Ruggedized Quad SAS/SATA Redriver/Equalizer with Extended Operating Temperature

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General Description The quad-channel redriver is designed to redrive two full lanes of SAS or SATA signals up to 6.GT/s (gigatransfers per second) and operates from a single +3.3V supply. The features independent input equalization and output preemphasis. It enhances signal integrity at the receiver by equalizing the signal at the input and establishing preemphasis at the output of the device. SAS and SATA OOB (out-of-band) signaling is supported using high-speed amplitude detection on the inputs and squelch on the corresponding outputs. Inputs and outputs are all internally 5Ω terminated and must be AC-coupled to the SAS/SATA controller IC and SAS/SATA device. The is available in a small 42-pin, 3.5mm x 9mm, TQFN package with flow-through traces for ease of layout. This device is specified over the -4 C to +85 C extended operating temperature range. Applications Industrial/Embedded PCs Computer on Modules Carrier Boards Test Equipment Rack Server Industrial PCs Medical Equipment Pin Configuration Benefits and Features High Performance Solution Designed to Overcome Lossy Channels 3dB of Independent (per Channel) Selectable Input EQ and Output Preemphasis Compensates up to 3in of Channel Losses with Deterministic Jitter: 23ps P-P (max); Random Jitter: 1.8ps RMS (max) 8dB (typ) of Return Loss Up to 3.GHz Designed to Reliably Operate in Harsh Environments Industrial Temperature Rated: -4 C to +85 C ±2.5kV Human Body Model (HBM) ESD Protection on All Pins Housed in a Flow-Through (42-Pin, 3.5mm x 9.mm) TQFN Package or Resistance to Vibration/ Shocks Ease of Design and Layout Single 3.3V Operation Internal Input/Output 5Ω Termination Resistors Ordering Information appears at end of data sheet. For related parts and recommended products to use with this part, refer to www.maximintegrated.com/.related. TOP VIEW ENB VCC OUT1BP OUT1BM INBP INBM VCC OUTAP OUTAM IN1AP IN1AM VCC MODEA 38 37 36 35 34 33 32 31 3 29 28 27 26 25 24 23 22 EQB PEB EQ1B PE1B 39 4 41 42 *EP 21 2 19 18 PE1A EQ1A PEA EQA 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 MODEB VCC IN1BP IN1BM OUTBP OUTBM VCC INAP INAM OUT1AP OUT1AM TQFN-EP VCC ENA *CONNECT EXPOSED PAD (EP) TO. 19-6647; Rev ; 3/13

Absolute Maximum Ratings (Voltages referenced to.)...-.3v to +4.V All Other Pins... -.3V to ( +.3V) Continuous Current (PE_, EQ_, MODE_)...±15mA Peak Current (for 1kHz, 1% duty cycle) (IN, OUT )...±1mA Continuous Power Dissipation (T A = +7 C) TQFN (derate 35.7mW/ C above +7 C)...2857mW Operating Temperature Range... -4 C to +85 C Storage Temperature Range...-55 C to +15 C Junction Temperature...+15 C Lead Temperature (soldering, 1s)...+3 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TQFN Junction-to-Case Thermal Resistance (θ JC )...2 C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics Junction-to-Ambient Thermal Resistance (θ JA )...28 C/W ( = +3.V to +3.6V, C COUPLE = 12nF, R L = 5Ω, T A = -4 C to +85 C, unless otherwise noted. Typical values are at = +3.3V, T A = +25 C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Power-Supply Range 3. 3.6 V EQ_ = PE_ = 28 35 Operating Supply Current I CC EQ_ = PE_ = 35 44 ma Standby Supply Current I STBY EN_ = 32 4 ma Input Termination R RX-SE Single-ended to 42.5 57.5 Ω Output Termination R TX-SE Single-ended to 42.5 57.5 Ω AC PERFORMANCE Differential Input Return Loss (Note 3) S DD11.1GHz f.3ghz.3ghz f 3.GHz -1-7.9 db 3.GHz f 6.GHz Common-Mode Input Return Loss (Note 3) S CC11.3GHz f 3.GHz -5 db.1ghz f.3ghz -6 3.GHz f 6.GHz Differential Output Return Loss (Note 3) S DD22.3GHz f 3.GHz -7.9 db.1ghz f.3ghz -1 3.GHz f 6.GHz Common-Mode Output Return Loss (Note 3) S CC22.3GHz f 3.GHz -4 db.1ghz f.3ghz -6 3.GHz f 6.GHz SAS 1.5, 3., or 6.GT/s, MODE_ = 275 1 Differential Input Voltage V IN-DIFF SATA 1.5, 3., or 6.GT/s, MODE_ = 225 1 mv P-P Input Equalization EQ EQ_ = (Note 4) 3 db Differential Output Voltage V OUT-DIFF f = 75MHz, PE_ = 75 1 mv P-P Output Preemphasis PE PE_ =, Figure 1 3 db www.maximintegrated.com Maxim Integrated 2

Electrical Characteristics (continued) ( = +3.V to +3.6V, C COUPLE = 12nF, R L = 5Ω, T A = -4 C to +85 C, unless otherwise noted. Typical values are at = +3.3V, T A = +25 C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Propagation Delay t PD PE_ = EQ_ = 3 ps Output Transition Time T TX-RF PE_ =, 2% to 8% 3 ps Differential Output Skew Same Pair T SK 1 ps Deterministic Jitter T DJ K28.5 pattern, 6.GT/s, PE_ = EQ_ = (Note 3) 23 ps P-P Random Jitter T RJ D1.2 pattern, 6.GT/s, PE_ = EQ_ = 1.8 ps RMS MODE_ =, f =.75GHz 12 22 OOB Squelch Threshold V SQ-DIFF MODE_ =, f =.75GHz 75 mv P-P OOB Squelch Entry Time T OOB,SQ f =.75GHz (Note 3) 5 ns OOB Exit Time T OOB,EX f =.75GHz (Note 3) 9 ns OOB Differential Offset Delta V OOB,DIFF Difference between OOB and active-mode output offset -5 +5 mv OOB Common-Mode Offset Delta V OOB,CM Difference between OOB and active-mode output common-mode voltage -3 +3 mv OOB Output Disable V OOB,OUT OOB disabled output level 3 mv P-P CONTROL LOGIC INPUTS Input Logic-High V IH 1.4 V Input Logic-Low V IL.6 V Input Logic Hysteresis V HYST 75 mv Input Leakage Current I IN = 3.3V, V IN =.5V or 1.5V -5 +5 µa Note 2: All devices are 1% production tested at T A = +85 C. All temperature limits are guaranteed by design. Note 3: Guaranteed by design. Note 4: EQ (input equalization) as employed in this device refers to the equivalent of adding preemphasis before the input. For example, input EQ of 3dB would show the same waveform as output PE of 3dB (see Figure 1). Timing Diagram V LOW_PP V HIGH_PP V PE(dB) = 2log [( HIGH_PP V LOW_PP )] Figure 1. Output Preemphasis www.maximintegrated.com Maxim Integrated 3

Typical Operating Characteristics ( = +3.3V, T A = +25 C, all eye diagrams measured using K28.5 pattern.) V IN = 275mV P-P, 1.5Gbps, PE =, EQ = toc1 V IN = 275mV P-P, 3Gbps, PE =, EQ = toc2 V IN = 275mV P-P, 6Gbps, PE =, EQ = toc3 - - - - - - - - ps/div - -1 1ps/div 1 - -1-5 5ps/div 5 1 8 V IN = 275mV P-P, 1.5Gbps, PE = 1, EQ = toc4 8 V IN = 275mV P-P, 3Gbps, PE = 1, EQ = toc5 - - - - - - -8 - - ps/div -8 - -1 1ps/div 1 8 V IN = 275mV P-P, 6Gbps, PE = 1, EQ = MAX4952 toc6 V IN = 1mV P-P, 1.5Gbps, PE =, EQ = toc7 - - - - - -8-1 -5 5ps/div 5 1 - - - ps/div www.maximintegrated.com Maxim Integrated 4

Typical Operating Characteristics (continued) ( = +3.3V, T A = +25 C, all eye diagrams measured using K28.5 pattern.) V IN = 1mV P-P, 3Gbps, PE =, EQ = toc8 V IN = 1mV P-P, 6Gbps, PE =, EQ = toc9 V IN = 1mV P-P, 1.5Gbps, PE = 1, EQ = toc1 8 - - - - - - - - - -1 1ps/div 1 - -1-5 5ps/div 5 1-8 - - ps/div 8 V IN = 1mV P-P, 3Gbps, PE = 1, EQ = toc11 8 V IN = 1mV P-P, 6Gbps, PE = 1, EQ = toc12 - - - - - - -8 - -1 1ps/div 1-8 -1-5 5ps/div 5 1 V IN = 5mV P-P WITH 2in FR4 STRIPLINE, 3GT/s, PE =, EQ = toc13 V IN = 5mV P-P WITH 2in FR4 STRIPLINE, 6GT/s, PE =, EQ = toc14 - - - - - - -3 - -1 1 3 1ps/div -15-1 -5 5 1 15 5ps/div www.maximintegrated.com Maxim Integrated 5

Typical Operating Characteristics (continued) ( = +3.3V, T A = +25 C, all eye diagrams measured using K28.5 pattern.) V IN = 5mV P-P WITH 2in FR4 STRIPLINE, 3GT/s, PE =, EQ = 1 toc15 V IN = 5mV P-P WITtH 2in FR4 STRIPLINE, 6GT/s, PE =, EQ = 1 toc16 - - - - - - -3 - -1 1 3 1ps/div V IN = 275mV P-P, 3GT/s, PE =, EQ =, OUTPUT AFTER 2in FR4 STRIPLINE toc17-15 -1-5 5 1 15 5ps/div V IN = 275mV P-P, 6GT/s, PE =, EQ =, OUTPUT AFTER 2in FR4 STRIPLINE toc18 EYE DIAGRAM VOLTAGE (1mV/div) 5 3 1-1 - -3 - -5 EYE DIAGRAM VOLTAGE (1mV/div) 5 3 1-1 - -3 - -5-3 - -1 1 3 1ps/div V IN = 275mV P-P, 3GT/s, PE = 1, EQ =, OUTPUT AFTER 2in FR4 STRIPLINE toc19-15 -1-5 5 1 15 5ps/div V IN = 275mV P-P, 6GT/s, PE = 1, EQ =, OUTPUT AFTER 2in FR4 STRIPLINE toc2 EYE DIAGRAM VOLTAGE (1mV/div) 5 3 1-1 - -3 - -5 EYE DIAGRAM VOLTAGE (1mV/div) 5 3 1-1 - -3 - -5-3 - -1 1 3 1ps/div -15-1 -5 5 1 15 5ps/div www.maximintegrated.com Maxim Integrated 6

Pin Description PIN NAME FUNCTION 1 MODEB OOB Threshold Logic Input B. MODEB is internally pulled down. 2, 9, 16, 23, 3, 37 Positive Supply Voltage Input. Bypass to with 2.2µF and.1µf capacitors in parallel as close as possible to the device, recommended on each pin. 3, 6, 12, 15, 24, 27, 33, 36 Ground 4 IN1BP Noninverting Input 1B 5 IN1BM Inverting Input 1B 7 OUTBP Noninverting Output B 8 OUTBM Inverting Output B 1 INAP Noninverting Input A 11 INAM Inverting Input A 13 OUT1AP Noninverting Output 1A 14 OUT1AM Inverting Output 1A 17 ENA Active-High Enable Input A. Drive ENA low to put A channels in standby mode. Drive ENA high to put A channels in normal operation. ENA is internally pulled down. 18 EQA Channel A Input Equalizer Logic Input. EQA is internally pulled down. 19 PEA Channel A Output Preemphasis Logic Input. PEA is internally pulled down. 2 EQ1A Channel 1A Input Equalizer Logic Input. EQ1A is internally pulled down. 21 PE1A Channel 1A Output Preemphasis Logic Input. PE1A is internally pulled down. 22 MODEA OOB Threshold Logic Input A. MODEA is internally pulled down. 25 IN1AM Inverting Input 1A 26 IN1AP Noninverting Input 1A 28 OUTAM Inverting Output A 29 OUTAP Noninverting Output A 31 INBM Inverting Input B 32 INBP Noninverting Input B 34 OUT1BM Inverting Output 1B 35 OUT1BP Noninverting Output 1B 38 ENB Active-High Enable Input B. Drive ENB low to put B channels in standby mode. Drive ENB high to put B channels in normal operation. ENB is internally pulled down. 39 EQB Channel B Input Equalizer Logic Input. EQB is internally pulled down. 4 PEB Channel B Output Preemphasis Logic Input. PEB is internally pulled down. 41 EQ1B Channel 1B Input Equalizer Logic Input. EQ1B is internally pulled down. 42 PE1B Channel 1B Output Preemphasis Logic Input. PE1B is internally pulled down. EP Exposed Pad. Internally connected to. EP must be electrically connected to a ground plane for proper thermal and electrical operation. Do not use EP as the sole ground connection. www.maximintegrated.com Maxim Integrated 7

Functional Diagram PE1B EQ1B PEB EQB MODEB CONTROL LOGIC ENB 5Ω 5Ω 5Ω 5Ω IN1BP IN1BM OUT1BP OUT1BM 5Ω 5Ω 5Ω 5Ω OUTBP OUTBM INBP INBM 5Ω 5Ω 5Ω 5Ω INAP INAM OUTAP OUTAM 5Ω 5Ω 5Ω 5Ω OUT1AP OUT1AM IN1AP IN1AM ENA CONTROL LOGIC MODEA EQA PEA EQ1A PE1A www.maximintegrated.com Maxim Integrated 8

Typical Application Circuit SAS/SATA HDD MIDPLANE MAINBOARD SAS CONTROLLER SAS/SATA HDD 18in SAS CABLES 2in BOARD TRACES CONNECTORS 8in BOARD TRACES www.maximintegrated.com Maxim Integrated 9

Detailed Description The consists of four identical redrivers with input equalization and output preemphasis useful for SAS or SATA signals up to 6.GT/s. Input/Output Terminations Inputs and outputs are internally 5Ω terminated to (see the Functional Diagram) and must be AC-coupled using 12nF (max) capacitors to the SAS/SATA controller IC and SAS/SATA device for proper operation. Enable Inputs (ENA, ENB) The features two active-high enable inputs (ENA, ENB). ENA and ENB have internal pulldown resistors of 7kΩ (typ). When ENA or ENB is driven low or left unconnected, the A or B channels enter low-power standby mode and the redrivers are disabled. Drive ENA or ENB high to place channel A or B in normal operation (see Table 1). Out-of-Band Threshold Selector (MODEA, MODEB) The provides full OOB signal support through high-speed amplitude detection circuitry. OOB differential input signals less than the internal OOB threshold (V SQ-DIFF ) are detected as off and not passed to the output. This prevents the system from responding to unwanted noise. OOB differential input signals higher than VSQ-DIFF are detected as on and passed to the output, allowing OOB signals to transmit through the. The logic level of the MODE inputs sets V SQ-DIFF for either SAS or SATA OOB signals (see Table 2). MODEA and MODEB have internal pulldown resistors of 7kΩ (typ). Table 1. Enable Inputs (ENA, ENB) ENA ENB CHANNEL 1A CHANNEL A CHANNEL 1B CHANNEL B STANDBY STANDBY STANDBY STANDBY 1 STANDBY STANDBY ENABLED ENABLED 1 ENABLED ENABLED STANDBY STANDBY 1 1 ENABLED ENABLED ENABLED ENABLED Table 2. Out-of-Band Logic Threshold (MODEA, MODEB) MODEA MODEB CHANNEL 1A CHANNEL A CHANNEL 1B CHANNEL B SAS SAS SAS SAS 1 SAS SAS SATA SATA 1 SATA SATA SAS SAS 1 1 SATA SATA SATA SATA www.maximintegrated.com Maxim Integrated 1

Input Equalization (EQA, EQ1A, EQB, EQ1B) The features control logic inputs (EQA, EQ1A, EQB, EQ1B) to enable input equalization on each channel, providing 3dB of boost (see Note 4 in the Electrical Characteristics table). Drive EQ_ high to enable input equalization. Drive EQ_ low to disable input equalization (see Table 3). EQA, EQ1A, EQB, and EQ1B have internal pulldown resistors of 7kΩ (typ). Output Preemphasis (PEA, PE1A, PEB, PE1B) The features control logic inputs (PEA, PE1A, PEB, PE1B) to enable output preemphasis on either channel, providing 3dB of boost. The true preemphasis, the transition signal, is increased after a changing bit, thus increasing the total energy content of the signal when employed. Drive PE_ high to enable output preemphasis. Drive PE_ low to disable output preemphasis (see Table 4). PEA, PE1A, PEB, and PE1B have internal pulldown resistors of 7kΩ (typ). Table 3. Input Equalization (EQ_, EQ1_) EQ1_ EQ_ CHANNEL 1_ (db) CHANNEL _ (db) 1 3 (typ) 1 3 (typ) 1 1 3 (typ) 3 (typ) Table 4. Output Preemphasis (PE_, PE1_) PE1_ PE_ CHANNEL 1_ (db) CHANNEL _ (db) 1 3 (typ) 1 3 (typ) 1 1 3 (typ) 3 (typ) Applications Information Exposed Pad Package The exposed pad, 42-pin TQFN package incorporates features that provide a very low thermal resistance path for heat removal from the IC. The exposed pad on the must be soldered to for proper thermal and electrical performance. For more information on exposed paddle packages, refer to Maxim Application Note HFAN-8.1: Thermal Considerations of QFN and Other Exposed-Paddle Packages. Layout Use controlled-impedance transmission lines to interface with high-speed inputs and outputs of the. Place 2.2µF and.1µf power-supply bypass capacitors as close as possible to, recommended on each pin. Power-Supply Sequencing Caution: Do not exceed the absolute maximum ratings because stresses beyond the listed ratings can cause permanent damage to the device. Proper power-supply sequencing is recommended for all devices. Always apply before applying signals, especially if the signal is not current limited. Ordering Information PART PIN-PACKAGE TEMP RANGE ETO+ 42 TQFN-EP* -4 C to +85 C +Denotes a lead(pb)-free/rohs-compliant package. *EP = Exposed pad. Chip Information PROCESS: BiCMOS Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 42 TQFN-EP T42359M+1 21-181 9-79 www.maximintegrated.com Maxim Integrated 11

Revision History REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 3/13 Initial release For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated s website at www.maximintegrated.com. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. 213 Maxim Integrated Products, Inc. 12