Typical Applications The is ideal for: Point-to-Point and Point-to-Multi-Point Radio Military Radar, EW & ELINT Satellite Communications Functional Diagram Features db Conversion Gain Image Rejection: 1 db 2 LO to RF Isolation: 3 db Noise Figure: 3. db Input IP3: + dbm 32 Lead xmm SMT Package: 2mm2 General Description The is a compact GaAs MMIC I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of db with a noise fi gure of 3. db and 1 db of image rejection across the frequency band. The utilizes an LNA followed by an image reject mixer which is driven by an active x2 multiplier. The image reject mixer eliminates the need for a fi lter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 9 hybrid is needed to select the required sideband. The is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques. Electrical Specifications, T A = +2 C, IF = MHz, LO = +4 dbm, Vdd = 3. Vdc* Parameter Min. Typ. Max. Min. Typ. Max. Units Frequency Range, RF 24. - 26. 23-2 GHz Frequency Range, LO 9 -. 9 -. GHz Frequency Range, IF DC - 3. DC - 3. GHz Conversion Gain (As IRM) 6.. 6 db Noise Figure 3. 3. db Image Rejection 14 17 14 db 1 db Compression (Input) -6-4 -7 - dbm 2 LO to RF Isolation 32 3 3 3 db 2 LO to IF Isolation 3 4 2 4 db IP3 (Input) + + +3 +6 dbm Amplitude Balance.3.4 db Phase Balance Deg Total Supply Current 12 16 12 16 ma *Data taken as IRM with external IF Hybrid - 17 Alpha Road, Chelmsford, MA 124 Phone: 97-2-3343 Fax: 97-2-3373
Data Taken As IRM With External IF Hybrid Conversion Gain vs. Temperature CONVERSION GAIN (db) - +2C +C -4C - 23 24 2 26 27 2 29 Conversion Gain vs. LO Drive CONVERSION GAIN (db) Input P1dB vs. Temperature P1dB (dbm) - - 23 24 2 26 27 2 29-4 - -12-16 dbm +2dBm +4dBm +6dBm +dbm +2C +C -4C Image Rejection vs. Temperature IMAGE REJECTION (db) 3 2 23 24 2 26 27 2 29 Return Loss RETURN LOSS (db) - - - - Input IP3 vs. LO Drive IP3 (dbm) +2C +C -4C RF LO -2 12 14 16 1 22 24 26 2 2 - FREQUENCY (GHz) LO = dbm LO = +2 dbm LO = +4 dbm LO = +6 dbm LO = + dbm - 23 24 2 26 27 2 29-23 24 2 26 27 2 29 Alpha Road, Chelmsford, MA 124 Phone: 97-2-3343 Fax: 97-2-3373-179
Quadrature Channel Data Taken Without IF Hybrid Isolations IF Bandwidth* ISOLATION (db) - - -3-4 - 2LO/IF1 RF/IF2 2LO/IF2-6 23 24 2 26 27 2 29 Amplitude Balance vs. LO Drive AMPLITUDE BALANCE (db) 4 3 2 1 LO = dbm LO = +2 dbm LO = +4 dbm LO = +6 dbm LO = + dbm RF/IF1 2LO/RF -1 23 24 2 26 27 2 29 Noise Figure vs. LO Drive, LO Frequency = 12 GHz NOISE FIGURE (db) 6 4 2 dbm +2dBm +4dBm +6dBm +dbm RESPONSE (db) - - - CONVERSION GAIN RETURN LOSS -. 1 1. 2 2. 3 3. IF FREQUENCY (GHz) Phase Balance vs. LO Drive PHASE BALANCE (degrees) LO = dbm LO = +2 dbm LO = +4 dbm LO = +6 dbm LO = + dbm - 23 24 2 26 27 2 29 Noise Figure vs. LO Drive, IF Frequency = MHz NOISE FIGURE (db) 6 4 2 dbm +2dBm +4dBm +6dBm +dbm. 1 1. 2 2. 3 3. 4 IF FREQUENCY (GHz) 21 22 23 24 2 26 27 2 29 * Conversion gain data taken with external IF hybrid, LO frequency fi xed at 12 GHz and RF varied - Alpha Road, Chelmsford, MA 124 Phone: 97-2-3343 Fax: 97-2-3373
MxN Spurious Outputs nlo mrf 1 2 3 4 xx 37 12 32 4 1 12 41 37 41 2 xx xx 66 7 46 3 xx xx xx xx 79 4 xx xx xx xx xx RF = 2 GHz @ - dbm LO = 12 GHz @ +4 dbm Data taken without IF hybrid All values in dbc below IF power level (1RF -2LO = 1 GHz) Outline Drawing Absolute Maximum Ratings RF +2 dbm LO Drive + 13 dbm Vdd.V Channel Temperature 17 C Continuous Pdiss (T= C) (derate 9.6 mw/ C above C) 6 mw Thermal Resistance (R TH ) (channel to package bottom) 4.6 C/W Storage Temperature -6 to + C Operating Temperature - to + C ESD Sensitivity (HBM) Class 1B ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 3 - MICROINCHES GOLD OVER MICROINCHES MINIMUM NICKLE 3. DIMENSIONS ARE IN INCHES [MILLIMETERS] 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. PACKAGE WARP SHALL NOT EXCEED.mm DATUM 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND Alpha Road, Chelmsford, MA 124 Phone: 97-2-3343 Fax: 97-2-3373-11
Pin Descriptions Pin Number Function Description Interface Schematic 1 VddLO Power supply for fi rst stage of LO amplifi er. 2, 4-6,, 9, 12-1, 21, 22, 2-2, 31, 32 N/C No connection required. These pins may be connected to RF/DC ground without affecting performance. 3 VddLO2 Power supply for second stage of LO amplifi er. 7 VddRF Power supply for RF LNA., 19, 24, 29 GND 11 RF IF2 23 IF1 3 LO Typical Application These pins and ground paddle must be connected to RF/DC ground. This pin is AC coupled and matched to Ohms. This pin is DC coupled for applications not requiring operation to DC. This port should be DC blocked externally using a series capacitor whose value has been chosen to pass the necessary frequency range. For operation to DC, this pin must not sink / source more than 3 ma of current or part non-function and possible failure will result. This pin is AC coupled and matched to Ohms. - 12 Alpha Road, Chelmsford, MA 124 Phone: 97-2-3343 Fax: 97-2-3373
Evaluation PCB List of Materials for Evaluation PCB 1137 [1] Item C1 - C4 Description Capacitor 63,.1 μf J1, J4 PCB Mount SMA RF Connector, SRI J2, J3 PCB Mount SMA Connector, Johnson J - J7 U1 PCB [2] DC Pin 11376 Evaluation Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 43 The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. Alpha Road, Chelmsford, MA 124 Phone: 97-2-3343 Fax: 97-2-3373-13