Task 4.2 Liner/Socket for multichannel EMG recording (OBG (22), UMG-GOE (2), M01 - M24):

Similar documents
Digital Strobe Tuner. w/ On stage Display

ECG Demonstration Board

1. Publishable summary

Sharif University of Technology. SoC: Introduction

Optimizing BNC PCB Footprint Designs for Digital Video Equipment

SUBSYSTEMS FOR DATA ACQUISITION #39. Analog-to-Digital Converter (ADC) Function Card

Triple RTD. On-board Digital Signal Processor. Linearization RTDs 20 Hz averaged outputs 16-bit precision comparator function.

Getting Started with Launchpad and Grove Starter Kit. Franklin Cooper University Marketing Manager

Be a part of the circuit. Brick'R'knowledge. Set overview.

Re: ENSC 370 Project Physiological Signal Data Logger Functional Specifications

Introduction to Data Conversion and Processing

X820S Seismic / accelerometric digitizer channels - 24 bit

System Quality Indicators

Real Time Bio-signal Acquisition System

SWITCH: Microcontroller Touch-switch Design & Test (Part 2)

An Integrated EMG Data Acquisition System by Using Android app

High ResolutionCross Strip Anodes for Photon Counting detectors

C-MAX. CMM-9301-V3.1S Bluetooth 4.0 Single Mode HCI Module. Description. 1.1 Features

Software Analog Video Inputs

Organic light emitting diode (OLED) displays

Digital Effects Pedal Description Ross Jongeward 10 December 2014

Antenna system Status & progress report

The touchskin -technology has come of age. T E C H N I C A L R E P O R T Linz / Austria, November 2014

Saving time & money with JTAG

High Performance TFT LCD Driver ICs for Large-Size Displays

Avoiding False Pass or False Fail

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

STB Front Panel User s Guide

How to overcome/avoid High Frequency Effects on Debug Interfaces Trace Port Design Guidelines

In total 2 project plans are submitted. Deadline for Plan 1 is on at 23:59. The plan must contain the following information:

Preliminary Design Report. Remote Fencing Scoreboard Gator FenceBox

EMI/EMC diagnostic and debugging

Techniques for Extending Real-Time Oscilloscope Bandwidth

AI-1616L-LPE. Features. High-precision Analog input board (Low Profile size) for PCI Express AI-1616L-LPE 1. Ver.1.02 Ver.1.01

High Value-Added IT Display - Technical Development and Actual Products

VOB - data over Video Overlay Box

DMX 512 Language Date: Venerdì, febbraio 12:15:08 CET Topic: Educational Lighting Site

Features. = +25 C, IF= 100 MHz, LO= +15 dbm* Parameter Min. Typ. Max. Min. Typ. Max. Units

Why Use the Cypress PSoC?

Multiwell-MEA-System

Belden IBDN System 10GX The next level of cabling performance

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

AD9884A Evaluation Kit Documentation

DT9857E. Key Features: Dynamic Signal Analyzer for Sound and Vibration Analysis Expandable to 64 Channels

ADC Peripheral in Microcontrollers. Petr Cesak, Jan Fischer, Jaroslav Roztocil

A dedicated data acquisition system for ion velocity measurements of laser produced plasmas

Illumination Challenges in Non- Industrial Vision Applications. Simon Stanley Managing Director ProPhotonix IRL Ltd

User Guide EMG. This user guide has been created to educate and inform the reader about doing EMG measurements

PRO-ScalerHD2V HDMI to VGA & Audio Scaler Converter. User s Guide. Made in Taiwan

SiRX Single-Chip RF Front-End for Digital Satellite TV

DMC550 Technical Reference

Sensor Development for the imote2 Smart Sensor Platform

EVALUATION KIT AVAILABLE 12.5Gbps Settable Receive Equalizer +2.5V +3.3V V CC1 V CC. 30in OF FR-4 STRIPLINE OR MICROSTRIP TRANSMISSION LINE SDI+ SDI-

A 400MHz Direct Digital Synthesizer with the AD9912

RF4432F27 wireless transceiver module

1 Feb Grading WB PM Low power Wireless RF Transmitter for Photodiode Temperature Measurements

The performance of a lifetime. Owner s Manual MOON 110LP v2 Phono Preamplifier

DT8837. High Performance Ethernet Instrument Module for Sound & Vibration. Overview. Key Features

Vorne Industries. 87/719 Analog Input Module User's Manual Industrial Drive Itasca, IL (630) Telefax (630)

Real-time Chatter Compensation based on Embedded Sensing Device in Machine tools

Multi-Touch Resistive Touch Screens

LabView Exercises: Part II

Comparing Ethernet and SerDes in ADAS Applications

CUSSOU504A. Microphones. Week Two

Features. = +25 C, As a Function of LO Drive & Vdd. IF = 1 GHz LO = -4 dbm & Vdd = +4V

SingMai Electronics SM06. Advanced Composite Video Interface: HD-SDI to acvi converter module. User Manual. Revision 0.

A Guide to Selecting the Right EMG System

Features. Parameter Min. Typ. Max. Min. Typ. Max. Units

L11/12: Reconfigurable Logic Architectures

Signal Conditioners. Highlights. Battery powered. Line powered. Multi-purpose. Modular-style. Multi-channel. Charge & impedance converters

NanoCom ADS-B. Datasheet An ADS-B receiver for space applications

e'a&- A Fiber Optic Wind Vane: A Conceptual View (U)

The field cage for a large TPC prototype

MAXIM INTEGRATED PRODUCTS

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

The Haply Development Kit

WEB SERVER NETWORK FOR ECG RECORDING AND BODY TEMPERATURE MONITORING SYSTEM BASED ON ARM MICROCONTROLLER

2014 Product Catalog

7 DESIGN ASPECTS OF IoT PCB DESIGNS JOHN MCMILLAN, MENTOR GRAPHICS

A pixel chip for tracking in ALICE and particle identification in LHCb

L12: Reconfigurable Logic Architectures

The Telegärtner Group

Introduction: Overview. EECE 2510 Circuits and Signals: Biomedical Applications. ECG Circuit 2 Analog Filtering and A/D Conversion

DVI over Single CAT5 Series CV-117. DVI over Single CAT5 Direct Plug-in Extender. User Manual. Made in Taiwan

Design for Testability

CAN/LIN Measurements (Option AMS) for Agilent s InfiniiVision Series Oscilloscopes

6 GHz to 26 GHz, GaAs MMIC Fundamental Mixer HMC773A

Integrated Circuit for Musical Instrument Tuners

JTAGcable II In Circuit Emulator for Atmel AVR microcontrollers. User s Guide REV 1.0. Many ideas one solution

Results on 0.7% X0 thick Pixel Modules for the ATLAS Detector.

DESIGN OF A MEASUREMENT PLATFORM FOR COMMUNICATIONS SYSTEMS

ECG Adaptive Filtering

New Generation of MEA-Systems: MEA2100-System

EECS150 - Digital Design Lecture 2 - CMOS

Sensors for the CMS High Granularity Calorimeter

Driver circuit for MPPC

microenable IV AS1-PoCL Product Profile of microenable IV AS1-PoCL Datasheet microenable IV AS1-PoCL

110LP MOON Series. Phono Preamplifier. Owner s Manual

Interfacing the TLC5510 Analog-to-Digital Converter to the

Super-Doubler Device for Improved Classic Videogame Console Output

Transcription:

DELIVERABLE REPORT Project acronym: INPUT Project number: 687795 D4.2, Optimized prototype of electrode liner Dissemination type: DEM Dissemination level: PP Planned delivery date: 2018-04-30 Actual delivery date: 2018-04-15 Reporting Period: 2 WP4, Task 4.2, Liner/Socket for multichannel EMG recording, OBG 1 DESCRIPTION OF THE TASK Task 4.1 Electronics for EMG recording (OBG (24), M01 - M24): This task deals with the development of multichannel EMG amplifiers (circuit design, layout etc.) which are small enough to integrate them in a prosthetic system. One possibility could be that those amplifiers will be integrated in the distal end of a liner. It needs to be investigated how this could be done. The connection of the electronics will be a main topic here. Another important work will be the development of shielding concepts, as the separation of electronics from electrodes could lead to a system which is more prone to electromagnetic interferences and cable movement artefacts. This includes noise sources such as power line noise, cell phones or electronic anti-theft devices. E.g. active shielding of the cables has been applied successfully in preliminary tests to reduce the influence of power line noise. This work is based on an already existing desktop amplifier which was developed to record EMG from dry electrodes in the EU funded project AMYO. Task 4.2 Liner/Socket for multichannel EMG recording (OBG (22), UMG-GOE (2), M01 - M24): A new liner/socket interface for EMG recording will be developed. Focus is on the combination of conductive and nonconductive materials. Experience showed that this is a critical point to record high quality EMG which is not prone to artefacts such as electrostatic noise Conductive polymers to have a consistent liner/socket surface to the skin will be investigated. One key is to find a polymer which does not tend to movement artefacts Moreover the likelihood of lift offs will be decreased by exploring special shape and/or flexibility of electrode material and new socket designs. Task 4.3 Design validation and iterative development (OBG (34), M06 - M48): All activities in this work package will be carried out according to an iterative, agile research and development process. This task was specifically introduced with a run time over almost the entire project duration to reflect this agile development, while keeping the other Tasks of this WP focused and concise. Already starting with the first design concepts and mock-ups we will integrate orthopaedic technicians and end-users (amputees) into the process in order to understand their needs. 17/04/2018 16:35:00 1/10

The evaluations comprise laboratory as well as clinical tests and the results will continuously guide the development progression of the electrode liner/socket interface. 2 DESCRIPTION OF DELIVERABLE The goal is to improve the quality of the electrode liner prototype. The robustness, signal quality and production of the electrode liner is the focus in this reporting period. 3 IMPLEMENTATION OF WORK In Deliverable 4.1 the first prototype of the developed electrode liner was presented. The electrode liner material selection, the manufacturing process and electronics development was shown. For the integration of the new system in the prosthesis it is necessary to improve the size of the electronics, robustness of the hardware and components like wires and connection. 3.1 ELECTRONICS AND SOFTWARE APPLICATION The project has focused on an analog front-end designed by Texas Instrument, the ADS1298, and a MSP430 Texas Instruments microcontroller. There are three versions of the electronic system: a monopolar desktop amplifier with 16 channels, a bipolar desktop amplifier with 8 channels, and a bipolar portable system based on pogo pins (dubbed PogoBoard). The signals acquired with these electronic systems are sent to a personal computer (PC) for further signal analysis. Three applications can be run on the PC: 1) a Debugging Tool that tests the signals obtained by the acquisition boards, 2) software for EMG signal analysis and processing called DynDOF, which uses a DataLab plugin, and 3) a Patient Training Tool used for pattern recognition, which connects to the acquisition boards using a specific library. Both the plugin and the library are written in C# and are based on the basic code generated for the Debugging Tool. Software packages 2) and 3) were already available in the consortium and are used for signal acquisition with the liner. Tools 1) and 3) can further be used to connect the acquired EMG data with the recognition system developed in WP 6. Figure 1 shows the structure of the EMG acquisition system and the signal analysis system used for the INPUT project. 17/04/2018 16:35:00 2/10

Figure 1: Structure of the EMG acquisition and signal analysis systems developed for INPUT project. The EMG acquisition system has two embedded software versions, one for the desktop amplifiers (monopolar and bipolar) and another one for the PogoBoard. In the PC, three different applications are available, which require their own specific C# code. ADS1298 analogue front-end Main characteristics of the analog front-end An analog front-end (AFE) is an integrated circuit composed of analog signal conditioning circuitry. They usually contain operational amplifiers, filters and analog-to-digital converters (ADC) to interface sensors with antennas or microcontrollers. One of the leading AFEs in the market is the ADS1298 from Texas Instruments. It is a 24-bit, 8 channel AFE, which includes independent programmable amplifiers, a high speed delta-sigma ADC, and configurable modules such as temperature and lead-off sensors. A simplified schematic of the AFE is shown in 2. 17/04/2018 16:35:00 3/10

Figure 2: Simplified schematic of the analogue front-end ADS1298 from Texas Instruments. The integrated circuit includes independent programmable amplifiers for 8 bipolar channels, a 24-bit delta-sigma analogue-to-digital converter (ADC), internal reference, on board The ADS1298 has two different packaging options: a 64-pin TQFP (dimensions: 12 12 mm) and a 64-pin NFBGA (dimensions: 8 8 mm). All the inputs of the AFE have an electromagnetic interference filter (EMI) with a cutoff filter of 3 MHz. Every channel has a programmable gain amplifier with seven possible gains: 1, 2, 3, 4, 6, 8, and 12. Additionally, the ADS1298 includes a Serial Peripheral Interface bus (SPI) to send or receive data to/from other devices. The AFE can be used in two different operating modes: high-resolution (HR) and low-power (LP). These modes define the sampling rate of the modulator used in the delta-sigma ADC. It also includes decimation filters that provide antialiasing filtering. Figure 3: Electrode liner cuff for able bodied subjects and wireless EMG amplifier. Figure 3 shows the first version of a miniaturized EMG amplifier board. However further improvements were necessary. This version was still too big to integrate it completely in a prosthetic socket. Moreover, it was found that the introduced liner/electronic interface was not robust enough for 17/04/2018 16:35:00 4/10

stable signal acquisition. Therefore, a new iteration of the electrode liner interface and the electronics itself was necessary based on the findings made with the first miniaturized version. IMPROVEMENTS IN ELECTRONICS The first system had some disadvantages in size and connection. The integration of the electronics in the in experimental prosthesis for study application was difficult. Therefore, the system was redesigned to its current size and connection method. The new approach is to use a sandwich plan. The electronic board was divided into the liner PCB, amplifier PCB and communication PCB. The liner PCB is integrated into the liner itself and connects to the wires and electrodes. The signal amplification is connected directly on the liner PCB. The communication board with Bluetooth interface communicates with the different end devices like a prosthetic hand or a computer. The dimensions got reduced from 50x103mm down to 30x30mm. The production of the electronic components is in progress and will be integrated in the next possible prototypes. a b communication PCB amplifier PCB liner PCB contact c d Figure 4: a: electrode liner mold with electronic stack located on the distal sided end of the liner, b: shows the cross section of the electronic stack with its components, c and d show the stacked PCB setup in the software during design process. 17/04/2018 16:35:00 5/10

3.2 FABRICATION IN DIFFERENT STANDARDIZED SIZES WITH SCALABLE MOLD While the first prototypes had high signal to noise ratios and good signal qualities, they lacked in equal liner wall thickness, high production time and the manufacturing inaccuracy. To improve the further signal processing it is necessary to avoid signal artefacts caused by fabrication problems. The focus has therefore been set on the prefabrication of the electrodes/wires, electronic integration and a scalable mold. The new fabrication process improves the following methods: Equal quality in liner thickness 1 Reliable quality in production process due to the development of fabrication tools Robust electrode integration Electrode - silicone - wire interface Silicone - wire - electronic interface Production time Size adaptation because of scalable moulds Figure 5 shows the first improved production process. For this process a 3D printed mould was designed and built. Figure 5a shows the sided adapter and the CAD mold design. The sided adapter placed on the inside of the mold and gets injected by polymer (Figure 5b). Figure 5 c and d show the removing of the outer mold. The coating of the liner with conductive fabric is shown in Figure. 5e. 1 Measured with digital caliper 17/04/2018 16:35:00 6/10

a b c d e Figure 5: a: a sided adapter with the new electrode liner injection mold, b: injection process with polymer material, c/d: mold removing, e: shows the coating of the liner with conductive fabric. Mold improvements The focus of further standardization and better reproducibility of the production process has been set on inter component connections such as electrode/electronics to wire connections and electrode placement. The presented liner mold in Figure 6 improves the electrode placement and reduces the production steps. Figure 6: The inner liner core covered with silicone (red), inserted in the outer mold with an inner layer of silicone. The inner layer of silicone has electrode positioning spots and wire dummies for the wire application in the polyurethane material. Electrode fabrication 17/04/2018 16:35:00 7/10

The manufacturing of multi-material electrodes is shown in Figure 7. The conductive fabric is put in the mold and held in place by a second mold. The upper mold part is filled with the conductive silicone and is pressed into the fabric to achieve a good connection. The centre of each electrode has a connection to snap contacts on (see also Figure 8). Figure 7: The electrode pre fabrication mold (left), final produced electrode (right) Wire production The previous prototypes used self-extruded and coated silicone wires. The bottleneck of this approach is the interface between the electrode wires and sided connector. Elongation and mechanical stress act on the electrode liner and could cause a wire defect. Therefore a new principle was used, eliminating the extrusion process. Instead, a thin plate of silicone is placed in a laser cutter to cut out the wires. A further improvement is the design of the electrode attachment. A ring was integrated to use it like a snap on connector on the electrodes. Figure 8 below shows the components and the connection of the components Figure 8: improved wire and wire/electrode interface 17/04/2018 16:35:00 8/10

3.3 RESULTS The new electrode liner preforms robustly providing high quality EMG signals. In the review meeting in October 2017 in Luxembourg a working prototype was demonstrated. The measurements showed the signal quality and artefact proneness of the state of the art material silicone in comparison to the in INPUT developed prototype based on polyurethane. a b Signal quality of silicone liner Signal quality of new polyurethane liner c d Large artefacts while touching the surface of the silicone liner Less artefacts while touching the surface of the polyurethane liner Figure 9: Improvements of signal quality and artefact robustness. Comparison of silicone (a&c) to polyurethane (b&d) electrode liner 3.4 BIOCOMPATIBILITY OF MATERIALS: Conductive silicone The conductive silicone was tested in 2009 by Fresenius Institute (Report number: 1554493-01, 23.12.2009). The results of the epicutaneous test showed not noticeable changes of the skin condition in 50 subjects over 48 hours. The cytotoxicity test was also performed by Qualis institute for level 2 (direct skin contact). (Report number: 0911.2312, 01.12.09) Silver fabric The Agitex silver coated fabric is for example used in shoe insoles for diabetic patients. Tests provided by a supplier showed germicidal effects on staphylococci, escheritia coli and pseudomonas aeruginosa. Cytotoxicity tests are currently in progress. 17/04/2018 16:35:00 9/10

Pulyurethane with cvd (Parylene N) coating Polyurethane liners have been used for many years in prosthetic liner treatments. Therefore, no renewed biocompatibility tests were performed with the material for INPUT. Long term tests Accelerating mechanical aging tests are planned and in preparation. This will be a don and doffing simulation. For this application a test machine will be adapted. Moreover we will conduct extended tests in a target population group. Preparation for the ethical approval is in progress. 3.5 FUTURE WORK COMPRISES AS FOLLOWS: Future work will focus on design validation and iterative development, which will be done within task 4.3. Next steps include: Finalizing the new sandwich hardware shown in figure 5 including the embedded software Implementation of the improved production process Biocompatibility tests Accelerating mechanical aging test (don and doffing simulation) Additionally, the second half of the INPUT project focuses on extensive patient tests which will be conducted together with the project partners. The following studies are currently planned, in which the new liners will be used: OSS (ADL studies, comparison of control methods) UMCG (20 patients control state of the art vs. INPUT) IDSIA (able bodied testing for development) ICL (model validation measurements) OBG (10 Patients long term test) Based on the obtained results, OBG will further improve the electrode liner, according to our iterative approach. 4 SUBCONTRACTING All work was done by Ottobock and we didn t have any subcontract within Work Package 4. 17/04/2018 16:35:00 10/10