HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs Data Sheet HSMx-C11/C12/C15/C17/ C177/C19/C191/C197/C265 Description These chip LEDs are designed in an industry standard package for ease of handling and use. Various different LED colors are available in nine compact, single color packages. The HSMx-C15 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMx-C17 has the widely used 2. x 1.25 mm footprint with.8 mm profile. The HSMx-C177 has the widely used 2. x 1.25 mm footprint with.4 mm profile. The HSMx-C19x series has the industry standard 1.6 x.8 mm footprint with varying profile to suit designers needs, the HSMx-C19 has.8 mm profile, the HSMx-C191 has a low profile of.6 mm, and the HSMx-C197 has the ultra low profile of.4 mm. This family with its thin profile and wide viewing angle makes this LED exceptional for backlighting applications. The HSMx-C11 is a right angle package with the universally accepted dimensions of 3.2 x 1. x 1.5 mm. The HSMx-C12 is a smaller right angle package with industry standard 1.6 x.6 x 1. mm. HSMx-C265 is a reverse mount package with dimensions of 3.4 x 1.25 x 1.1 mm. These devices are ideal for LCD backlighting and sidelighting applications. Features Small size Industry standard footprint Compatible with IR solder Diffused optics Operating temperature range of -3 C to +85 C Right angle & reverse mount package available Various colors available Available in 8 mm tape on 7 in. (178 mm) diameter reels Applications Keypad backlighting Push-button backlighting LCD backlighting Symbol backlighting Front panel indicator All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. In order to facilitate pick and place operation, these chip LEDs are shipped in tape and reel with 4 units per reel for HSMx-C12, C17, C177, C19, C191, C197 packages, and 3 units per reel for HSMx-C11, C15, C265 packages. CAUTION: HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx and HSMY-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selectiion Guide GaP Green HER Orange Yellow Description HSMG-C11 HSMS-C11 HSMD-C11 HSMY-C11 Untinted, Non-Diffused HSMG-C12 HSMS-C12 HSMD-C12 Untinted, Non-Diffused HSMG-C15 HSMS-C15 HSMD-C15 HSMY-C15 Untinted, Diffused HSMG-C17 HSMS-C17 HSMD-C17 HSMY-C17 Untinted, Diffused HSMG-C177 HSMS-C177 HSMD-C177 HSMY-C177 Untinted, Diffused HSMG-C19 HSMS-C19 HSMD-C19 HSMY-C19 Untinted, Diffused HSMG-C191 HSMS-C191 HSMD-C191 HSMY-C191 Untinted, Diffused HSMG-C197 HSMS-C197 HSMD-C197 HSMY-C197 Untinted, Diffused HSMG-C265 Untinted, Non-Diffused As AlGaAs Red HSMH-C11 HSMH-C12 HSMH-C15 HSMH-C17 HSMH-C19 HSMH-C191 HSMH-C265 Description Untinted, Non-Diffused Untinted, Non-Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Non-Diffused 2
Package Dimensions MARK (ANODE MARK FOR HSMH-C15) MARK (ANODE MARK FOR HSMH-C17).8 (.31) 1.6 (.63) 1.25 (.49) 3.2 (.126 ) 2. (.79 ).62 (.24) DIFFUSED EPOXY 2. (.79) POLARITY [3] DIFFUSED EPOXY 1.4 (.55) POLARITY [3].6 (.24).5 (.2) 1.1 (.43).3 (.12).8 (.31).3 (.12).5 ±.2 (.2 ±.8).5 ±.2 (.2 ±.8).4 ±.15 (.16 ±.6).4 ±.15 (.16 ±.6) HSMx-C15 HSMx-C17 MARK (ANODE MARK FOR HSMH-C19) LINE (ANODE MARK FOR HSMH-C11) 1. (.39).8 (.31) 1.6 (.63 ).4 (.16) 2.6 (.12 ) 3.2 (.126 ) POLARITY 1. (.39) POLARITY [3] CLEAR EPOXY.3 (.12) 1.5 (.59) DIFFUSED EPOXY.8 (.31).3 (.12) 3.2 (.126 ) 1.6 (.63 ).5 (.2).3 ±.15 (.12 ±.6).3 ±.15 (.12 ±.6).8 (.31) 1. (.39).7 (.28) MIN. HSMx-C19 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ±.1 mm (±.4 in.) unless otherwise specified. 3. Polarity for HSMH-C1 x will be the opposite of what is shown on above drawings. HSMx-C11 3
MARK (ANODE MARK for HSMH-C191) MARK.3 (.12) 1.6 (.63 ) 1. (.39).4 (.16).8 (.31) POLARITY DIFFUSED EPOXY 2. (.79).62 (.25) 1.25 (.49).4 (.16) POLARITY DIFFUSED EPOXY.3 ±.15 (.12 ±.6).8 (.31).26 (.1).3 ±.15 (.12 ±.6).4 ±.15 (.16 ±.6).16 (.6).4 ±.15 (.16 ±.6).7 (.28) MIN. 1.1 (.43) MIN. HSMx-C191 HSMx-C177 3.4 (.134) MARK (ETCHED) [ANODE MARK FOR HSMH-C265] MARK 1.25 (.49).8 (.31).4 (.16) GREEN SOLDER MASK POLARITY 1.6 (.63) UNDIFFUSED EPOXY 1.1 (.43) 1.2 (.47) 1.1 (.43) DIFFUSED EPOXY.4 (.16) POLARITY.3 (.12).16 (.6).5 ±.15 (.2 ±.6).5 ±.15 (.2 ±.6).3 ±.15 (.12 ±.6).7 (.28) MIN. HSMx-C265 HSMx-C197 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ±.1 mm (±.4 in.) unless otherwise specified. 3. Polarity for HSMH-C1 x will be the opposite of what is shown on above drawings. 4
MARK (ANODE MARK FOR HSMH-C12).3 (.12) 1.6 (.63).6 (.24) CLEAR EPOXY 1.2 (.47) POLARITY.4 (.16) 1. (.39) 3.3 (.12) HSMx-C12 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ±.1 mm (±.4 in.) unless otherwise specified. 3. Polarity for HSMH-C1x will be the opposite of what is shown on above drawings. 5
Absolute Maximum Ratings for GaP at T A =25 C Parameter C11/15/265 C12/17/177/19/191/197 Units DC Forward Current [1] 25 2 ma Power Dissipation 65 52 mw Reverse Voltage (I R =1 µa) 5 5 V LED Junction Temperature 95 95 C Operating Temperature Range -3 to +85-3 to +85 C Storage Temperature Range -4 to +85-4 to +85 C Soldering Temperature See reflow soldering profile (Figure 9 & 1) Absolute Maximum Ratings for AlGaAs at T A =25 C Parameter C11/15 C12/17/19/191/265 Units DC Forward Current [1] 3 25 ma Power Dissipation 78 65 mw Reverse Voltage (I R =1µA) 5 5 V LED Junction Temperature 95 95 C Operating Temperature Range -3 to +85-3 to +85 C Storage Temperature Range -4 to +85-4 to +85 C Soldering Temperature See reflow soldering profile (Figure 9 & 1) Note: 1. Derate linearly as shown in Figure 4 for temperature above 25 C. Electrical Characteristics at T A =25 C Reverse Capacitance Forward Voltage Breakdown C(pF), Thermal Part Number Color V F (Volts) V R (Volts) @ V F = V, Resistance @ I F = 2 ma @ I R = 1 µa f = 1 MHz Rθ J-P ( C/W) Typ. Max. Min. Typ. Typ. HSMS-C11/15 HER 2.1 2.6 5 5 4 HSMS-C12 35 HSMS-C17/177/19/191/197 25 HSMD-C11/15 Orange 2.2 2.6 5 7 4 HSMD-C12 35 HSMD-C17/177/19/191/197 25 HSMY-C11/15 Yellow 2.1 2.6 5 6 4 HSMY-C17/177/19/191/197 25 HSMG-C11/15 Green 2.2 2.6 5 9 4 HSMG-C12 35 HSMG-C17/177/19191/197/265 25 HSMH-C11/15 AlGaAs 1.8 2.6 5 18 46 HSMH-C12 4 HSMH-C17/19/191/265 3 6
Optical Characteristics at T A =25 C Luminous Peak Dominant Intensity [1] Wavelength Wavelength Viewing Part Number Color Iv(mcd)@2mA λ peak (nm) λ d (nm) Angle 2θ 1/2 ( ) [2] Min. Typ. Typ. Typ. Typ. HSMG-C11/177/197 Green 4.5 15. 57 572 13 HSMG-C12 155 HSMG-C15/17/19/191/265 17 HSMS-C11/177/197 HER 2.8 1. 63 626 13 HSMS-C12 155 HSMS-C15/17/19/191 17 HSMD-C11/177/197 Orange 2.8 8. 65 64 13 HSMD-C12 155 HSMD-C15/17/19/191 17 HSMY-C11/177/197 Yellow 2.8 8. 589 586 13 HSMY-C15/17/19/191 17 HSMH-C11 AlGaAs 7.2 17. 66 639 13 HSMH-C12 155 HSMH-C15/17/19/191/265 17 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits [1] Green Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 561.5 564.5 B 564.5 567.5 C 567.5 57.5 D 57.5 573.5 E 573.5 576.5 Tolerance: ±1 nm Yellow Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 582. 584.5 B 584.5 587. C 587. 589.5 D 589.5 592. E 592. 594.5 F 594.5 597. Tolerance: ±1 nm Orange Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 597. 6. B 6. 63. C 63. 66. D 66. 69. E 69. 612. F 612. 615. Tolerance: ±1 nm 7
Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Intensity (mcd) Bin ID Min. Max. Bin ID Min. Max. A.11.18 N 28.5 45. B.18.29 P 45. 71.5 C.29.45 Q 71.5 112.5 D.45.72 R 112.5 18. E.72 1.1 S 18. 285. F 1.1 1.8 T 285. 45. G 1.8 2.8 U 45. 715. H 2.8 4.5 V 715. 1125. J 4.5 7.2 W 1125. 18. K 7.2 11.2 X 18. 285. L 11.2 18. Y 285. 45. M 18. 28.5 Tolerance: ±15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 1. GREEN AlGaAs RELATIVE INTENSITY.5 YELLOW ORANGE HER 5 55 6 65 7 75 Figure 1. Relative intensity vs. wavelength. WAVELENGTH nm I F FORWARD CURRENT ma 1 HER AlGaAs GREEN 1 1 YELLOW ORANGE.1 1.5 1.7 1.9 2.1 2.3 V F FORWARD VOLTAGE V LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 1.6 1.2.8.4 AlGaAs GaP 1 2 3 4 I F FORWARD CURRENT ma I F MAX. MAXIMUM FORWARD CURRENT ma 35 C11/C15 AlGaAs 3 25 2 15 1 5 C12/C17/ C177/C19/ C191/C197 HER, ORANGE, YELLOW, GREEN C11/C15/C265 HER, ORANGE, YELLOW, GREEN C12/C17/C177/ C19/C191/C197/ C265 AlGaAs Rθ J-A = 8 C/W Rθ J-A = 6 C/W 2 4 6 8 1 T A AMBIENT TEMPERATURE C Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature. 8
RELATIVE INTENSITY % RELATIVE INTENSITY % 1..9.8.7.6.5.4.3.2.1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE 1..9.8.7.6.5.4.3.2.1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C11. RELATIVE INTENSITY 1 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE RELATIVE INTENSITY 1 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C12. 9
RELATIVE INTENSITY % 1 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 7. Relative intensity vs. angle for HSMx-C177 and C197. RELATIVE INTENSITY % 1..9.8.7.6.5.4.3.2.1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 8. Relative intensity vs. angle for HSMx-C15, C17, C19, C191 and C265. 1-3 SEC. TEMPERATURE 14-16 C 1 SEC. MAX. 23 C MAX. 4 C/SEC. MAX. 4 C/SEC. MAX. 3 C/SEC. MAX. TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6-12 SEC. 6 C/SEC. MAX. 1 SEC. MAX. OVER 2 MIN. TIME TIME (Acc. to J-STD-2C) Figure 9. Recommended reflow soldering profile. Figure 1. Recommended Pb-free reflow soldering profile..8 (.31) 1.5 (.59) 1.2 (.47) 1.5 (.59) 2. (.79) 1.5 (.59) 1.2 (.47).9 (.35) 1.2 (.47).8 (.31).7 (.28).8 (.31) Figure 11. Recommended soldering pattern for HSMx-C15. Figure 12. Recommended soldering pattern for HSMx-C17 and C177. Figure 13. Recommended soldering pattern for HSMx-C19, C191 and C197. 1
5. (.2).9 (.35).9 (.35).4 (.16).4 (.16) 1. (.39).7 (.28).2 (.8) 1.5 (.59) 2. (.79) 1.5 (.59) CENTERING BOARD.15 (.6).8 (.31) 1.2 (.47).8 (.31) CENTERING BOARD Figure 14. Recommended soldering pattern for HSMx-C11. Figure 15. Recommended soldering pattern for HSMx-C12. USER FEED DIRECTION 2.2 (.87) DIA. PCB HOLE 1.25 (.49) SIDE 1.4 (.55) 2.3 (.91) 1.4 (.55) PRINTED LABEL Figure 16. Recommended soldering pattern for HSMx-C265. Figure 17. Reeling orientation. 8. ± 1. (.315 ±.39) 1.5 ± 1. (.413 ±.39) ;; Ø 13.1 ±.5 (Ø.516 ±.2) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) ; 178.4 ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS ; 5. ±.5 (.197 ±.2) ;; Figure 18. Reel dimensions. Note: All dimensions in millimeters (inches). 11
4. (.157) 1.5 (.59) DIM. C ; ;.2 ±.5 (.8 ±.2) ;;;;; DIM. A 8. 1.75 (.69) 3.5 ±.5 (.138 ±.2) ±.3 (.315 ±.12) DIM. B 2. ±.5 (.79 ±.2) HSMx-C11/C12 ;; POSITION IN CARRIER TAPE DIM. A DIM. B 4. (.157) R 1. ±.5 (.39 ±.2) R.5 ±.5 (.2 ±.2) USER FEED DIRECTION PART NUMBER HSMx-C11 SERIES HSMx-C12 SERIES HSMx-C15 SERIES HSMx-C17 SERIES HSMx-C177 SERIES HSMx-C19 SERIES HSMx-C191 SERIES HSMx-C197 SERIES TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (.4) 3.4 (.134) 1.9 (.75) 3.5 (.138) 2.3 (.91) 2.3 (.91) 1.8 (.71) 1.86 (.73) 1.75 (.69) DIM. B ±.1 (.4) 1.7 (.67) 1.15 (.45) 1.88 (.74) 1.45 (.57) 1.4 (.55).9 (.35).88 (.35).95 (.37) COVER TAPE CARRIER TAPE DIM. C ±.1 (.4) 1.2 (.47).75 (.3) 1.27 (.5).95 (.37).6 (.24).9 (.35).85 (.34).6 (.24) DIM. A 4. (.157) 1.5 (.59) ;;;;; ;;;;; 1.75 (.69) DIM. C 3.5 ±.5 (.138 ±.2) ;; ; 8. ±.3 (.315 ±.12).2 ±.5 (.8 ±.2) DIM. B 2. ±.5 (.79 ±.2) 4. (.157) PART NUMBER USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (.4) DIM. B ±.1 (.4) COVER TAPE DIM. C ±.1 (.4) HSMx-C265 SERIES 3.7 (.146) 1.45 (.57) 1.3 (.51) CARRIER TAPE Figure 19. Tape dimensions. 12
END START Storage Condition: 5 to 3 C @ 6% RH max. Baking is required under the condition: a) Humidity Indicator Card is >1% when read at 23 ± 5 C. b) Device exposed to factory conditions <3 C/6% RH more than 672 hours. Baking recommended condition: 6 +/ 5 C for 2 hours. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 2. Tape leader and trailer dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ±.1 mm (±.4 in.)unless otherwise specified. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 16, Surface Mounting SMT LED Indicator Components. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 27 Avago Technologies Limited. All rights reserved. Obsoletes 5989-486EN AV2-551EN July 17, 27