WAH WANG HOLDINGS (HONG KONG) CO., LTD.

Similar documents
WAH WANG HOLDINGS (HONG KONG) CO., LTD.

LITE-ON TECHNOLOGY CORPORATION

Through Hole Lamp Product Data Sheet LTW-2S3D7 Spec No.: DS Effective Date: 10/06/2012 LITE-ON DCC RELEASE

Through Hole Lamp Product Data Sheet LTW-1KHDS5Z Spec No.: DS Effective Date: 10/19/2012 LITE-ON DCC RELEASE

3mm Round White LED T-1. Technical Data Sheet. Part No: LL-304WC2E-W2-3TC

Through Hole Lamp Product Data Sheet LTW-42NDP4-HF Spec No.: DS Effective Date: 08/23/2011 LITE-ON DCC RELEASE

SE-SMD0603-PW65 SMD 0603 purweiss, wasserklar

DATA SHEET PART NO. : MOA20UB018GJ REV : A / 1

CDSx80 series. package dimensions. cdsc80 series. cdsa80 series. T: F:

CDSX23 series. package dimensions. T: F:

Luckylight Package Warm White Chip LED. Technical Data Sheet. Part No.: S150W-W6-1E

3mm Round Blue LED T-1 Technical Data Sheet

Luckylight. 1.10mm Height 0805 Package. Warm White Chip LED. Technical Data Sheet. Part No.: S170W-W6-1E

1.10mm Height 1210 Package. Bi-Color (Multi-Color) Chip LED. Technical Data Sheet. Part No: S155VBC-V12B-B41B

Features: Descriptions: Applications:

Part No: 0805-FLWC-DHB

Luckylight. 1.9mm (0.8") 8 8 Pure Green Dot Matrix LED Displays Technical Data Sheet. Model No.: KWM-20882XPGB

Luckylight Package Pure Green Chip LED. Technical Data Sheet. Part No.: S150PGC-G5-1B

Luckylight. 10 Segment Light Bars Displays. Technical Data Sheet. Part No.: KWL-R1025WB-Y

3.0*3.0mm (1.2") 8 8 White Dot Matrix LED Displays Technical Data Sheet. Model No.: KWM-R30881XWB-Y

Spec No.: R3528 Date: 28-Sep-2017

Luckylight. 0.56" Quadruple Digit Numeric Displays. Technical Data Sheet. Model No.: KW4-56NXWB-P-Y

СВЕТОДИОДЫ BEELED - ТЕХНИЧЕСКОЕ ОПИСАНИЕ

LED Display Product Data Sheet LTC-5623SW Spec No.: DS Effective Date: 04/11/2013 LITE-ON DCC RELEASE

S192PGC-G5-1AG 1.6x0.8mm, Pure Green LED Surface Mount Chip LED Indicator Technical Data Sheet

Kingbright. L-7104YD-12V T-1 (3mm) Solid State Lamp DESCRIPTIONS PACKAGE DIMENSIONS FEATURES APPLICATIONS ATTENTION SELECTION GUIDE

S195AVGC-2BM 1.6x0.8mm, Red & Yellow Green LED Surface Mount Bi-Color Chip LED Indicator

LITE-ON TECHNOLOGY CORPORATION

WP36BHD T-1 (3mm) Blinking LED Lamp

Technical Data Sheet 0603 Package Chip LED (0.4mm Height)

Technical Data Sheet White SMD Surface Mount Device

SMD LED Product Data Sheet LTW-006DCG-5 Spec No.: DS Effective Date: 11/30/2010 LITE-ON DCC RELEASE

Super Blue Chip LED With Right Angle TSPR-BR3020-AN1P2. Super Blue Chip LED with Right Angle. Features. Descriptions. Applications

HSME-C400. Data Sheet. Side-Fire Mono-Color Surface-Mount ChipLED. Features. Description. Applications

Light LED Product Data Sheet LTW-M140VWS57 Spec No.: DS Effective Date: 11/10/2011 LITE-ON DCC RELEASE

3528-2PIN-SMD LED. White LED. Lumimicro 3528 One Chip Specification Doc. No: LUMI P SPEC.

Display & Mobile Product Data Sheet LTW-108SEG-W Spec No.: DS Effective Date: 03/10/2015 LITE-ON DCC RELEASE

Technical Data Sheet 0805 Package White Chip LED

EVERLIGHT ELECTRONICS CO.,LTD.

LITE-ON TECHNOLOGY CORPORATION

EVERLIGHT ELECTRONICS CO.,LTD.

LED Display Product Data Sheet LTS-4817SW-P Spec No.: DS Effective Date: 10/04/2011 LITE-ON DCC RELEASE

SMD LED Product Data Sheet LTST-T680UWET Spec No.: DS Effective Date: 09/26/2014 LITE-ON DCC RELEASE

JZM15882AGR-GW DATA SHEET

DATA SHEET 發行 立碁電子 DCC. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only. SINGLE DIGIT LED DISPLAY (0.39Inch) Pb LSD355/6DBK-XX-PF

LED Display Product Data Sheet LTP-1557TBE Spec No.: DS Effective Date: 06/16/2010 LITE-ON DCC RELEASE

Features. Applications

Technical Data Sheet 0805 Package Chip LED (0.8mm Height)

16-213SDRC/S530-A3/TR8

SPECIFICATION PART NO. : LT8AB3-43-UGE3-TD 0805 SMD CHIP LED

SMD LED Product Data Sheet LTW-670DS Spec No.: DS Effective Date: 09/03/2010 LITE-ON DCC RELEASE

Features 1.0 MIN. CATHODE LEAD. Sq Typ 0.50 ±0.10

Specific Lighting Product Data Sheet LTW-010DCG LITE-ON DCC RELEASE

17-21SURC/S530-A2/TR8

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only BAR DIGIT LED DISPLAY LBD1F1/25-XX DATA SHEET REV. : B

Data Sheet. HSMW-C120, HSMW-C130, HSMW-C191, HSMW-C197, HSMW-C265 White ChipLEDs. Description. Features. Applications

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only. TRIPLE DIGIT LED DISPLAY (0.56 Inch) DATA SHEET LTD511/21-XX REV. : B

SINGLE DIGIT LED DISPLAY (0.50 Inch) LSD505/61-XX DATA SHEET

Data Sheet. HSMR-CL mm Blue Leadframe-Based Surface Mount ChipLED. Features. Description. Advantages. Package Dimensions

AA3528VR4AS-W2 3.5 x 2.8 mm Surface Mount LED Lamp

LED Display Product Data Sheet LTS-2306CKD-P Spec No.: DS Effective Date: 07/20/2013 LITE-ON DCC RELEASE

1.6X1.25mm BI-COLOR SMD CHIP LED LAMP. Description. Features. Package Dimensions

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only. SINGLE DIGIT LED DISPLAY (0.56 Inch) LSD511/24-XX DATA SHEET REV. : A

SMD LED Product Data Sheet LTST-5630VDWT LITE-ON DCC RELEASE

YJ-VTC-5730-G02 High CRI LED

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only. SINGLE DIGIT LED DISPLAY (0.32 Inch) LSD335/61-XX DATA SHEET REV. : A

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only. FOUR DIGIT LED DISPLAY (0.39 Inch) Lead-Free Parts DATA SHEET LFD3F5/62-XX-PF REV.

ASMT SxB5 Nxxxx Surface Mount LED Indicator

Features. Applications R TOP VIEW

1.0X0.5X0.2mm (0402)SMD CHIP LED LAMP. Features. Descriptions. Package Dimensions

Features. Applications. Part Number Color Package Description

SURFACE MOUNT DISPLAY. Features. Descriptions. Package Dimensions& Internal Circuit Diagram

DATA SHEET LDD405/61-XX-PF. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only. DUAL DIGIT LED DISPLAY (0.40 lnch) DOC. NO : QW0905-LDD405/61-XX-PF

Cylindrical High-Intensity LED (5 mm)

EAST16086YA1 SMD B. Applications

Display & Mobile Product Data Sheet LTW-010DCG-TR Spec No.: DS Effective Date: 06/06/2015 LITE-ON DCC RELEASE

SMD B 23-22B/R7G6C-A30/2T

Display & Mobile Product Data Sheet LTW-303DCG-KB Spec No.: DS Effective Date: 09/09/2015 LITE-ON DCC RELEASE

Features. Applications

19-217/B7C-ZL2N1B3X/3T

SMD B /BHC-YJ2K2TX/3T

YJ-BC-3030-G01 High CRI LED

17-21SYGC/S530-E2/TR8

SMD B /R6C-AP1Q2B/3T

SMD LED Product Data Sheet LTSA-T680UAET Spec No.: Created Date: 2015/07/07 Revision: (PRELIMINARY) - 1.0

Agilent HSMx-C265 Surface Mount Chip LEDs Data Sheet

HUIYUAN OPTO-ELECTRONIC CO.,LTD

SURFACE MOUNT DISPLAY. Description. Features. Package Dimensions& Internal Circuit Diagram. Green. Part Number: ACSA02-41SGWA-F01. Super Bright Green

11-22SURSYGC/S530-A3/TR8

42-21/BHC-AUW/1T SMD B

CSD131R4C. package outlines. Chip. IV (IF = 20mA) Part Number. Recommended Pad Layout. Notes: Unit = mm, Tolerance = 0.1mm

SMD B 42-21UYC/S530-A2/TR8

Features Description Applications

SURFACE MOUNT DISPLAY. Descriptions. Features. Package Dimensions& Internal Circuit Diagram

YJ-VTC-2835-G01 High CRI LED

DATA SHEET LTD511/25-XX/RP105-PF. TRIPLE DIGIT LED DISPLAY (0.56 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

SMD LED Product Data Sheet LTST-M140TGKT LITE-ON DCC RELEASE

YJ-BC-2835L-G02 High CRI LED

SMD LED Product Data Sheet LTW-M670ZVS-CS Spec No.: DS Effective Date: 06/12/2014 LITE-ON DCC RELEASE

Applications Keypad Backlighting Symbol Backlighting Status Indication Front Panel Indicator

Transcription:

Wah Wang Data Sheet for 5mm Super White LED 5C3 Series Angle: 2 Class: Q Part No: WW5C3SWQ4-N Address : Unit 8, 8 th Floor, Nanang Plaza, No.57 Hung To Road, Kwun Tong, Kowloon, Hong Kong Tel : 852-252 9939 ( line) Fa : 852-2344 2398 Web Site : www.wahwang.com WW5C3SWQ4-N Version. Page of 5

Wah Wang Data Sheet For 5mm Super White LED 5C3 Series Angle 2 Class: Q Features Standard T- Diameter Tpe Package. General Purpose Leads Reliable and Rugged Absolute Maimum Ratings at Ta=25 Parameter MAX. Unit Power Dissipation mw Peak Forward Current ( / Dut Ccle,.ms Pulse Wide) ma Continuous Forward Current 2 ma Derating Linear From 5 C.4 ma/ C Reverse Voltage 5 V Operating Temperature Range Storage Temperature Range Lead Soldering Temperature [ 4mm(.57 ) From Bod] -4 C to +8 C -4 C to +8 C 26 C for 3 Seconds Package Dimensions 5.(.97) 5.6(.22) R2.5(.98) R3.4(.34).(.4).5(.2) 2.54(.) NOM. 8.6(.339).6 (.24) 25.4(.) MIN..5(.6)MIN 5.(.97).5(.2) Part Number Electrical Optical Characteristics at Ta=25 C Luminous Intensit Forward Voltage / V Source Iv / mcd Lens color at I at I F = 2mA (Note 5) F = 2mA Color Viewing Angle / Deg (Note 6) Min. Tp. Ma. Min. Tp. Ma. WW5C3SWQ4-N Water Clear White 38 8 --- --- 3.2 4. 2 Reverse Voltage = 5V Reverse Current = 5µA Notes:. All dimensions are in millimeter. 2. Tolerance of measurement is ±.25mm(. ) unless others otherwise noted. 3. Protruded resin under flanges is.mm(.4 ) ma. 4. Lead spacing is measured where the leads emerge from the package. 5. Luminous intensit is measured with a light sensor and filter combination that approimates the CIE ee-response curve. Tolerance of measurement of luminous intensit is 5% 6. θ /2 is the off-ais angle at which the luminous intensit is half the aial luminous intensit. It use man parameters that correspond to the CIE 93 2 Tolerance of measurement of angle is 5 degree 7. Caution in ESD: Static Electricit and surge damages the LED. lt is recommended to use a wrist band or anti-electrostatic glove when handling the LED.All devices, equipment and machiner must be properl grounded. 8. X,Y, and Z are CIE93 2 values of Red, Green and Blue content of the measurement. Color Coordinates Measurement allowance is 9. Specifications are subject to change without notice. WW5C3SWQ4-N Version. Page 2 of 5

CIE Diagram.9.8 5 52 53 54.7 55 56.6 57.5 5 58 59.4 6.3 49 b2 b4 b b3 c 6 62 63 a.2 a 48. 47. 46.2.3.4.5.6.7.8 * Color Coordinates Measurement allowance is ±. Color Ranks (Note 8) a a b b2.256.226.255.278.278.255.274.292.282.274.35.38.38.35.33.33.9.9.248.23.23.248.286.255.273.286.33.39.39.33.36.332 b3 b4 c.292.282.38.33.33.38.33.33.33.33.385.38.255.273.39.285.285.39.332.37.37.36.395.368 Color Coordinates Measurement allowance is WW5C3SWQ4-N Version. Page 3 of 5

Tpical Characteristic for Super Bright White LED Forward Current vs. Chromaticit Coordinate ( D) Spectrum.35.34.33.32.3.3 ma 5mA 2mA 5mA ma.29.3.3.32.33.34 Relative Emission Intensit (a.u.).2..8.6.4.2 IF = 2mA 35 45 55 65 75 Wavelength nm) Chromaticit Coordinate ( D).35.34 IFP = 2mA.33-3 C C.32 25 C 5 C.3 85 C.3.29.3.3.32.33.34 Directivit (Angle : 2 ) Relative Luminosit (a.u.).5 9 IF = 2mA 6 3 Radiation Angle 2 3 4.5 5 6 7 8 9 Forward Current IFP (ma) Forward Voltage vs. Forward Current 2 5 2 5 2.5 3. 3.5 4. 4.5 5. Relative Luminosit (a.u.) Forward Current vs. Relative Lumiinosit 4. 3.5 3. 2.5 2..5..5 2 4 6 8 2 Dut Ratio vs. Allowable Forward Current Allowable Forward Current IFP (ma) 2 5 3 2 5 2 5 Forward Voltage ( V ) Forward Current IFP (ma) Dut Ratio ( % ) Forward Voltage Relative Luminosit Allowable Forward Current Forward Voltage VF (V) 5.4 5. 4.6 4.2 :IFP=6mA 2:IFP=2mA 3:IFP=5mA 3.8 3.4 2 3. 3 2.6-4 -2 2 4 6 8 Ambient Temperature Ta ( C ) Relative Luminosit (a.u.) 2...5.2-4 -2 IFP = 2mA 2 4 6 8 Ambient Temperature Ta ( C ) Allowable Forward Current IFP (ma) 4 3 2 2 4 6 8 Ambient Temperature ( C ) WW5C3SWQ4-N Version. Page 4 of 5

CAUTIONS- Super Bright White LED Because the White LEDs are make b combining Blue LEDs and special phosphors. Hence, the color of White LEDs is changed a little b an operation current. Care should be taken after due consideration when using LEDs. () Lead Forming a. At least 3mm from the base of the epo bulb should be keep when forming leads. b. Do not use the base of the leadframe as a fulcrum during lead forming. Lead forming should be done before soldering. c. Because the stress to the base ma damage the characteristics or it ma break the LEDs, do not appl an bending stress to the base of the lead d. When mounting the LEDs onto a PCB, the holes on the circuit board should be eactl aligned with the leads of the LEDs. Stress at the leads should be avoid when the LEDs are mounted on the PCB, because it causes damage to the epo resin and this will degrade the LEDs. (2) Storage a. The LEDs should be stored at stored at 3 C or less and 7%RH or less after being shipped and the storage life limits are 3 months. b. If the LEDs are stored more then 3 months, the can be stored for a ear in a sealed container with a nitrogen atmosphere and moisture absorbent material. c. Please avoid rapid transitions in ambient temperature, especiall, in high humidit environments where condensation can occur. (3) Static Electricit a. Static electricit or surge voltage damages the LEDs. b. It is recommended that a wristband or an anti-electrostatic glove be used when handling the LEDs. c. All devices, equipment and machiner must be properl grounded. d. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. e. Damaged LEDs will show some unusual characteristics such as the leak current remarkabl increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF>2.V at IF=.5mA) (4) Heat Generation a. Thermal design of the end product was most importance. Please consider the heat generation of the LED when making the sstem design. b. The thermal resistance of the circuit board and densit of LED placement on the board, as well as other components was the important factor affecting the coefficient of temperature increase per input electric power. It must be avoid intense heat generation and operate within the maimum ratings given in the specification. c. The operating current should be decided after considering the ambient maimum temperature of LEDs. (5) Cleaning a. It is recommended that isopropl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. b. Do not clean the LEDs b the ultrasonic. When it is absolutel necessar, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether an damage to the LEDs would occur. (6) Safet Guideline for Human Ees a. In 993, the International Electric Committee (IEC) issued a standard concerning laser product safet (IEC 825-).Since then, this standard has been applied for diffused light sources (LEDs) as well as lasers.in 998 IEC 6825- Edition. evaluated the magnitude of the light source. b. In 2 IC 6825- Amendment 2 converted the laser class into 7 classes for end products. c. Components are ecluded from this sstem. Products which contain visible LEDs are now classified as class. Products containing UV LEDs can be classified as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the energ emitted is high. For these sstems it is recommended to avoid long term eposure. It is also recommended to follow the ICE regulations regarding safet and labeling of products. (7) Soldering Condition for LED Lamps a Careful attention should be paid during soldering. b. Solder the LED no closer than 3mm from the base of the epo bulb. Soldering beond the base of the tie bar is recommender. c. Recommender soldering conditions Dip Soldering Soldering Pre-Heat Pre-Heat Time Solder Bath Temperature Dipping Time Dipping Position 2 C Ma 6 seconds Ma 26 C Ma seconds Ma No lower than 3 mm from the base of the epo bulb. Temperature Soldering Time Position 35 C Ma 3 seconds Ma No closer than 3 mm from the base of the epo bulb. d. Do not appl an stress to the lead particularl when heated. The LEDs must not be repositioned after soldering. After soldering the LEDs, the epo bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. Direct soldering onto a PC board should be avoided. Mechanical stress to the resin ma be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it is absolutel necessar, the LEDs ma be mounted in this fashion but the User will assume responsibilit for an problems. Direct soldering should onl be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. Wah Wang LEDs should not be soldered directl to double sided PC boards because the heat will deteriorate the epo resin. When it is necessar to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures ma cause failure of the LEDs. (8) Others a. Care must be taken to ensure that the reverse voltage will not eceed the absolute maimum rating when using the LEDs with matri drive. Keeping the Normal Forward to 2 ma. b. The LEDs described in this brochure are intended to be used for ordinar electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Wah Wang s sales staff in advance for information on the applications in which eceptional qualit and reliabilit are required, particularl when the failure or malfunction of the LEDs ma directl jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control sstems, automobiles, traffic control equipment, life support sstems and safet devices). IF R VF IF = V - VF R V c. User shall not reverse engineer b disassembling or analsis of the LEDs without having prior written consent from WahwWang. When defective LEDs are found, the User shall inform Wah Wang directl before disassembling or analsis. d. The formal specifications must be echanged and signed b both parties before large volume purchase begins. e. The appearance and specifications of the product ma be modified for improvement without notice. WW5C3SWQ4-N Version. Page 5 of 5