DESIGNING MEMS MICROPHONES FROM CONCEPT TO FINISHED GDSII IN ABOUT TWO WEEKS

Similar documents
ADDRESSING THE CHALLENGES OF IOT DESIGN JEFF MILLER, PRODUCT MARKETING MANAGER, MENTOR GRAPHICS

Wafer Thinning and Thru-Silicon Vias

PREVENTING IOT EDGE DEVICE VULNERABILITIES JEFF MILLER, PRODUCT MARKETING & STRATEGY, MENTOR, A SIEMENS BUSINESS

FASwitch - A MEMS Display Backplane Manufactured by Flex Circuit Methods

Applied Materials. 200mm Tools & Process Capabilities For Next Generation MEMS. Dr Michel (Mike) Rosa

7 DESIGN ASPECTS OF IoT PCB DESIGNS JOHN MCMILLAN, MENTOR GRAPHICS

Alien Technology Corporation White Paper. Fluidic Self Assembly. October 1999

Circuits Assembly September 1, 2003 Duck, Allen

COMPONENT PREPARATION AND MANUAL INSERTION TRAINING CERTIFICATION TEST (DVD-44C) v.2

InvenSense Fabless Model for the MEMS Industry

Multi-Shaped E-Beam Technology for Mask Writing

Xpedition Layout for Package Design. Student Workbook

Display Technologies CMSC 435. Slides based on Dr. Luebke s slides

Flexible Electronics Production Deployment on FPD Standards: Plastic Displays & Integrated Circuits. Stanislav Loboda R&D engineer

Leveraging 300 mm Technology Solutions to Enable New MEMS Process Capabilities

Lecture 18 Design For Test (DFT)

Advancements in Acoustic Micro-Imaging Tuesday October 11th, 2016

Data Sheet. ASMT-UWB1-NX302 OneWhite Surface Mount PLCC-2 LED Indicator. Description. Features. Applications

Vesper VM1000 Piezoelectric MEMS Microphone

Achieving Faster Time to Tapeout with In-Design, Signoff-Quality Metal Fill

AT5040 White Paper Final 10/01/12

Perfecting the Package Bare and Overmolded Stacked Dies. Understanding Ultrasonic Technology for Advanced Package Inspection. A Sonix White Paper

SEMICONDUCTOR TECHNOLOGY -CMOS-

Designing for the Internet of Things with Cadence PSpice A/D Technology

Data Sheet. HSMR-CL mm Blue Leadframe-Based Surface Mount ChipLED. Features. Description. Advantages. Package Dimensions

Component Placement Tutorial Part One

SEMICONDUCTOR TECHNOLOGY -CMOS-

TKK S ASIC-PIIRIEN SUUNNITTELU

PTIK UNNES. Lecture 02. Conceptual Model for Computer Graphics and Graphics Hardware Issues

Organic light emitting diode (OLED) displays

RAPID SOC PROOF-OF-CONCEPT FOR ZERO COST JEFF MILLER, PRODUCT MARKETING AND STRATEGY, MENTOR GRAPHICS PHIL BURR, SENIOR PRODUCT MANAGER, ARM

AA3528VR4AS-W2 3.5 x 2.8 mm Surface Mount LED Lamp

IC Mask Design. Christopher Saint Judy Saint

Digital Light Processing

Data Sheet. ASMT-UWB1-NX302 OneWhite Surface Mount PLCC-2 LED Indicator. Description. Features. Applications

CPD LED Course Notes. LED Technology, Lifetime, Efficiency and Comparison

Advanced WLP Platform for High-Performance MEMS. Presented by Dean Spicer, Director of Engineering

WP36BHD T-1 (3mm) Blinking LED Lamp

MicroLED Displays: Global Trends & Opportunities for Equipment and Material Suppliers

EE C247B ME C218 Introduction to MEMS Design Spring 2017

VJ 6040 UHF Chip Antenna for Mobile Devices

SKY : Shielded Low-Noise Amplifier Front-End Module with GPS/GNSS/BDS Pre-Filter

Optimizing BNC PCB Footprint Designs for Digital Video Equipment

13th MOST Interconnectivity Conference 2012 MOST150 on the Road with Avago FOTs

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

SKY LF: GPS/GLONASS/Galileo/BDS Low-Noise Amplifier

International Research Journal of Engineering and Technology (IRJET) e-issn: Volume: 03 Issue: 07 July p-issn:

Challenges in the design of a RGB LED display for indoor applications

Ultrasonic Testing adapts to meet the needs of the Automotive Tube Industry

3D-CHIP TECHNOLOGY AND APPLICATIONS OF MINIATURIZATION

TCP-3039H. Advance Information 3.9 pf Passive Tunable Integrated Circuits (PTIC) PTIC. RF in. RF out

Meeting the challenge of accurately assembling active optical cables

Focused-ion-beam fabrication of nanoplasmonic devices

MOST - Roadmap Physical Layer & Connectivity from 150Mbps to 5Gbps

Combination Solder Pad for Single-chip LEDs with P-LCC-2 and P-LCC-4 Housings Application Note

IC TECHNOLOGY Lecture 2.

AN4184 Application note

Smart. Connected. Energy-Friendly.

RF V W-CDMA BAND 2 LINEAR PA MODULE

3.22 Finalize exact specifications of 3D printed parts.

Integrated Circuit Design ELCT 701 (Winter 2017) Lecture 1: Introduction

Forward-Looking Statements

Future of MEMS: Market and Technologies Perspective Dr. Eric MOUNIER, Yole Développement

January Spectra7 Microsystems, Inc.

Correlating differences in the playing properties of five student model clarinets with physical differences between them

How would you go about creating the presentation?

The field cage for a large TPC prototype

An Update from HDMI Licensing, LLC

Scan. This is a sample of the first 15 pages of the Scan chapter.

TN0991 Technical note

Kingbright. L-7104YD-12V T-1 (3mm) Solid State Lamp DESCRIPTIONS PACKAGE DIMENSIONS FEATURES APPLICATIONS ATTENTION SELECTION GUIDE

ADVANCED MICRO DEVICES, 2 CADENCE DESIGN SYSTEMS

Deep Silicon Etch Technology for Advanced MEMS Applications

ASMT SxB5 Nxxxx Surface Mount LED Indicator

Innovative Rotary Encoders Deliver Durability and Precision without Tradeoffs. By: Jeff Smoot, CUI Inc

LED - TYPES. The main types of LEDs are miniature, high power devices and custom designs

Reduction of Clock Power in Sequential Circuits Using Multi-Bit Flip-Flops

TGL2210-SM_EVB GHz 100 Watt VPIN Limiter. Product Overview. Key Features. Applications. Functional Block Diagram. Ordering Information

Data Sheet. HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs

S195AVGC-2BM 1.6x0.8mm, Red & Yellow Green LED Surface Mount Bi-Color Chip LED Indicator

ADD AN AUDIO MESSAGE TO YOUR PRODUCT WITH THIS RECORD & PLAYBACK KIT

Automatic Connector MHV Connectors MHV Introduction MHV series connectors Contents Polarized mating interfaces Anti-Rock mating interfaces

= +25 C, IF= 100 MHz, LO = +15 dbm*

X-ray Inspection. Series.

Features. = +25 C, IF = 1 GHz, LO = +13 dbm*

TIL311 HEXADECIMAL DISPLAY WITH LOGIC

FLOW INDUCED NOISE REDUCTION TECHNIQUES FOR MICROPHONES IN LOW SPEED WIND TUNNELS

AltiumLive 2017: Effective Methods for Advanced Routing

HB LEDs & OLEDs. Complete thin film process solutions

ECMF4-20A42N10. Common mode filter with ESD protection for high speed serial interface. Features. Applications. Description

MEMS Revolutionizes Sensor Landscape

Features. Applications

Basic Electronics Prof. Mahesh Patil Department of Electrical Engineering Indian Institute of Technology, Bombay

Lead free and RoHS package. High reduction of parasitic elements through integration Complies with IEC level 4 standards:

HSME-C400. Data Sheet. Side-Fire Mono-Color Surface-Mount ChipLED. Features. Description. Applications

Data Sheet. HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs. HSMx-C110/C120/C150/C170/ C177/C190/C191/C197/C265

Parts of dicing machines for scribing or scoring semiconductor wafers , , , , ,

Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis

Features. Applications R TOP VIEW

MKE 2 Gold. Instruction manual

Transcription:

DESIGNING MEMS MICROPHONES FROM CONCEPT TO FINISHED GDSII IN ABOUT TWO WEEKS A M S D E S I G N & V E R I F I C A T I O N C A S E S T U D Y w w w. m e n t o r. c o m

ABOUT THE MEMS MICROPHONE MARKET Knowles Corporation has been credited with boosting the MEMS market in 2003 with the first MEMS microphone. In a recent press release from the company, they announced a milestone of 8 billion units sold. So, by all accounts, they have been successful. In fact, they are the market leader for MEMS microphones. You most likely speak to your friends through a Knowles MEMS microphone in your smartphone. KNOWLES MEMS MICROPHONES Knowles MEMS microphones require creation and manipulation of complex geometry and integration of mask layout data with automated component assembly software. Knowles relies entirely on Tanner L-Edit for the complex geometries and manipulation of thousands of repeating elements at the heart of their MEMS designs. When you make audio transducers for more than 60 years, eventually you can design almost anything even a heat tolerant microphone that fits into electronic assembly flow like any other component. It s not easy, but Pete Loeppert, Vice President of R&D for the Knowles Acoustics Division, leads a team that figured out how to increase the high temperature survivability of microphones. This temperature robustness has played a key part in productizing their MEMS designs which provide significant revenue to his company. WHY A MEMS MICROPHONE? Since 1946, the parent company, Knowles Corporation, has specialized in microphones and receivers for hearing aids. The Knowles Acoustics division has built a new business around designing and manufacturing MEMS microphones used in mobile phones and consumer electronic devices, and is making inroads to the entire microphone market. The division s business revolves around its answer to a thorny electronic problem. Traditionally, microphone suppliers stack up individual components and assemble microphones one at a time. Most are cylindrical, about 6 mm in diameter by 1-2 mm high, and inexpensive enough to go into everything from phones to toys. The problem is that traditional microphones are heat sensitive, which precludes the use of lead-free solder and the option for surface mounting into circuits. So, most manufacturers of high volume products resort to some kind of offline task, such as hand assembly or a special insertion machine, at the end of the mainstream assembly line to get around the fact that the microphones won t tolerate high temperatures or reflow soldering. Knowles answer is the SiSonic MEMS microphone (see Figure 1), batch produced on silicon wafers and assembled like any IC, except for an air pocket that allows sound waves to vibrate the diaphragm. The SiSonic is re-flowable, so an assembler can place it on a circuit board with a chip shooter like any other component. Suddenly, microphones fit in with normal assembly flow. www.mentor.com 2

Designing MEMS Microphones from Concept to Finished GDSII Figure 1: SiSonic MEMS devices. THE WORLD OF TOROIDAL GEOMETRY Loeppert describes the difference in design paradigm: In MEMS there are no circuits per se, so we don t deal in schematic versus layout. MEMS in our group is all about drawing complex polygonal and curved structures. I used other high-end tools for years because we were doing circuit work in the background, but when the task is mainly to render complex geometries in these microphones, those tools have a lot of overhead, and they are awkward. Most of what we design and make is circular, based on tori toroidal elements and toroidal sections and there are almost no right angles in our designs (Figure 2). You ll find some circular symmetry, but most of the design looks like modern art. Figure 2: MEMS shapes. w w w. m e nto r. co m 3

High end EDA tools are better suited to Manhattan-style geometry and keeping things square, but everything we do in MEMS is circular. With L-Edit, I can go from concept to finished GDSII in about two weeks. There s never been anything as easy to use for this as Tanner tools. In the late 1990 s Knowles Acoustics moved entirely to L-Edit for MEMS design. In particular, Loeppert cites the flexibility of manipulating thousands of repeating elements through L-Edit s hierarchical architecture. Said Loeppert, L-Edit has saved me a great deal of time in creating all sorts of shapes that are parametrically driven. In fact, I always have my circles, pie wedges and tori instanced slightly differently in every layer, because I use them as primitives. I might have been able to do this in a tool like AutoCAD, but I d have wasted hours going back and forth between mechanical design and EDA tools. I want to create and analyze designs in one environment, then send them out for photomask fabrication. DESIGN MEETS SCRIPTING Loeppert s designs are not especially small the die size is about 1 mm but they are intricate, and drawings with 10-12 million objects are common. While MEMS design flow today does not lend itself to direct object generation through standardized libraries, L-Edit s scripting function makes creating and managing thousands of parametric objects extremely easy. High-end tools have highly specialized scripting languages, but users of Tanner tools can write scripts using ordinary C/C++ code. L-Edit s scripting function is very flexible and I use it often to create primitives with a one or two-page script, notes Loeppert. For example, in MEMS we often etch holes through our wafers and we cannot have die intersecting the edge of the wafer, so we need to array our die in a circular pattern. I start with an instance of a die and use L-Edit to make that into a rectangular array. Then I use a script that I have written to clip the rectangular array to fit within the wafer extents leaving a few millimeter exclusion zone around the edge. This is a big timesaver for us. Loeppert takes advantage of L-Edit s scripting function for other tasks as well, I have made mapping programs for die bonding pick-and-place equipment. The script goes through the database of cells in the layout and automatically generates a wafer map this is particularly important when working on a matrix design that has lots of different designs in it. I create the maps and assign different letters to different design styles, then tell the diebonding engineers to pick a particular letter out of the map. Being able to generate the map automatically saves an enormous amount of time. GETTING TO THE FAB Design Rule Checking (DRC) is also different in the world of MEMS because there are few set rules. Loeppert has to create his own rules, or work them out on the fly with the fab. The cross-sectioning tool in L-Edit helps with this because it allows Loeppert to visualize his designs in the third dimension of stacked layers. Loeppert exports to GDSII for handoff to his fabs. He notes two limitations peculiar to many GDSII tools and explains how L-Edit helps him get around them: First, the fab can have instances only at 90/180/270/360 - degrees, and when I rotate things, I don t always end up with these particular angles. I wrote a script for L-Edit that scans the database for any acute or obtuse angles and flushes them out for me. I ungroup each one, change it to be rectilinear, then later regroup it as it was originally. www.mentor.com 4

Also, L-Edit supports user-controllable fracturing of polygons. This allows me to set the limits for the various mask fabrication vendors. We ve never had a tool related problem. Even when we encounter limitations in our vendor s systems, L-Edit lets us easily overcome them. We have a very smooth interface with the fab. Figure 3 shows a fabricated MEMS microphone. Figure 3: a fabricated MEMS microphone. According to the Yole Développement Status of the MEMS Industry report for 2015, Knowles dominates the smartphone microphone market. This report also predicts future growth in wearable devices, voice-controlled home automation, medical devices, and automotive systems. L-Edit will be right there to help develop MEMS microphone designs for these future markets. For the latest product information, call us or visit: w w w. m e n t o r. c o m 2016 Mentor Graphics Corporation, all rights reserved. This document contains information that is proprietary to Mentor Graphics Corporation and may be duplicated in whole or in part by the original recipient for internal business purposes only, provided that this entire notice appears in all copies. In accepting this document, the recipient agrees to make every reasonable effort to prevent unauthorized use of this information. All trademarks mentioned in this document are the trademarks of their respective owners. MGC 4-16 TECH14190-w