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Typical Applications The is ideal for: Point-to-Point and Point-to-Multi-Point Radio Military Radar, EW & ELINT Satellite Communications Functional Diagram Features Conversion Gain: db Image Rejection: db LO to RF Isolation: db Noise Figure:. db Input IP: dbm Lead x mm SMT Package: mm² General Description The is a compact GaAs MMIC I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of db with a noise figure of db and db of image rejection across the frequency band. The utilizes an LNA followed by an image reject mixer which is driven by an LO buffer amplifier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external hybrid is needed to select the required sideband. The is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and is compatible with surface mount manufacturing techniques. Electrical Specifications, T A = + C, IF = MHz, LO = dbm, Vdd = V LSB [] Parameter Min. Typ. Max. Units Frequency Range, RF Frequency Range, LO -. GHz Frequency Range, IF DC -. GHz Conversion Gain (As IRM) db Noise Figure db Image Rejection dbc db Compression (Input) - dbm LO to RF Isolation db LO to IF Isolation db IP (Input) dbm Amplitude Balance [] db Phase Balance [] - deg Total Supply Current @LO = dbm [] Idd Idd ma Idd [] Data taken as IRM with external IF Hybrid. [] Data taken without external hybrid, IF = MHz. [] Current is set by the external bias resistor. Idq of LO Amp = ma. - Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com
Data Taken As IRM With External IF Hybrid, IF = MHz Conversion Gain LSB vs. Temperature Conversion Gain LSB vs. LO Drive....... +C +C -C Image Rejection LSB vs. Temperature IMAGE REJECTION (dbc)....... +C +C -C LO Return Loss vs. Temperature RETURN LOSS (db) - - -....... - dbm dbm RF Return Loss vs. Temperature RETURN LOSS (db) - - - - IF Return Loss [] RETURN LOSS (db) -.... - - - +C +C -C - - -.... -.... +C +C -C IF IF [] Data taken without external hybrid. Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com -
Data Taken as IRM With External IF Hybrid, IF = MHz Isolations ISOLATION (db) - - - - - -....... LO/RF RF/IF LO/IF RF/IF Input IP, LSB vs. Temperature - LO/IF -.... +C +C -C NOISE FIGURE (db) Noise Figure vs. Temperature, IF Frequency = MHz Input PdB LSB vs. Temperature PdB (dbm) - - - - - - - -....... + C + C - C Input IP, LSB vs. LO Drive.... dbm....... +C +C -C - Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com
Quadrature Channel Data Taken Without IF Hybrid, IF = MHz IF Bandwidth Amplitude Balance vs. LO Drive [] RESPONSE (db) - -.... IF FREQUENCY (GHz) CONVERSION GAIN RETURN LOSS PHASE BALANCE (deg) Phase Balance vs. LO Drive [] - - -.. -. - -. - AMPLITUDE BALANCE (db) LO = LO = -....... LO = + dbm LO = + dbm LO = - dbm LO = LO = dbm LO = [] Data taken with IF = MHz Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com -
Data Taken as IRM With External IF Hybrid, IF = MHz Conversion Gain, USB vs. Temperature Conversion Gain, USB vs. LO Drive....... +C +C -C Image Rejection USB vs. Temperature IMAGE REJECTION (dbc)....... +C +C -C Input IP, USB vs. Temperature....... - dbm dbm Input PdB, USB vs. Temperature PdB (dbm) - - - - - - - Input IP, USB vs. LO Drive -....... + C + C - C - -.... FREQUENCY (GHz) -.... FREQUENCY (GHz) +C +C -C dbm - Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com
Data Taken as IRM With External IF Hybrid, IF = MHz Conversion Gain, LSB vs. Temperature Conversion Gain, LSB vs. LO Drive....... +C +C -C Image Rejection LSB vs. Temperature IMAGE REJECTION (dbc)....... +C +C -C Input IP, LSB vs. Temperature....... - dbm dbm Input PdB, LSB vs. Temperature PdB (dbm) - - - - - - - Input IP, LSB vs. LO Drive -....... + C + C - C -.... FREQUENCY (GHz).... FREQUENCY (GHz) +C +C -C dbm Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com -
Data Taken as IRM With External IF Hybrid, IF = MHz Conversion Gain, USB vs. Temperature Conversion Gain, USB vs. LO Drive....... +C +C -C Image Rejection USB vs. Temperature IMAGE REJECTION (dbc)....... +C +C -C Input IP, USB vs. Temperature....... - dbm dbm Input PdB, USB vs. Temperature PdB (dbm) - - - - - - - Input IP, USB vs. LO Drive -....... + C + C - C - - -.... FREQUENCY (GHz) - - -.... FREQUENCY (GHz) +C +C -C dbm - Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com
MxN Spurious Outputs nlo mrf x RF =. GHz @ LO =. GHz @ dbm Data taken without IF hybrid All values in dbc below IF power level (LO - RF = GHz) Outline Drawing Absolute Maximum Ratings RF + dbm LO Drive Vdd +.V Channel Temperature C Continuous Pdiss (T= C) (derate. mw/ C above C). W Thermal Resistance (R TH ) (channel to package bottom). C/W Storage Temperature - to + C Operating Temperature - to + C ESD Sensitivity (HBM) Class A ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES:. LEADFRAME MATERIAL: COPPER ALLOY. DIMENSIONS ARE IN INCHES [MILLIMETERS]. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.. PAD BURR LENGTH SHALL BE.mm MAXIMUM. PAD BURR HEIGHT SHALL BE.mm MAXIMUM.. PACKAGE WARP SHALL NOT EXCEED.mm.. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [] [] H RoHS-compliant Low Stress Injection Molded Plastic % matte Sn MSL XXXX [] -Digit lot number XXXX [] Max peak reflow temperature of C Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com -
Pin Descriptions Pin Number Function Description Interface Schematic,,,,,,,,,,,, GND These pins and package bottom must be connected to RF/DC ground VDD VBIAS_RF RFIN LOIN, VDD, VDD VBIAS_LO, N/C IF IF Power supply voltage for RF Amplifier. Bypass capacitors are required. See application circuit This pin is used to set the DC current of the RF amplifier by selection of the external bias resistor. See application circuit. This pin is the RF input pin. It is AC coupled and matched to Ohms This pin is the LO input pin. It is AC coupled and matched to Ohms Power supply voltages for LO Amplifier. Bypass capacitors are required. See application circuit This pin is used to set the DC current of the LO amplifier by selection of the external bias resistor. See application circuit. These pins are not connected internally; however, all data shown herein was measured with these pins connected to RF/DC ground externally. This pin is DC coupled. For applications not requiring operations to DC this port should be DC blocked externally using a series capacitor whose value has been chosen to pass the necessary frequency range. For operation to DC, this pin must not sink / source more than ma of current or part non-function and possible failure will result. - Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com
Typical Application Circuit pf Vdd O HYBRID RF IN ohms + Volts (Iq = ma) Vbias RF +. µf pf pf + Volts Vdd +. µf pf pf + Volts Vdd +. µf pf pf Notes:. µf capacitors can be shared. Evaluation Board is generic and handles multiple parts. Not all components or bias lines are used on the evaluation board. LO IN. -. GHz IF IF Vbias LO pf ohms (Iq ma) pf +. µf + Volts IF OUT Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com -
Evaluation PCB List of Materials for Evaluation PCB [] Item Description J, J PCB Mount SMA RF Connector, SRI J, J PCB Mount SMA Connector, Johnson J, J DC Pins C, C, C, C, C, C pf Capacitor, Pkg. C, C, C, C, C, C pf Capacitor, Pkg. C, C. µf Capacitor, Pkg. R Ohm Resistor, Pkg. R kohm Resistor, Pkg. R Ohm Resistor, Pkg. U PCB [] Evaluation Board [] Reference this number when ordering complete evaluation PCB [] Circuit Board Material: Rogers The circuit board used in the application should use RF circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. - Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com
Notes: Phone: -- Fax: -- Order On-line at www.hittite.com Application Support: Phone: -- or apps@hittite.com -