Produc Daa Shee Spec No.: DS35-2016-0088 Effecive Dae: 10/12/2016 Revision: - LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Opoelecronics No.90,Chien 1 Road, Chung Ho, New Taipei Ciy 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 hp://www.lieon.com/opo
1. Descripion s from Lie-On are available in miniaure sizes and special configuraions for auomaed PC board assembly and space-sensiive applicaions. These s are suiable for use in a wide variey of afermarke. 1.1 Feaures Mee ROHS Package in 8mm ape on 7" diameer reels Precondiioning: accelerae o JEDEC level 3 EIA STD package I.C. compaible Compaible wih auomaic placemen equipmen Compaible wih infrared reflow solder process 1.2 Applicaions Afermarke: accessory applicaions, 2. Package Dimensions Par No. Lens Color Source Color Waer clear AlInGaP Red Noes: 1. All dimensions are in millimeers. 2. Tolerance is ±0.2 mm (.008") unless oherwise noed. 3. ANODE lead frame is hea sink of LED. 1/12 Par No. :
3. Raing and Characerisics 3.1 Absolue Maximum Raings a Ta=25 C Parameer Uni Power Dissipaion 530 mw Peak Forward Curren (1/10 Duy Cycle, 0.1ms Pulse Widh) 1000 ma DC Forward Curren 200 ma Operaing Temperaure Range -40 C o +110 C Sorage Temperaure Range -40 C o + 110 C Infrared Soldering Condiion 260 C For 10 Seconds 3.2 Thermal Characerisics Parameer Symbol TYP. MAX. Uni Thermal Resisance (Juncion Ambien) Noe Rh JA 50 - C /W Thermal Resisance (Juncion Solder Poin) Noe Rh JS 30 - C /W Juncion Temperaure T J - 115 C Noe: Rh JA Measuremen Condiion Subsrae: FR4 (=1.6mm) / Paern Size: 16mm 2 2/12 Par No. :
3.3 Sugges IR Reflow Condiion for Pb Free Process: IR-Reflow Soldering Profile for lead free soldering (Acc. o J-STD-020) 3/12 Par No. :
3.4 Elecrical / Opical Characerisics a Ta=25 C Parameer Symbol Par No. LTSA- Min. Typ. Max. Uni Tes Condiion Luminous Inensiy IV G6SPVEKT 3.55-9.0 cd IF = 140mA Noe 1 Viewing Angle 2 1/2 G6SPVEKT - 120 - deg Noe 2 (Fig.5) Peak Emission Wavelengh P G6SPVEKT - 631 - nm Dominan Wavelengh d G6SPVEKT 620-629 nm Measuremen @Peak (Fig.1) IF = 140mA Noe 3 Specral Line Half-Widh G6SPVEKT - 18 - nm Forward Volage VF G6SPVEKT 1.9-2.65 V Reverse Curren IR G6SPVEKT - 10 μa IF = 140mA Noe 4 VR =5V Noe 5 Noes: 1. Luminous inensiy is measured wih a ligh sensor and filer combinaion ha approximaes he CIE eye-response curve 2. 1/2 is he off-axis angle a which he luminous inensiy is half he axial luminous inensiy. 3. The dominan wavelengh, λd is derived from he CIE chromaiciy diagram and represens he single wavelengh which defines he color of he device. Dominae Wavelengh Tolerance is +/- 1nm. 4. Forward Volage Tolerance is +/- 0.1 vol. 5. Reverse volage (VR) condiion is applied o IR es only. The device is no designed for reverse operaion. 4/12 Par No. :
4. Bin Rank Bach Descripion on Label: Vf / Iv /Wd (Ex. G/DA/1) Vf Rank Forward Volage (Vf) Uni : V @140mA Bin Code Min. Max. C 1.90 2.05 D 2.05 2.20 E 2.20 2.35 F 2.35 2.50 G 2.50 2.65 Tolerance on each Volage bin is +/-0.1V IV Rank Luminous Inensiy (Iv) Uni : cd @140mA Bin Code Min. Max. CB 3.55 4.5 DA 4.5 5.6 DB 5.6 7.1 EA 7.1 9.0 Tolerance on each Inensiy bin is +/-11% Wd Rank Dominan Wavelengh (Wd) Uni : nm @140mA Bin Code Min. Max. 1 620 629 Tolerance for each Dominae Wavelengh bin is +/- 1nm 5/12 Par No. :
5. Typical Elecrical / Opical Characerisics Curves. 25 C Ambien Temperaure Unless Special Noed) Fig. 2 SPATIAL DISTRIBUTION 6/12 Par No. :
6. User Guide 6.1 Cleaning Do no use unspecified chemical liquid o clean LED hey could harm he package. If cleaning is necessary, immerse he LED in ehyl alcohol or isopropyl alcohol a normal emperaure for less han one minue. 6.2 Recommend Prined Circui Board Aachmen Pad Infrared Reflow Soldering 6.3 Package Dimensions of Tape And Reel Noe: 1. All dimensions are in millimeers. 7/12 Par No. :
6.4 Package Dimensions of Reel Noes: 1. Empy componen pockes sealed wih op cover ape. 2. 7 inch reel 1000 pieces per reel. 3. The maximum number of consecuive missing lamps is wo. 4. In accordance wih ANSI/EIA 481 specificaions. 8/12 Par No. :
7. Cauions 7.1 Applicaion The LEDs described here are inended o be used for ordinary elecronic equipmen (such as office equipmen, communicaion equipmen and household applicaions).consul Lieon s Sales in advance for informaion on applicaions in which excepional reliabiliy is required, paricularly when he failure or malfuncion of he LEDs may direcly jeopardize life or healh (such as in aviaion, ransporaion, raffic conrol equipmen, medical and life suppor sysems and safey devices). 7.2 Sorage The package is sealed: The LEDs should be sored a 30 C or less and 70%RH or less. And he LEDs are limied o use wihin one year, while he LEDs is packed in moisure-proof package wih he desiccans inside. The package is opened: The sorage ambien for he LEDs should no exceed 30 C emperaure and 60% relaive humidiy. I is recommended ha LEDs ou of heir original packaging are IR-reflowed wihin 168hrs. For exended sorage ou of heir original packaging, i is recommended ha he LEDs be sored in a sealed conainer wih appropriae desiccan, or in a desiccaors wih nirogen ambien. LEDs sored ou of heir original packaging for more han 168hrs should be baked a abou 60 C for a leas 48 hours before solder assembly. 7.3 Cleaning Use alcohol-based cleaning solvens such as isopropyl alcohol o clean he LED if necessary. 7.4 Soldering Recommended soldering condiions: Reflow soldering Soldering iron Pre-hea Pre-hea ime Peak emperaure Soldering ime 150~200 C 120 sec. Max. 260 C Max. 10 sec. Max.(Max. wo imes) Temperaure Soldering ime 300 C Max. 3 sec. Max. (one ime only) Noes: Because differen board designs use differen number and ypes of devices, solder pases, reflow ovens, and circui boards, no single emperaure profile works for all possible combinaions. However, you can successfully moun your packages o he PCB by following he proper guidelines and PCB-specific characerizaion. LITE-ON Runs boh componen-level verificaion using in-house KYRAMX98 reflow chambers and board-level assembly. The resuls of his esing are verified hrough pos-reflow reliabiliy esing.profiles used a LITE-ON are based on JEDEC sandards o ensure ha all packages can be successfully and reliably surface mouned. Figure on page3 shows a sample emperaure profile complian o JEDEC sandards. You can use his example as a generic arge o se up your reflow process. You should adhere o he JEDEC profile limis as well as specificaions and recommendaions from he solder pase manufacurer o avoid damaging he device and creae a reliable solder join. 9/12 Par No. :
7.5 Drive Mehod A LED is a curren-operaed device. In order o ensure inensiy uniformiy on muliple LEDs conneced in parallel in an applicaion, i is recommended ha a curren limiing resisor be incorporaed in he drive circui, in series wih each LED as shown in Circui A below. Circui model A Circui model B LED LED (A) Recommended circui. (B) The brighness of each LED migh appear differen due o he differences in he I-V characerisics of hose LEDs. 7.6 ESD (Elecrosaic Discharge) Saic Elecriciy or power surge will damage he LED. Suggesions o preven ESD damage: Use of a conducive wris band or ani-elecrosaic glove when handling hese LEDs. All devices, equipmen, and machinery mus be properly grounded. Work ables, sorage racks, ec. should be properly grounded. Use ion blower o neuralize he saic charge which migh have buil up on surface of he LED s plasic lens as a resul of fricion beween LEDs during sorage and handling. ESD-damaged LEDs will exhibi abnormal characerisics such as high reverse leakage curren, low forward volage, or no lighup a low currens. To verify for ESD damage, check for lighup and Vf of he suspec LEDs a low currens. The Vf of good LEDs should be >2.0V@0.1mA for InGaN produc and >1.4V@0.1mA for AlInGaP produc. 10/12 Par No. :
8. Reliabiliy Tes 8.1 Tes Iem/Condiion: No. Tes iem Tes condiion Reference sandard MSL 3 1 Pre-condiioning 2 3 High Temperaure Forward Bias (HTFB) High Temperaure Forward Bias (HTFB) 125, 24 hrs baking Moisure Soak 60 /60% 52 hrs Inerval: 15mins ~ 4 hours o do IR-Reflow Ta=70 ± 2 C IF: 200 ma 1000 hrs Ta=110 ± 2 C IF: 50mA 1000 hrs JESD22 A-113 (101) (101) 4 Low Temperaure Operaing Life Ta=-40 ± 2 C IF=200mA 1000 hrs (101) 5 High Temperaure Sorage Ta=110 ± 2 C 1000 hrs (201) 6 Low Temperaure Sorage Ta=-40 ± 2 C 1000 hrs (202) 7 8 High Temperaure High Humidiy Bias (HTHHB) Thermal Shock (air o air) 9 Temperaure Cycle (TC) Ta=60, Rh=90% IF=200mA 1000 hrs -40 ± 5 ~ 100 ± 5 30min 300cycles 30min -40 C ~ 25 C ~100 C ~ 25 C 30 min 5 min 30 min 5 min 300 cycles (102) EIAJ ED-4701/300 (307) (105) 10 Resisance o Solder Tsld=260 C, 10sec. 3imes Hea JESD22A-111 11 Solderabiliy Tsld = 245± 5 C, 5sec, Leas-free Solder J-STD-002 JESD22B102 11/12 Par No. :
9. Ohers The appearance and specificaions of he produc may be modified for improvemen wihou prior noice. 10. Suggesed Checking Lis Training and Cerificaion 1. Everyone working in a saic-safe area is ESD-cerified? 2. Training records kep and re-cerificaion daes moniored? Saic-Safe Worksaion & Work Areas 1. Saic-safe worksaion or work-areas have ESD signs? 2. All surfaces and objecs a all saic-safe worksaion and wihin 1 f measure less han 100V? 3. All ionizer acivaed, posiioned owards he unis? 4. Each work surface mas grounding is good? Personnel Grounding 1. Every person (including visiors) handling ESD sensiive (ESDS) iems wears wris srap, heel srap or conducive shoes wih conducive flooring? 2. If conducive foowear used, conducive flooring also presen where operaor sand or walk? 3. Garmens, hairs or anyhing closer han 1 f o ESD iems measure less han 100V*? 4. Every wris srap or heel srap/conducive shoes checked daily and resul recorded for all DLs? 5. All wris srap or heel srap checkers calibraion up o dae? Noe: *50V for InGaN LED. Device Handling 1. Every ESDS iems idenified by EIA-471 labels on iem or packaging? 2. All ESDS iems compleely inside properly closed saic-shielding conainers when no a saic-safe worksaion? 3. No saic charge generaors (e.g. plasics) inside shielding conainers wih ESDS iems? 4. All flexible conducive and dissipaive package maerials inspeced before reuse or recycles? Ohers 1. Audi resul repored o eniy ESD conrol coordinaor? 2. Correcive acion from previous audis compleed? 3. Are audi records complee and on file? 12/12 Par No. :