VG5761, VG5661 VD5761, VD5661 Data brief

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VG5761, VG5661 VD5761, VD5661 Data brief Automotive 1.6-2.3 megapixel high-dynamic global shutter image sensor Features Product summary Root part number Resolution (megapixel) Package VG5661 1.6 IM2BGA 8.5 x 8.5 mm VG5761 2.3 IM2BGA 10.0 x 8.5 mm VD5661 1.6 VD5761 2.3 Product label Bare die AEC-Q100 grade 2 automotive qualification ongoing Automotive global shutter with high-dynamic technology range (up to 98 db linear) and high-density charge storage 3.2 µm pixel GS-HDR, monochrome, visible, and IR spectrum Optical formats 1.6 MP (1464 x1104) at 75 fps in 1/3 optical format with micro lens 2.3 MP (1944 x1204) at 60 fps in 1/2.5 optical format with micro lens Very high MTF, even in near IR (perfect pixel encapsulation) Low noise 11-bit ADC with digital CDS Linear or compressed output from RAW8 to RAW16 resolution Output interface Mipi CSI-2 (4 x 0.8 Gbps) Parallel 12 bits (100 MHz) Camera control interface (CCI) Machine vision application support In-pixel HDR and background substration modes, with flexible strobe illumination control Up to 4-LED control output, synchronized with sensor integration periods 8 regions of interest (ROI) Programmable sequences of 4-frame contexts Master/slave external frame start control Embedded 16-bit video processing pipe with pixel defect correction, high dynamic range (HDR) merge with ghost removal, and programmable compression of dynamic Mirror/flip/crop Support of subsampling by 2 and by 4 Support of binning by 2 and by 4 Integrated double temperature sensors Operating junction temperature of -40 C to 125 C Automotive qualified IM2BGA plastic package Large spectrum glass for visible and IR applications with dual AR coating ASIL B support e.g. CPU redundancy, embedded full self test, memory and register ECC, safety manager, and voltage monitoring Monochrome micro lens (maximum CRA optimized for 20 C and 0 C) Description This automotive global shutter sensor product family features both HDR and ultra low-noise where crosstalk is minimized for near infrared (NIR) scenes. They are highly recommended for high-end computer vision applications in demanding environments. DB3776 - Rev 3 - November 2018 For further information contact your local STMicroelectronics sales office. www.st.com

Block diagram 1 Block diagram Figure 1. Block diagram of Vx5y61 DB3776 - Rev 3 page 2/5

Ordering information 2 Ordering information Table 1. Order codes Order code Resolution Packages Maximum CRA optimization VG5661AAL5/1 1.6 megapixel monochrome IM2BGA 8.5 x 8.5 mm VG5761AALJ/1 2.3 megapixel monochrome IM2BGA 10.0 x 8.5 mm VD5661AA/RW 1.6 megapixel monochrome Bare die VD5761AA/RW 2.3 megapixel monochrome 20 linear DB3776 - Rev 3 page 3/5

Revision history Table 2. Document revision history Date Version Changes 19-Nov-2018 1 Initial release 21-Nov-2018 2 Updated the main document title to include all root part numbers 27-Nov-2018 Added sustainability logo Updated Section Description DB3776 - Rev 3 page 4/5

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2018 STMicroelectronics All rights reserved DB3776 - Rev 3 page 5/5