HSMM-C11/C12/C15/C17/C19 HSMN-C11/C12/C15/C17/C19/C191 SMT ChipLEDs Data Sheet Description These small chip-type LEDs utilize high efficient InGaN/SiC material to deliver competitively priced high performance blue and green. These 525 nm green and 47 nm blue are unique hues which provide color differentiation to a product. These ChipLEDs come in either top emitting packages (HSMx-C17, C19, C191, and C15) or in a side emitting package (HSMx-C11 and HSMX-C12). The side emitting package is especially suitable for LCD backlighting application. The top emitting packages with their wide viewing angle are suitable for direct backlighting application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel with 4 units per reel for HSMx-C12, C17, C19, and C191 packages, and 3 units per reel for HSMx-C11 and C15 packages. All packages are compatible with IR soldering and binned by both color and intensity. Features High brightness Small size Industrial standard footprint Diffused optics Top emitting or right angle emitting Compatible with IR soldering Compatible for use with light piping Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications LCD backlighting Pushbutton backlighting Front panel indicator Symbol indicator Microdisplays Small message panel signage Device Selection Guide Package Dimension (mm) [1], [2] Ingan Green Ingan Blue Package Description 3.2 (L) x 1.5 (W) x 1. (H) HSMM-C11 HSMN-C11 Untinted, Non-diffused 1.6 (L) x 1. (W) x.6 (H) HSMM-C12 HSMN-C12 Untinted, Nondiffused 3.2 (L) x 1.6 (W) x 1.1 (H) HSMM-C15 HSMN-C15 Untinted, Diffused 2. (L) x 1.25 (W) x.8 (H) HSMM-C17 HSMN-C17 Untinted, Diffused 1.6 (L) x.8 (W) x.8 (H) HSMM-C19 HSMN-C19 Untinted, Diffused 1.6 (L) x.8 (W) x.6 (H) HSMN-C191 Untinted, Diffused Notes: 1. Dimensions in mm. 2. Tolerance ±.1 mm unless otherwise noted. CAUTION: HSMM-C1xx and HSMN-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions LED DIE LINE LED DIE MARK 1. (.39).3 (.12) 2.6 (.12 ) 3.2 (.126 ) 1.6 (.63).6 (.24) CLEAR EPOXY 1.5 (.59) CLEAR EPOXY 1.2 (.47) 3.2 (.126 ) 1.6 (.63 ).5 (.2).5 (.2) 1. (.39).8 (.31) 3.3 (.12) 1. (.39) TERM INAL HSMx-C11 HSMx-C 12 MARK 1.25 (.49) MARK.8 (.31) 2. (.79 ) 1.6 (.63 ) DIFFUSED EPOXY 1.4 (.55) 1. (.39).3 (.12).3 (.12).4 ±.15 (.16 ±.6).8 (.31).3 (.12).4 ±.15 (.16 ±.6) DIFFUSED EPOXY.3 ±.15 (.12 ±.6).8 (.31).3 (.12).3 ±.15 (.12 ±.6).7 (.28) MIN. HSMx-C17 HSMx-C19 2
Package Dimensions, continued MARK MARK.8 (.31) 1.6 (.63) 1.6 (.63 ) DIFFUSED EPOXY 3.2 (.126 ) 2. (.79).3 (.12) 1. (.39).6 (.24).5 ±.2 (.2 ±.8) 1.1 (.43).5 (.2).5 ±.2 (.2 ±.8) DIFFUSED EPOXY.3 ±.15 (.12 ±.6).6 (.23).3 (.12).3 ±.15 (.12 ±.6).7 (.28) MIN. HSMx-C15 HSMx-C191 NOTES: 1. All dimensions in millimeters (inches). 2. Tolerance is ±.1 mm (±.4 in.) unless otherwise specified. Absolute Maximum Ratings at T A = 25 C HSMM-C11/C12/C17/C19/C15 Parameter HSMN-C11/C12/C17/C19/C191/C15 Units DC Forward Current [1] 2 ma Power Dissipation 78 mw Reverse Voltage (I R = 1 μa) 5 V Led Junction Temperature 95 C Operating Temperature Range 4 to +85 C Storage Temperature Range 4 to +85 C Soldering Temperature See reflow soldering profile (Figure 7) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at T A = 25 C Forward Voltage Reverse Breakdown Capacitance C Thermal V F (Volts) V R (Volts) (pf), V F =, Resistance @ I F = 2 ma @ I R = 1 μa f = 1 MHz R J PIN ( C/W) Part Number Typ. Max. Min. Typ. Typ. HSMM-C11/C15 3.3 3.9 5 7 45 HSMN-C11/C15 3.3 3.9 5 7 45 HSMM-C12 3.3 3.9 5 45 45 HSMN-C12 3.3 3.9 5 45 45 HSMM-C17/C19 3.3 3.9 5 7 3 HSMN-C17/C19/C191 3.3 3.9 5 7 3 V F Tolerance: ±.1 V. 3
Optical Characteristics at T A = 25 C Luminous Color, Viewing Luminous Intensity Peak Dominant Angle Efficacy I V (mcd) Wavelength Wavelength 2 1/2 V @ 2 ma [1] peak (nm) d [2] (nm) Degrees [3] (lm/w) Part Number Color Min. Typ. Typ. Typ. Typ. Typ. HSMM-C11 Green 45 126 523 525 13 49 HSMM-C12 Green 45 12 523 525 155 49 HSMM-C17/C19/ Green 45 12 523 525 17 49 /C15 HSMN-C11 Blue 11.2 39 468 47 13 77 HSMN-C12 Blue 11.2 35 468 47 155 8 HSMN-C17/C19/ Blue 11.2 35 468 47 17 77 C191/C15 Notes: 1. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits [1] Blue Color Bins [1] Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Intensity (mcd) Dom. Wavelength (nm) Bin ID Min. Max. Bin ID Min. Max. Bin ID Min. Max. A.11.18 N 28.5 45. A 46. 465. B.18.29 P 45. 71.5 B 465. 47. C.29.45 Q 71.5 112.5 C 47. 475. D.45.72 R 112.5 18. D 475. 48. E.72 1.1 S 18. 285. Tolerance: ± 1 nm F 1.1 1.8 T 285. 45. G 1.8 2.8 U 45. 715. InGaN Green Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 515. 52. B 52. 525. C 525. 53. D 53. 535. Tolerance: ± 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. H 2.8 4.5 V 715. 1125. J 4.5 7.2 W 1125. 18. K 7.2 11.2 X 18. 285. L 11.2 18. Y 285. 45. M 18. 28.5 Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There is no upper Iv bin limits. 4
1. 1 RELATIVE INTENSITY %.5 BLUE GREEN I F FORWARD CURRENT ma 1 1 35 4 45 5 55 6 65.1 2. 2.5 3. 3.5 4. WAVELENGTH nm V F FORWARD VOLTAGE V Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. 1.2 LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 1..8.6.4.2 5 1 15 2 25 I F - FORWARD CURRENT - ma Figure 3. Luminous intensity vs. forward current. RELATIVE INTENSITY - % 1..9.8.7.6.5.4.3.2.1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 I F MAX. - MAXIMUM FORWARD CURRENT - ma 25 2 15 1 5 Rθ J-A = 8 C/W Rθ J-A = 6 C/W 2 4 6 8 1 T A - AMBIENT TEMPERATURE - C RELATIVE INTENSITY - % 1..9.8.7.6.5.4.3.2.1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 Figure 4. Maximum forward current vs. ambient temperature. Figure 5. Relative intensity vs. angle for HSMx-C11. 5
RELATIVE INTENSITY 1 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 RELATIVE INTENSITY 1 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 Figure 6. Relative intensity vs. angle for HSMx-C12 RELATIVE INTENSITY - % 1..9.8.7.6.5.4.3.2.1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 Figure 7. Relative intensity vs. angle for HSMx-C17, C19, C191, and C15. 6
1 SEC. MAX. TEMPERATURE 14-16 C 1 SEC. MAX. 23 C MAX. 4 C/SEC. MAX. 4 C/SEC. MAX. 3 C/SEC. MAX. TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6-12 SEC. 6 C/SEC. MAX. 6 SEC. MAX. OVER 2 MIN. TIME TIME Figure 8. Recommended reflow soldering profile. Figure 9. Recommended Pb-free reflow soldering profile..9 (.35) 5. (.2).9 (.35).4 (.16).4 (.16).7 (.28).2 (.8) 1.5 (.59) 2. (.79) 1.5 (.59) 1. (.39) CENTERING BOARD.15 (.6).8 (.31) 1.2 (.47).8 (.31) CENTERING BOARD Figure 1. Recommended soldering pattern for HSMx-C11. Figure 11. Recommended soldering pattern for HSMx-C12..8 (.31) 1.2 (.47) 1.2 (.47).9 (.35) 1.2 (.47).8 (.31).7 (.28).8 (.31) Figure 12. Recommended soldering pattern for HSMx-C17. Figure 13. Recommended soldering pattern for HSMX-C19/C191 NOTE: 1. All dimensions in millimeters (inches). 7
USER FEED DIRECTION 1.5 (.59) SIDE 1.5 (.59) 2. (.79) 1.5 (.59) PRINTED LABEL Figure 14. Recommended soldering pattern for HSMx-C15. Figure 15. Reeling orientation. 8. ± 1. (.315 ±.39) 13.1 ±.5 (.516 ±.2) 1.5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) 2.2 MIN. (.795 MIN.) 178.4 ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) NOTE: 1. All dimensions in millimeters (inches). Figure 16. Reel dimensions. 8
4. (.157) 1.5 (.59) DIM. C.2 ±.5 (.8 ±.2) 1.75 (.69) DIM. A 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B 2. ±.5 (.79 ±.2) HSMx-C11/12 POSITION IN CARRIER TAPE DIM. A 4. (.157) PART NUMBER USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (±.4) DIM. B ±.1 (±.4) COVER TAPE CARRIER TAPE DIM. C ±.1 (±.4) HSMx-C191 SERIES 1.85 (.73).88 (.35).85 (.33) HSMx-C19 SERIES 1.75 (.69).9 (.35).9 (.35) HSMx-C17 SERIES 2.3 (.91) 1.45 (.57).95 (.37) HSMx-C11 SERIES 3.4 (.134) 1.7 (.67) 1.2 (.47) HSMx-C12 SERIES 1.9 (.75) 1.15 (.45).75 (.3) HSMx-C15 SERIES 3.5 (.138) 1.88 (.74) 1.27 (.5) DIM. B Figure 17. Tape dimensions. R 1. ±.5 (.39 ±.2) FOR HSMx-C11 R.5 ±.5 (.2 ±.2) FOR HSMx-C12 END THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS Figure 18. Tape leader and trailer dimensions. START THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. NOTES: 1. All dimensions in millimeters (inches). 2. Tolerance is ±.1 mm (±.4 in.) unless otherwise specified. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-16, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 3 C @ 6%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 1% when read at 23 ± 5 C. 2. Device expose to factory conditions <3 C/6%RH more than 672 hours. Recommended baking condition: 6±5 C for 2 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 25-21 Avago Technologies. All rights reserved. AV2-592EN - May 5, 21