The Hmc869LC5 is ideal for: Point-to-Point and Point-to-Multi-Point Radio. Parameter Min. Typ. Max. Units

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Typical Applications The Hmc86LC is ideal for: Point-to-Point and Point-to-Multi-Point Radio Military Radar, EW & ELINT Satellite Communications Functional Diagram Features Electrical Specifications, T A = +2 C, IF = MHz, LO =, VD3 = V, VD1, VD2 = 3V* Conversion Gain: 14 db Image Rejection: 32 db LO to RF Isolation: 4 db Noise Figure: 2.8 db Input IP3: -1 dbm 32 Lead xmm SMT Ceramic Package: 2mm² General Description The Hmc86LC is a GaAs mcm I/Q downconverter in a leadless RoHS compliant smt package. This device provides a small signal conversion gain of 14 db with a noise figure of 2.8 db and 32 db of image rejection. The Hmc86LC utilizes an LNA followed by an image reject mixer which is driven by an LO buffer amplifier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external hybrid is needed to select the required sideband. The Hmc86LC is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques. Parameter Min. Typ. Max. Units Frequency Range, RF Frequency Range, LO 8. - 1. GHz Frequency Range, IF DC - 3. GHz Conversion Gain (As IRM) 14 db Noise Figure 2.8 db Image Rejection 1 32 db 1 db Compression (Input) - dbm LO to RF Isolation 3 4 db LO to IF Isolation 32 db IP3 (Input) -1 dbm Amplitude Balance db Phase Balance ± Deg Supply Current (ID1 + ID2) 6 88 ma Supply Current (ID3) 1 ma *Data taken as IRM with external IF Hybrid - 1 Phone: 78-2-3343 Fax: 78-2-3373 Order On-line at www.hittite.com Application Support: Phone: 78-2-3343 or apps@hittite.com

Data Taken As IRM With External IF Hybrid Conversion Gain vs. Temperature Image Rejection vs. Temperature CONVERSION GAIN (db) 1 +2C +8C -4C 11 12 13 14 1 16 17 Conversion Gain vs. LO Drive CONVERSION GAIN (db) Input P1dB vs. Temperature P1dB (dbm) 1 11 12 13 14 1 16 17-4 -6-8 - -12-14 dbm +6 dbm +2C +8C -4C IMAGE REJECTION (db) 4 3 11 12 13 14 1 16 17 Return Loss RETURN LOSS (db) Input IP3 vs. LO Drive IP3 (dbm) - - -1 - +2C +8C -4C -2 8 12 14 16 18 2-2 -4-6 LO RF FREQUENCY (GHz) dbm -16 11 12 13 14 1 16 17-8 11 12 13 14 1 16 17 Phone: 78-2-3343 Fax: 78-2-3373 Order On-line at www.hittite.com Application Support: Phone: 78-2-3343 or apps@hittite.com - 2

Quadrature Channel Data Taken Without IF Hybrid Isolations IF Bandwidth* 3 RF/IF1 ISOLATION (db) - - -3-4 LO/IF1 RF/IF2 LO/IF2 - LO/RF -6 11 12 13 14 1 16 17 Amplitude Balance vs. LO Drive AMPLITUDE BALANCE (db) 3 1-1 -3 dbm - 11 12 13 14 1 16 17 Noise Figure vs. LO Drive, LO Frequency = 12 GHz NOISE FIGURE (db) 6 4 3 2-4 dbm dbm RESPONSE (db) - - RETURN LOSS CONVERSION GAIN -3. 1 1. 2 2. 3 3. IF FREQUENCY (GHz) Phase Balance vs. LO Drive PHASE BALANCE (degrees) 1 - - -1 dbm - 11 12 13 14 1 16 17 Noise Figure vs. LO Drive, IF Frequency = MHz NOISE FIGURE (db) 6 4 3 2 dbm 1 1. 1 1. 2 2. 3 3. IF FREQUENCY (GHz) 11 12 13 14 1 16 17 * Conversion gain data taken with external IF hybrid, LO frequency fixed at 12 GHz and RF varied - 3 Phone: 78-2-3343 Fax: 78-2-3373 Order On-line at www.hittite.com Application Support: Phone: 78-2-3343 or apps@hittite.com

MxN Spurious Outputs nlo mrf 1 2 3 4 xx 43 4 4 xx 1 22 xx 42 6 77 2 74 67 xx 74 8 3 7 73 xx 4 xx 4 1 2 xx RF = 13.6 GHz @ - dbm LO = 13. GHz @ Data taken without IF hybrid All values in dbc below IF power level. Outline Drawing Absolute Maximum Ratings RF + dbm LO Drive + dbm VD1, VD2 4.V VD3.V Channel Temperature 1 C Continuous Pdiss (T=8 C) (derate.6 mw/ C above 8 C).6 W Thermal Resistance (R TH ) (channel to package bottom) 71 C/W Storage Temperature -6 to +1 C Operating Temperature -4 to +8 C ELecTROSTATIC SENsiTive DEVICE OBserve HANDLING PrecAUTIONS NOTes: 1.. PACKAGE BODY MATeriAL: ALUmiNA 2.. LEAD AND GROUND PADDLE PLATING: 3-8 MICROINCHes GOLD Over MICROINCHes MINimUM NicKLE 3.. DimeNsiONS Are IN INCHes [millimeters] 4.. LEAD SPAciNG TOLerANce IS NON-CUMULATive.. PACKAGE WARP SHALL NOT EXCEED.mm DATUM 6.. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDereD TO PCB RF GROUND Phone: 78-2-3343 Fax: 78-2-3373 Order On-line at www.hittite.com Application Support: Phone: 78-2-3343 or apps@hittite.com - 4

Pin Descriptions Pin Number Function Description Interface Schematic 1,, 7 -, 13-16, 22-27, 3-32 N/C The pins are not connected internally; however, all data shown herein was measured with these pins connected to RF/DC ground externally. 2, 4,, 12, 17, 1, 21 GND 3 RF These pins and ground paddle must be connected to RF/DC ground. This pin is AC coupled and matched to Ohms. 6 VD3 Power supply for LO amplifier. 28, 2 VD2, VD1 Power supply for RF LNA. 18 IF2 IF1 11 LO Typical Application This pin is DC coupled for applications not requiring operation to DC. This port should be DC blocked externally using a series capacitor whose value has been chosen to pass the necessary frequency range. For operation to DC, this pin must not sink / source more than 3 ma of current or part non-function and possible failure will result. This pin is AC coupled and matched to Ohms. Note: LSB and USB is determined by GND on Hybrid - Phone: 78-2-3343 Fax: 78-2-3373 Order On-line at www.hittite.com Application Support: Phone: 78-2-3343 or apps@hittite.com

Evaluation PCB List of Materials for Evaluation PCB 111227 [1] Item Description J1, J2 PCB Mount SMA RF Connector, SRI J3, J4 PCB Mount SMA Connector, Johnson J, J6, J7 DC Pin C1, C2, C3 Capacitor 42, Pkg. pf C4, C, C6 Capacitor 42, Pkg. pf C7, C8,C Capacitor, Case A, 2.2uF R1, R2 Resistor, 42 Pkg. Ohm U1 PCB [2] Hmc86LC 11122 Evaluation Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 43 or Arlon 2FR The circuit board used in the final application should use RF circuit design techniques. Signal lines should have Ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. Phone: 78-2-3343 Fax: 78-2-3373 Order On-line at www.hittite.com Application Support: Phone: 78-2-3343 or apps@hittite.com - 6