ASMT-CW InGaN White,.4mm Low Profile Right Angle Surface Mount ChipLED Data Sheet Description The ASMT-CW of white color chip-type LEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint 1.6 mm x 1. mm and a height of only.4 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication application where space is a constraint. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in conductive tape and reel, with 4 units per reel. These part are compatible with IR soldering. Features Small size right angle mount 63 industry standard footprint.4 mm low profile type Operating temperature range of -4 C to +85 C Compatible with IR reflow soldering process Available in 8mm tape on 178mm (7 ) diameter reels Reel sealed in zip locked moisture barrier bags Applications LCD Backlighting Keypad Side / Backlighting Pushbutton backlighting Symbol Indicator Package Dimension 1.6.63 1.2.47 R.6.24.2.2.8.8.4`.5.16`.2 1..39.5.2 SIDE VIEW TOP VIEW.2.9 CATHODE MARK.3.12.3.12.35.14.35.14.3.12 TERMINAL VIEW 1. All dimensions will be in millimeters (inches) 2. Tolerance is.1mm (.4 in) unless otherwise stated CAUTION: ASMT-CW LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide Package Dimension (mm) Parts per Reel Package Description 1.6 (L) x 1. (W) x.4 (H) 4 Untinted, Non-diffused Absolute Maximum Ratings at T A = 25 C Parameter ASMT-CW Unit DC Forward Current [1] 1 ma Power Dissipation 32 mw Reverse Voltage (I R = 1 A) 5 V LED Junction Temperature 95 C Operating Temperature Range -4 to +85 C Storage Temperature Range -4 to +85 C Soldering Temperature See reflow soldering profile (Figure 8 & 9) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at T A = 25 C Forward Voltage V F (Volts) [1] @ I F = 5mA Reverse Breakdown V R (Volts) @ I R = 1 A Part Number Min. Max. Minimum Typical ASMT-CW 2.55 3.15 5 45 1. Vf tolerance :.1V Thermal Resistance R J-PIN ( C/W) Optical Characteristics at T A = 25 C Luminous Intensity I V [1] (mcd) @ 5mA Color Chromaticity [2] (Degrees) Viewing Angle 2 1/2 [3 Part Number Min. Typ. Bin Typical ASMT-CW 18 35 A1 D2 (Refer to Figure 1) 17 1. The luminous intensity I V is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The chromaticity coordinates are derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. 2
Light Intensity (I V ) Bin Limits Intensity (mcd) Bin ID Minimum Maximum M 18. 28.5 N 28.5 45. P 45. 71.5 Q 71.5 112.5 Tolerance : ±15% 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. Forward Voltage (V F ) Bin Limits Forward Voltage (V) Bin ID Minimum Maximum 1 2.55 2.75 2 2.75 2.95 3 2.95 3.15 Tolerance : ±.1V Y - COORDINATE.38.36.34.32.3.28.26.24.22.2.18 A1 A2 B1 B2.16.24.26.28.3.32.34 X - COORDINATE Figure 1. Color bin limits (CIE 1931 Chromaticity Diagram) [Tolerance: ±.2] C1 C2 D1 D2 Rank Chromaticity Coordinates A1 X.27.27.25.25 Y.2455.278.25.2175 A2 X.27.27.25.25 Y.2455.213.185.2175 B1 X.27.27.29.29 Y.2455.278.36.2735 B2 X.27.27.29.29 Y.2455.213.241.2735 C1 X.29.31.31.29 Y.36.3355.33.2735 C2 X.29.31.31.29 Y.241.275.33.2735 D1 X.31.31.33.33 Y.33.3355.365.3325 D2 X.31.31.33.33 Y.33.275.3.3325 1.9 1 RELATIVE INTENSITY.7.6.5.4.3.2 FORWARD CURRENT - ma 1 1.1 38 43 48 53 58 63 68 73 78.1 2. 2.5 3. 3.5 4. WAVELENGTH - nm FORWARD VOLTAGE - V Figure 2. Relative intensity vs. wavelength Figure 3. Forward voltage vs. forward current 3
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 ma) 2. 1.8 1.6 1.4 1.2 1..6.4.2 2 4 6 8 1 DC FORWARD CURRENT - ma Figure 4. Luminous intensity vs. forward current RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 ma) 12 1 8 6 4 2 2 4 6 8 1 DC FORWARD CURRENT - ma Figure 5. Maximum forward current vs. ambient temperature RELATIVE INTENSITY 1.9.7.6.5.4.3.2.1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 6. Radiation pattern.4 (.16).15 (.6) (.31) 1.2 (.47).4 (.16) (.31) 1. All dimensions are in millimeters (inches). 2. Tolerance is ±.1mm (±.4in.) unless otherwise specified Figure 7. Recommended soldering land pattern.7 (.28) CENTERING BOARD 1 SEC. MAX. 1 to 3 SEC. TEMPERATURE 14-16 C 23 C MAX. 4 C/SEC. MAX. 4 C/SEC. MAX. 3 C/SEC. MAX. TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6 C/SEC. MAX. OVER 2 MIN. 6-12 SEC. 1 SEC. MAX. TIME Figure 8. Recommended reflow soldering profile TIME Figure 9. Recommended Pb-free reflow soldering profile 4
Figure 1. Reeling orientation Figure 11. Reel dimensions 1. All dimensions are in millimeters (inches). 2. Tolerance is ±.1mm (±.4in.) unless otherwise specified. 5
4. ±.1.157 ±.4 DIM. A SEE TABLE 1 1.5.59 1.75.69 8. ±.3.315 ±.12 DIM. C SEE TABLE 1.2 ±.2.8 ±.1 DIM. B R.4 [ SEE TABLE 1 ] USER FEED DIRECTION 2. ±.5.79 ±.2 4..157 Table1. COVER TAPE CARRIER TAPE 1. All dimensions are in millimeters (inches). 2. Tolerance is ±.1mm (±.4in.) unless otherwise specified. PART NUMBER DIM.A ±.1 (.4) DIM.B ±.1 (.4) DIM.C ±.1 (.4) ASMT-CW 1.75 (.69) 1.1 (.43).6 (.24) Dimensions In Millimeters (Inches) Figure 12. Tape dimensions END START THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS Figure 13. Tape leader and trailer dimensions THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Reflow Soldering For more information on reflow soldering, refer to Application Note AN-16, Surface Mounting SMT LED Indicator Components. Storage Condition 5 to 3 C @ 6 RH max.baking is required before mounting, if 1. Humidity Indicator Card is 1% when read at 23 5 C. 2. Device expose to factory conditions <3 C/6%RH more than 672 hours. Recommended baking condition: 6 5 C for 2 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 25-21 Avago Technologies. All rights reserved. AV2-588EN - May 5, 21