Surface Mount Chip LEDs Technical Data HSMB-C19/C17/C11 Features Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -3 C to +85 C Right Angle Package Available SiC Blue Color Available in 8 mm tape on 7" (178 mm) Diameter Reels Applications Keypad Backlighting Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator Description These Blue chip LEDs are designed in an industry standard package for ease of handling and use. Blue color chip LED is a new product that offers color differentiation for backlighting applications. The HSMB-C17 has the widely used 2. x 1.25 mm footprint. The HSMB-C19 has the industry standard 1.6 x.8 mm footprint, its low.8 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The HSMB-C11 is a right-angle package with the universally accepted dimensions of 3.2 x 1. x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. Device Selection Guide Footprint (mm) SiC Blue Parts Per Reel 2. x 1.25 HSMB-C17 4 1.6 x.8 HSMB-C19 4 3.2 x 1. [1] HSMB-C11 3 Note: 1. Right-angle package.
2 Package Dimensions LED DIE CATHODE MARK LED DIE CATHODE MARK.8 (.31) 1.25 (.49) 1.6 (.63 ).4 (.16) 2. (.79 ).62 (.24) 1. (.39) POLARITY DIFFUSED EPOXY 1.4 (.55) POLARITY.3 (.12).3 (.12) DIFFUSED EPOXY PC BOARD.3 ±.15 (.12 ±.6).8 (.31).3 (.12).3 ±.15 (.12 ±.6) PC BOARD.4 ±.15 (.16 ±.6).8 (.31).3 (.12).4 ±.15 (.16 ±.6) SOLDERING TERMINAL HSMB-C19 SOLDERING TERMINAL HSMB-C17 LED DIE CATHODE MARK 1. (.39) 2.6 (.12 ) 3.2 (.126 ) POLARITY CLEAR EPOXY 1.5 (.59) PC BOARD 1.6 (.63 ).5 (.2) 1. (.39) 1. (.39) SOLDERING TERMINAL CATHODE LINE HSMB-C11 NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED.
3 Absolute Maximum Ratings at T A =25 C Parameter HSMB-C19/C17/C11 Units DC Forward Current [1] 2 ma Peak Pulsing Current [2] 1 ma Power Dissipation 92 mw Reverse Voltage (I R = 1 µa) 5 V Maximum LED Junction Temperature 95 C Operating Temperature Range -3 to +85 C Storage Temperature Range -4 to +85 C Soldering Temperature See IR soldering profile (Figure 7) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25 C. 2. Pulse condition of 1/1 duty and.1 msec. width. Optical Characteristics at T A =25 C Luminous Peak Dominant Viewing Intensity [1] Wavelength Wavelength Angle 2θ 1/2 Part No. Color I v (mcd) @ 2 ma λ peak (nm) λ d (nm) (degrees) [2] Min. Typ. Typ. Typ. Typ. HSMB- SiC Blue 1.6 6. 428 466 17 C19/C17 HSMB-C11 SiC Blue 1.6 6.5 428 466 13 Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at T A =25 C Reverse Forward Voltage Breakdown Thermal Capacitance C V F (Volts) V R (Volts) Resistance (pf) @ V F = V, Part No. @ I F = 2 ma @ I R = 1 µa Rθ J-P ( C/W) f = 1 MHz Typ. Max. Min. Typ. Typ. HSMB-C19/C17 3.8 4.6 5 3 67 HSMB-C11 3.8 4.6 5 3 67
4 1 1 1.2 RELATIVE INTENSITY % 8 6 4 2 38 48 58 68 I F FORWARD CURRENT ma 1 1 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma).1 3. 3.2 3.4 3.6 3.8 4. 5 1 15 2 25 1..8.6.4.2 WAVELENGTH nm V F FORWARD VOLTAGE V I F FORWARD CURRENT ma Figure 1. Relative Intensity vs. Wavelength. Figure 2. Forward Current vs. Forward Voltage. Figure 3. Relative Luminous Intensity vs. Forward Current. I F MAX. MAXIMUM FORWARD CURRENT ma 25 2 15 1 5 2 4 6 8 1 T A AMBIENT TEMPERATURE C RELATIVE INTENSITY % 1 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 4. Maximum Forward Current vs. Ambient Temperature. RELATIVE INTENSITY % 1 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 5. Relative Intensity vs. Angle for HSMB-C11.
5 RELATIVE INTENSITY % 1 9 8 7 6 5 4 3 2 1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 6. Relative Intensity vs. Angle for HSMB-C17 and HSMB-C19. 1 SEC. MAX. TEMPERATURE 14-16 C 23 C MAX. 4 C/SEC. MAX. OVER 2 MIN. TIME 4 C/SEC. MAX. 3 C/SEC. MAX. 1.2 (.47).9 (.35) 1.2 (.47) 1.2 (.47) Figure 7. Recommended Reflow Soldering Profile. Figure 8. Recommended Soldering Pattern for HSMB-C17. 5. (.2).9 (.35).9 (.35).8 (.31) 1.5 (.59).2 (.8).8 (.31).7 (.28).8 (.31) 1.5 (.59) 2. (.79) 1.5 (.59) Figure 9. Recommended Soldering Pattern for HSMB-C19. Figure 1. Recommended Soldering Pattern for HSMB-C11. Note: 1. All dimensions in millimeters (inches).
6 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 11. Reeling Orientation. 8. ± 1. (.315 ±.39) Ø 2.2 MIN. (Ø.795 MIN.) 1.5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 13.1 ±.5 (Ø.516 ±.2) 178.4 ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Figure 12. Reel Dimensions. Note: 1. All dimensions in millimeters (inches).
7 4. (.157) 1.5 (.59) CATHODE DIM. C (SEE TABLE 1).2 ±.5 (.8 ±.2) 1.75 (.69) DIM. A (SEE TABLE 1) 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B (SEE TABLE 1) 2. ±.5 (.79 ±.2) HSMB-C11 POSITION IN CARRIER TAPE 4. (.157) PART NUMBER USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (±.4) DIM. B ±.1 (±.4) COVER TAPE CARRIER TAPE DIM. C ±.1 (±.4) HSMB-C17 SERIES 2.4 (.94) 1.6 (.63) 1.2 (.47) HSMB-C19 SERIES 1.85 (.73) 1. (.39) 1.2 (.47) HSMB-C11 SERIES 3.35 (.132) 1.85 (.73) 1.2 (.47) Figure 13. Tape Dimensions. END START THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 14. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ±.1 mm (±.4 in.) unless otherwise specified.
Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 16, Surface Mounting SMT LED Indicator Components. www.hp.com/go/led For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-8-235-312 or 48-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright 1999 Hewlett-Packard Co. 5968-7452E (1/99)