Advanced Display Manufacturing Technology John Busch Vice President, New Business Development Display and Flexible Technology Group September 28, 2017
Safe Harbor This presentation contains forward-looking statements, including those regarding anticipated growth and trends in Applied s businesses and markets, industry outlooks, technology transitions, and other statements that are not historical facts. These statements are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements and are not guarantees of future performance. Information concerning these risks and uncertainties is contained in Applied s most recent Form 10-K or 10-Q and other filings with the SEC. All forward-looking statements are based on management's current estimates, projections and assumptions, and Applied assumes no obligation to update them. 2
APPLIED TODAY SERVICES $2.1B DISPLAY and ADJACENT MARKETS FY16 ORDERS SEMI SYSTEMS 3
Applied Materials is the world s leading display and flexible electronics equipment manufacturer with 25 years of materials engineering experience on large area rigid and flexible substrates 2.9m GEN 10+ GLASS 9.9m 2 3.4m 300mm Wafer 4
Applied s Display and Flexible Technology Products CVD CORE PRODUCT PORTFOLIO PVD NEW PRODUCTS (launched in 2016) Thin Film Encapsulation E-Beam Tester Roll-to-Roll E-Beam Evaporation PVD CVD In-Line SEM Review 5
Social Networking Entertainment Productivity Education Health Safety Fashion Displays are the Window to the Information Universe 6
New Display Era on the Horizon LCD Era CRT Replacement TODAY OLED Era Advanced 3-D Era Laptop PC Monitor Large Screen TV SCALING RESOLUTION FORM FACTOR / VISUAL PERFORMANCE 2-D NATURAL 3-D
Display Technology Roadmap TODAY RESOLUTION TV HD 4K 8K TRANSISTOR DISPLAY PHONE >326ppi >600ppi >700ppi VR/AR 400ppi >1000ppi >2500ppi LTPS LCD OLED FORM FACTOR/ PERFORMANCE FPD Curved Rollable Foldable a-si OR Rigid Flexible SIZE TV PHONE 40 4.5 55 5.5 70 >5.5 MOx 2-D 3-D 8
Display Mega-Trend : Components to Process LCD PANEL CROSS-SECTION IN-CELL / ON-CELL Cover glass Touch panel Polarizer Thin film encapsulation / hard coat In-cell / on-cell touch Wire-grid polarizer Color filter Liquid crystal TFT backplane RGB OLED emitter OLED emitter Needs Materials Engineering Innovation Polarizer Wire-grid polarizer Backlight OLED emitter 9
Key Technology Challenges for Flexible Displays DISPLAY STRUCTURE CHALLENGES Cover Window Touch Screen Encapsulation Cathode Emitting Layer Anode Transistor (TFT) Substrate Flexible Window Flexible Touch Sensor Flexible Encapsulation Flexible OLED Emitter Flexible TFT 10
Display Semiconductor Increasing Complexity in Semi and Display Yield Management Darkfield Inspection Brightfield inspection SEM Review SEM Inspection SEM Inspection Holistic Process / Materials SiO 2 Al/Si RIE, Implant PECVD Cu / Low-k PVD RTP CMP ECD Selective Epi Laser Anneal Laser Anneal ALE Device Innovation Scale Dual damascene High-k/Metal Gate High-k/Metal Gate Strained Si FinFET 3D NAND Substrate Size Change Rapid substrate size change Changes in device, process and materials 1960 1970 1980 1um CD 1990 2000 2010 2020 Yield Management AOI Repair Yield management software SEM review Process/materials a-si/al/sinx CU Laser anneal QD OLED ALD High-k gate Device innovation TFT LCD LTPS Resolution Scaling MOx Flex/Rigid Foldable Substrate size changes Rapid substrate size change Changes in device, process and materials 1990 2000 2010 1um CD 2020 Display can Leverage 30 Years of Semi Technology, Methodology and Knowhow 11
Backplane Yield Challenge Example: Particles Smaller TFTs have more (& smaller) killer particles OLED TFT active area larger than LCD increasing chance of killer particle Increasing resolution increases # transistors/area requires smaller TFT increases # of killer particles 12
Semiconductor Methodologies for Advanced Displays Example: Yield Management You can t FIX What you can t SEE 13
Semiconductor Yield Management: Enabled by Inline SEM SEMI CD-SEM and SEM review introduction in 80s 10µm 1971 1µm 1985 Display TODAY 0.18 µm 1999 0.13 µm 65 nm 32 2002 2006 nm nm 22 2010 2012 SEMI TODAY 90% processes are SEMed! Defect Inspection AOI (Sub 1um) Defect Review Inline SEM (with EDX) Defect Classification Yield management (connect the dots root cause) DISPLAY 14
New Inspection Methodology for Advanced Displays Old way (Lab SEM) New way (Inline SEM) AOI Defects Map EBR in line Array Test Destructive Inspection Long Cycle Time Low Sampling Rate Non-destructive Inspection High Throughput High Sampling Rate 15
Inline SEM Brings Semi Methodologies to Display Auto Process Inspection (API) Inspection & Review (defects) Auto Defect Review (ADR) Metrology Auto-CD (ACD) Process & Defects Composition Analysis LTPS Grain Analysis CD Measurements No Secco Etch ITO residue EDX & BSE ELA in-line Monitoring Accelerates yield by connecting the dots Inline SEM + yield management software fast ramp & high yield 16
YIELD YIELD w/ EBR PARTICLE DENSITY EBR Time Machine 3 Yield Entitlement 2 Yield Excursions 1 Ramp to Yield TIME System Fab-in Setup Pilot Pre -MP MP [ w/o EBR ] Process time 60sec Inspection 60 sec Measurement several mins Analysis several hours or days P I M Analysis [ w/ EBR ] Process time 60sec Inspection 60 sec Measurement several mins Analysis ~ several mins P I M Ana 17
Thin Film Encapsulation (TFE) Requirements Flexible OLED Device PROCESS REQUIREMENTS PURPOSE Depo temperature <100 Device protection Mask depo Mask deposition Bonding pad Water vapor transmission rate (WVTR) <1E-6g/m 2 day Long lifetime High deposition rate >2,500A/min High throughput Barrier Performance Stress Control Optical Transmittance Mask Depo Low stress ~ 0 Avoid cracking of metal electrodes or film itself High visible light transmittance >90% at wavelength 400nm Increase brightness Good adhesion No film peeling Device integrity High flexibility Mechanical duration Tolerate mechanical bending through lifetime Buffer Technology Conformal particle coverage No voids or diffusion channels Eliminate water and oxygen permeation 18
Enflexor Gen6H TFE Solutions for High Resolution Flexible OLED SUBSTRATE SIZE 925 x 1,500mm 2 SYSTEM ARCHITECTURE Single substrate operation system at cluster tool Max 5 TFE process chambers Mask chamber Pas chamber or DSSL (Dual Single Slot Load lock) Transfer chamber Dual arm vacuum robot TFE Process Chamber (max 5) Mask Chamber Transfer Chamber w/dual arm vacuum robot Pass Chamber or DSSL (Dual Single Slot Load lock) KEY ADVANTAGES Superior WVTR & uniformity Particle control High system reliability 19
One Cluster Solution Complete All TFE process in one cluster Vacuum Atm Vacuum Vacuum Connection to EV tool Flexible sequence control by MCC software High reliability mainframe and vacuum robot Mask deposition with auto mask exchange and mask stocker OLED EV Tool IN IJP OUT TFE Technology for OLED mass production new concept CVD Chamber Mask Stocker 2 nd Layer All process under vacuum pp-hmdso Upper-stream Load Lock Lower-stream Load Lock 3 Layer OLED EV Tool IN OUT Multiple Layer Stack 1 st Layer 3 rd Layer SiN CVD Chamber SiN 20
Displays are the window to the information universe and better displays are constantly in demand Many display technology inflections need materials engineering innovation Display industry can leverage semiconductor methodologies to enable increasingly complex displays 21