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General Description * Description This is a color active matrix TFT (Thin Film Transistor) LCD (liquid crystal display) that uses amorphous silico n TFT as a switching device. This model is composed of a Transmissive type TFT-LCD Panel, driver circuit, back-light unit. The resolution of a 2.6 TFT-LCD contains 240x320 pixels, and can display up to 65K/262K colors. * Features -Low Input Voltage: 2.8V~3.3V(TYP) -Display Colors of TFT LCD: 65K/262K colors -Interface: 8/9/16/18 BIT MCU Interface 3/4 SPI + 16/18 BIT RGB Interface 3-line/4-line Serial Interface General Information Specification Items Main Panel Unit Display area(aa) 39.60(H)*52.80(V) (2.6inch) mm - Driver element TFT active matrix - - Display colors 65K/262k colors - Number of pixels 240(RGB)*320 dots - Pixel arrangement RGB vertical stripe - - Pixel pitch 0.165(H)*0.165(V) mm - Viewing angle ALL o'clock - Controller IC ILI9341V - - Display mode Transmissive/Normally Black - - Operating temperature -20~+70 - Storage temperature -30~+80 - Note * Mechanical Information Item Min. Typ. Max. Unit Note Module size Horizontal(H) 46 mm - Vertical(V) 64 mm - Depth(D) 3.80 mm - Weight TBD g -

1. Block Diagram

K6 -- -- K1 K6 -- -- K1 不包括双面胶 ) Pin Name GND VCI VCI IM2 IM1 IM0 RESET CS 导电双面胶 T= RS(SCL) WR(D/C) RD VSYNC HSYNC ENABLE DOTCLK SDA DB04 DB05 DB06 DB07 FPC 弯折参考图 FPC 展开出货 DB08 DB09 DB10 DB11 DB12 DB13 DB14 DB15 DB16 DB17 NC IM2 IM1 IM0 Interface type DBI Tyb_ 8-bit interface DB Pin in use DB7-DB0 LEDA LEDK1 LEDK2 PI 补强 DBI Tyb_ 16-bit interface DBI Tyb_ 9-bit interface DBI Tyb_ 18-bit interface DB15-DB0 DB8-DB0 DB17-DB0 LEDK3 LEDK4 LEDK5 LEDK6 对位线 3-Wire 9 BIT data serial SDA SCL CS interface 4-Wire 8 BIT data serial SDA SCL CS RS interface XR YU XL YD R G B R G B NOTE: 1.If not use PIN,fix to the GND,IOVCC or NC. 2.If use RGB mode must select serial interface GND GND GND GND Revision content description Date 公差 更改 IC Drawn Checked Unit mm Scale 1:1 Approve Page 1/1

3. Input terminal Pin Assignment NO. SYMBOL DISCRIPTION I/O 1 GND Ground. P 2 VCI Power Supply voltage(3.3v). P 3 VCI P 4 IM2 I 5 IM1 Interface selecting signal. I 6 IM0 I 7 RESET This signal low will reset the device and must be applied to properly initialize the chip. I Signal is low active. 8 CS System bus select signal. Low: Select (Accessible). I High: Not select (Inaccessible). 9 RS(SCL) Display data / Command selection pin. RS= 1 : Display data. I RS= 0 : Command data. 10 WR(D/C) Write strobe signal in DBI Type B operation. Data are written when WRX is Low. I Synchronous clock signal in DBI Type C operation. 11 RD Read strobe signal. Data are read when RDX is low. I If not used, please connect this pin to VCI. 12 VSYNC Frame synchronous signal. Low active. Connect to I GND when DPI is not selected. I 13 HSYNC Line synchronous signal. Low active. Connect to GND when DPI is not selected. I 14 ENABLE Data enable signal in DPI operation. Low: Select (Accessible) High: Not select (Inaccessible) I Connect to GND when DPI is not selected. 15 DOTCLK Pixel clock signal. The data input timing is set on the rising edge. Connect to GND when DPI is not selected. I 16 SDA Serial data input/output pin in DBI Type C operation. I

17~34 DB0~DB17 Data bus. Connect to GND when is not used. P 35 SDO This pin is enabled when SDOE=1 and DBI Type C is used. With this setting, SDA can be used as an input pin and SDO pin can be used as an output pin without bidirectional bus to exe cute O serial communication. If not used please open. 36 LEDA Anode pin of backlight. P 37 LEDK1 Cathode pin of backlight. P 38 LEDK2 Cathode pin of backlight. P 39 LEDK3 Cathode pin of backlight. P 40 LEDK4 Cathode pin of backlight. P 41 LEDK5 Cathode pin of backlight. P 42 LEDK6 Cathode pin of backlight. P 43 XR Touch panel Right Glass Terminal. 44 YU Touch panel Top Film Terminal. 45 XL Touch panel LEFT Glass Terminal. 46 YD Touch panel Bottom Film Terminal. 47 GND Ground. P 48 GND Ground. P 49 GND Ground. P 50 GND Ground. P

4. LCD Optical Characteristics 4.1 Optical specification Parameter Symbol Values Min Typ Max Unit Notes Threshold Voltage V sat 3.7 3.8 3.9 V V th 1.9 2.0 2.1 V Rig.2 Transmittance T(%) 3.86 4.40 - % Rig.1 Contrast Ratio C/R 400 500 - Response Time T r + T f - 35 50 Msec Rig.3 R x 0.640 0.660 0.680 R y 0.297 0.317 0.337 G x 0.240 0.260 0.280 CIE Color Coordinate G y 0.555 0.575 0.595 B x 0.121 0.141 0.161 B y 0.055 0.075 0.095 W x 0.275 0.295 0.315 W y 0.295 0.317 0.337 Θ l - 80 - Viewing Angle Θ r - 80 - Θ u - 80 - Degree C/R>10 Rig.4 Θ d - 80 -

4.2 Measuring Condition Measuring surrounding : dark room Ambient temperature : 25±2 15min. warm-up time 4.3 Measuring Equipment FPM520 of Westar Display technologies, INC., which utilized SR-3 for Chromaticity and BM-5A for other optical characteristics.

5. Electrical Characteristics 5.1 Absolute Maximum Rating (Ta=25 VSS=0V) (The following are maximum values which, if exceeded, may cause operation or damage to the unit.) Item Symbol Min. Max. Unit Note Power supply voltage 2 VCI -0.3 4.6 V - Input Voltage V t -0.3 IOVCC+0.3 V - Operating temperature T OP -20 +70 - Storage temperature TST -30 +80-5.2 DC Electrical Characteristics Item Symbol Min. Typ. Max. Unit Note Power supply voltage VCI 2.5 2.8 3.3 V - Normal mode Current consumption I DD - 10 - ma - Level input voltage V IH 0.8V DDIO - V V IL - 0.2V DDIO V Level output voltage V OH 0.8V DDIO - V V OL - 0.2V DDIO V 5.3 LED Backlight Characteristics The back-light system is edge-lighting type with 6chips White LED Item Symbol Min. Typ. Max. Unit Note Forward Current I F 90 120 -- ma Forward Voltage V F -- 3.2 -- V LCM Luminance L V 300 -- -- cd/m2 IF=120 Uniformity AVG 80 -- -- %

6. AC Characteristic (IOVCC1=1.65V ~ 3.30V, Ta=-40C ~ +85C) 6.1 Display Parallel 18/16/9/8-bits Interface Timing Characteristics

6.2 Display Serial Interface Timing Characteristics (3-line SPI system)

6.3 Display Serial Interface Timing Characteristics (4-line SPI system)

6.4 Display Parallel 16/18-bit RGB Interface Timing Characteristics

6.5 RESET Timing

7. LCD Module Out-Going Quality Level 7.1 VISUAL & FUNCTION INSPECTION STANDARD 7.1.1 Inspection conditions Inspection performed under the following conditions is recommended. Temperature : 25±5 Humidity : 65%±10%RH Viewing Angle : Normal viewing Angle. Illumination: Single fluorescent lamp (300 to 700Lux) Viewing distance:30-50cm Upper Polarizer Bottom glass Upper Glass Light Source Bottom Polarizer 7.1.2 Definition Zone B Zone A Zone C Zone A : Effective Viewing Area(Character or Digit can be seen) Zone B : Viewing Area except Zone A Zone C : Outside (Zone A+Zone B) which can not be seen after assembly by customer.) Note: As a general rule,visual defects in Zone C can be ignored when it doesn t effect product function or appearance after assembly by customer.

7.1.3 Sampling Plan According to GB/T 2828-2003 ;, normal inspection, Class Ⅱ AQL: Major defect Minor defect 0.65 1.5 LCD: Liquid Crystal Display, TP: Touch Panel, LCM: Liquid Crystal Module No Items to be inspected Criteria 1) No display, Open or miss line 1 Functional defects 2) Display abnormally, Short 3) Backlight no lighting, abnormal lighting. 4) TP no function 2 Missing Missing component 3 Outline dimension Overall outline dimension beyond the drawing is not allowed 4 Color tone Color unevenness, refer to limited sample 5 Soldering Good soldering, Peeling off is not allowed. appearance 6 LCD/Polarizer/TP Black/White spot/line, scratch, crack, etc. Classification of defects Major Minor 7.1.4 Criteria (Visual) Number Items Criteria(mm) 1.0 LCD Crack/Broken NOTE: X: Length Y: Width Z: Height L: Length of ITO, (1) The edge of LCD broken X Y Z 3.0mm <Inner border line of the seal T

T: Height of LCD (2)LCD corner broken X Y Z 3.0mm L T (3) LCD crack Crack Not allowed

2.0 Spot defect Y X Φ=(X+Y)/2 1 light dot(lcd/tp/polarizer black/white spot, light dot, pinhole, dent, stain) Zone Acceptable Qty Size (mm) A B C Φ 0.10 0.10<Φ 0.15 3( distance 10mm) 0.15<Φ 0.2 1 0.2<Φ 0 2Dim spot(lcd/tp/polarizer dim dot, light leakage dark spot) Zone Acceptable Qty Size (mm) A B C Φ 0.1 0.1<Φ 0.2 2( distance 10mm) 0.2<Φ 0.3 1 Φ>0.3 0 Line defect (LCD/TP /Polarizer black/white line, scratch, stain) 3 Polarizer accidented spot Acceptable Qty Zone Size (mm) A B C Φ 0.2 0.2<Φ 0.5 2( distance 10mm) Φ>0.5 0 Width(mm) Length(mm) Φ 0.03 0.03<W 0.05 L 3.0 N 2 0.05<W 0.08 L 2.0 N 2 Acceptable Qty A B C 0.08<W Define as spot defect

Items Criteria (mm) Spot defect Y X Φ=(X+Y)/2 1 light dot(lcd/tp/polarizer black/white spot, light dot, pinhole, dent, stain) Zone Acceptable Qty Size (mm) A B C Φ 0.10 0.10<Φ 0.15 3( distance 10mm) 0.15<Φ 0.2 1 0.2<Φ 0 2Dim spot(lcd/tp/polarizer dim dot, light leakage dark spot) Zone Acceptable Qty Size (mm) A B C Φ 0.1 0.1<Φ 0.2 2( distance 10mm) 0.2<Φ 0.3 1 Φ>0.3 0 3 Polarizer accidented spot Zone Acceptable Qty Size (mm) A B C Φ 0.2 0.2<Φ 0.5 2( distance 10mm) Φ>0.5 0

Line defect (LCD/TP /Polarizer black/white line, scratch, stain) Acceptable Qty Width(mm) Length(mm) A B C Φ 0.03 0.03<W 0.05 L 3.0 N 2 0.05<W 0.08 L 2.0 N 2 0.08<W Define as spot defect Polarizer Bubble Acceptable Qty Zone Size (mm) A B C Φ 0.2 0.2<Φ 0.4 2(distance 10mm) 0.4<Φ 0.6 1 0.6<Φ 0 SMT According to IPC-A-610C class Ⅱ standard. Function defect and missing part are major defect,the others are minor defect. TP bubble/ accidented spot Assembly deflection Size Φ(mm) Acceptable Qty A B C Φ 0.1 0.1<Φ 0.2 2(distance 10mm) 0.2<Φ 0.3 1 0.3<Φ 0 beyond the edge of backlight 0.15mm

5.0 TP Related Newton Ring Newton Ring area>1/3 TP area Newton Ring area 1/3 TP area NG OK TP corner broken X:length Y:width Z:height X Y Z X 3.0mm Y 3.0mm Z<LCD thickness * Circuitry broken is not allowed. Z X Y TP edge broken X:length Y:width X Y Z X 6.0mm Y 2.0mm Z<LCD thickness X Y Z Z:height * Circuitry broken is not allowed.

Criteria ( functional items) Number 1 2 3 4 5 Items No display Missing segment Short Backlight no lighting TP no function Criteria (mm) Not allowed Not allowed Not allowed Not allowed Not allowed

8. Reliability Test Result 8.1 Condition Item Low Temperature Operating Life test Thermal Humidity Operating Life test Temperature Cycle ON/OFF test High Temperature Storage test Low Temperature Storage test Condition Sample Test Size Result Note -20, 96HR 3ea pass - 70, 90%RH, 96HR 3ea pass - -20 70, ON/OFF, 20CYC 3ea pass (1) 80, 96HR 3ea pass - -30, 96HR 3ea pass - The sample should be allowed to stand the following 5 cycles of operation: TSTL for 30 minutes -> Thermal Shock Resistance normal temperature for 5 minutes -> TSTH for 30 minutes -> normal temperature for 5 minutes, as one 3ea pass cycle, then taking it out and drying it at normal temperature, and allowing it stand for 24 hours Box Drop Test 1 Corner 3 Edges 6 faces, 66 cm (MEDIUM BOX) 1box pass - Note (1) ON Time over 10 seconds, OFF Time under 10 seconds

9. Cautions and Handling Precautions 9.1 Handling and Operating the Module (1) When the module is assembled, it should be attached to the system firmly. Do not warp or twist the module during assembly work. (2) Protect the module from physical shock or any force. In addition to damage, this may cause improper operation or damage to the module and back-light unit. (3) Note that polarizer is very fragile and could be easily damaged. Do not press or scratch the surface. (4) Do not allow drops of water or chemicals to remain on the display surface. If you have the droplets for a long time, staining and discoloration may occur. (5) If the surface of the polarizer is dirty, clean it using some absorbent cotton or soft cloth. (6) The desirable cleaners are water, IPA (Isopropyl Alcohol) or Hexane. Do not use ketene type materials (ex. Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride. It might permanent damage to the polarizer due to chemical reaction. (7) If the liquid crystal material leaks from the panel, it should be kept away from the eyes or mouth. In case of contact with hands, legs, or clothes, it must be washed away thoroughly with soap. (8) Protect the module from static; it may cause damage to the CMOS ICs. (9) Use finger-stalls with soft gloves in order to keep display clean during the incoming inspection and assembly process. (10) Do not disassemble the module. (11) Protection film for polarizer on the module shall be slowly peeled off just before use so that the electrostatic charge can be minimized. (12) Pins of I/F connector shall not be touched directly with bare hands. (13) Do not connect, disconnect the module in the Power ON condition. (14) Power supply should always be turned on/off by the item 6.1 Power On Sequence &6.2 Power Off Sequence 9.2 Storage and Transportation. (1) Do not leave the panel in high temperature, and high humidity for a long time. It is highly recommended to store the module with temperature from 0 to 35 and relative humidity of less than 70% (2) Do not store the TFT-LCD module in direct sunlight. (3) The module shall be stored in a dark place. When storing the modules for a long time, be sure to adopt effective measures for protecting the modules from strong ultraviolet radiation, sunlight, or fluorescent light. (4) It is recommended that the modules should be stored under a condition where no condensation is allowed. Formation of dewdrops may cause an abnormal operation or a failure of the module. In particular, the greatest possible care should be taken to prevent any module from being operated where condensation has occurred inside. (5) This panel has its circuitry FPC on the bottom side and should be handled carefully in order not to be stressed.