Minutes of the T0+12 meeting

Similar documents
Minutes of the T0+24 meeting

Minutes of the T0+36 meeting

Minutes of the T0 meeting

DELIVERABLES D.18A -

Broadcom AFEM-8072 Mid&High Band Front End module in iphone 8/X

1. Publishable summary

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

12-14 February 2015 Nice, France PROMOTIONAL SUPPORT & ADVERTISING

2016, Amkor Technology, Inc.

Analog, Mixed-Signal, and Radio-Frequency (RF) Electronic Design Laboratory. Electrical and Computer Engineering Department UNC Charlotte

Rooted in CARE... Thank you Olivier! Thank you Dieter! Assumptions for DCO presentation

24. Scaling, Economics, SOI Technology

Flexible Electronics Production Deployment on FPD Standards: Plastic Displays & Integrated Circuits. Stanislav Loboda R&D engineer

Installation Instructions

25 March 2015, Auditorium Confindustria Umbria

2018 Industry Promotional opportunities

Deliverable 2.17 Periodic WP2 Progress Report 3

AIDA Advanced European Infrastructures for Detectors at Accelerators. Milestone Report. Pixel gas read-out progress

RFSOI and FDSOI enabling smarter and IoT applications. Kirk Ouellette Digital Products Group STMicroelectronics

SPECIALIST TASK FORCE 505 IOT STANDARDS LANDSCAPING & IOT LSP GAP ANALYSIS. Objectives and deliverables. ETSI All rights reserved

Newly Developed Robotics Recycling of LCD Displays Emerging from the EC funded ReVolv Pilot Action

SAMSUNG HOSPITALITY DISPLAYS

Power Amplifier 0.5 W 2.4 GHz AM TR Features. Functional Schematic. Description. Pin Configuration 1. Ordering Information

EE C247B ME C218 Introduction to MEMS Design Spring 2017

2016, Amkor Technology, Inc.

RF Solutions Inc. Sanjay Moghe Low Cost RF ICs for OFDM Applications

MAXIM INTEGRATED PRODUCTS

SEMICONDUCTOR TECHNOLOGY -CMOS-

THE NEXT GENERATION OF CITY MANAGEMENT INNOVATE TODAY TO MEET THE NEEDS OF TOMORROW

Smart. Connected. Energy-Friendly.

Distributed by Pycom Ltd. Copyright 2016 by Pycom Ltd. All rights reserved. No part of this document may be reproduced, distributed, or transmitted

HD to RGB video decoder IC is industry's first

ESA-ESTEC GSTP project Analog Silicon Compiler for Mixed-Signal ASICs Final Presentation - Introduction

ADDENDUM NUMBER 02 TO THE BID DOCUMENTS. BID DOCUMENT: RFP #G PE Building Audio Visual System San Jose City College

Advanced WLP Platform for High-Performance MEMS. Presented by Dean Spicer, Director of Engineering

RAJASTHAN TECHNICAL UNIVERSITY, KOTA

AIXTRON in EXCILIGHT project

DESIGNING MEMS MICROPHONES FROM CONCEPT TO FINISHED GDSII IN ABOUT TWO WEEKS

VJ 6040 UHF Chip Antenna for Mobile Devices

LAB CODE 571- Page No.: of 11 Measurement System Information General Information Testing Condition: Temperature: 5±3 C Humidity: <8% Measurement Facil

MAXIM INTEGRATED PRODUCTS

Access technologies integration to meet the requirements of 5G networks and beyond

ADDRESSING THE CHALLENGES OF IOT DESIGN JEFF MILLER, PRODUCT MARKETING MANAGER, MENTOR GRAPHICS

Leeds Inspired Light Night Commission 2014

Semiconductor Devices. Microwave Application Products. Microwave Tubes and Radar Components

GaAs, MMIC Fundamental Mixer, 2.5 GHz to 7.0 GHz HMC557A

EECS150 - Digital Design Lecture 2 - CMOS

Digital Integrated Circuits Lecture 19: Design for Testability

Technology Overview LTCC

Perfecting the Package Bare and Overmolded Stacked Dies. Understanding Ultrasonic Technology for Advanced Package Inspection. A Sonix White Paper

MRFIC1804. The MRFIC Line SEMICONDUCTOR TECHNICAL DATA

Overview of All Pixel Circuits for Active Matrix Organic Light Emitting Diode (AMOLED)

SEMICONDUCTOR TECHNOLOGY -CMOS-

A. Chatterjee, Georgia Tech

VLSI Design Digital Systems and VLSI

PRICING SCHEDULE JSE LIMITED VENUE PRICING

DB W. 60W / 26V / MHz PA using 1x PD57070S The LdmoST FAMILY. General Features. Description. Order Code

Financial presentation. February 2014

Task 4.2 Liner/Socket for multichannel EMG recording (OBG (22), UMG-GOE (2), M01 - M24):

Lecture 17: Introduction to Design For Testability (DFT) & Manufacturing Test

WXL-2F, WXL-1F, WXL-2M, WXL-1M

13th MOST Interconnectivity Conference 2012 MOST150 on the Road with Avago FOTs

Internet of Things (IoT)

DM DiagMon Architecture

Power that Changes. the World. LED Backlights Made Simple 3M OneFilm Integrated Optics for LCD. 3M Optical Systems Division

MEMS Technologies Dresden - Product Development and Fabrication at IPMS Dresden

Reference Release Definition for ConnMO

Leading. Through Innovation. Film Technology Franchise. September 9, 2008

3D IC Test through Power Line Methodology. Alberto Pagani

Structure, Process & Cost Analysis

Freescale SPC5604BF1CLL6 Embedded NOR Flash with M27V Die Markings 32 Bit Power Architecture Automotive Microcontroller 90 nm Logic Process

Management Manual Version th of August 2013

Meeting & Hospitality Space Request Form Spring 2019 Convention: February 22 24, 2019 Hyatt Regency Sacramento and Sacramento Convention Center

OMNI FIT Connectors and Universal Trimming Tools

Unit V Design for Testability

FLEX2017 June, Monterey, USA Dr Mike Cowin, CMO, SmartKem.

VLSI Chip Design Project TSEK06

Microwave Laboratory

Operations of ewelink APP

No monopoly for High Throughput Satellite (HTS) services at sea

Qualcomm VIVE QCA9500 First WiGig Chipset in 60 GHz Band

Next Generation of Poly-Si TFT Technology: Material Improvements and Novel Device Architectures for System-On-Panel (SOP)

Leveraging 300 mm Technology Solutions to Enable New MEMS Process Capabilities

User Guide. Smart Wi-Fi LED Bulb with Color-Changing Hue REV1.0.0

Title: STMicroelectronics NIR Camera Sensor Pages: 97 Date: December 2017 Format: PDF & Excel file Price: Full report: EUR 3,490

X-Sign 2.0 User Manual

De-embedding Techniques For Passive Components Implemented on a 0.25 µm Digital CMOS Process

Wafer Thinning and Thru-Silicon Vias

Exhibitor Information

Monolithic Optoelectronic Integration of High- Voltage Power FETs and LEDs

Design Project Proposal

Helping to bridge the Digital Divide. STMicroelectronics Foundation and the Digital Unify Program

Work Type Definition and Submittal Requirements. Work Type Definition: Traffic Signal Design

IC Mask Design. Christopher Saint Judy Saint

Low-Cost, 900MHz, Low-Noise Amplifier and Downconverter Mixer

GaAs MMIC Double Balanced Mixer

2018 Florida Encounter

GaAs MMIC High Dynamic Range Mixer

Sharif University of Technology. SoC: Introduction

Note on the preliminary organisation for the design, fabrication and test of a prototype double-sided ladder equipped with MAPS

Transcription:

CARBON BASED SMART SYSTEM FOR WIRELESS APPLICATION Start Date : 01/09/12 Project n 318352 Duration : 36 months Topic addressed : Very advanced nanoelectronic components: design, engineering, technology and manufacturability WORK PACKAGE 7 : Project management DELIVERABLE D7.4 Minutes of the T0+12 Due date : T0+6 Submission date : T0+13 Lead contractor for this deliverable : TRT Dissemination level : PU Public

2/10 WORK PACKAGE 7: Project management PARTNERS ORGANISATION APPROVAL Name Function Date Signature Prepared by: S.Xavier R&D Engineer 31/10/13 Approved by: Afshin Ziaei Research Program Manager 31/10/13 DISTRIBUTION LIST QUANTITY ORGANIZATION NAMES 1 ex Thales Research and Technology TRT Afshin ZIAEI 1 ex Chalmers University of Technology CHALMERS Johan LIU 1 ex Foundation for Research & Technology - Hellas FORTH George KONSTANDINIS 1 ex Laboratoire d Architecture et d Analyse des Systèmes CNRS-LAAS George DELIGEORGIS 1 ex Université Pierre et Marie Curie UPMC Charlotte TRIPON- CANSELIET 1 ex National Research and Development Institute for Microtechnologies IMT Mircea DRAGOMAN 1 ex Graphene Industries GI Peter BLAKE 1 ex Thales Systèmes Aéroportés TSA Yves MANCUSO 1 ex SHT Smart High-Tech AB SHT Yifeng FU 1 ex Universita politecnica delle Marche UNIVPM Luca PIERANTONI 1 ex Linköping University LiU Rositsa YAKIMOVA 1 ex Fundacio Privada Institute Catala de Nanotecnologia ICN Clivia SOTOMAYOR 1 ex Tyndall-UCC Tyndall Mircea MODREANU 2

3/10 CHANGE RECORD SHEET REVISION LETTER DATE PAGE NUMBER DESCRIPTION Template 07/2013 8 V1 31/10/2013 10 Final version 3

4/10 CONTENTS 1 PARTICIPANTS 5 2 AGENDA 6 3 INTRODUCTION AND PROJECT OVERVIEW (A. ZIAEI, TRT) ERREUR! SIGNET NON DEFINI. 4 WP PRESENTATIONS ERREUR! SIGNET NON DEFINI. 4.1 WP 1 (A.ZIAEI, TRT) ERREUR! SIGNET NON DEFINI. 4.2 WP 2 (M.DRAGOMAN, IMT) ERREUR! SIGNET NON DEFINI. 4.3 WP 3 (G. KONSTANDINIS, FORTH) ERREUR! SIGNET NON DEFINI. 4.4 WP 6 (A. ZIAEI, TRT) ERREUR! SIGNET NON DEFINI. 4.5 WP 7 (A. ZIAEI, TRT) ERREUR! SIGNET NON DEFINI. 5 REVIEW OF WORK & ACTION LIST ERREUR! SIGNET NON DEFINI. 4

5/10 1 PARTICIPANTS Date: 13 th September 2013 Location: Out of the Blue Capsis Elite Resort Hotel, Aghia Pelagia, Crete Contact: Stephane Xavier Ph: +33 169 415 892/ Mob: +33 6 1923 8805 stephane.xavier@thalesgroup.com Afshin Ziaei Ph: +33 169 415 777 / Mob: +33 6 8924 8810 afshin.ziaei@thalesgroup.com Organisation Person Names Email Address Afshin Ziaei afshin.ziaei@thalesgroup.com 1 TRT Stéphane Xavier stephane.xavier@thalesgroup.com Matthieu Lebaillif Matthieu.lebaillif@thalesgroup.com 2 CHALMERS Johan Liu johan@sht-tek.com Kell Jeppson jeppson@chalmers.se George Konstandinis aek@physics.uoc.gr 3 FORTH George Stavrinidis gstav@ physics.uoc.gr 4 CNRS-LAAS George Deligeorgis gdeligeo@laas.fr Alexandru Müller alexandru.muller@imt.ro 5 IMT Mircea Dragoman mircea.dragoman@imt.ro 6 SHT Yifeng Fu yifeng@sht-tek.com 7 GI Peter Blake peter@grapheneindustries.com 8 ICN Juan Reparaz sebas.reparaz@icn.cat Markus Wagner markus.wagner@icn.cat 9 Tyndall Mircea Modreanu mircea.modreanu@tyndall.ie 5

6/10 2 AGENDA Friday 13 September 2013 09:00 Opening, Welcome and Agenda Introduction : general presentation and organisational 9:00 9:15 TRT aspects WP1/WP2 Presentations - Objectives & means - Schedule of main milestones & deliverables WP 9:15 11:00 - Inputs / Outputs with other WPs leaders - Over the project duration - Focus on the period T 0 +9 T 0 +12 - Check the deliverables for T 0 +12 11:00 11:20 Coffee Break WP3 Presentation - Objectives & means - Schedule of main milestones & deliverables WP 11:20 13:00 - Inputs / Outputs with other WPs leaders - Over the project duration - Focus on the period T 0 +9 T 0 +12 - Check the deliverables for T 0 +12 13:00 14:30 Lunch WP6/WP7 Presentations - Dissemination tools 14:30 14:45 TRT - Financial aspects - Publications and IPR 14:45 16:00 Technical discussion / Working group All 16:00 16:20 Coffee Break Detailed review of the deliverables for the period T 0 +12 T 0 +18: 16:20 17:00 - Working plan of the responsible partner All - Who is involved? How? When? - Means & Actions to achieve the deliverables on time 17:00 End of Meeting 6

7/10 All the presentations made during the Progrees Meeting will be available as soon as possible on the website. We report here only the contents of the discussions that occurred during the presentations. 3 INTRODUCTION AND PROJECT OVERVIEW (A. ZIAEI, TRT) Thanks to FORTH to receiving us in Heraklion The aims of the project are the RF active and passive fabrication devices with CNTs and Graphene. Reminder of the WP responsible: WP1 : TAS (Y.Mancuso) WP2 : IMT (M.Dragoman) WP3 : FORTH (G.Konstandinis) WP4 : CNRS-LAAS (G.Deligeorgis) WP5 : ICN (C.Sotomayor) WP6 : TRT (A.Ziaei) WP7 : TRT(A.Ziaei) Work planned for T0+12 : Planning of the review for T0+12 Del. Deliverable name WP Delivery WP Lead date Leaders Beneficiary Report on design of the distributed amplifier based on CNT FET including the PA design and D2.1 T graphene based LNA, mixer and detector 0 +12 IMT UNIVPM D2.2 Report on design of the CNT based RF switch T 0 +12 IMT IMT D2.3 Report on design of the CNT filter/oscillator 2 T 0 +12 IMT LAAS D2.4 Report on design of the CNT and graphene antenna T 0 +12 IMT TSA D2.5 Report on design of graphene devices T 0 +12 IMT IMT D3.1 Activity report on growth of carbon nanotubes and graphene T 0 +12 FORTH SHT 3 D3.2 Activity report on CNT and graphene material characterization T 0 +12 FORTH FORTH There are 5 deliverables for WP2 and 2 deliverables for WP3 For the activity report we need from each partner one page to summarize your work for the last 6 month ==> end of September For the management report, we need you cost ==> end of September For the e-newsletter, each partner must send few line to TRT to summarize his work (highlights for the first year of the project) ==> end of September Next : First review will take place in Brussel (Belgium), on the 12 nd of November (9am- 5pm). There is a preparation November 11 7

8/10 Next progress (T0+15) will take place in Barcelona (Spain), on the 24 th of January (9am-6pm). The reviewer for the project are : Project Officer (EC) : Isabel VERGARA-OGANDO Siebe Bouwstra (MEMS TC) & Dr Pirjo Pasanen (Spinverse Oy Ltd) 4 WP PRESENTATIONS 4.1 WP 1 (A.ZIAEI, TRT) 4.2 WP 2 (M.DRAGOMAN, IMT) All the deliverables are for T0+12 : Deliverable Deliverable Title Lead Beneficiary D2.1 D2.2 D2.3 D2.4 Report on design of the distributed amplifier based on CNT FET including the PA design and graphene based LNA, mixer and detector Report on design of the CNT based RF switch Report on design of the CNT filter/oscillator Report on design of the CNT and graphene antenna UNIVPM IMT CNRS-LAAS TAS D2.5 Report on design of graphene devices IMT Partners involved TRT,IMT, TAS TRT, IMT, CNRS-LAAS, ICN TRT, IMT IMT, TRT, CNRS-LAAS, UPMC IMT, UNIVPM, CNRS-LAAS Status of the different deliverables: - D2.1 : Luca (UNIVPM) work on it and will be completed on time - D2.2 : OK - D2.3: simulations are completed and must write the deliverable - D2.4 : Charlotte (UPMC) work on it with Luca (UNIVPM) - D2.5 : OK Mircea showed the presentation of Charlotte concerning CNTs antennas. 4.3 WP 3 (G. KONSTANDINIS, FORTH) 8

9/10 Chalmers show the results concerning the CNTs interconnect. There is a process development for the CNTs transfer on the TSV for 3D integration. It is also possible to densified the CNTs. Future plan Fabrication of CNT filled TSV chips Stacking of CNT filled TSV chips FORTH show the last result concerning the graphene FET fabrication. Some results are obtained concerning the ohmic contacts quality. Better result is obtained with Pd. LAAS showed the 1 st fabrication of the hall device. We obtained a mobility of 200cm²/Vs. New process flow are defined to work on power loss substrate (Polyimide membrane). It should discuss interest in working with this kind of substrate (compatible with our applications?) Peter Blake (Graphene industries) shows the last result concerning the graphene transfer. 11 samples produced using high resistivity silicon provided by IMT. Graphene on hbn sample available for Nano-RF. ICN studies the high-k dielectrics provided by Tyndall 4.4 WP 6 (A. ZIAEI, TRT) Publications can be uploaded and the bibliographic details entered. All partners need to send few lines to summarize the work for the newsletters 9

10/10 4.5 WP 7 (A. ZIAEI, TRT) For the activity report we need from each partner one page to summarize your work for the last 6 month ==> end of September For the management report, we need you cost ==> end of September 5 REVIEW OF WORK & ACTION LIST Description Date Leader One page for the activity report End of September TRT Cost for the management report End of September TRT Few lines for the e-newsletter End of September TRT D2.1, D2.2, D2.3, D2.4, D2.5 End of September IMT D3.1, D3.2 End of September FORTH D7.10,D7.16 End of September TRT D6.2 End of September TRT Review : Brussels,12nd November November 2013 ALL Next : ICN, Barcelona 31 January and 1 st February 2013 January 2014 ALL 10