to magnetic fields - Simple readout circuit operation 3-p.e. APD Quenching resistor 2-p.e. 1-p.e. Output is summation of all pixel output Q out = N fired C pixel (V op -V BR ) N fired = PDE x N photon

History of MPPC s 19/32 Noise 2007 1 st generation (S10362 series) 2013 2 nd generation (S1257x series) 2015 w/ Low afterpulse 3 rd generation (S1336x series) 2017 New 4 th generation (S1416x series) w/ High Fill factor Low Operation voltage Sensitivity (PDE)

Characteristics comparison of PD,APD,MPPC and PMT 20/32 PD APD MPPC PMT Gain 1 10 2 10 5-10 6 10 5 10 7 Operation voltage 5 V 100 500 V ~40 V 800 1000 V Large area No No Scalable Yes Readout circuit Complex Complex Simple Simple Detection efficiency High High High Middle Noise Low Middle Middle Low Timing reso. - - High Middle Energy reso. High Middle High High Ambient light resist. Yes Yes Yes No Magnetic resist Yes Yes Yes No Compact Yes Yes Yes No

MPPC for T2K Experiment (2008) 21/32 WLS fiber connector connector S10362-13-050C Installed 56kpcs. Required properties Good coupling to φ1mm fiber High PDE for 525nm Withstand high magnetic field (Provided from Kyoto University)

MPPC for LHCb SciFi Tracker 22/32 S13552 Required properties Coupled with SciFi matrix 64x2ch fine pitch MPPC array Sensitive area: 0.23x1.5mm p0.25mm High position accuracy High PDE @400nm

MPPC for Cherenkov Telescope Array 23/32 Required properties High PDE @300nm High Gain Low cross talk Low dark count Large sensitive area S12516

Improvement for VUV sensitivity 24/32 (VUV4:S13370 series) ref) K.Yamamoto, et al., ICHEP 2016, ID:450 VUV-MPPC has VUV-sensitivity down to 120nm. New developed VUV-MPPC (4 th generation: VUV4) is improve photo detection efficiency, which is much higher in comparison with previous VUV-MPPC (VUV3). Optical cross-talk is still suppressed by the inter-pixel trench structure. VUV4-MPPC achieved improvement of Signal-Noise ratio.

Ultralow-RI Package for physics ref) K.Yamamoto, et al., ICHEP 2016, ID:450 For indirect detection (1mm SQ.) For direct detection (6mm SQ.) 25/32 Package type: Plastic mold (for indirect detection) Pure ceramic (for direct detection) RI level: All radioactive nuclides has not been quantified in on-ground measurement at HPK. High precision RI measurements are ongoing with some customers.

MPPC for MEGⅡ 26/32 MEG experiment : searching for μ+ e+ + γ decay Liquid xenon γ-ray detector will be upgraded 2 PMT MPPC for VUV (175nm) total 4,000pcs. MEG MEGⅡ (CG image) PMT MPPC γ-ray S13371-6050CQ-02 PMT Required properties Sensitive area: 6x6mm, 4ch discrete With quartz cover glass High PDE in VUV (175nm) Low dark count Low crosstalk Low temp. operation (< -100 )

1. SSD (Silicon Strip Detector) for tracker of many HEP experiments 2. Development of large area PAD detector 3. APD(Avalanche Photo Diode) for LHC-CMS 4. MPPC (Multi Pixel Photon Counter) for HEP application 5. MPPC for medical application

MPPC for PET 27/32 APDs or MPPCs arranged around 360 detect pair annihilation gamma-rays to capture the target position such as cancer tissue. APDs and MPPCs can be used with MRI because they are not affected by magnetic fields. In addition, MPPCs are useful for TOF-PET because they have good timing resolution. Notion of TOF-PET t1 t1 γ x e + e - t2 γ t2 X = ( t2 - t1 ) c 2

MPPC for scintillation 28/32

Characteristics of S14160 series 29/32

HPK MPPC PET module 30/32 Lutetium scintillator Low cost (mass production zone) ASIC Low cost (manufacturing under mass production stage) MPPC: best type for PET-OEM Best selected MPPC for PET cost down S14161 Series All components are suitable for PET application Big advantage for performance and cost

Summary 31/32 1. The history of Hamamatsu SSD is more than 30 years, and SSDs have been used for many HEP experiments. 2. As a new development, we started developing 8-inch PAD detector, and we have obtained several trial results. First we proceed with DC-type, and after that also plan to AC-type. 3. We have developed and delivered APDs and MPPC s for HEP experiments as well as SSDs. 4. MPPC s various characteristics for example sensitivity, noise, after pulse have been improved. 5. MPPC is widely used in medial fields like PET, in addition to HEP experiments.

Closing 32/32 We Hamamatsu are proud that our Si-detectors are used At this Hiroshima Symposium, for many physical experiments. I will participate fully 12/11~15. We continually make efforts to provide a better sensor, and contributes to the development of physics. We also exhibit Hamamatsu booth during the symposium. If you have any interests or please feel free to speak to me! Photo of Ichino factory with beautiful cherry blossom Awards received from the LHC experimental groups Thank you for your attention.

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