HSMx-C1/C177/C197/C265 High Performance Chip LEDs Data Sheet Description These chip type LEDs utilize Aluminium Indium Galium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 65 nm Orange, 626 nm Red and 639 nm Deep Red. All packages are binned by both color and intensity, except for red and deep red color. These ChipLEDs come either in low profile top emitting packages (HSMx-C177/C197), in a side emitting package (HSMx-C1) or in a reverse mount package (HSMx-C265). The right angle ChipLED is suitable for applications such as LCD back lighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. The reverse mount ChipLED is suitable for space saving. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4 units per reel for HSMx-C1/C177/C197 and units per reel for HSMx-C265. These packages are compatible with IR soldering process. Features High brightness AlInGaP material 85 or 63 industry standard footprint with.4 mm height for top emitting packages Also available in right angle emitting and reverse mounting packages Diffused optics Operating temperature range of C to +85 C Compatible with IR soldering Available in 4 colors Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications Membrane switch indicator LCD backlighting Push button backlighting Front panel indicator Symbol backlighting Keypad backlighting Microdisplays Small message panel signage Device Selection Guide Dimensions (mm) [1,2] Amber Red Orange Deep Red Package Description 1.6 x 1. x.6 HSMA-C1 HSMC-C1 HSML-C1 Untinted, Non-diffused 2. x 5 x.4 HSMA-C177 HSMC-C177 HSML-C177 HSMT-C177 Untinted, Diffused 1.6 x.8 x.4 HSMA-C197 HSMC-C197 HSML-C197 HSMT-C197 Untinted, Diffused 3.4 x 5 x 1.1 HSMA-C265 HSMC-C265 HSML-C265 HSMT-C265 Untinted, Non-diffused CAUTION: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMT-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions CATHODE MARK 5 (.49) CATHODE MARK 2. (.79) DIFFUSED EPOXY.4 (.16) POLARITY.8 (.31) 1.6 (.63) POLARITY DIFFUSED EPOXY.4 (.16) PC BOARD.16 (.6) CATHODE LINE.4 ±.15 (.16 ±.6).4 ±.15 (.16 ±.6) PC BOARD CATHODE LINE. ±.15 (.12 ±.6).16 (.6) 1. (.43) MIN..7 (.28) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C177 HSMx-C197 LED DIE 3.4 (.134) CATHODE MARK (ETCHED) LED DIE 3.4 (.134) CATHODE MARK (ETCHED) 5 (.49) 5 (.49) GREEN SOLDER MASK GREEN SOLDER MASK POLARITY POLARITY UNDIFFUSED EPOXY (.47) UNDIFFUSED EPOXY (.47) 1.1 (.43) 1.1 (.43) 1.1 (.43) 1.1 (.43) PC BOARD PC BOARD.3 (.12).3 (.12) CATHODE LINE CATHODE LINE.5 ±.15 (. ±.6).5 ±.15 (. ±.6).5 ±.15 (. ±.6).5 ±.15 (. ±.6) SOLDERING TERMINAL HSMx-C265 SOLDERING TERMINAL HSMx-C265 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. 2
Absolute Maximum Ratings at T A = 25 C Parameter HSMx-Cxxx Units DC Forward Current [1] 25 ma Peak Pulsing Current [2] ma Power Dissipation 6 mw Reverse Voltage (I R = µa) 5 V LED Junction Temperature 95 C Operating Temperature Range to +85 C Storage Temperature Range 4 to +85 C Soldering Temperature See reflow soldering profile (Figures 8 & 9) Notes: 1. Derate linearly as shown in Figure 4. 2. Pulse condition of 1/ duty and.1 ms width. Electrical Characteristics at T A = 25 C Part Number Forward Voltage V F (Volts) @ I F = ma Reverse Breakdown V R (Volts) @ I R = µa Capacitance C (pf), V F =, f = 1 MHz Typ. Max. Min. Typ. Typ. HSMA-C1 1.9 2.4 5 11 4 HSMA-C177/197 1.9 2.4 5 11 HSMA-C265 1.9 2.4 5 11 55 HSMC-C1 1.9 2.4 5 15 4 HSMC-C177/197 1.9 2.4 5 15 HSMC-C265 1.9 2.4 5 15 55 HSML-C1 1.9 2.4 5 4 HSML-C177/197 1.9 2.4 5 HSML-C265 1.9 2.4 5 55 HSMT-C177/197 1.9 2.4 5 15 HSMT-C265 1.9 2.4 5 15 55 V F Tolerance: ±.1 V Thermal Resistance Rθ J PIN ( C/W) 3
Optical Characteristics at T A = 25 C Part Number Color Luminous Intensity I V (mcd) @ ma [1] Color, Peak Wavelength λ peak (nm) Dominant Wavelength λ d [2] (nm) Viewing Angle 2 θ 1/2 Degrees [3] Min. Typ. Typ. Typ. Typ. Typ. HSMA-C1 Amber 28.5 9 595 592 155 48 HSMA-C177/197 Amber 28.5 9 595 592 1 48 HSMA-C265 Amber 28.5 75 595 592 15 48 HSMC-C1 Red 28.5 9 637 626 155 155 HSMC-C177/197 Red 28.5 9 637 626 1 155 HSMC-C265 Red 28.5 75 637 626 15 155 HSML-C1 Orange 28.5 9 69 65 155 37 HSML-C177/197 Orange 28.5 9 69 65 1 37 HSML-C265 Orange 28.5 75 69 65 15 37 HSMT-C177/197 Deep Red 1 66 639 1 7 HSMT-C265 Deep Red 1 25 66 639 15 7 Luminous Efficacy η V (lm/w) Notes: 1. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λ d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4
Color Bin Limits Orange Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 597. 6. B 6. 63. C 63. 66. D 66. 69. E 69. 612. F 612. 615. Tolerance: ± 1 nm Amber Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 582. 584.5 B 584.5 587. C 587. 589.5 D 589.5 592. E 592. 594.5 F 594.5 597. Tolerance: ± 1 nm Red Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. - 6. 635. Tolerance: ±1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Bin ID Min. Max. A.11.18 B.18.29 C.29.45 D.45.72 E.72 1. F 1. 1.8 G 1.8 2.8 H 2.8 4.5 J 4.5 7. K 7. L 18. M 18. 28.5 N 28.5 45. P 45. 71.5 Q 71.5 112.5 R 112.5 18. S 18. 285. T 285. 45. U 45. 715. V 715. 1125. W 1125. 18. X 18. 285. Y 285. 45. Tolerance: ± 15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits. 5
RELATIVE INTENSITY % 9 8 7 6 5 4 AS AMBER AS ORANGE 5 55 6 65 7 WAVELENGTH nm AS RED AS DEEP RED I F FORWARD CURRENT ma AS AlInGaP 1 1.5 1.6 1.7 1.8 1.9 2. 2.1 2.2 2.3 V F FORWARD VOLTAGE V LUMINOUS INTENSITY (NORMALIZED AT ma) 1.4 1..8.6.4.2 AS AMBER AS ORANGE, RED and DEEP RED 5 15 25 I F FORWARD CURRENT ma Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. I F MAX MAXIMUM FORWARD CURRENT ma 25 15 5 HSMx-C1/177/197 HSMx-C265 4 5 6 7 8 9 T A AMBIENT TEMPERATURE C RELATIVE INTENSITY 9 8 7 6 5 4-9 -8-7 -6-5 -4 - - - 4 5 6 7 8 9 ANGLE Figure 4. Maximum forward current vs. ambient temperature. RELATIVE INTENSITY 9 8 7 6 5 4-9 -8-7 -6-5 -4 - - - 4 5 6 7 8 9 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C1. 6
RELATIVE INTENSITY % 9 8 7 6 5 4-9 -8-7 -6-5 -4 - - - 4 5 6 7 8 9 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C177/197. 9 RELATIVE INTENSITY % 8 7 6 5 4-9 -8-7 -6-5 -4 - - - 4 5 6 7 8 9 TEMPERATURE 14-16 C SEC. MAX. 2 C MAX. 4 C/SEC. MAX. OVER 2 MIN. 4 C/SEC. MAX. 3 C/SEC. MAX. ANGLE TIME Figure 7. Relative intensity vs. angle for HSMx-C265. Figure 8. Recommended reflow soldering profile. CENTERING BOARD to SEC. (.47) TEMPERATURE 217 C C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6-1 SEC. 6 C/SEC. MAX. SEC. MAX. (.47).9 (.35) (.47) Figure. Recommended soldering pattern for HSMx-C177. TIME (Acc. to J-STD-C) CENTERING BOARD.8 (.31) Figure 9. Recommended Pb-free reflow soldering profile..8 (.31).7 (.28).8 (.31) NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 11. Recommended soldering pattern for HSMx-C197. 7
.4 (.16).4 (.16) 2.2 (.87) DIA. PCB HOLE.15 (.6).8 (.31) (.47).8 (.31).7 (.28) CENTERING BOARD 1.4 (.55) 2.3 (.91) 1.4 (.55) 5 (.49) Figure 12. Recommended soldering pattern for HSMx-C1. Figure 13. Recommended soldering pattern for HSMx-C265. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. 8. ± 1. (.315 ±.39) Ø 13.1 ±.5 (Ø.516 ±.).5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.) Ø. MIN. (Ø.795 MIN.) 178.4 ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.) 6 PS 5. ±.5 (.197 ±.) Figure 15. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 8
4. (.157) 1.5 (.59) CATHODE DIM. C. ±.5 (.8 ±.2) 1.75 (.69) DIM. A 3.5 ±.5 (.138 ±.2) 8. ±. (.315 ±.12) HSMx-C1 POSITION IN CARRIER TAPE DIM. A DIM. B 2. ±.5 (.79 ±.2) 4. (.157) USER FEED DIRECTION PART NUMBER HSMx-C1 SERIES HSMx-C177 SERIES HSMx-C197 SERIES COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±. (.4) 1.9 (.75) 2. (.91) 1.75 (.69) DIM. B ±. (.4) 1.15 (.45) 1.4 (.55).95 (.37) CARRIER TAPE DIM. C ±. (.4).75 (.).6 (.24).6 (.24) DIM. B HSMx-C1 R.5 ±.5 (. ±.2) 4. (.157) 1.5 (.59) CATHODE DIM. C. ±.5 (.8 ±.2) 1.75 (.69) DIM. A 3.5 ±.5 (.138 ±.2) 8. ±. (.315 ±.12) DIM. B 2. ±.5 (.79 ±.2) 4. (.157) PART NUMBER USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±. (.4) DIM. B ±. (.4) COVER TAPE DIM. C ±. (.4) HSMx-C265 SERIES 3.7 (.146) 1.45 (.57) 1. (.51) CARRIER TAPE Figure 16. Tape dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. 9
END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 6, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS Figure 17. Tape leader and trailer dimensions. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 2 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to C @ 6% RH max. Baking is required under the condition: a) Humidity Indicator Card is >% when read at 23 ± 5 C b) Device exposed to factory conditions < C/6% RH more than 672 hours. Baking recommended condition: 6 ± 5 C for hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 5-8 Avago Technologies Limited. All rights reserved. Obsoletes AV1-5EN AV2-975EN - April 14, 8