BAS70 series; PS7xSB70 series Rev. 08 4 May 006 Product data sheet. Product profile. General description in small Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number Package Configuration Philips JEITA PS76SB70 SOD SC-76 single diode PS79SB70 SOD5 SC-79 single diode BAS70 SOT - single diode BAS70H SODF - single diode BAS70L SOD88 - single diode BAS70W SOT SC-70 single diode BAS70-04 SOT - dual series BAS70-04W SOT SC-70 dual series BAS70-05 SOT - dual common cathode BAS70-05W SOT SC-70 dual common cathode BAS70-06 SOT - dual common anode BAS70-06W SOT SC-70 dual common anode BAS70-07 SOT4B - dual isolated BAS70-07S SOT6 SC-88 dual isolated BAS70-07V SOT666 - dual isolated BAS70VV SOT666 - triple isolated BAS70XY SOT6 SC-88 quadruple; series. Features High switching speed High breakdown voltage Low leakage current Low capacitance. Applications Ultra high-speed switching Voltage clamping
.4 Quick reference data Table. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode I F forward current - - 70 ma V F forward voltage I F =ma [] - - 40 mv V R reverse voltage - - 70 V [] Pulse test: t p 00 µs; δ 0.0.. Pinning information Table. Pinning Pin Description Simplified outline Symbol BAS70H; PS76SB70; PS79SB70 cathode [] anode sym00 00aab540 BAS70L cathode [] anode sym00 Transparent top view BAS70; BAS70W anode not connected cathode n.c. 006aaa46 006aaa44 BAS70-04; BAS70-04W anode (diode ) cathode (diode ) cathode (diode ), anode (diode ) 006aaa44 006aaa47 BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 of 0
Table. Pinning continued Pin Description Simplified outline Symbol BAS70-05; BAS70-05W anode (diode ) anode (diode ) cathode (diode ), cathode (diode ) 006aaa44 006aaa48 BAS70-06; BAS70-06W cathode (diode ) cathode (diode ) anode (diode ), anode (diode ) 006aaa44 006aaa49 BAS70-07 cathode (diode ) cathode (diode ) 4 4 anode (diode ) 4 anode (diode ) 006aaa44 BAS70-07S; BAS70-07V anode (diode ) not connected cathode (diode ) 4 anode (diode ) 5 not connected 6 cathode (diode ) 6 5 4 00aab555 6 5 4 006aaa440 BAS70VV anode (diode ) anode (diode ) anode (diode ) 4 cathode (diode ) 5 cathode (diode ) 6 cathode (diode ) 6 5 4 6 5 4 sym046 BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 of 0
Table.. Ordering information Pinning continued Pin Description Simplified outline Symbol BAS70XY anode (diode ) cathode (diode ) anode (diode ), cathode (diode 4) 4 anode (diode 4) 5 cathode (diode ) 6 cathode (diode ), anode (diode ) [] The marking bar indicates the cathode. 6 5 4 6 5 4 006aaa56 Table 4. Type number Ordering information Package Name Description Version PS76SB70 SC-76 plastic surface-mounted package; leads SOD PS79SB70 SC-79 plastic surface-mounted package; leads SOD5 BAS70 - plastic surface-mounted package; leads SOT BAS70H - plastic surface-mounted package; leads SODF BAS70L - leadless ultra small plastic package; terminals; SOD88 body.0 0.6 0.5 mm BAS70W SC-70 plastic surface-mounted package; leads SOT BAS70-04 - plastic surface-mounted package; leads SOT BAS70-04W SC-70 plastic surface-mounted package; leads SOT BAS70-05 - plastic surface-mounted package; leads SOT BAS70-05W SC-70 plastic surface-mounted package; leads SOT BAS70-06 - plastic surface-mounted package; leads SOT BAS70-06W SC-70 plastic surface-mounted package; leads SOT BAS70-07 - plastic surface-mounted package; 4 leads SOT4B BAS70-07S SC-88 plastic surface-mounted package; 6 leads SOT6 BAS70-07V - plastic surface-mounted package; 6 leads SOT666 BAS70VV - plastic surface-mounted package; 6 leads SOT666 BAS70XY SC-88 plastic surface-mounted package; 6 leads SOT6 BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 4 of 0
4. Marking 5. Limiting values Table 5. Marking codes Type number Marking code [] Type number Marking code [] PS76SB70 S BAS70-05W 75* PS79SB70 G BAS70-06 76* BAS70 7* BAS70-06W 76* BAS70H AH BAS70-07 77* BAS70L S8 BAS70-07S 77* BAS70W 7* BAS70-07V 77 BAS70-04 74* BAS70VV N BAS70-04W 74* BAS70XY 70* BAS70-05 75* - - [] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 604). Symbol Parameter Conditions Min Max Unit Per diode V R reverse voltage - 70 V I F forward current - 70 ma I FRM repetitive peak forward t p s;δ 0.5-70 ma current I FSM non-repetitive peak forward t p 0 ms [] - 00 ma current T j junction temperature - 50 C T amb ambient temperature 65 +50 C T stg storage temperature 65 +50 C [] T j =5 C prior to surge. BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 5 of 0
6. Thermal characteristics Table 7. 7. Characteristics Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per device R th(j-a) thermal resistance from junction to ambient in free air [] R th(j-sp) SOT - - 500 K/W SOT4B - - 500 K/W SOT6 (BAS70-07S) - - 46 K/W SOT666 (BAS70VV) [] - - 700 K/W SOT666 (BAS70-07V) [] - - 46 K/W SODF [] - - 0 K/W SOD - - 450 K/W SOD5 [] - - 450 K/W SOD88 [] - - 500 K/W SOT - - 65 K/W thermal resistance from junction to solder point SOT6 (BAS70XY) [] - - 60 K/W [] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [] Reflow soldering is the only recommended soldering method. [] Soldering point at pins,, 5 and 6. Table 8. Characteristics T amb =5 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode V F forward voltage [] I F = ma - - 40 mv I F = 0 ma - - 750 mv I F =5mA - - V I R reverse current V R = 50 V - - 00 na V R =70V - - 0 µa C d diode capacitance V R = 0 V; f = MHz - - pf [] Pulse test: t p 00 µs; δ 0.0. BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 6 of 0
0 mra80 0 mra805 I F (ma) 0 I R (µa) 0 () () 0 0 0 () () () () (4) Fig. 0 0 0. 0.4 0.6 0.8 V F (V) () T amb = 5 C () T amb =85 C () T amb =5 C (4) T amb = 40 C Forward current as a function of forward voltage; typical values Fig. 0 0 0 40 60 80 V R (V) () T amb = 5 C () T amb =85 C () T amb =5 C Reverse current as a function of reverse voltage; typical values 0 mra80 mra804 r dif (Ω) 0 C d (pf).5 0 0.5 0 0 I F (ma) 0 0 0 0 40 60 80 V R (V) f = 0 khz T amb =5 C; f = MHz Fig. Differential forward resistance as a function of forward current; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 7 of 0
8. Package outline.5.5. 0.8 0.85 0.75 0.65 0.58 0.45 0.5.7..8.6.65.55.5.5 0.40 0.5 0.5 0.0 0.4 0.6 0.7 0. 0--7 0-- Fig 5. Package outline SOD (SC-76) Fig 6. Package outline SOD5 (SC-79).0.8. 0.9.7.5..0.5..4. 0.45 0.5.6.4.7.5 0.55 0.5.9 0.48 0.8 0.5 0.09 0.70 0.55 0.5 0.0 04--04 04--9 Fig 7. Package outline SOT (TO-6AB) Fig 8. Package outline SODF 0.6 0.55 0.50 0.46..8. 0.8 0.0 0. 0.45 0.5 0.65.0 0.95..0.5.5 0.0 0. 0.55 0.47 cathode marking on top side. 0.4 0. 0.5 0.0 0-04-7 04--04 Fig 9. Package outline SOD88 Fig 0. Package outline SOT (SC-70) BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 8 of 0
4.0.8.9. 0.9..8 6 5 4 0.45 0.5. 0.8.5..4. 0.45 0.5..0.5.5 pin index 0.88 0.78.7 0.48 0.8 0.5 0.09 0. 0.65 0.. 0.5 0.0 04--6 04--08 Fig. Package outline SOT4B Fig. Package outline SOT6 (SC-88).7.5 0.6 0.5 6 5 4.7.5.. pin index 0. 0. 0.5 0.7 0.7 0.8 0.08 04--08 Fig. Package outline SOT666 BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 9 of 0
9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the NC ordering code. [] Type number Package Description Packing quantity 000 4000 8000 0000 PS76SB70 SOD 4 mm pitch, 8 mm tape and reel -5 - - -5 PS79SB70 SOD5 mm pitch, 8 mm tape and reel - - -5-4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70H SODF 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70L SOD88 mm pitch, 8 mm tape and reel - - - -5 BAS70W SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70-04 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70-04W SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70-05 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70-05W SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70-06 SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70-06W SOT 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70-07 SOT4B 4 mm pitch, 8 mm tape and reel -5 - - -5 BAS70-07S SOT6 4 mm pitch, 8 mm tape and reel; T [] -5 - - -5 4 mm pitch, 8 mm tape and reel; T [] -5 - - -65 BAS70-07V SOT666 mm pitch, 8 mm tape and reel - - -5-4 mm pitch, 8 mm tape and reel - -5 - - BAS70VV SOT666 mm pitch, 8 mm tape and reel - - -5-4 mm pitch, 8 mm tape and reel - -5 - - BAS70XY SOT6 4 mm pitch, 8 mm tape and reel; T [] -5 - - -5 4 mm pitch, 8 mm tape and reel; T [] -5 - - -65 [] For further information and the availability of packing methods, see Section. [] T: normal taping [] T: reverse taping BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 0 of 0
0. Soldering.05.80.0.60.65 0.95 0.50 0.60 0.50 ( ) msa4 solder paste Fig 4. Reflow soldering footprint SOD (SC-76) 5.00 4.40.40.75.0 MSA45 preferred transport direction during soldering Fig 5. Wave soldering footprint SOD (SC-76).5 solder paste.0 0.50 0.60.80.90 0.0 0.40 MGS4 Reflow soldering is the only recommended soldering method. Fig 6. Reflow soldering footprint SOD5 (SC-79) BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 of 0
.90.50 0.85.00.0.70 0.85 0.60 (x) solder paste 0.50 (x) 0.60 (x).00.0 MSA49 Fig 7. Reflow soldering footprint SOT (TO-6AB).40.0 (x) 4.60 4.00.0 preferred transport direction during soldering.80 4.50 MSA47 Fig 8. Wave soldering footprint SOT (TO-6AB) BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 of 0
4.4 4.9.6..6.. solder paste. ( ) Reflow soldering is the only recommended soldering method. Fig 9. Reflow soldering footprint SODF.0 R = 0.05 (8 ) 0.0 R = 0.05 (8 ) 0.90 0.60 ( ) 0.70 ( ) 0.80 ( ) solder paste 0.0 ( ) 0.40 ( ) 0.50 ( ) MBL87 Reflow soldering is the only recommended soldering method. Fig 0. Reflow soldering footprint SOD88 BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 of 0
.65 0.75.0.5.5 0.85 0.60 (x) 0.50 (x).90 solder paste 0.55 (x).40 MSA49 Fig. Reflow soldering footprint SOT (SC-70) 4.60 4.00.5.65.0.70 0.90 (x) preferred transport direction during soldering MSA49 Fig. Wave soldering footprint SOT (SC-70) BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 4 of 0
.5 0.60 (x) 0.50 (x).70 0.60 (4x) 4.0.00 solder paste msa44 0.90.00.50 Fig. Reflow soldering footprint SOT4B 4.45.0 (x) 4.5 4.00 4.60 preferred transport direction during soldering.40.00 MSA4 Fig 4. Wave soldering footprint SOT4B BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 5 of 0
.65 0.60 ( ).5 0.40 ( ) 0.90.0 solder paste 0.50 (4 ) 0.50 (4 ).0.40 MSA4 Fig 5. Reflow soldering footprint SOT6 (SC-88) 5.5 4.50 0.0.00 4.00.5.75 transport direction during soldering sot6 Fig 6. Wave soldering footprint SOT6 (SC-88) BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 6 of 0
.75.45.0.60 0.5 (4 ) 0.40 (6 ) 0.55.00.70.00 0.0 ( ) ( ) 0.75 (4 ).0.0.50 0.075 placement area Reflow soldering is the only recommended soldering method. Fig 7. Reflow soldering footprint SOT666 BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 7 of 0
. Revision history Table 0. Revision history Document ID Release date Data sheet status Change notice Supersedes BAS70_PS7XSB70_ SER_8 Modifications: BAS70_PS7XSB70_ SER_7 0060504 Product data sheet - BAS70_PS7XSB70_ SER_7 Type number BAS70XY added Table 9 Packing methods : added packing method mm pitch for SOD5 Figure 6 Wave soldering footprint SOT6 (SC-88) : amended Figure 7 Reflow soldering footprint SOT666 : amended Section Legal information : updated 005078 Product data sheet - PS76SB70_ PS79SB70_ BAS70H_ BAS70L_ BAS70-07V_ BAS70VV_ BAS70W_ BAS70-07S_4 BAS70_SERIES_6 PS76SB70_ 00406 Product specification - PS76SB70_ PS79SB70_ 998076 Product specification - - BAS70H_005045 Product data sheet - - BAS70L_00050 Product specification - - BAS70-07V_0007 Product specification - - BAS70VV_004090 Product data sheet - - BAS70W_ 99906 Product specification - BAS70W_ BAS70-07S_4 0004 Product specification - BAS70_07S_ BAS70_SERIES_6 000 Product specification - BAS70_5 BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 8 of 0
. Legal information. Data sheet status Document status [][] Product status [] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [] The term short data sheet is explained in section Definitions. [] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.. Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.. Disclaimers General Information in this document is believed to be accurate and reliable. However, does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a product can reasonably be expected to result in personal injury, death or severe property or environmental damage. accepts no liability for inclusion and/or use of products in such equipment or applications and therefore such inclusion and/or use is for the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 604) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights..4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com BAS70_PS7XSB70_SER_8 Koninklijke Philips Electronics N.V. 006. All rights reserved. Product data sheet Rev. 08 4 May 006 9 of 0
4. Contents Product profile........................... General description....................... Features............................... Applications............................4 Quick reference data..................... Pinning information...................... Ordering information..................... 4 4 Marking................................ 5 5 Limiting values.......................... 5 6 Thermal characteristics................... 6 7 Characteristics.......................... 6 8 Package outline......................... 8 9 Packing information..................... 0 0 Soldering............................. Revision history........................ 8 Legal information....................... 9. Data sheet status...................... 9. Definitions............................ 9. Disclaimers........................... 9.4 Trademarks........................... 9 Contact information..................... 9 4 Contents.............................. 0 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. Koninklijke Philips Electronics N.V. 006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 4 May 006 Document identifier: BAS70_PS7XSB70_SER_8