TGC21-SM Product Description The QORVO TGC21-SM is a Ku-Band image reject upconverter with integrated LO buffer amplifier and output variable gain amplifier. The TGC21-SM operates from an RF of 1 to 16 GHz and LO from 6. to 19 GHz with IF inputs from DC to 3.GHz and is designed using QORVO s 3MI DR.1 um phemt production process. The TGC21-SM typically provides 33 dbm of output TOI at 1 dbm input power per tone and has a conversion gain of 17 db. The TGC21-SM is available in a low-cost, surface mount 28 lead xmm QFN package and is ideally suited for Pointto-Point Radio, and Ku-Band VSAT Ground Terminal. 28-pin x mm QFN package Product Features RF Frequency Range: 1-16 GHz IF Frequency: DC LO Frequency: 6. 19 GHz LO Input Power: to 6 dbm Conversion Gain: 17 db OTOI: 33 dbm at max gain Attenuation Range: 1 db typical Package Dimensions:. x. x 1.3 mm Function Block Diagram Ordering Information Part No. TGC21-SM TGC21-SMEVBLL TGC21-SMEVBLH TGC21-SMEVBUL TGC21-SMEVBUH Description Ku-Band Upconverter TGC21-SM EVB LSB, Low IF Band, 1.3 to 2.4 GHz TGC21-SM EVB LSB, High IF Band, 2. to 4. GH TGC21-SM EVB USB, Low IF Band, 1.3 to 2.4 GHz TGC21-SM EVB USB, High IF Band, 2. to 4. GHz Applications VSAT Point-to-Point Radio Test Equipment & Sensors Data Sheet Rev I. August 6, 218 Subject to change without notice 1 of 23 www.qorvo.com
TGC21-SM Absolute Maximum Ratings Parameter VDRF VDLO IDRF IDLO VREF VGRF, VGLO, VGX VCTRL IF1, IF2 IF Input Power, Ω, T = 2 C Channel Temperature, Tch Storage Temperature Rating 6 V 6 V 3 ma 1 ma 3 V -2 to +1. V 3 V -2 to +2 V 1 dbm 2 C -6 to 12 C Recommended Operating Conditions Parameter Min Typ Max Units Operating Temp. Range -4 +2 +8 C VDRF V IDRF 24 ma VGRF -.7 V VDLO V IDLO 6 ma VGLO -.63 V VREF 2 V VGX -1.2 V VCTRL V LO Input Power 6 dbm These are stress ratings only, functional operation of the device at these conditions is not implied. Extended application of Absolute Maximum Rating conditions may reduce device reliability. Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: IF Input Power = -1 dbm, VGX = -1.2 V, VREF = 2 V, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma. VCTRL = V for maximum gain. Parameter Conditions Min Typ Max Units RF Frequency Range 1 16 GHz LO Frequency Range 6. 19 GHz IF Frequency Range DC LO Input Power 6 dbm Conversion Gain IF=2GHz 1 17 dbm Third Order Output Intercept Point, OIP3 RF = 1 to 11.7GHz, IF=2GHz 24 33 dbm Third Order Output Intercept Point, OIP3 RF = 12.7 to 1.4GHz, IF=2GHz 26 33 dbm Image Rejection 2 db P1dB Output Power 22 dbm Data Sheet Rev I. August 6, 218 Subject to change without notice 2 of 23 www.qorvo.com
TGC21-SM Thermal and Reliability Information Parameter Conditions Rating Thermal Resistance, θjc, measured to back of package Tbase = 8 C θjc = 26.1 C/W Channel Temperature (Tch), and Median Lifetime (Tm) Channel Temperature (Tch), and Median Lifetime (Tm) Under RF Drive Tbase = 8 C, VDRF = V, IDRF = 24 ma VDLO = V, IDLO = 6 ma Pdiss = 1. W Tbase = 8 C VDRF = V, IDRF = 24 ma VDLO = V, IDLO = 8 ma Pin = -1 dbm Pdiss = 1.63 W Tch = 124 C Tm = 2.3 E+7 Hours Tch = 128 C Tm = 1.4 E+7 Hours Data Sheet Rev I. August 6, 218 Subject to change without notice 3 of 23 www.qorvo.com
Conversion Gain (db) Conversion Gain (db) Conversion Gain (db) Conversion Gain (db) Conversion Gain (db) Conversion Gain (db) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma. VGX = -1.2 V, VREF = 2 V. 2 Conversion Gain vs. RF vs. IF Vcontrol = V, LO = dbm, LSB, 2 C 2 Conversion Gain vs. RF vs. IF Vcontrol = V, LO = dbm, USB, 2 C 2 2 1 1 1 1. GHz 2. GHz 3. GHz 1 1. GHz 2. GHz 3. GHz 2 Conversion Gain vs. RF vs. IF Vcontrol = V, LO = 6 dbm, LSB, 2 C 2 Conversion Gain vs. RF vs. IF Vcontrol = V, LO = 6 dbm, USB, 2 C 2 2 1 1 1 1. GHz 2. GHz 3. GHz 1 1. GHz 2. GHz 3. GHz Conversion Gain vs. RF vs. IF Vcontrol = 2 V, LO = dbm, LSB, 2 C Conversion Gain vs. RF vs. IF Vcontrol = 2 V, LO = dbm, USB, 2 C - - -1-1 1. GHz 2. GHz 3. GHz -2-1 -1 1. GHz 2. GHz 3. GHz -2 Data Sheet Rev I. August 6, 218 Subject to change without notice 4 of 23 www.qorvo.com
Image Rejection Ratio (db) Image Rejection Ratio (db) Image Rejection Ratio (db) Image Rejection Ratio (db) Conversion Gain (db) Conversion Gain (db) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. Conversion Gain vs. RF vs. IF Vcontrol = 2 V, LO = 6 dbm, LSB, 2 C Conversion Gain vs. RF vs. IF Vcontrol = 2 V, LO = 6 dbm, USB, 2 C - - -1-1 1. GHz 2. GHz 3. GHz -1-1 1. GHz 2. GHz 3. GHz -2-2 IMR vs. RF Output and IF Input Vcontrol = V, LO = dbm, LSB, 2 C IMR vs. RF Output and IF Input Vcontrol = V, LO = dbm, USB, 2 C 4 4 3 3 2 1. GHz 2. GHz 1 3. GHz 2 1. GHz 2. GHz 1 3. GHz IMR vs. RF Output and IF Input Vcontrol = V, LO = 6 dbm, LSB, 2 C IMR vs. RF Output and IF Input Vcontrol = V, LO = 6 dbm, USB, 2 C 4 4 3 3 2 1. GHz 1 2. GHz 3. GHz 2 1. GHz 1 2. GHz 3. GHz Data Sheet Rev I. August 6, 218 Subject to change without notice of 23 www.qorvo.com
Image Rejection Ratio (db) Image Rejection Ratio (db) Image Rejection Ratio (db) Image Rejection Ratio (db) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. 4 3 IMR vs. RF Output and IF Input Vcontrol = 2 V, LO = dbm, LSB, 2 C 4 3 IMR vs. RF Output and IF Input Vcontrol = 2 V, LO = dbm, USB, 2 C 1. GHz 2. GHz 3. GHz 2 1. GHz 2. GHz 1 3. GHz 2 1 IMR vs. RF Output and IF Input Vcontrol = 2 V, LO = 6 dbm, LSB, 2 C IMR vs. RF Output and IF Input Vcontrol = 2 V, LO = 6 dbm, USB, 2 C 4 3 4 3 1. GHz 2. GHz 3. GHz 2 1. GHz 1 2. GHz 3. GHz 2 1 Data Sheet Rev I. August 6, 218 Subject to change without notice 6 of 23 www.qorvo.com
OIP3 (dbm) OIP3 (dbm) OIP3 (dbm) OIP3 (dbm) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. 4 3 3 2 2 1 1 OIP3 vs. RF Output and IF Input Vcontrol = V, LO = dbm, LSB, 2 C 1. GHz 2. GHz 3. GHz 4 3 3 2 2 1 1 OIP3 vs. RF Output and IF Input Vcontrol = V, LO = dbm, USB, 2 C 1. GHz 2. GHz 3. GHz 4 3 3 2 2 1 1 OIP3 vs. RF Output and IF Input Vcontrol = V, LO = 6 dbm, LSB, 2 C 1. GHz 2. GHz 3. GHz 4 3 3 2 2 1 1 OIP3 vs. RF Output and IF Input Vcontrol = V, LO = 6 dbm, USB, 2 C 1. GHz 2. GHz 3. GHz Data Sheet Rev I. August 6, 218 Subject to change without notice 7 of 23 www.qorvo.com
Isolation (db) Isolation (db) OIP3 (dbm) OIP3 (dbm) OIP3 (dbm) OIP3 (dbm) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. 4 3 3 2 2 OIP3 vs. RF Output and IF Input Vcontrol = 2 V, LO = dbm, LSB, 2 C 1 1. GHz 1 2. GHz 3. GHz 4 3 3 2 2 OIP3 vs. RF Output and IF Input Vcontrol = 2 V, LO = dbm, USB, 2 C 1 1. GHz 1 2. GHz 3. GHz 4 3 3 2 2 OIP3 vs. RF Output and IF Input Vcontrol = 2 V, LO = 6 dbm, LSB, 2 C 1 1. GHz 1 2. GHz 3. GHz 4 3 3 2 2 OIP3 vs. RF Output and IF Input Vcontrol = 2 V, LO = 6 dbm, USB, 2 C 1 1. GHz 1 2. GHz 3. GHz L-I Isolation vs. LO Frequency Vcontrol = V, LSB, 2 C L-I Isolation vs. LO Frequency Vcontrol = V, USB, 2 C 4 4 3 2 LO = dbm LO = 6 dbm 3 2 LO = dbm LO = 6 dbm 1 1 Data Sheet Rev I. August 6, 218 Subject to change without notice 8 of 23 www.qorvo.com
Isolation (db) Isolation (db) Isolation (db) Isolation (dbm) Isolation (db) Isolation (db) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. L-I Isolation vs. LO Frequency Vcontrol = 2 V, LSB, 2 C L-I Isolation vs. LO Frequency Vcontrol = 2 V, USB, 2 C 4 4 3 2 LO = dbm LO = 6 dbm 3 2 LO = dbm LO = 6 dbm 1 1 L-R Isolation vs. LO Frequency Vcontrol = V, LSB, 2 C L-R Isolation vs. LO Frequency Vcontrol = V, USB, 2 C 4 3 LO = dbm LO = 6 dbm 4 3 LO = dbm LO = 6 dbm 2 2 1 1 L-R Isolation vs. LO Frequency Vcontrol = 2 V, LSB, 2 C L-R Isolation vs. LO Frequency Vcontrol = 2 V, USB, 2 C 4 4 3 2 LO = dbm LO = 6 dbm 3 2 LO = dbm LO = 6 dbm 1 1 Data Sheet Rev I. August 6, 218 Subject to change without notice 9 of 23 www.qorvo.com
Isolation (db) Isolation (db) Isolation (db) Isolation (db) Isolation (db) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. 8 7 6 4 3 2 1 I to R Isolation vs. LO vs. IF Vcontrol = V, LO = dbm, LSB, 2 C 1. GHz 2. GHz 3. GHz 8 7 6 4 3 2 1 I to R Isolation vs. LO vs. IF Vcontrol = V, LO = dbm, USB, 2 C 1. GHz 2. GHz 3. GHz 8 7 6 4 3 2 1 I to R Isolation vs. LO vs. IF Vcontrol = V, LO = 6 dbm, LSB, 2 C 1. GHz 2. GHz 3. GHz 8 7 6 4 3 2 1 I to R Isolation vs. LO vs. IF Vcontrol = V, LO = 6 dbm, USB, 2 C 1. GHz 2. GHz 3. GHz 8 7 6 4 3 2 1 I to R Isolation vs. LO vs. IF Vcontrol = 2 V, LO = dbm, LSB, 2 C 1. GHz 2. GHz 3. GHz Data Sheet Rev I. August 6, 218 Subject to change without notice 1 of 23 www.qorvo.com
Input 1dB Compression (dbm) Input 1dB Compression (dbm) Input 1dB Compression (dbm) Input 1dB Compression (dbm) Isolation (db) Isolation (db) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. 8 7 6 4 3 2 1 I to R Isolation vs. LO vs. IF Vcontrol = 2 V, LO = 6 dbm, LSB, 2 C 1. GHz 2. GHz 3. GHz 8 7 6 4 3 2 1 I to R Isolation vs. LO vs. IF Vcontrol = 2 V, LO = 6 dbm, USB, 2 C 1. GHz 2. GHz 3. GHz 1 Input 1dB Compression vs. RF Output Vcontrol = V, LO = dbm, LSB, 2 C 1 Input 1dB Compression vs. RF Output Vcontrol = V, LO = dbm, USB, 2 C 1 1 1. GHz 2. GHz 3. GHz - 1. GHz 2. GHz 3. GHz - 1 Input 1dB Compression vs. RF Output Vcontrol = V, LO = 6 dbm, LSB, 2 C 1 Input 1dB Compression vs. RF Output Vcontrol = V, LO = 6 dbm, USB, 2 C 1 1 1. GHz 2. GHz 3. GHz - 1. GHz 2. GHz 3. GHz - Data Sheet Rev I. August 6, 218 Subject to change without notice 11 of 23 www.qorvo.com
Voltage (V) Voltage (V) Input 1dB Compression (dbm) Input 1dB Compression (dbm) Input 1dB Compression (dbm) Input 1dB Compression (dbm) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. 1 Input 1dB Compression vs. RF Output Vcontrol = 2 V, LO = dbm, LSB, 2 C 1 Input 1dB Compression vs. RF Output Vcontrol = 2 V, LO = dbm, USB, 2 C 1 1 1. GHz 2. GHz 3. GHz 1. GHz 2. GHz 3. GHz - - 1 Input 1dB Compression vs. RF Output Vcontrol = 2 V, LO = 6 dbm, LSB, 2 C 1 Input 1dB Compression vs. RF Output Vcontrol = 2 V, LO = 6 dbm, USB, 2 C 1 1 1. GHz 2. GHz 3. GHz 1. GHz 2. GHz 3. GHz - - 1.8.6.4.2 -.2 -.4 -.6 -.8-1 Nulling Voltages vs. LO Frequency LO at 3 dbm, IF = 2. GHz, USB, 2 C VDI_Min Gain VDI_Max Gain VDQ_Min Gain VDQ_Max gain 1.8.6.4.2 -.2 -.4 -.6 -.8-1 Nulling Voltages vs. LO Frequency LO at 3 dbm, IF =, USB, 2 C VDI_Min Gain VDI_Max Gain VDQ_Min Gain VDQ_Max gain Data Sheet Rev I. August 6, 218 Subject to change without notice 12 of 23 www.qorvo.com
OIP3 (dbm) OIP3 (dbm) Conversion Gain (db) Conversion Gain (db) Conversion Gain (db) Conversion Gain (db) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. 2 2 Conversion Gain vs. RF vs. Temperature Vcontrol = V, LO = dbm, LSB IF = 2. GHz 2 2 Conversion Gain vs. RF vs. Temperature Vcontrol = V, LO = dbm, USB IF @ 2. GHz 1 1 1 8 C 2 C -4 C 1 8 C 2 C -4 C 2 Conversion Gain vs. RF vs. Temperature Vcontrol = V, LO = dbm, LSB IF = 2 Conversion Gain vs. RF vs. Temperature Vcontrol = V, LO = dbm, USB IF @ 2 2 1 1 1 8 C 2 C -4 C 1 8 C 2 C -4 C OIP3 vs. RF Output vs. Temperature Vcontrol = V, LO = 6 dbm, LSB IF = 2. GHz OIP3 vs. RF Output vs. Temperature Vcontrol = V, LO = 6 dbm, USB IF @ 2. GHz 4 4 3 2 1 8 C 2 C -4 C 3 2 1 8 C 2 C -4 C Data Sheet Rev I. August 6, 218 Subject to change without notice 13 of 23 www.qorvo.com
Image Rejection Ratio (db) Image Rejection Ratio (db) Image Rejection Ratio (db) Image Rejection Ratio (db) OIP3 (dbm) OIP3 (dbm) TGC21-SM Performance Plots IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma, VGX = -1.2 V, VREF = 2 V. OIP3 vs. RF Output vs. Temperature Vcontrol = V, LO = 6 dbm, LSB IF = OIP3 vs. RF Output vs. Temperature Vcontrol = V, LO = 6 dbm, USB IF @ 4 4 3 3 2 1 8 C 2 C -4 C 2 1 8 C 2 C -4 C 4 IMR vs. RF Output vs. Temperature Vcontrol = V, LO = dbm, LSB IF = 2. GHz 4 IMR vs. RF Output vs. Temperature Vcontrol = V, LO = dbm, USB IF @ 2. GHz 3 3 2 1 8 C 2 C -4 C 2 8 C 1 2 C -4 C IMR vs. RF Output vs. Temperature Vcontrol = V, LO = dbm, LSB IF = IMR vs. RF Output vs. Temperature Vcontrol = V, LO = dbm, USB IF @ 4 4 3 3 2 1 8 C 2 C -4 C 2 1 8 C 2 C -4 C Data Sheet Rev I. August 6, 218 Subject to change without notice 14 of 23 www.qorvo.com
TGC21-SM Mixing Products IF Input Power = -1 dbm, VDLO = V, IDLO = 6 ma, VDRF = V, IDRF = 24 ma. VGX = -1.2 V, VREF = 2 V. M x N Spurious Outputs for LSB LO = 6 dbm, 2 C; All values are in dbc. For LSB IF = 2. GHz: LO = 12. GHz to 18. GHz; IF = : LO = 1 to 19. GHz. Spurious Suppresion (dbc) for IF = 2. GHz RF/LO 1 2 3-3 --- 7 79 76-2 --- 44 4 7-1 --- 38 69 --- 24 3 38 1 61 24 69 68 2 62 44 79 7 3 72 78 78 76 Spurious Suppresion (dbc) for IF = RF/LO 1 2 3-3 --- 84 7 73-2 --- 4 71-1 --- 9 63 --- 21 28 34 1 1 27 64 69 2 49 64 74 74 3 8 77 7 --- M x N Spurious Outputs for USB LO = 6 dbm, 2 C; All values are in dbc. For USB IF = 2. GHz: LO = 8. GHz to 14. GHz; IF = : LO = 6. GHz to 12. GHz. Spurious Suppresion (dbc) for IF = 2. GHz RF/LO 1 2 3-3 --- 7 46 44-2 --- 46 29 4-1 --- 17 2 1 --- 23-17 2 1 6 8 26 2 28 33 32 62 3 48 43 66 71 Spurious Suppresion (dbc) for IF = RF/LO 1 2 3-3 --- 62 66 49-2 --- 7 33 41-1 --- 23 8 14 --- 19-29 -17 1 23 4 11 2 27 3 38 41 3 6 8 64 72 Data Sheet Rev I. August 6, 218 Subject to change without notice 1 of 23 www.qorvo.com
TGC21-SM Pin Configuration and Description Pin No. Label Description 1, 7, 8, 9, 13, 14, 1, 16, 21, 22, 26, 28 GND Internal Grounding; must be grounded on PCB. 2 RF OUT RF Output matched to ohms, AC Coupled. 3, 11, 18, 19, 2 NC No internal connection; must be grounded on PCB. 4 VCTRL VREF 6 VGRF Control Voltage. Bias network is required; see Application Circuit on page 17 as an example. Reference Voltage. Bias network is required; see Application Circuit on page 17 as an example. RF Gate Voltage. Bias network is required; see Application Circuit on page 17 as an example. 1 IF1 IF Input matched to ohms, DC coupled. 12 IF2 IF Input matched to ohms, DC coupled. 17 LO IN LO Input, matched to ohms, AC coupled. 23 VGLO 24 VDLO 2 VGX 27 VDRF 29 GND LO Gate Voltage. Bias network is required; see Application Circuit on page 17 as an example. LO Drain Voltage. Bias network is required; see Application Circuit on page 17 as an example. Mixer Voltage. Bias network is required; see Application Circuit on page 17 as an example. RF Drain Voltage. Bias network is required; see Application Circuit on page 17 as an example. Backside Paddle. Multiple vias should be employed to minimize inductance and thermal resistance; see Mounting Configuration on page 2 for suggested footprint. Data Sheet Rev I. August 6, 218 Subject to change without notice 16 of 23 www.qorvo.com
TGC21-SM Applications Circuit Bias-up Procedure Set VGX = -1.2 V, Set VREF = 2. V, Set VCTRL = V Set VGLO = -1. V, Set VDLO =. V Set VGX, VREF, VCTRL, VGLO, VGRF, VDI, VDQ current limits to 1 ma Set IDLO limit to 1 ma, Set IDRF limit to 3 ma Increase VGLO to get IDLO = 6 ma Set VGRF = -1. V, Set VDRF =. V Increase VGRF to get IDRF = 24 ma Set VDI, VDQ to V; or no connection Apply LO and RF signals Bias-down Procedure Turn off RF and LO signals Reduced VDLO = V Reduce VDRF = V Set VDI = V, if used for LO nulling Set VDQ = V, if used for LO nulling Reduced VGLO = V, VGRF = V, VREF = V Reduce VCTRL = V Reduced VGX = V Data Sheet Rev I. August 6, 218 Subject to change without notice 17 of 23 www.qorvo.com
TGC21-SM Evaluation Board (EVB) Assembly Layout Board material is RO43.8 thickness with ½ oz copper cladding. Data Sheet Rev I. August 6, 218 Subject to change without notice 18 of 23 www.qorvo.com
TGC21-SM Application Circuit Component Bill of Material Ref Des Value Description Manufacturer Part Number C1 C2 1 pf Cap, 42, V, %, NPO various C3 - C, C7, C13 - C1 1 pf Cap, 42, V, %, NPO various C1 C12, C6, C8, C9 1 µf Cap, 8, 2V, %, XR various L1 L4 27 nh Ind, 21, 1 ma, %, SMD various Q1 Ku-Band Up-Converter QORVO TGC21-SM LSB Configuration Ref Des Value Description Manufacturer Part Number X1 IF Quad Coupler, 1.3 to 2.4 GHz Mini-Circuits QCN-2+ X1 IF Quad Coupler, 2. to 4. GHz Mini-Circuits QCN-4+ R1 Ω Res, 42,.1W, SMD various R4 Ω Res, 42,.W,.1%, SMD various R2, R3 DNP USB Configuration Ref Des Value Description Manufacturer Part Number X1 IF Quad Coupler, 1.3 to 2.4 GHz Mini-Circuits QCN-2+ X1 IF Quad Coupler, 2. to 4. GHz Mini-Circuits QCN-4+ R3 Ω Res, 42,.1W, SMD various R2 Ω Res, 42,.W,.1%, SMD various R1, R4 DNP Note: Due to bandwidth limitations of IF quad coupler, two versions of coupler were used on EVBs, users need to choose low or high band of IF to be used, in addition to LSB and USB selection. Refer to ordering information section for details. Data Sheet Rev I. August 6, 218 Subject to change without notice 19 of 23 www.qorvo.com
TGC21-SM Package Marking and Dimensions The TGC21-SM will be marked with the 21 designator. The YY represents the last two digits of the year the part was manufactured, the WW is the work week, and the XXXX is batch ID. This package is lead-free/rohs-compliant with a copper alloy base (CDA194), and the plating material on the leads is NiPdAu. It is compatible with a lead-free (maximum 26 C reflow temperature) soldering process. PCB Mounting Pattern Notes: 1. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a.3mm diameter drill and have a final plated thru diameter of.2 mm. Data Sheet Rev I. August 6, 218 Subject to change without notice 2 of 23 www.qorvo.com
TGC21-SM Tape and Reel Information Standard T/R size = pieces on a 7 reel. Vendor Tek-Pak Material Vendor P/N QFNX F-L Length (A) Cavity (mm) Width (B) Depth (K) Pitch (P1) Distance Between Centerline (mm) Length Width direction Direction (P2) (F) Carrier Tape (mm) Width (W) Cover Carrier (mm) Width (W).3.3 1.6 8. 2.. 12. 9.2 Data Sheet Rev I. August 6, 218 Subject to change without notice 21 of 23 www.qorvo.com
TGC21-SM Solderability Compatible with both lead-free (26 C max. reflow temp.) and tin/lead (24 C max. reflow temp.) soldering processes. Solder profiles available upon request. Recommended Soldering Temperature Profile Data Sheet Rev I. August 6, 218 Subject to change without notice 22 of 23 www.qorvo.com
TGC21-SM Handling Precautions Parameter Rating Standard ESD Human Body Model (HBM) Class ESDA / JEDEC JS-1-212 MSL Moisture Sensitivity Level Level 1 IPC/JEDEC J-STD-2 Caution! ESD-Sensitive Device RoHS Compliance This product is compliant with the 211/6/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances Electrical and Electronic Equipment), as amended by Directive 21/863/EU. This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C1H12Br42) Free PFOS Free SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Tel: 1-844-89-8163 Web: www.qorvo.com Email: customer.support@qorvo.com For technical questions and application information: Email: appsupport@qorvo.com Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained here and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained herein subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo produc The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, license or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TH INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORV HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED B LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIE WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medic life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe person injury or death. Copyright 218 Qorvo, Inc. Qorvo is a registered trademark of Qorvo, Inc. Data Sheet Rev I. August 6, 218 Subject to change without notice 23 of 23 www.qorvo.com