BAL-NRF01D3. 50 ohm balun transformer for 2G45 ISM matched Nordic s chipset: nrf24le1 QFN32, nrf24ap2-1ch and nrf24ap2-8ch. Features.

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Transcription:

50 ohm balun transformer for 2G45 ISM matched Nordic s chipset: nrf24le1 QFN32, nrf24ap2-1ch and nrf24ap2-8ch Features 50 nominal input / conjugate match to nrf24le1 QFN32, nrf24ap2-1ch and nrf24ap2-8ch Low insertion loss Low amplitude imbalance Datasheet production data Low phase imbalance Small footprint: < 1.5 mm 2 Benefits Lead-free Flip-Chip package 5 bumps Very low profile: < 595 µm after reflow High RF performance RF BOM and area reduction Applications Figure 1. Pinout diagram (top view) 1 2 3 2.45 GHz impedance matched balun filter A DIFF GND Optimized for Nordic's Chipset nrf24le1/ap2 Description STMicroelectronics is an ultraminiature balun. The integrates matching network and harmonics filter. Matching impedance has been customized for the following Nordic Semiconductor circuits: nrf24le1 QFN-32 pins, nrf24ap2-1ch and nrf24ap2-8ch. The uses STMicroelectronics IPD technology on non conductive glass substrate which optimize RF performances. The has been tested and approved by Nordic Semiconductor in their nrf2723 nrfgo module. B C DIFF VCC SE October 2012 Doc ID 023215 Rev 1 1/8 This is information on a product in full production. www.st.com 8

Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values) Symbol Parameter Value Min. Typ. Max. Unit P IN Input Power RFIN 20 dbm V ESD ESD ratings MIL STD883C (HBM: C = 100 pf, R = 1.5 k, air discharge) 2000 ESD ratings charge device model (JESD22-C101-C) 500 ESD ratings machine model (MM: C = 200 pf, R = 25, L = 500 nh) 200 T OP Operating temperature -40 +85 C V Table 2. Impedances (T amb = 25 C) Symbol Parameter Value Min. Typ. Max. Unit Z OUT Nominal differential output impedance conjugate match to nrf24le1/ap2 Z IN Nominal input impedance 50 Table 3. RF performance (T amb = 25 C) Symbol Parameter Test condition Value Min. Typ. Max. Unit F Frequency range (bandwidth) 2400 2540 MHz I L Insertion loss in bandwidth 2.25 db R L Return loss in bandwidth 10 db imb Phase imbalance 3 Aimb Amplitude imbalance 0.1 db 2f0 2nd harmonic filtering 4880 MHz 10 db 3f0 3rd harmonic filtering 7320 MHz 20 db 2/8 Doc ID 023215 Rev 1

Characteristics 1.1 On-board simulations Figure 2. Insertion loss (T amb = 25 C) Figure 3. Return loss @ single port (T amb = 25 C) 0 5 10 15 Transmission (db) -5-7.5-10 Return loss on SE port (db) 20-12.5 25 30-15 0 1 2 3 4 5 6 7 8 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 4. Amplitude imbalance (T amb = 25 C) Figure 5. Phase imbalance (T amb = 25 C) -20-25 -30-35 -40 Return Loss on DIFF port (db) -45 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 0.5 0.4 0.3 0.2 0.1 0.0-0.1-0.2-0.3 Amplitude imbalance (db) -0.4-0.5 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 6. Transmission (T amb = 25 C) 10 8 6 4 2 0-2 -4-6 -8 Phase imbalance (deg) 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Doc ID 023215 Rev 1 3/8

Application information 2 Application information Figure 7. Application schematic (courtesy of Nordic Semiconductor Figure 8. Application board (courtesy of Nordic Semiconductor) 4/8 Doc ID 023215 Rev 1

Package information 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 9. Package dimensions (bump side view) 630 µm ± 60 600 µm 400 µm 500 µm GND DIFF 1010 ± 50 µm SE 500 µm VCC DIFF 433 µm 205 µm 1475 ± 50µm Figure 10. Footprint Figure 11. Marking Copper pad diameter: 220 µm recommended 260 µm maximum Solder stencil opening: 220 µm recommended Solder mask opening: 300 µm minimum Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode x y x w z w Doc ID 023215 Rev 1 5/8

Package information Figure 12. Flip Chip tape and reel specifications Dot identifying Pin A1 location 0.22 2.0 4.0 Ø 1.55 8.0 ST xxz yww ST xxz yww 1.75 ST xxz yww 1.57 3.5 0.71 1.1 4.0 All dimensions are typical values in mm User direction of unreeling Note: More information is available in the STMicroelectronics Application notes: AN2348 Flip-Chip: Package description and recommendations for use AN4111: matched balun with integrated harmonic filter for Nordic nrf24le1 QFN32, nrf24ap2-1ch and nrf24ap2-8ch 6/8 Doc ID 023215 Rev 1

Ordering information 4 Ordering information Table 4. Ordering information Order code Marking Weight Base Qty Delivery mode SC 1.82 mg 5000 Tape and Reel 5 Revision history Table 5. Document revision history Date Revision Changes 15-Oct-2012 1 Initial release. Doc ID 023215 Rev 1 7/8

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