AVX RF Microwave Products

AVX RF Microwave Products www.avx.com Version 16.12

AVX Microwave Ask The World Of Us As one of the world s broadest line multilayer ceramic chip capacitor suppliers, and a major Thin Film RF/Microwave capacitor, inductor, directional coupler and low pass filter and microwave ceramic capacitor manufacturer, it is our mission to provide First In Class Technology, Quality and Service, by establishing progressive design, manufacturing and continuous improvement programs driving toward a single goal: TOTAL CUSTOMER SATISFACTION 1

RF/Microwave Products Table of Contents Company Profile...4 Thin-Film RF/Microwave Capacitor Technology Accu-P Thin-Film Technology...6 Thin-Film Chip Capacitors...7-9 21 Typical Electrical Tables Accu-P...1-11 42 Typical Electrical Tables Accu-P...12-13 63 Typical Electrical Tables Accu-P...14-15 85 Typical Electrical Tables Accu-P...16-17 121 Typical Electrical Tables Accu-P...18-19 High Frequency Characteristics...2-25 Environmental / Mechanical Characteristics...26 Performance Characteristics RF Power Applications...27 Application Notes...28-29 Automatic Insertion Packaging...3 Thin-Film RF/Microwave Inductor Technology Accu-L L21 Tight Tolerance RF Inductor...32-33 L42 Tight Tolerance RF Inductor...34-35 L63 AND L85 SMD High-Q RF Inductor Accu-L...36-38 Environmental Characteristics...39 Application Notes... 4 Thin-Film RF/Microwave Directional Couplers CP32/CP42/CP63/CP85 and DB63N/DB85 3dB 9 CP42W27FNTR Wide Band High Directivity...42-43 CP42W27FNTR Test Jigs...44 CP32A5425ENTR / CP42Q5425ENTR / CP63Q5425ENTR High Directivity Directional Couplers For WiFi Bands...45-46 CP42P High Directivity, Tight Coupling Tolerance...47-48 CP42 High Directivity LGA Termination...49-52 CP63 High Directivity LGA Termination...53-58 CP42 / CP63 High Directivity Couplers Test Jigs...59 CP63 SMD Type Thin-Film Directional Couplers...6-62 CP63 SMD Type High Directivity...63 CP85 SMD Type Thin-Film Directional Couplers...64-68 CP85 and CP63 Test Jigs...69 DB63N 3dB 9º Couplers...7-86 DB85 3dB 9 Couplers...87-98 DB85 3dB 9 Test Jigs...99 Thin-Film RF/Microwave Harmonic Low Pass Filter LP42/LP63/LP85 LP42N Series Harmonic Low Pass Filter Lead-Free LGA Termination...11-13 LP42N Series Harmonic Low Pass Filter Lead-Free LGA Termination Test Jigs...14 LP63 Lead-Free LGA Type...15-18 LP63 Test Jigs...19 LP85 Type Harmonic...11-111 LP85 Test Jigs...112 126 High Performance LP126A512BNTR Harmonic Low Pass Filter...113-114 LP126A7ANTR Low Pass Filter...115-116 Thin-Film RF/Microwave Products Designer Kits...117-119 Multilayer Organic (MLO TM ) Technology MLO TM Capacitors...121-124 MLO TM Diplexers 63 WLAN/BT...125-13 85 CDMA...131-132 85 WCDMA...133-134 85 WLAN...135-136 85 WLAN/BT...137-138 Automated SMT Assembly/SMT Reflow Profile...139 MLO TM Inductors Tight Tolerance...14-141 High Current...142-143 Hi-Q...144-145 Performance Characteristics...146 Automated SMT Assembly/SMT Reflow Profile...147 MLO TM SMT Crossovers RF-DC...148-15 RF-RF...151-153 Automated SMT Assembly/SMT Reflow Profile...154 RF Inductors AL Series Air Core Inductors...156-162 AS Series Square Air Core Inductors...163-167 LCWC Series Wire Wound Chip Inductor...168-177 RF/Microwave Capacitors RF/Microwave Multilayer Capacitors (MLC) UQ Series High Q Ultra Low ESR MLC...179-191 SQ Series Ultra Low ESR MLC...192-24 AQ Series...25-28 MIL-PRF-55681 BG Voltage Temperature Limits (+9±2ppm/ C)...29-211 CDR11BG; CDR12BG (.55" x.55") - Failure Rate Level: M, P, R, S CDR13BG; CDR14BG (.11" x.11") - Failure Rate Level: M, P, R, S Performance Curves...212-216 Automatic Insertion Packaging...217 HQ Series, High RF Power Capacitors...218-224 RF/Microwave CG (NP) Capacitors Ultra Low ESR CU Series, CG (NP) Capacitors (RoHS)...225-226 Ultra Low ESR U Series, CG (NP) Capacitors (RoHS)...227-229 Ultra Low ESR U Series, CG (NP) Capacitors (RoHS) Automotive, AEC Q2 Qualified...23-232 Ultra Low ESR U Series, CG (NP) Capacitors (Sn/Pb)...233-235 RF/Microwave U Series Designer Kits...236 2

RF/Microwave Products Table of Contents Company Profile...................................................................................................... 4 Thin-Film RF/Microwave Capacitor Technology................................................................ 5-3 Accu-P 1 Thin-Film RF/Microwave Inductor Technology................................................................ 31-4 Accu-L 2 Thin-Film RF/Microwave Directional Couplers.......................................................................... 41-99 CP32/CP42/CP63/CP85 and DB63N/DB85 3dB 9 3 Thin-Film RF/Microwave Harmonic Low Pass Filter.......................................................... 1-116 LP42/LP63/LP85 LP126 High Performance 4 Thin-Film RF/Microwave Products Designer Kits........................................................... 117-119 5 Multilayer Organic (MLO TM ) Technology.................................................................... 12-154 MLO TM Capacitors MLO TM Inductors MLO TM Diplexers MLO TM SMT Crossovers 6 RF Inductors......................................................................................... 155-177 Air Core Inductors Square Air Core Inductors Wire Wound Chip Inductors 7 RF/Microwave Capacitors............................................................................... 178-236 RF/Microwave Multilayer Capacitors (MLC) RF/Microwave CG (NP) Capacitors RF/Microwave U Series Designer Kits 3 8

RF/Microwave Products Company Profile AVX Corporation is a leading manufacturer of multilayer ceramic, thin film and tantalum, as well as other passive electronic components. These products are used in virtually every electronic system today, including data processing, telecommunications, consumer electronics, automotive electronics, military and aerospace systems, and instrumentation and process controls. We continually strive to be the leader in all component segments we supply. RF/Microwave capacitors is a thrust business for us. AVX offers a broad line of RF/Microwave Chip Capacitors in a wide range of sizes, styles, and ratings. The Thin-Film Products range illustrated in this catalog represents the state-of-the-art in RF Capacitors, Inductors, Directional Couplers and Low Pass Filters. The thin-film technology provides components that exhibit excellent batch-to-batch repeatability of electrical parameters at RF frequencies. The Accu-P series of capacitors are available in ultra-tight tolerances (±.1pF) as well as non-standard capacitance values. The Accu-L series of inductors are ideally suited for applications requiring an extremely high Q and high current capability. The CP32/CP42/CP63/CP85 series of Directional Couplers cover the frequency range of 8 MHz to 6 GHz. They feature low insertion loss, high directivity and highly accurate coupling factors. The LP42/63/85 series of Low Pass Filters provide a rugged component in a small size package with excellent high frequency performance. The Multilayer Organic (MLO TM ) series of components are based on AVX s patented multilayer organic technology (US patent 6,987,37). They are low profile with frequencies well above 1GHz. Another major series of microwave capacitors consists of both multilayer porcelain and ceramic capacitors for frequencies from 1 MHz to 4.2 GHz (UQ and SQ Series). Six sizes of specially designed ultra-low ESR CG (NP) capacitors are covered for RF applications (CU and U Series). The air core and wire wound ceramic chip inductors offer high current ratings (up to 4.4A) and quality factor (>1). Ask the world of us. Call (864) 967-215. Or visit our website http://www.avx.com 4

Thin-Film RF/Microwave Capacitor Technology Accu-P 5

1 Accu-P Thin-Film Technology THE IDEAL CAPACITOR The non-ideal characteristics of a real capacitor can be ignored at low frequencies. Physical size imparts inductance to the capacitor and dielectric and metal electrodes result in resistive losses, but these often are of negligible effect on the circuit. At the very high frequencies of radio communication (>1MHz) and satellite systems (>1GHz), these effects become important. Recognizing that a real capacitor will exhibit inductive and resistive impedances in addition to capacitance, the ideal capacitor for these high frequencies is an ultra low loss component which can be fully characterized in all parameters with total repeatability from unit to unit. Until recently, most high frequency/microwave capacitors were based on fired-ceramic (porcelain) technology. Layers of ceramic dielectric material and metal alloy electrode paste are interleaved and then sintered in a high temperature oven. This technology exhibits component variability in dielectric quality (losses, dielectric constant and insulation resistance), variability in electrode conductivity and variability in physical size (affecting inductance). An alternate thin-film technology has been developed which virtually eliminates these variances. It is this technology which has been fully incorporated into Accu-P and Accu-P to provide high frequency capacitors exhibiting truly ideal characteristics. The main features of Accu-P may be summarized as follows: High purity of electrodes for very low and repeatable ESR. Highly pure, low-k dielectric for high breakdown field, high insulation resistance and low losses to frequencies above 4GHz. Very tight dimensional control for uniform inductance, unit to unit. Very tight capacitance tolerances for high frequency signal applications. This accuracy sets apart these Thin-Film capacitors from ceramic capacitors so that the term Accu has been employed as the designation for this series of devices, an abbreviation for accurate. THIN-FILM TECHNOLOGY Thin-film technology is commonly used in producing semiconductor devices. In the last two decades, this technology has developed tremendously, both in performance and in process control. Today s techniques enable line definitions of below 1μm, and the controlling of thickness of layers at 1Å (1-2 μm). Applying this technology to the manufacture of capacitors has enabled the development of components where both electrical and physical properties can be tightly controlled. The thin-film production facilities at AVX consist of: Class 1 clean rooms, with working areas under laminar-flow hoods of class 1, (below 1 particles per cubic foot larger than.5μm). High vacuum metal deposition systems for high-purity electrode construction. Photolithography equipment for line definition down to 2.μm accuracy. Plasma-enhanced CVD for various dielectric depositions (CVD=Chemical Vapor Deposition). High accuracy, microprocessor-controlled dicing saws for chip separation. High speed, high accuracy sorting to ensure strict tolerance adherence. Orientation Marking Alumina (Al 2 O 3 ) Electrode Seal (SiNO) Dielectric (SiO 2 / SiNO) Electrode Alumina (Al 2 O 3 ) Terminations ACCU-P CAPACITOR STRUCTURE 6

Accu-P Thin-Film Chip Capacitors ACCU-P TECHNOLOGY The use of very low-loss dielectric materials, silicon dioxide and silicon oxynitride, in conjunction with highly conductive electrode metals results in low ESR and high Q. These high-frequency characteristics change at a slower rate with increasing frequency than for ceramic microwave capacitors. Because of the thin-film technology, the above-mentioned frequency characteristics are obtained without significant compromise of properties required for surface mounting. The main Accu-P properties are: Internationally agreed sizes with excellent dimensional control. Ultra small size chip capacitors (15) are available. Ultra tight capacitance tolerances. Low ESR at VHF, UHF and microwave frequencies. Enhanced RF power handling capablity. High stability with respect to time, temperature, frequency and voltage variation. Nickel/solder-coated terminations to provide excellent solderability and leach resistance. APPLICATIONS Cellular Communications CT2/PCN (Cordless Telephone/Personal Comm. Networks) Satellite TV Cable TV GPS (Global Positioning Systems) Vehicle Location Systems Vehicle Alarm Systems Paging Military Communications Radar Systems Video Switching Test & Measurements Filters VCO's Matching Networks RF Amplifiers APPROVALS ISO 91 1 ACCU-P FEATURES Accu-P meets the fast-growing demand for low-loss (high-q) capacitors for use in surface mount technology especially for the mobile communications market, such as cellular radio of 45 and 9 MHz, UHF walkie-talkies, UHF cordless telephones to 2.3 GHz, low noise blocks at 11-12.5 GHz and for other VHF, UHF and microwave applications. Accu-P is currently unique in its ability to offer very low capacitance values (.5pF) and very tight capacitance tolerances (±.1pF). The RF power handling capability of the Accu-P allows for its usage in both small signal and RF power applications. Thin Film Technology guarantees minimal batch to batch variability of parameters at high frequency. Inspection test and quality control procedures in accordance with ISO 91, CECC, IECQ and USA MIL Standards yield products of the highest quality. Hand soldering Accu-P : Due to their construction utilizing relatively high thermal conductivity materials, Accu-P s have become the preferred device in R & D labs and production environments where hand soldering is used. 7

Accu-P Thin-Film Chip Capacitors for RF Signal and Power Applications 1 T L B 2 B 1 W ACCU-P (Signal and Power Type Capacitors) 15* 21* 42* 63* 85* 121.45±.2.6±.5 1.±.1 1.6±.1 2.1±.1 3.2±.1 L (.16±.1) (.23±.2) (.39±.4) (.63±.4) (.79±.4) (.119±.4).215 ±.2.325±.5.55±.7.81±.1 1.27±.1 2.5±.1 W (.85 ±.1) (.128±.2) (.22±.3) (.32±.4) (.5±.4) (.1±.4).145 ±.2.225±.5.4±.1.63±.1.93±.2.93±.2 T (.6 ±.1) (.9±.2) (.16±.4) (.25±.4) (.36±.8) (.36±.8) +.1 +.1. -..1±.1. -..35±.15.3±.1.43±.1 B 1 +.4 +.4 (. -. ) (.4±.4) (. -. ) (.14±.6) (.12±.4) (.17±.4).1 ±.3.15±.5.2±.1.35±.15.3±.1.43±.1 B 2 (.4 ±.1) (.6±.2) (.8±.4) (.14±.6) (.12±.4) (.17±.4) *Mount Black Side Up DIMENSIONS: millimeters (inches) HOW TO ORDER 42 3 J 4R7 A B S TR \5 Size C5 21 42 63 85 121* Voltage 2 = 2V 1 = 1V 5 = 5V 3 = 25V Y = 16V Z = 1V Temperature Coefficient (1) J = ±3ppm/ C (-55 C to +125 C) K = ±6ppm/ C (-55 C to +125 C) Capacitance Capacitance expressed in pf. (2 significant digits + number of zeros) for values <1pF, letter R denotes decimal point. Example: 68pF = 68 8.2pF = 8R2 The following 3 digit capacitance codes should be used for ordering AVX Accu-P capacitors CAPACITANCE EXAMPLE CODE. to.99pf Rxx.15pF = 423JR15ABSTR 1. to 1.99pF Axx 1.55pF = 423JA55PBSTR 2. to 2.99pF Bxx 2.85pF =...B85... 3. to 3.99pF Cxx 3.85pF =...C85... 4. to 4.99pF Dxx 4.85pF =...D85... 5. to 5.99pF Exx 5.85pF =...E85... 6. to 6.99pF Fxx 6.85pF =...F85... 7. to 7.99pF Gxx 7.85pF =...G85... 8. to 8.99pF Hxx 8.85pF =...H85... 9. to 9.99pF Jxx 9.85pF =...J85... 1. to 19.9pF Kxx 13.8pF =...K38... 2. to 29.9pF Lxx 22.5pF =...L25... 3. to 39.9pF Mxx 33.8pF =...M38... 4. to 49.9pF Nxx 43.5pF =...N35... Tolerance Specification for Code C 2.pF* B = Accu-P Z = ±.1pF technology P = ±.2pF Q = ±.3pF A = ±.5pF B = ±.1pF C = ±.25pF for C 3.pF Q = ±.3pF A = ±.5pF B = ±.1pF C = ±.25pF for C 5.6pF A = ±.5pF B = ±.1pF C = ±.25pF for 5.6pF<C<1pF B = ±.1pF C = ±.25pF D = ±.5pF for C 1pF F = ±1% G = ±2% J = ±5% Termination Code W = Nickel/Solder Coated Accu-P 42 Sn9, Pb1*** T = Nickel/High Temperature Solder Coated Accu-P 85**, 121** Sn96, Ag4 Nickel/Solder Coated Accu-P 63*** Sn63, Pb37 **S = Nickel/Lead Free Solder Coated Accu-P 15, 21, 42, 63 Sn1 **RoHS compliant *** Not RoHS Compliant Packaging Code TR = Tape & Reel LEAD-FREE COMPATIBLE COMPONENT Option For RoHS compliant products, please select correct termination style. (1) TC s shown are per EIA/IEC Specifications. * Tolerances as tight as ±.1pF are available. Please consult the factory. Engineering Kits Available see pages 118-119 ELECTRICAL SPECIFICATIONS Operating and Storage Temperature Range -55 C to +125 C Temperature Coefficients (1) ± 3ppm/ C dielectric code J / ± 6ppm/ C dielectric code K Capacitance Measurement 1 MHz, 1 Vrms Insulation Resistance (IR) 1 11 Ohms ( 1 1 Ohms for 21 and 42 size) Proof Voltage 2.5 U R for 5 secs. Aging Characteristic Zero Dielectric Absorption.1% 8

Accu-P Signal and Power Type Capacitors Accu-P Capacitance Ranges (pf) TEMP. COEFFICIENT CODE J = ±3ppm/ C (-55 C to +125 C) (2) K = ±6ppm/ C (-55 C to +125 C) (2) Size Size Code C5 21 42 63 85 121 Voltage 16 1 5 25 16 1 2 1 5 25 16 1 2 1 5 25 1 5 25 1 5 Cap in Cap pf (1) code.1 R1.2 R2.3 R3.4 R4.5 R5.6 R6.7 R7.8 R8.9 R9 1. 1R 1.1 1R1 1.2 1R2 1.3 1R3 1.4 1R4 1.5 1R5 1.6 1R6 1.7 1R7 1.8 1R8 1.9 1R9 2. 2R 2.1 2R1 2.2 2R2 2.3 2R3 2.4 2R4 2.5 2R5 2.6 2R6 2.7 2R7 2.8 2R8 2.9 2R9 3. 3R 3.1 3R1 3.2 3R2 3.3 3R3 3.4 3R4 3.5 3R5 3.6 3R6 3.7 3R7 3.8 3R8 3.9 3R9 4. 4R 4.1 4R1 4.2 4R2 4.3 4R3 4.4 4R4 4.5 4R5 4.6 4R6 4.7 4R7 5.1 5R1 5.6 5R6 6.2 6R2 6.8 6R8 7.5 7R5 8.2 8R2 9.1 9R1 1. 1 11. 11 12. 12 13. 13 14. 14 15. 15 16. 16 17. 17 18. 18 19. 19 2. 2 21. 21 22. 22 24. 24 27. 27 3. 3 33. 33 39. 39 47. 47 56. 56 68. 68 (1) For capacitance values higher than listed in table, please consult factory. (2) TC shown is per EIA/IEC Specifications. These values are produced with K temperature coefficient code only. 1 Intermediate values are available within the indicated range. 9

Accu-P 21 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..5 ±.2 2.9 599 42.55 65 322.56 265 41.57 195 445.1 ±.2 19.4 574 316.11 614 2682.112 246 336.113 188 3113.15 ±.2 17.9 51 28.163 55 287.166 22 244.168 17 2441.2 ±.2 16.4 445 245.216 52 1693.22 21 1971.223 16 197.25 ±.2 15.5 436 24.262 51 1371.268 24 164.272 153 1646.3 ±.2 14.6 427 235.39 5 1149.316 199 1337.32 146 1421.35 ±.2 14.1 423 232.36 494 11.369 196 1177.374 144 1265.4 ±.2 12.5 418 23.411 489 874.421 193 138.427 142 1129.45 ±.2 11.9 413 227.461 484 819.473 191 972.481 14 166.5 ±.2 11.3 48 224.512 478 765.526 188 96.535 138 13.55 ±.2 1.9 43 222.563 473 71.578 186 84.588 137 94.6 ±.2 1.4 398 219.614 468 667.631 183 791.642 135 882.65 ±.2 1. 394 217.664 462 624.683 181 742.695 133 825.7 ±.2 9.5 389 214.715 457 58.735 178 693.749 131 767.75 ±.2 9.3 384 211.766 452 557.788 176 664.82 129 729.8 ±.2 9.1 379 29.817 446 534.84 173 635.856 127 692.85 ±.2 8.9 374 26.868 441 511.893 171 66.99 126 654.9 ±.2 8.8 37 23.918 436 487.945 168 577.963 124 616.95 ±.2 8.6 365 21.969 43 464.998 166 548 1.16 122 579 1 ±.2 8.4 36 198 1.2 425 441 1.5 163 519 1.7 12 541 1.5 ±.2 8.2 358 197 1.78 421 426 1.112 161 52 1.134 119 523 1.1 ±.2 8. 355 195 1.135 418 41 1.173 159 486 1.199 117 55 1.15 ±.2 7.8 353 194 1.193 414 395 1.235 157 469 1.263 116 488 1.2 ±.2 7.6 35 193 1.251 411 379 1.296 155 452 1.327 115 47 1.25 ±.2 7.5 348 191 1.38 47 364 1.358 153 436 1.392 114 452 1.3 ±.2 7.4 345 19 1.366 43 348 1.419 151 419 1.456 112 434 1.35 ±.2 7.3 343 189 1.424 4 333 1.481 149 42 1.52 111 416 1.4 ±.2 7.2 34 187 1.481 396 317 1.542 147 386 1.585 11 398 1.45 ±.2 7.1 338 186 1.539 393 32 1.64 145 369 1.649 19 381 1.5 ±.2 7. 335 184 1.597 389 287 1.665 144 353 1.713 17 363 1.55 ±.2 6.8 332 183 1.642 386 282 1.714 142 347 1.764 16 358 1.6 ±.2 6.7 33 181 1.687 382 277 1.762 141 342 1.815 15 352 1.65 ±.2 6.6 327 18 1.732 378 272 1.81 14 337 1.866 14 347 1.7 ±.2 6.5 324 178 1.777 375 267 1.859 138 331 1.917 13 342 1.75 ±.2 6.4 321 176 1.822 371 262 1.97 137 326 1.968 12 337 1.8 ±.2 6.3 318 175 1.866 367 257 1.955 136 321 2.18 11 331 1.85 ±.2 6.2 315 173 1.911 364 252 2.3 134 316 2.69 1 326 1.9 ±.2 6.2 312 172 1.956 36 247 2.52 133 31 2.12 99 321 1.95 ±.2 6.1 39 17 2.1 357 242 2.1 132 35 2.171 98 316 2 ±.3 6. 36 168 2.46 353 237 2.148 131 3 2.222 97 31 2.1 ±.3 5.9 31 166 2.15 348 232 2.263 128 293 2.344 95 33 2.2 ±.3 5.7 296 163 2.254 343 227 2.377 125 287 2.467 93 296 2.3 ±.3 5.6 292 16 2.358 337 222 2.491 122 281 2.59 91 289 2.4 ±.3 5.5 287 158 2.462 332 217 2.66 12 274 2.712 89 282 2.5 ±.3 5.4 282 155 2.566 327 212 2.72 117 268 2.835 87 275 2.6 ±.3 5.3 277 152 2.67 322 27 2.834 114 262 2.958 85 268 2.7 ±.3 5.2 272 15 2.773 317 22 2.949 112 255 3.8 83 261 2.8 ±.3 5.1 269 148 2.878 312 199 3.66 11 252 3.29 81 258 2.9 ±.3 5. 265 146 2.983 38 196 3.184 18 248 3.337 8 254 3 ±.3 4.9 261 144 3.88 34 193 3.31 16 245 3.465 78 251 3.1 ±.5 4.8 257 141 3.192 299 19 3.419 15 241 3.593 77 247 3.2 ±.5 4.7 253 139 3.297 295 187 3.536 13 238 3.722 76 244 3.3 ±.5 4.6 25 137 3.42 291 185 3.654 11 234 3.85 74 24 3.4 ±.5 4.6 246 135 3.56 286 182 3.771 99 231 3.978 73 237 3.5 ±.5 4.5 242 133 3.611 282 179 3.889 98 227 4.17 71 233 3.6 ±.5 4.5 238 131 3.716 278 176 4.6 96 224 4.235 7 23 3.7 ±.5 4.4 234 129 3.82 273 173 4.124 94 22 4.363 69 226 3.8 ±.5 4.4 23 127 3.925 269 17 4.241 92 217 4.492 67 223 3.9 ±.5 4.3 227 125 4.3 265 167 4.359 91 213 4.62 66 219 1 1

Accu-P 21 Typical Electrical Tables Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Tesonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ±.5 4.3 224 123 4.138 262 165 4.484 89 21 4.76 65 216 4.1 ±.5 4.2 222 122 4.247 259 162 4.61 88 27 4.91 64 213 4.2 ±.5 4.2 22 121 4.356 257 159 4.735 87 24 5.41 63 21 4.3 ±.5 4.1 218 12 4.464 254 157 4.86 86 21 5.181 62 27 4.4 ±.5 4.1 216 119 4.573 252 154 4.986 85 198 5.322 61 24 4.5 ±.5 4. 214 118 4.682 249 152 5.111 83 195 5.462 6 21 4.6 ±.5 4. 212 116 4.79 246 149 5.237 82 192 5.62 59 198 4.7 ±.5 3.9 29 115 4.899 244 147 5.362 81 189 5.743 58 195 5.1 ±.5 3.8 21 11 5.334 233 136 5.863 76 178 6.34 54 183 5.6 ±.5 3.6 19 15 5.877 22 124 6.49 7 163 7.6 49 168 6.2 ±.1 3.5 177 97 6.488 28 126 7.29 65 167 7.993 45 174 6.8 ±.1 3.3 164 9 7.1 195 128 8.9 6 171 8.98 41 179 7.5 ±.1 3.2 153 84 7.91 182 125 9.129 56 166 1.27 38 173 8.2 ±.1 3. 142 78 8.71 168 121 1.17 52 16 11.56 34 167 9.1 ±.1 2.9 135 74 9.676 159 118 11.57 49 154 13.49 32 161 1 ±1% 2.8 128 7 1.65 151 114 12.96 45 148 15.41 29 155 11 ±1% 2.7 12 66 11.73 141 11 14.52 42 142 17.55 27 148 12 ±1% 2.5 112 62 12.82 132 15 16.7 39 135 19.68 24 141 13 ±1% 2.4 15 58 13.92 124 14 17.82 36 135 22.38 22 142 14 ±1% 2.4 98 54 15.2 116 13 19.57 32 135 25.8 19 142 15 ±1% 2.3 91 5 16.12 18 12 21.32 29 135 27.78 17 143 16 ±1% 2.2 86 47 17.37 12 13 24.4 27 135 NA NA NA 17 ±1% 2.2 81 44 18.63 96 15 26.76 25 136 NA NA NA 18 ±1% 2.1 76 42 19.88 9 16 29.48 23 136 NA NA NA 19 ±1% 2.1 71 39 21.14 83 18 32.2 21 136 NA NA NA 2 ±1% 2.1 65 36 22.39 77 19 34.92 19 136 NA NA NA 22 ±1% 2. 55 3 24.9 65 112 4.36 15 137 NA NA NA 1 11

Accu-P 42 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..5 ±.2 2.9 856 471.6 881 1411.6 562 1216.6 498 983.1 ±.2 19.4 848 466.11 873 1316.11 554 1115.11 49 914.15 ±.2 17.9 84 462.16 866 1222.16 547 113.16 482 845.2 ±.2 16.4 832 457.21 858 1128.21 539 912.22 474 776.25 ±.2 15.5 823 453.26 85 133.27 532 81.27 465 77.3 ±.2 14.6 815 448.31 842 939.32 525 78.32 457 638.35 ±.2 14.1 87 444.36 834 844.37 517 67.37 449 569.4 ±.2 12.5 799 439.41 827 75.42 51 55.42 441 5.45 ±.2 11.9 791 435.46 819 667.47 52 458.48 432 453.5 ±.2 11.3 783 43.51 811 583.52 495 41.53 424 47.55 ±.2 1.9 774 426.57 83 5.57 487 363.58 416 36.6 ±.2 1.4 766 421.62 796 465.62 48 343.63 48 339.65 ±.2 1. 758 417.67 788 431.67 472 322.68 399 317.7 ±.2 9.5 75 413.72 78 396.72 465 32.73 391 296.75 ±.2 9.3 746 41.77 776 375.78 456 29.79 381 285.8 ±.2 9.1 743 48.82 772 354.83 447 277.84 37 273.85 ±.2 9. 739 46.87 768 334.88 438 265.89 36 262.9 ±.2 8.8 735 44.92 764 313.93 429 253.95 35 25.95 ±.2 8.4 732 42.97 76 292.98 42 24 1. 339 239 1 ±.2 8. 728 4 1.2 756 271 1.4 411 228 1.5 329 227 1.5 ±.2 7.9 725 398 1.7 752 258 1.9 46 221 1.11 323 221 1.1 ±.2 7.8 721 397 1.12 749 245 1.14 41 214 1.16 318 214 1.15 ±.2 7.6 718 395 1.17 745 232 1.2 396 27 1.22 312 28 1.2 ±.2 7.4 714 393 1.22 742 218 1.25 391 2 1.27 36 22 1.25 ±.2 7.2 711 391 1.27 738 25 1.31 386 193 1.32 31 195 1.3 ±.2 7. 77 389 1.32 734 192 1.36 381 185 1.38 295 189 1.35 ±.2 6.9 74 387 1.37 731 179 1.41 376 178 1.43 289 183 1.4 ±.2 6.8 7 385 1.42 727 165 1.47 371 171 1.49 283 177 1.45 ±.2 6.7 697 383 1.47 724 152 1.52 366 164 1.54 278 17 1.5 ±.2 6.5 693 381 1.52 72 139 1.58 361 157 1.6 272 164 1.55 ±.2 6.5 69 379 1.56 716 135 1.62 358 153 1.65 269 159 1.6 ±.2 6.5 686 377 1.61 713 13 1.67 355 148 1.7 267 155 1.65 ±.2 6.5 683 375 1.66 79 126 1.72 352 143 1.76 264 15 1.7 ±.2 6.4 679 373 1.71 75 122 1.77 349 139 1.81 261 146 1.75 ±.2 6.3 676 372 1.75 72 118 1.82 347 134 1.86 259 141 1.8 ±.2 6.2 672 37 1.8 698 113 1.87 344 13 1.92 256 137 1.85 ±.2 6.1 669 368 1.85 694 19 1.92 341 125 1.97 253 132 1.9 ±.2 6. 665 366 1.9 69 15 1.97 338 121 2.2 251 128 1.95 ±.2 5.9 662 364 1.94 687 11 2.1 335 116 2.8 248 123 2 ±.3 5.7 658 362 1.99 683 96 2.6 332 112 2.13 245 119 2.1 ±.3 5.4 651 358 2.1 676 93 2.18 326 18 2.26 241 115 2.2 ±.3 5.1 643 354 2.21 669 89 2.3 321 14 2.38 236 112 2.3 ±.3 5. 636 35 2.31 662 85 2.42 315 11 2.51 231 19 2.4 ±.3 4.9 629 346 2.42 656 81 2.54 39 97 2.64 226 16 2.5 ±.3 4.7 622 342 2.53 649 77 2.65 33 94 2.76 221 12 2.6 ±.3 4.6 614 338 2.64 642 74 2.77 298 9 2.89 216 99 2.7 ±.3 4.5 67 334 2.75 635 7 2.89 292 86 3.2 211 96 2.8 ±.3 4.5 6 33 2.85 628 68 3.1 288 83 3.15 27 92 2.9 ±.3 4.4 592 326 2.95 621 66 3.13 283 8 3.28 23 88 3 ±.3 4.4 585 322 3.6 614 64 3.24 279 76 3.41 2 84 3.1 ±.5 4.4 578 318 3.16 67 62 3.36 274 73 3.54 196 8 3.2 ±.5 4.3 57 314 3.27 6 6 3.48 27 7 3.67 192 76 3.3 ±.5 4.3 563 31 3.37 593 58 3.6 265 67 3.8 188 72 3.4 ±.5 4.3 556 36 3.47 586 57 3.71 261 63 3.93 184 68 3.5 ±.5 4.2 548 32 3.58 579 55 3.83 256 6 4.6 18 64 3.6 ±.5 4.2 541 298 3.68 572 53 3.95 252 57 4.19 177 6 3.7 ±.5 4.1 534 294 3.78 565 51 4.6 247 54 4.32 173 56 3.8 ±.5 4. 526 289 3.89 558 49 4.18 243 5 4.45 169 52 3.9 ±.5 3.9 519 285 3.99 551 47 4.3 238 47 4.58 165 48 12

Accu-P 42 Typical Electrical Tables Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ±.5 3.9 513 282 4.1 545 47 4.42 235 47 4.73 162 48 4.1 ±.5 3.8 57 279 4.2 539 47 4.55 232 46 4.87 16 48 4.2 ±.5 3.8 51 275 4.3 534 46 4.67 228 46 5.1 157 48 4.3 ±.5 3.7 495 272 4.41 528 46 4.79 225 46 5.16 154 48 4.4 ±.5 3.7 489 269 4.51 522 46 4.92 222 46 5.3 151 47 4.5 ±.5 3.6 483 265 4.61 516 46 5.4 219 45 5.44 149 47 4.6 ±.5 3.6 477 262 4.72 511 45 5.16 216 45 5.59 146 47 4.7 ±.5 3.5 471 259 4.82 55 45 5.29 213 45 5.73 143 47 5.1 ±.5 3.4 446 245 5.23 482 44 5.78 2 43 6.3 133 47 5.6 ±.5 3.3 416 229 5.75 453 43 6.4 184 42 7.2 119 46 6.2 ±.1 3. 388 213 6.41 427 44 7.26 167 44 8.11 17 47 6.8 ±.1 2.8 36 198 7.7 4 44 8.12 15 45 9.19 95 48 7.5 ±.1 2.7 338 186 7.85 378 45 9.17 139 47 1.57 86 49 8.2 ±.1 2.6 315 173 8.62 356 45 1.22 128 48 11.95 77 5 9.1 ±.1 2.5 292 16 9.63 333 45 11.75 115 47 14.23 69 5 1 ±1% 2.4 268 148 1.65 31 45 13.28 13 47 16.5 61 49 11 ±1% 2.3 242 133 11.77 285 44 14.98 89 46 19.4 51 49 12 ±1% 2.2 217 119 12.9 259 44 16.68 75 45 21.57 42 48 13 ±1% 2.2 22 111 14.3 241 44 18.83 68 47 25.73 38 49 14 ±1% 2.1 187 13 15.17 223 44 2.97 62 49 29.89 33 49 15 ±1% 2.1 172 94 16.3 24 45 23.12 56 51 34.5 29 5 16 ±1% 2. 157 87 17.53 187 44 25.91 5 49 41.44 25 49 17 ±1% 1.9 143 79 18.75 169 43 28.7 45 46 48.82 21 47 18 ±1% 1.8 129 71 19.98 152 42 31.49 39 44 56.21 17 46 19 ±1% 1.8 121 67 21.11 143 42 33.51 36 44 6.92 15 47 2 ±1% 1.8 11 61 22.25 131 41 35.53 33 43 65.63 14 48 22 ±1% 1.8 98 54 24.51 116 41 39.57 26 42 75.5 1 51 24 ±1% 1.8 87 48 27.51 14 37 54.94 21 35 NA NA NA 27 ±1% 1.7 7 39 32.1 85 32 77.98 13 23 NA NA NA 3 ±1% 1.7 65 36 35.89 78 28 16.5 1 12 NA NA NA 33 ±1% 1.7 6 33 4.5 74 27 NA NA NA NA NA NA 36 ±1% 1.7 58 32 45.13 71 28 NA NA NA NA NA NA 39 ±1% 1.7 56 31 5.21 69 28 NA NA NA NA NA NA 43 ±1% 1.6 53 29 56.98 66 29 NA NA NA NA NA NA 47 ±1% 1.6 5 28 63.75 63 3 NA NA NA NA NA NA 51 ±1% 1.6 48 26 7.53 6 31 NA NA NA NA NA NA 56 ±1% 1.6 44 24 78.99 56 33 NA NA NA NA NA NA 58 ±1% 1.6 42 23 83.54 54 34 NA NA NA NA NA NA 68 ±1% 1.6 32 18 16.28 42 4 NA NA NA NA NA NA 1 13

Accu-P 63 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..5 ±.2 25.6 12 66.6 1333 945.6 556 832.6 397 88.1 ±.2 18.1 1156 636.11 1284 675.11 535 628.11 382 667.15 ±.2 14.8 1111 611.16 1235 555.16 514 533.16 367 567.2 ±.2 12.8 167 587.21 1185 483.21 494 474.22 353 55.25 ±.2 11.4 122 562.26 1136 433.27 473 433.27 338 462.3 ±.2 1.4 978 538.31 186 397.32 453 42.32 323 43.35 ±.2 9.7 933 513.36 137 368.37 432 378.37 39 44.4 ±.2 9. 889 489.41 988 345.42 412 358.42 294 383.45 ±.2 8.5 844 464.46 938 326.47 391 341.48 279 365.5 ±.2 8.1 8 44.51 889 31.52 37 327.53 265 35.55 ±.2 7.7 788 434.57 875 296.57 363 315.58 261 337.6 ±.2 7.4 777 427.62 86 283.62 356 34.63 258 326.65 ±.2 7.1 765 421.67 846 273.67 348 294.68 255 315.7 ±.2 6.8 754 414.72 832 263.72 341 285.73 252 36.75 ±.2 6.6 742 48.77 817 254.78 334 277.79 248 298.8 ±.2 6.4 73 42.82 83 247.83 326 27.84 245 29.85 ±.2 6.2 719 395.87 789 239.88 319 264.89 242 283.9 ±.2 6. 77 389.92 775 233.93 312 258.95 239 277.95 ±.2 5.9 696 383.97 76 227.98 34 252 1. 235 271 1 ±.2 5.7 684 376 1.19 746 216 1.61 297 242 1.11 232 26 1.5 ±.2 5.6 667 367 1.76 731 213 1.126 29 239 1.171 226 256 1.1 ±.2 5.4 649 357 1.134 717 21 1.19 282 236 1.241 22 253 1.15 ±.2 5.3 632 347 1.192 72 26 1.254 275 233 1.311 214 25 1.2 ±.2 5.2 614 338 1.25 687 23 1.318 267 23 1.381 29 247 1.25 ±.2 5.1 65 333 1.37 677 2 1.382 262 227 1.451 23 244 1.3 ±.2 5. 596 328 1.365 667 197 1.446 257 224 1.521 197 241 1.35 ±.2 4.9 587 323 1.423 658 194 1.511 252 221 1.591 191 238 1.4 ±.2 4.8 578 318 1.481 648 19 1.575 247 218 1.661 185 235 1.45 ±.2 4.8 569 313 1.538 638 187 1.639 242 215 1.731 179 232 1.5 ±.2 4.7 56 38 1.596 628 184 1.73 237 212 1.81 173 229 1.55 ±.2 4.6 551 33 1.645 62 181 1.76 233 29 1.866 17 226 1.6 ±.2 4.5 542 298 1.694 611 178 1.817 228 26 1.93 166 222 1.65 ±.2 4.5 534 293 1.743 63 175 1.874 224 23 1.995 163 219 1.7 ±.2 4.4 525 289 1.792 595 172 1.931 219 2 2.6 159 216 1.75 ±.2 4.3 516 284 1.841 587 169 1.988 215 197 2.124 156 213 1.8 ±.2 4.2 57 279 1.89 578 166 2.45 211 194 2.189 153 29 1.85 ±.2 4.2 498 274 1.939 57 163 2.12 26 191 2.253 149 26 1.9 ±.2 4.1 49 269 1.988 562 16 2.158 22 188 2.318 146 23 1.95 ±.2 4.1 481 264 2.37 553 157 2.215 197 185 2.383 142 199 2 ±.3 4. 472 26 2.86 545 154 2.272 193 182 2.447 139 196 2.1 ±.3 3.9 462 254 2.19 535 151 2.42 187 18 2.64 134 193 2.2 ±.3 3.8 452 249 2.295 524 148 2.532 181 177 2.761 129 191 2.3 ±.3 3.8 442 243 2.4 514 145 2.662 175 175 2.917 124 188 2.4 ±.3 3.7 433 238 2.54 53 143 2.793 168 172 3.74 118 186 2.5 ±.3 3.6 423 232 2.69 493 14 2.923 162 17 3.23 113 183 2.6 ±.3 3.6 413 227 2.714 482 137 3.53 156 167 3.387 18 181 2.7 ±.3 3.5 43 222 2.818 472 134 3.183 15 165 3.543 13 178 2.8 ±.3 3.4 395 217 2.933 463 133 3.336 147 164 3.742 1 177 2.9 ±.3 3.4 388 213 3.47 453 131 3.489 144 162 3.94 97 175 3 ±.3 3.3 38 29 3.162 444 13 3.642 14 161 4.139 95 174 3.1 ±.5 3.2 372 25 3.276 435 129 3.795 137 16 4.337 92 172 3.2 ±.5 3.2 365 21 3.391 425 127 3.947 134 159 4.536 89 171 3.3 ±.5 3.1 357 196 3.56 416 126 4.1 131 157 4.734 86 169 3.4 ±.5 3.1 349 192 3.62 47 125 4.253 128 156 4.933 84 168 3.5 ±.5 3.1 342 188 3.735 397 123 4.46 125 155 5.131 81 166 3.6 ±.5 3. 334 184 3.849 388 122 4.559 121 154 5.33 78 165 3.7 ±.5 3. 326 179 3.964 379 121 4.712 118 152 5.528 75 164 3.8 ±.5 3. 318 175 4.78 369 119 4.865 115 151 5.727 73 162 3.9 ±.5 2.9 311 171 4.193 36 118 5.18 112 15 5.925 7 161 14

Accu-P 63 Typical Electrical Tables Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ±.5 2.9 37 169 4.31 355 117 5.188 11 149 6.188 68 16 4.1 ±.5 2.8 33 167 4.41 351 116 5.358 18 148 6.45 67 159 4.2 ±.5 2.8 299 164 4.518 347 116 5.528 16 148 6.713 65 158 4.3 ±.5 2.7 295 162 4.627 342 115 5.698 14 147 6.975 64 157 4.4 ±.5 2.7 291 16 4.735 338 114 5.867 12 146 7.238 62 157 4.5 ±.5 2.7 287 158 4.843 333 113 6.37 1 146 7.5 61 156 4.6 ±.5 2.6 283 156 4.952 329 112 6.27 98 145 7.763 59 155 4.7 ±.5 2.6 279 154 5.6 324 112 6.377 96 144 8.25 58 154 5.1 ±.5 2.5 263 145 5.494 37 19 7.57 88 142 9.75 52 151 5.6 ±.5 2.4 244 134 6.35 285 15 7.96 78 138 1.39 44 147 6.2 ±.1 2.3 228 126 6.865 267 12 9.517 72 133 13.66 4 141 6.8 ±.1 2.2 213 117 7.694 25 1 11.13 66 128 16.93 35 135 7.5 ±.1 2.1 195 17 8.367 227 98 12.63 57 125 2.91 28 132 8.2 ±.1 2. 176 97 9.41 25 96 14.14 49 123 24.88 21 129 9.1 ±.1 1.9 161 89 1.2 188 96 18.9 42 122 4. 16 128 1 ±1% 1.8 146 8 11.37 171 95 22.5 36 121 7. 12 127 11 ±1% 1.7 129 71 12.66 153 95 26.44 29 12 14. 6 126 12 ±1% 1.6 112 62 13.95 134 94 3.83 22 119 231.3 1 125 13 ±1% 1.6 12 56 15.31 122 93 4.37 18 118 n/a n/a n/a 14 ±1% 1.5 92 51 16.67 111 92 49.91 15 118 n/a n/a n/a 15 ±1% 1.5 82 45 18.3 99 9 59.44 11 117 n/a n/a n/a 16 ±1% 1.4 79 43 19.61 96 9 8. 8 117 n/a n/a n/a 17 ±1% 1.4 76 42 21.18 92 9 12. 6 116 n/a n/a n/a 18 ±1% 1.3 73 4 22.76 89 9 19. 4 116 n/a n/a n/a 19 ±1% 1.3 69 38 24.37 84 89 n/a n/a n/a n/a n/a n/a 2 ±1% 1.2 65 36 25.98 8 89 n/a n/a n/a n/a n/a n/a 22 ±1% 1.2 57 31 29.21 72 87 n/a n/a n/a n/a n/a n/a 24 ±1% 1.2 48 26 34.44 62 87 n/a n/a n/a n/a n/a n/a 27 ±1% 1.1 43 24 41.87 56 86 n/a n/a n/a n/a n/a n/a 3 ±1% 1. 37 21 49.29 49 85 n/a n/a n/a n/a n/a n/a 33 ±1% 1. 32 18 56.72 43 84 n/a n/a n/a n/a n/a n/a 36 ±1% 1. 27 15 64.15 37 83 n/a n/a n/a n/a n/a n/a 39 ±1% 1. 21 12 71.57 3 82 n/a n/a n/a n/a n/a n/a 1 15

Accu-P 85 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..1 ±.2 17.2 88 484.125 89 3296.125 545 2417.126 447 2265.15 ±.2 14.1 872 48.176 885 273.178 53 1626.181 434 1546.2 ±.2 12.3 864 475.228 88 1492.231 516 1227.235 42 1178.25 ±.2 11. 857 471.279 874 1156.284 51 986.29 47 955.3 ±.2 1.1 849 467.331 869 938.337 487 825.344 394 84.35 ±.2 9.4 841 462.382 864 787.39 472 71.399 38 695.4 ±.2 8.8 833 458.433 859 675.443 458 623.453 367 613.45 ±.2 8.3 825 454.485 853 59.496 443 555.58 353 549.5 ±.2 7.9 817 45.536 848 523.549 429 51.562 34 497.55 ±.2 7.5 811 446.584 843 469.6 42 456.616 331 454.6 ±.2 7.2 85 443.631 838 425.651 411 419.67 322 418.65 ±.2 6.9 798 439.679 834 387.72 42 387.724 313 388.7 ±.2 6.7 792 436.726 829 356.753 393 36.778 34 362.75 ±.2 6.5 786 432.774 824 329.84 384 337.832 295 339.8 ±.2 6.3 779 429.822 819 36.855 375 316.886 286 319.85 ±.2 6.1 773 425.869 814 285.96 366 298.94 277 31.9 ±.2 5.9 767 422.917 81 267.957 357 282.994 268 285.95 ±.2 5.8 76 418.964 85 251 1.8 348 267 1.49 26 271 1 ±.2 5.6 754 415 1.12 8 231 1.59 339 235 1.13 251 242 1.5 ±.2 5.5 747 411 1.65 794 223 1.12 335 228 1.17 247 235 1.1 ±.2 5.4 74 47 1.119 788 215 1.181 33 221 1.237 244 228 1.15 ±.2 5.3 732 43 1.172 782 28 1.242 326 214 1.34 24 22 1.2 ±.2 5.1 725 399 1.225 776 2 1.34 322 27 1.371 237 213 1.25 ±.2 5. 718 395 1.279 77 192 1.365 318 2 1.438 233 26 1.3 ±.2 4.9 711 391 1.332 764 184 1.426 313 193 1.55 23 199 1.35 ±.2 4.9 74 387 1.386 758 176 1.487 39 186 1.573 226 192 1.4 ±.2 4.8 696 383 1.439 752 169 1.548 35 179 1.64 223 184 1.45 ±.2 4.7 689 379 1.492 746 161 1.69 3 172 1.77 219 177 1.5 ±.2 4.6 682 375 1.546 74 153 1.67 296 165 1.774 216 17 1.55 ±.2 4.6 675 371 1.6 733 151 1.734 292 163 1.85 212 168 1.6 ±.2 4.5 668 367 1.654 726 148 1.799 287 161 1.927 28 165 1.65 ±.2 4.4 66 363 1.78 719 146 1.864 283 159 2.3 24 163 1.7 ±.2 4.3 653 359 1.762 712 143 1.928 278 157 2.79 2 16 1.75 ±.2 4.3 646 355 1.816 75 141 1.993 274 155 2.156 197 158 1.8 ±.2 4.2 639 351 1.87 698 139 2.58 269 152 2.232 193 155 1.85 ±.2 4.2 632 347 1.924 691 136 2.122 265 15 2.38 189 153 1.9 ±.2 4.1 624 343 1.978 684 134 2.187 26 148 2.385 185 15 1.95 ±.2 4.1 617 339 2.33 677 131 2.252 256 146 2.461 181 148 2 ±.3 4. 61 336 2.87 67 129 2.316 251 144 2.537 177 145 2.1 ±.3 3.9 597 328 2.183 658 127 2.44 245 142 2.69 171 143 2.2 ±.3 3.8 584 321 2.28 646 124 2.563 239 139 2.843 165 141 2.3 ±.3 3.8 571 314 2.377 634 122 2.687 233 137 2.996 159 139 2.4 ±.3 3.6 557 37 2.474 623 119 2.81 227 135 3.149 154 136 2.5 ±.3 3.6 544 299 2.571 611 117 2.934 221 133 3.31 148 134 2.6 ±.3 3.6 531 292 2.668 599 114 3.57 215 13 3.454 142 132 2.7 ±.3 3.4 518 285 2.764 587 112 3.181 29 128 3.67 136 13 2.8 ±.3 3.4 57 279 2.875 575 111 3.348 24 127 3.85 132 129 2.9 ±.3 3.4 497 273 2.987 564 11 3.514 199 125 4.93 129 127 3 ±.3 3.3 486 267 3.98 552 19 3.681 194 124 4.335 125 126 3.1 ±.5 3.3 475 261 3.29 54 18 3.848 189 123 4.578 121 125 3.2 ±.5 3.2 465 256 3.32 528 17 4.14 183 122 4.821 118 123 3.3 ±.5 3.1 454 25 3.431 517 16 4.181 178 12 5.64 114 122 3.4 ±.5 3.1 443 244 3.542 55 15 4.348 173 119 5.37 11 121 3.5 ±.5 3.1 433 238 3.653 493 14 4.515 168 118 5.549 17 119 3.6 ±.5 3. 422 232 3.764 481 13 4.681 163 116 5.792 13 118 3.7 ±.5 3. 412 226 3.875 47 12 4.848 158 115 6.35 99 116 3.8 ±.5 3. 41 22 3.986 458 11 5.15 153 114 6.278 96 115 3.9 ±.5 2.9 39 215 4.97 446 1 5.182 148 113 6.521 92 114 16

Accu-P 85 Typical Electrical Tables Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ±.5 2.9 384 211 4.214 44 99 5.378 144 112 6.861 89 113 4.1 ±.5 2.9 378 28 4.331 434 98 5.574 141 112 7.21 86 113 4.2 ±.5 2.8 372 25 4.448 428 98 5.769 138 111 7.541 84 112 4.3 ±.5 2.7 366 22 4.564 422 97 5.965 134 111 7.881 81 111 4.4 ±.5 2.7 36 198 4.681 415 96 6.161 131 11 8.222 78 111 4.5 ±.5 2.7 355 195 4.798 49 96 6.357 128 11 8.562 75 11 4.6 ±.5 2.7 349 192 4.915 43 95 6.553 124 19 8.92 72 11 4.7 ±.5 2.6 343 188 5.32 397 94 6.749 121 19 9.242 69 19 5.1 ±.5 2.5 319 175 5.499 373 91 7.533 18 17 1.6 58 17 5.6 ±.5 2.4 289 159 6.83 342 88 8.513 91 14 12.3 44 14 6.2 ±.1 2.3 264 145 6.842 313 86 1.43 79 12 18.3 36 13 6.8 ±.1 2.2 239 131 7.61 283 84 12.35 68 11 23.76 28 12 7.5 ±.1 2.1 218 12 8.468 259 83 14.84 61 1 37.25 21 11 8.2 ±.1 2. 198 19 9.334 234 82 17.32 55 1 5.74 15 1 9.1 ±.1 1.9 179 99 1.57 213 82 24.9 46 1 n/a n/a n/a 1 ±1% 1.8 16 88 11.8 191 81 32.48 37 1 n/a n/a n/a 11 ±1% 1.7 139 77 13.17 167 81 4.9 26 11 n/a n/a n/a 12 ±1% 1.6 119 65 14.54 143 8 49.32 16 11 n/a n/a n/a 13 ±1% 1.6 11 6 16.17 134 8 n/a n/a n/a n/a n/a n/a 14 ±1% 1.5 11 55 17.79 125 8 n/a n/a n/a n/a n/a n/a 15 ±1% 1.5 92 51 19.42 116 8 n/a n/a n/a n/a n/a n/a 16 ±1% 1.4 87 48 21.13 11 79 n/a n/a n/a n/a n/a n/a 17 ±1% 1.4 83 46 22.85 14 78 n/a n/a n/a n/a n/a n/a 18 ±1% 1.3 78 43 24.57 99 77 n/a n/a n/a n/a n/a n/a 19 ±1% 1.3 73 4 26.41 92 77 n/a n/a n/a n/a n/a n/a 2 ±1% 1.3 67 37 28.26 85 76 n/a n/a n/a n/a n/a n/a 22 ±1% 1.2 57 31 31.95 72 76 n/a n/a n/a n/a n/a n/a 24 ±1% 1.2 46 25 35.64 59 75 n/a n/a n/a n/a n/a n/a 27 ±1% 1.1 41 22 44.94 54 74 n/a n/a n/a n/a n/a n/a 3 ±1% 1. 36 2 54.24 48 73 n/a n/a n/a n/a n/a n/a 33 ±1% 1. 3 17 63.54 42 72 n/a n/a n/a n/a n/a n/a 36 ±1%.9 25 14 72.84 37 71 n/a n/a n/a n/a n/a n/a 39 ±1%.9 2 11 82.14 31 7 n/a n/a n/a n/a n/a n/a 43 ±1%.9 16 9 12.9 27 66 n/a n/a n/a n/a n/a n/a 47 ±1%.8 12 7 123.7 23 63 n/a n/a n/a n/a n/a n/a 1 17

Accu-P 121 Typical Electrical Tables 1 Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ..1 ±.2 15.6 119 654.136 1176 3633.136 66 2149.136 45 268.15 ±.3 12.7 1179 648.19 1166 2129.19 597 147.191 444 137.2 ±.2 11. 1168 642.244 1156 1457.244 589 142.246 438 123.25 ±.2 9.8 1156 636.297 1145 186.299 581 826.31 432 816.3 ±.2 8.9 1145 63.351 1135 854.353 573 683.356 426 678.35 ±.2 8.3 1134 624.45 1125 697.48 565 581.411 421 58.4 ±.2 7.7 1123 618.459 1115 584.462 557 55.466 415 56.45 ±.2 7.3 1112 612.513 115 5.516 549 447.521 49 449.5 ±.2 6.9 111 66.567 195 435.571 541 4.576 43 44.55 ±.2 6.6 19 599.617 184 384.621 532 362.627 397 366.6 ±.2 6.3 179 593.666 174 342.672 524 331.679 391 335.65 ±.2 6. 168 587.716 164 38.723 516 34.731 385 39.7 ±.2 5.8 157 581.765 154 279.774 58 282.783 379 287.75 ±.2 5.6 146 575.815 144 255.824 5 262.834 374 267.8 ±.2 5.4 135 569.864 134 234.875 492 245.886 368 25.85 ±.2 5.3 123 563.914 124 216.926 484 23.938 362 236.9 ±.2 5.1 112 557.963 113 21.976 476 217.989 356 222.95 ±.2 5. 11 551 1.13 13 187 1.27 467 25 1.41 35 21 1 ±.2 5. 992 546 1.62 983 167 1.78 459 17 1.93 344 177 1.5 ±.2 4.9 981 539 1.17 975 163 1.124 451 167 1.141 338 174 1.1 ±.2 4.8 969 533 1.152 966 158 1.17 443 165 1.189 331 172 1.15 ±.2 4.7 958 527 1.196 958 154 1.217 435 162 1.236 325 169 1.2 ±.2 4.6 946 521 1.241 95 15 1.263 427 16 1.284 318 167 1.25 ±.2 4.5 935 514 1.285 942 146 1.39 419 157 1.332 312 164 1.3 ±.2 4.4 923 58 1.33 933 142 1.355 41 155 1.38 35 162 1.35 ±.2 4.3 912 52 1.375 925 138 1.42 42 152 1.428 299 159 1.4 ±.2 4.2 9 495 1.419 917 134 1.448 394 15 1.476 293 156 1.45 ±.2 4.1 889 489 1.464 98 129 1.494 386 147 1.524 286 154 1.5 ±.2 4.1 877 483 1.58 9 125 1.541 378 144 1.572 28 151 1.55 ±.2 4. 862 474 1.567 89 123 1.618 371 143 1.638 274 15 1.6 ±.2 3.9 846 465 1.626 881 122 1.694 363 142 1.74 268 149 1.65 ±.2 3.9 831 457 1.685 871 12 1.771 356 14 1.77 262 148 1.7 ±.2 3.8 815 448 1.743 862 118 1.848 349 139 1.836 256 147 1.75 ±.2 3.7 8 44 1.82 852 116 1.925 342 138 1.92 25 145 1.8 ±.2 3.7 784 431 1.861 843 114 2.2 334 136 1.968 244 144 1.85 ±.2 3.6 769 423 1.92 833 112 2.79 327 135 2.34 239 143 1.9 ±.2 3.5 753 414 1.978 824 11 2.156 32 134 2.1 233 142 1.95 ±.2 3.4 737 46 2.37 814 18 2.233 313 132 2.167 227 141 2 ±.3 3.3 722 397 2.96 85 17 2.31 35 131 2.233 221 139 2.1 ±.3 3.2 691 38 2.213 786 13 2.464 291 128 2.365 29 137 2.2 ±.3 3. 66 363 2.331 767 99 2.618 276 126 2.497 198 135 2.3 ±.3 2.9 644 354 2.42 747 97 2.681 268 123 2.613 191 132 2.4 ±.3 2.9 629 346 2.58 728 96 2.744 259 121 2.729 185 13 2.5 ±.3 2.8 614 338 2.597 79 94 2.87 251 118 2.845 179 128 2.6 ±.3 2.8 598 329 2.686 689 93 2.87 242 116 2.961 173 126 2.7 ±.3 2.7 583 321 2.775 67 91 2.933 234 114 3.77 167 123 2.8 ±.3 2.7 574 316 2.875 659 9 3.47 23 113 3.25 164 122 2.9 ±.3 2.7 566 311 2.975 647 89 3.162 227 112 3.334 161 121 3 ±.3 2.7 557 36 3.75 636 88 3.276 223 111 3.462 157 121 3.1 ±.5 2.7 548 32 3.174 625 87 3.39 22 11 3.59 154 12 3.2 ±.5 2.6 54 297 3.274 613 87 3.54 216 19 3.718 151 119 3.3 ±.5 2.6 531 292 3.374 62 86 3.619 213 18 3.847 148 118 3.4 ±.5 2.6 522 287 3.474 591 85 3.733 29 17 3.975 145 117 3.5 ±.5 2.6 514 283 3.574 579 84 3.847 26 16 4.13 141 116 3.6 ±.5 2.5 55 278 3.674 568 83 3.961 22 15 4.231 138 115 3.7 ±.5 2.5 496 273 3.773 556 82 4.76 198 14 4.359 135 114 3.8 ±.5 2.5 488 268 3.873 545 81 4.19 195 13 4.488 132 113 3.9 ±.5 2.4 479 264 3.973 534 8 4.34 191 12 4.616 129 112 18

Capacitance Self Q Standard Value Frequency Frequency Frequency @ 1MHz Resonance @ 1GHz 9MHz 19MHz 24MHz and Tolerance Frequency C (pf) Tol. (GHz) C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Typ. Min. Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. (pf) Typ. Typ. (mohm) Typ. 4 ±.5 2.4 473 26 4.83 528 79 4.435 189 11 4.768 127 112 4.1 ±.5 2.4 467 257 4.192 522 78 4.565 186 1 4.919 125 111 4.2 ±.5 2.4 462 254 4.32 516 78 4.695 183 1 5.71 123 11 4.3 ±.5 2.3 456 251 4.411 511 77 4.825 18 99 5.223 121 11 4.4 ±.5 2.3 45 247 4.521 55 76 4.956 178 98 5.375 119 19 4.5 ±.5 2.3 444 244 4.63 499 75 5.86 175 98 5.526 117 18 4.6 ±.5 2.3 438 241 4.74 493 75 5.216 172 97 5.678 115 18 4.7 ±.5 2.2 432 238 4.849 487 74 5.347 17 96 5.83 113 17 5.1 ±.5 2.1 48 225 5.288 464 71 5.868 159 93 6.437 16 15 5.6 ±.5 2. 379 28 5.835 435 67 6.519 145 9 7.195 96 12 6.2 ±.1 1.9 355 195 6.44 48 65 7.176 137 86 7.897 91 96 6.8 ±.1 1.8 33 182 7.44 38 62 7.832 129 83 8.599 85 91 7.5 ±.1 1.7 38 169 7.823 351 61 8.927 115 81 1.8 74 89 8.2 ±.1 1.7 285 157 8.61 322 6 1.2 1 78 11.55 63 87 9.1 ±.1 1.6 266 146 9.6 34 58 11.55 93 77 13.93 57 85 1 ±1% 1.5 247 136 1.6 285 57 13.9 85 76 16.3 5 84 11 ±1% 1.5 225 124 11.71 265 56 14.79 76 74 18.94 43 82 12 ±1% 1.4 24 112 12.82 244 54 16.49 68 73 21.57 36 81 13 ±1% 1.3 193 16 13.97 23 53 18.64 61 72 26.9 32 8 14 ±1% 1.3 181 99 15.13 215 53 2.8 55 71 3.61 28 79 15 ±1% 1.2 169 93 16.28 2 52 22.95 48 7 35.13 24 78 16 ±1% 1.2 164 9 17.51 195 51 26.1 46 69 46.51 22 76 17 ±1% 1.2 159 88 18.75 189 5 29.7 43 67 57.9 19 75 18 ±1% 1.1 154 85 19.98 183 49 32.14 41 66 69.29 17 73 19 ±1% 1.1 15 82 21.21 178 49 36.34 39 66 n/a n/a n/a 2 ±1% 1.1 145 8 22.43 172 49 4.55 38 65 n/a n/a n/a 22 ±1% 1. 136 75 24.88 162 49 48.96 34 64 n/a n/a n/a 24 ±1% 1. 126 7 27.34 151 48 57.38 31 63 n/a n/a n/a 27 ±1%.9 112 62 31.2 135 48 7. 26 62 n/a n/a n/a 3 ±1%.9 11 56 36.14 121 48 n/a n/a n/a n/a n/a n/a 33 ±1%.8 9 5 41.27 18 48 n/a n/a n/a n/a n/a n/a 36 ±1%.8 79 44 46.39 95 48 n/a n/a n/a n/a n/a n/a 39 ±1%.8 68 38 51.52 82 48 n/a n/a n/a n/a n/a n/a 43 ±1%.7 54 3 58.35 64 48 n/a n/a n/a n/a n/a n/a 47 ±1%.7 39 21 65.18 46 48 n/a n/a n/a n/a n/a n/a 82 ±1%.7 17 1 148.4 24 48 n/a n/a n/a n/a n/a n/a 1 19

Accu-P High Frequency Characteristics 2.5 Accu-P 15 Typical SRF vs Capacitance 1 Capacitance (pf) 2 1.5 1.5 5 1 15 2 25 3 35 SRF (GHz) Measured on HP872ES 1 Accu-P 15 Typical ESR vs Frequency ESR (mω) 1.5pF.8pF 1.pF 1.2pF 1.8pF 1 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 15 Typical Q vs Frequency Q 1 1.pF.8pF 2.4pF 1 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 2

Accu-P High Frequency Characteristics 35. Accu-P 21 Typical SRF vs Capacitance Capacitance (pf) 3. 25. 2. 15. 1. 1 5.. 5 1 15 2 25 SRF (GHz) Measured on HP872ES 1 Accu-P 21 Typical ESR vs Frequency ESR (mω).8pf 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF 1 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 21 Typical Q vs Frequency Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF 1 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 21

Accu-P High Frequency Characteristics 3. Accu-P 42 Typical SRF vs Capacitance 1 Capacitance (pf) 25. 2. 15. 1. 5.. 1 2 3 4 5 6 7 SRF (GHz) Measured on HP872ES 1 Accu-P 42 Typical ESR vs Frequency ESR (mω) 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 5 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 42 Typical Q vs Frequency Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 1 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 22

Accu-P High Frequency Characteristics 3. Accu-P 63 Typical SRF vs Capacitance Capacitance (pf) 25. 2. 15. 1. 5. 1. 5 1 15 2 25 3 35 4 SRF (GHz) Measured on HP872ES 35 Accu-P 63 Typical ESR vs Frequency ESR (mω) 3 25 2 15.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 1 5 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 63 Typical Q vs Frequency Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 1 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 23

Accu-P High Frequency Characteristics 1 Capacitance (pf) Accu-P 85 Typical SRF vs Capacitance 2 18 16 14 12 1 8 6 4 2 1 2 3 4 5 SRF (GHz) Measured on HP872ES 35 Accu-P 85 Typical ESR vs Frequency ESR (mω) 3 25 2 15.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 8.2pF 1 5 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 1 Accu-P 85 Typical Q vs Frequency Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 8.2pF 1 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 24

Accu-P High Frequency Characteristics Capacitance (pf) Accu-P 121 Typical SRF vs Capacitance 2 18 16 14 12 1 8 6 4 2 5 1 15 2 25 3 35 4 45 5 SRF (GHz) Measured on HP872ES 1 3 Accu-P 121 Typical ESR vs Frequency ESR (mω) 25 2 15 1 5.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A Accu-P 121 Typical Q vs Frequency 1 Q 1.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF 1 8 1 12 14 16 18 2 22 24 26 Frequency (MHz) Measured on Agilent 4278A/4991A 25

Accu-P Environmental / Mechanical Characteristics 1 ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Life (Endurance) 125 C, 2U R,1 hours No visible damage MIL-STD-22F Method 18A Δ C/C 2% for C 5pF Δ C.25pF for C<5pF Accelerated Damp 85 C, 85% RH, U R, 1 hours No visible damage Heat Steady State Δ C/C 2% for C 5pF MIL-STD-22F Method 13B Δ C.25pF for C<5pF Temperature Cycling -55 C to +125 C, 15 cycles Accu-P No visible damage MIL-STD-22F Method 17E Δ C/C 2% for C 5pF MIL-STD-883D Method 11.7 Δ C.25pF for C<5pF Resistance to Solder Heat 26 C ± 5 C for 1 secs C remains within initial limits IEC-68-2-58 MECHANICAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Solderability Components completely immersed in a Terminations to be well tinned, minimum 95% IEC-68-2-58 solder bath at 235 C for 2 secs. coverage Leach Resistance IEC-68-2-58 Components completely immersed in a solder bath at 26±5 C for 6 secs. Dissolution of termination faces 15% of area Dissolution of termination edges 25% of length Adhesion MIL-STD-22F Method 211A A force of 5N applied for 1 secs. No visible damage Termination Bond Strength Tested as shown in diagram No visible damage IEC-68-2-21 Amend. 2 D = 3mm Accu-P D = 1mm Accu-F Δ C/C 2% for C 5pF Δ C.25pF for C<5pF Robustness of Termination IEC-68-2-21 Amend. 2 A force of 5N applied for 1 secs. No visible damage High Frequency Vibration MIL-STD-22F Method 21A, 55Hz to 2Hz, 2G No visible damage 24D (Accu-P only) Storage 12 months minimum with components Good solderability stored in as received packaging D 45mm 45mm QUALITY & RELIABILITY Accu-P is based on well established thin-film technology and materials. ON-LINE PROCESS CONTROL This program forms an integral part of the production cycle and acts as a feedback system to regulate and control production processes. The test procedures, which are integrated into the production process, were developed after long research work and are based on the highly developed semiconductor industry test procedures and equipment. These measures help AVX to produce a consistent and high yield line of products. FINAL QUALITY INSPECTION Finished parts are tested for standard electrical parameters and visual/mechanical characteristics. Each production lot is 1% evaluated for: capacitance and proof voltage at 2.5 U R. In addition, production is periodically evaluated for: Average capacitance with histogram printout for capacitance distribution; IR and Breakdown Voltage distribution; Temperature Coefficient; Solderability; Dimensional, mechanical and temperature stability. QUALITY ASSURANCE The reliability of these thin-film chip capacitors has been studied intensively for several years. Various measures have been taken to obtain the high reliability required today by the industry. Quality assurance policy is based on well established international industry standards. The reliability of the capacitors is determined by accelerated testing under the following conditions: Life (Endurance) 125 C, 2U R, 1 hours Accelerated Damp Heat Steady State 85 C, 85% RH, U R, 1 hours. 26

Accu-P Performance Characteristics RF Power Applications RF POWER APPLICATIONS In RF power applications capacitor losses generate heat. Two factors of particular importance to designers are: Minimizing the generation of heat. Dissipating heat as efficiently as possible. CAPACITOR HEATING The major source of heat generation in a capacitor in RF power applications is a function of RF current (I) and ESR, from the relationship: Power dissipation = I 2 RMS x ESR Accu-P capacitors are specially designed to minimize ESR and therefore RF heating. Values of ESR for Accu-P capacitors are significantly less than those of ceramic MLC components currently available. HEAT DISSIPATION Heat is dissipated from a capacitor through a variety of paths, but the key factor in the removal of heat is the thermal conductivity of the capacitor material. The higher the thermal conductivity of the capacitor, the more rapidly heat will be dissipated. The table below illustrates the importance of thermal conductivity to the performance of Accu-P in power applications. 1 Amps 8 6 4 2 PRODUCT MATERIAL THERMAL CONDUCTIVITY W/mK Accu-P Alumina 18.9 Microwave MLC Magnesium Titanate 6. Power Handling Accu-P 1pF 121 85 85 63 42 Data used in calculating the graph: Thermal impedance of capacitors: 42 17 C/W 63 12 C/W 85 6.5 C/W 121 5 C/W Thermal impedance measured using RF generator, amplifier and strip-line transformer. ESR of capacitors measured on Boonton 34A 2 4 6 8 1 12 14MHz THERMAL IMPEDANCE Thermal impedance of Accu-P chips is shown below compared with the thermal impedance of Microwave MLC s. CAPACITOR TYPE CHIP SIZE THERMAL IMPEDANCE ( C/W) Accu-P 85 6.5 121 5 Microwave MLC 55 12 121 7.5 ADVANTAGES OF ACCU-P IN RF POWER CIRCUITS The optimized design of Accu-P offers the designer of RF power circuits the following advantages: Reduced power losses due to the inherently low ESR of Accu-P. Increased power dissipation due to the high thermal conductivity of Accu-P. THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR APPLICATION IS ITS PERFORMANCE UNDER OPERATING CONDITIONS IN THE ACTUAL CIRCUIT. The thermal impedance expresses the temperature difference in C between chip center and termination caused by a power dissipation of 1 watt in the chip. It is expressed in C/W. PRACTICAL APPLICATION IN RF POWER CIRCUITS There is a wide variety of different experimental methods for measuring the power handling performance of a capacitor in RF power circuits. Each method has its own problems and few of them exactly reproduce the conditions present in real circuit applications. Similarly, there is a very wide range of different circuit applications, all with their unique characteristics and operating conditions which cannot possibly be covered by such theoretical testing. 27

1 Accu-P Application Notes GENERAL Accu-P SMD capacitors are designed for soldering to printed circuit boards or other substrates. The construction of the components is such that they will withstand the time/temperature profiles used in both wave and reflow soldering methods. CIRCUIT BOARD TYPE The circuit board types which may be used with Accu-P are as follows: All flexible types of circuit boards (eg. FR-4, G-1) and also alumina. For other circuit board materials, please consult factory. REFLOW SOLDERING PAD DIMENSIONS: millimeters (inches) HANDLING SMD capacitors should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product gives the ideal medium for direct presentation to the placement machine. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during reflow soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap.5mm beneath large components. Pad overlap about.3mm beneath small components. c. Pad extension of.5mm for reflow of large components and pad extension about.3mm for reflow of small components. Pad extension about 1.mm for wave soldering. 15 21 42 63 85 121 Accu-P Accu-P Accu-P Accu-P Accu-P Accu-P.22 (.9).2 (.8).17 (.7).26 (-.1).78.26 (.3) (-.1).6 (.24).85 (.33) 1. (.39) 1. (.39).26 (-.1).34 (.13) 1.7 (.68).5 (.2).6 (.24).55 (.22) 2.3 (.91).6 (.24).85 (.33).8 (.31) 3. (.118) 1. (.39) 1. (.39) 4. (.157) 2. (.79) 1.25 (.49) 1. (.39) 2.5 (.98) 28

Accu-P Application Notes PREHEAT & SOLDERING The rate of preheat in production should not exceed 4 C/ second and a recommended maximum is about 2 C/second. Temperature differential from preheat to soldering should not exceed 1 C. For further specific application or process advice, please consult AVX. COOLING After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 15 C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 3 watts should be used and set to not more than 26 C. CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids....... i-propanol, ethanol, acetylacetone, water and other standard PCB cleaning liquids. Ultrasonic conditions.. power-2w/liter max. frequency-2khz to 45kHz. Temperature......... 8 C maximum (if not otherwise limited by chosen solvent system). Time............... 5 minutes max. STORAGE CONDITIONS Recommended storage conditions for Accu-P prior to use are as follows: Temperature.......... 15 C to 35 C Humidity............. 65% Air Pressure.......... 86mbar to 16mbar 1 RECOMMENDED REFLOW SOLDERING PROFILE COMPONENTS WITH SnPb TERMINATIONS RECOMMENDED REFLOW SOLDERING PROFILE LEAD FREE COMPONENTS WITH Sn1 TERMINATIONS COMPONENT LAND TEMP (DEG C) 22 21 2 19 18 17 16 15 14 13 12 11 1 9 8 7 6 5 4 3 2 Assembly enters the preheat zone Additional soak time to allow uniform heating of the substrate Soak time 1) Activates the flux 2) Allows center of board temperatures to catch up with corners 45-6 sec. above solder melting point Assembly exits heat no forced cooldown 186 C solder melting temperature.5 1 1.5 2 2.5 3 3.5 4 4.5 Time (mins) Temp (ºC) 33 26 25 2 15 1 5 Peak Temperature = 26ºC : :43 1:28 2:1 2:53 3:36 4:19 5:2 5:48 6:29 Time 29

Accu-P Automatic Insertion Packaging 1 TAPE & REEL All tape and reel specifications are in compliance with EIA 481-1-A. (equivalent to IEC 286 part 3). 8mm carrier Reeled quantities: Reels of 3, per 7" reel or 1, pieces per 13" reel 15, 21 and 42 = 5, pieces per 7" reel and 2, pieces per 13" reel REEL DIMENSIONS: millimeters (inches) A (1) B C D E F G 18±1. 1.5 min. 13±.2 2.2 min. 5 min. 9.6±1.5 14.4 max. (7.87±.39) (.59 min.) (.512 ±.8) (.795 min.) (1.969 min.) (.37 ±.5) (.567 max.) Metric dimensions will govern. Inch measurements rounded and for reference only. (1) 33mm (13 inch) reels are available. G MAX. B* C A D* E FULL RADIUS CARRIER DIMENSIONS: millimeters (inches) * DRIVE SPOKES OPTIONAL IF USED, ASTERISKED DIMENSIONS APPLY. A B C D E F +.1 8. ±.3 3.5 ±.5 1.75±.1 2. ±.5 4. ±.1 1.5 -. +.4 (.315 ±.12) (.138 ±.2) (.69 ±.4) (.79 ±.2) (.157 ±.4) (.59 ) The nominal dimensions of the component compartment (W,L) are derived from the component size. F -. F E D 1 PITCHES CUMULATIVE TOLERANCE ON TAPE ±.2 TOP TAPE W B C A L P DIRECTION OF FEED CENTER LINES OF CAVITY P = 4mm for 63, 85, 121 P = 2mm for C5, 21 and 42 AVX reserves the right to change the information published herein without notice. 3

Thin-Film RF/Microwave Inductor Technology Accu-L 31

Accu-L 21 Tight Tolerance SMD RF Thin Film Tuning Inductor ACCU-L TECHNOLOGY The L21 SMD Tuning Inductor is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. 2 APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s Filters Matching Networks HOW TO ORDER L21 XXX X H S TR Inductance (nh) Tolerance Series Lead Free Termination Taped & Reeled P/N Example: L213R3BHSTR QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Lead Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. DIMENSIONS: (TOP View) millimeters (inches) Recommended Pad Layout Dimensions mm (inches) B1.26 (.1) T W.78 (.31).26 (.1) L B2.26 (.1) L W T.6±.5 (.24±.2).325±.5 (.13±.2).225±.5 (.9±.2) B1 B2.1±.1 (.4±.4).15±.5 (.6±.2).34 (.13) 32

Accu-L 21 Tight Tolerance SMD RF Thin Film Tuning Inductor ELECTRICAL SPECIFICATIONS 45MHz 9MHz 19MHz 24MHz SRF RDC IDC Tolerance Q Q Q Q min. max. max. L(nH) A=±.5nH, B=±.1nH, (min) (Typ) (Typ) (Typ) (GHz) ( ) (ma) C=±.2nH, D=±.5nH.33 ±.5nH, ±.1nH, ±.2nH 13 24 36 39 35.1 55.39 ±.5nH, ±.1nH, ±.2nH 11 23 34 38 33.1 55.47 ±.5nH, ±.1nH, ±.2nH 1 18 26 3 32.1 55.56 ±.5nH, ±.1nH, ±.2nH 9 16 24 27 31.1 5.68 ±.5nH, ±.1nH, ±.2nH 8 19 28 32 3.2 5.82 ±.5nH, ±.1nH, ±.2nH 8 19 28 32 28.2 4 1. ±.5nH, ±.1nH, ±.2nH 7 16 26 3 26.2 4 1.2 ±.5nH, ±.1nH, ±.2nH 7 16 26 3 24.3 3 1.5 ±.1nH, ±.2nH, ±.5nH 7 16 26 3 23.5 25 1.8 ±.1nH, ±.2nH, ±.5nH 7 15 25 29 2.5 25 2.2 ±.1nH, ±.2nH, ±.5nH 7 15 22 24 18.6 2 2.7 ±.1nH, ±.2nH, ±.5nH 7 15 22 24 14.7 18 3.3 ±.1nH, ±.2nH, ±.5nH 7 15 22 24 13 1. 15 2 All intermediate Inductance values within the indicated range are available. 33

L42 Tight Tolerance RF Inductor GENERAL DESCRIPTION ITF TECHNOLOGY DIMENSIONS: (Bottom View) millimeters (inches) The L42 LGA Inductor is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. B S A 2 APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s Filters Matching Networks HOW TO ORDER L42 XXX X LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation H N TR T L W T W 1.±.1 (.39±.4).58±.7 (.23±.3).35±.1 (.14±.4) L A B S, H H.48±.5 (.19±.2).17±.5 (.7±.2).64±.5 (.3±.2) Inductance (nh) P/N Example: L423R3BHNTR Tolerance Series LGA Termination Sn1 Taped & Reeled LEAD-FREE COMPATIBLE COMPONENT QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Lead Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. MAKING AND ORIENTATION IN TAPE (Top View) Recommended Pad Layout Dimensions mm (inches).7 (.28) 1.6 (.63).6 (.24) 34

L42 Tight Tolerance RF Inductor ELECTRICAL SPECIFICATIONS 45MHz 9MHz 19MHz 24MHz SRF RDC IDC Tolerance Q Q Q Q Q min. max. max. L(nH) A=±.5nH, B=±.1nH, (min) (Typ) (Typ) (Typ) (Typ) (MHz) ( ) (ma) C=±.2nH, D=±.5nH.56 ±.5nH, ±.1nH 35 45 55 65 75 2.2 1.68 ±.5nH, ±.1nH 3 4 5 6 7 2.4 75.82 ±.5nH, ±.1nH 25 4 5 6 7 2.6 5 1. ±.5nH, ±.1nH 2 3 35 4 5 2.15 5 1.2 ±.5nH, ±.1nH, ±.2nH 2 3 3 4 45 2.2 4 1.5 ±.5nH, ±.1nH, ±.2nH 2 25 3 4 4 18.2 4 1.8 ±.5nH, ±.1nH, ±.2nH 18 2 3 35 4 16.2 4 2.2 ±.5nH, ±.1nH, ±.2nH 15 2 25 35 4 15.2 4 2.7 ±.5nH, ±.1nH, ±.2nH 15 2 25 35 4 95.25 25 3.3 ±.1nH, ±.2nH, ±.5nH 15 2 25 35 4 85.4 25 3.9 ±.1nH, ±.2nH, ±.5nH 13 2 2 3 3 8.45 25 4.7 ±.1nH, ±.2nH, ±.5nH 13 2 2 3 3 75.45 25 5.6 ±.1nH, ±.2nH, ±.5nH 13 2 2 3 3 7.65 2 6.8 ±.1nH, ±.2nH, ±.5nH 12 15 2 25 3 65.9 2 2 Please contact factory for intermediate inductance values within the indicated range. 35

Accu-L SMD High-Q RF Inductor 2 1 nh Inductor (Top View) ACCU-L TECHNOLOGY The Accu-L SMD Inductor is based on thin-film mul ti lay er technology. This technology provides a level of control on the elec tri cal and physical characteristics of the com po nent which gives consistent characteristics within a lot and lot-to-lot. The original design provides small size, excellent highfrequency performance and rugged construction for re li able automatic assembly. The Accu-L inductor is particularly suited for the tele com - mu ni ca tions industry where there is a continuing trend towards miniaturization and in creas ing frequencies. The Accu-L inductor meets both the per for mance and tolerance requirements of present cellular frequencies 45MHz and 9MHz and of future fre quen cies, such as 17MHz, 19MHz and 24MHz. FEATURES High Q RF Power Capability High SRF Low DC Resistance Ultra-Tight Tolerance on Inductance Standard 63 and 85 Chip Size Low Profile Rugged Construction Taped and Reeled APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Locations Systems Filters Matching Networks DIMENSIONS: millimeters (inches) 63 85 1.6±.1 2.11±.1 L (.63±.4) (.83±.4).81±.1 1.5±.1 W (.32±.4) (.59±.4).61±.1.91±.13 T (.24±.4) (.36±.5) T top:. +.3/-..25±.15 (.+.12) (.1±.6) L B bottom:.35±.2 (.14±.8) B W Operating/Storage Temp. Range: -55 C to +125 C 36

Accu-L 63 and 85 SMD High-Q RF Inductor HOW TO ORDER L 85 4R7 D E S TR Product Inductor Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT Size 63 85 For RoHS compliant products, please select correct termination style. Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = 22 4.7nH = 4R7 Tolerance for L 4.7nH, B = ±.1nH C = ±.2nH D = ±.5nH 4.7nH<L<1nH, C = ±.2nH D = ±.5nH L 1nH, G = ±2% J = ±5% Specification Code E = Accu-L 85 technology G = Accu-L 63 technology ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L 63 Termination Code W = Nickel/ solder coated (Sn 63, Pb 37) **S = Nickel/ Lead Free Solder coated (Sn1) Packaging Code TR = Tape and Reel (3,/reel) **RoHS compliant 2 Engineering Kits Available see pages 118-119 45 MHz 9 MHz 19 MHz 24 MHz IDC max Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (ma) Inductance Available Q Q Q Q L (nh) L (nh) L (nh) (MHz) (Ω) L (nh) Inductance Tolerance Typical Typical Typical Typical (1) 1.2 ±.1, ±.2nH 49 1.2 7 1.2 134 1.2 17 1.4 1 1.5 ±.1, ±.2nH 26 1.54 39 1.52 63 1.52 76 1.6 1 1.8 ±.1, ±.2nH 2 1.74 3 1.73 5 1.72 59 1.7 1 2.2 ±.1, ±.2nH 2 2.2 3 2.24 49 2.24 56 1.8 1 2.7 ±.1, ±.2nH 21 2.7 3 2.75 48 2.79 54 9.8 75 3.3 ±.1, ±.2, ±.5nH 24 3.33 35 3.39 56 3.47 64 84.8 75 3.9 ±.1, ±.2, ±.5nH 25 3.9 57 4.6 6 4.21 69 65.12 5 4.7 ±.1, ±.2, ±.5nH 23 4.68 32 4.92 46 5.2 49 55.15 5 5.6 ±.2, ±.5nH 26 5.65 36 5.94 54 6.23 6 5.25 3 6.8 ±.2, ±.5nH 23 6.9 33 7.3 47 8.1 39 45.3 3 8.2 ±.2, ±.5nH 23 8.4 31 1 35 12.1 31 38.35 3 1. ±2%, ±5% 28 1 39 11.8 47 14.1 41 35.45 3 12. ±2%, ±5% 28 13.2 38 14.1 3 17.2 2 3.5 3 15. ±2%, ±5% 28 16.2 38 25.9 3 49.8 15 25.6 3 (1) I DC measured for 15 C rise at 25 C ambient temperature when soldered to FR-4 board. Inductance and Q measured on Agilent 4291B / 4287 using the 16196A test fixture. ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L 85 45 MHz 9 MHz 17 MHz 24 MHz IDC max Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (ma) Inductance Available Q Q Q Q L (nh) L (nh) L (nh) (MHz) (Ω) T = 15 C T = 7 C L (nh) Inductance Tolerance Typical Typical Typical Typical (1) (2) 1.2 ±.1nH, ±.2nH, ±.5nH 6 1.2 92 1.2 122 1.2 92 1.5 1 2 1.5 ±.1nH, ±.2nH, ±.5nH 5 1.5 74 1.5 12 1.5 84 1.5 1 2 1.8 ±.1nH, ±.2nH, ±.5nH 5 1.8 72 1.8 88 1.9 73 1.6 1 2 2.2 ±.1nH, ±.2nH, ±.5nH 42 2.2 62 2.2 82 2.3 72 1.7 1 2 2.7 ±.1nH, ±.2nH, ±.5nH 42 2.7 62 2.8 8 2.9 7 1.8 1 2 3.3 ±.1nH, ±.2nH, ±.5nH 38 3.3 46 3.4 48 3.5 57 1.11 75 15 3.9 ±.1nH, ±.2nH, ±.5nH 27 3.9 36 4. 38 4.1 42 1.2 75 15 4.7 ±.1nH, ±.2nH, ±.5nH 43 4.8 62 5.3 76 5.8 6 55.1 75 15 5.6 ±.5nH 5 5.7 68 6.3 73 7.6 62 46.1 75 15 6.8 ±.5nH 43 7. 62 7.7 71 9.4 5 45.11 75 15 8.2 ±.5nH 43 8.5 56 1. 55 15.2 32 35.12 75 15 1 ±2%, ±5% 46 1.6 6 13.4 52 25.13 75 15 12 ±2%, ±5% 4 12.9 5 17.3 4 24.2 75 15 15 ±2%, ±5% 36 16.7 46 27 23 22.2 75 1 18 ±2%, ±5% 3 21.9 27 17.35 5 1 22 ±2%, ±5% 36 27.5 33 14.4 5 1 (1) I DC measured for 15 C rise at 25 C ambient temperature (2) I DC measured for 7 C rise at 25 C ambient temperature L, Q, SRF measured on HP 4291A, Boonton 34A and Wiltron 36 Vector Analyzer, R DC measured on Keithley 58 micro-ohmmeter. 37

Accu-L 63 and 85 SMD High-Q RF Inductor 2 L63 Typical Q vs. Frequency L63 18 16 14 12 Q 1 8 6 4 2 1 2 Frequency (GHz) 1.2nH 1.5nH 5.6nH 8.2nH 15nH 3 L (nh) 1 Typical Inductance vs. Frequency L63 15nH 8.2nH 1 6.8nH 4.7nH 3.3nH 2.2nH 1.8nH 1.2nH 1.5 1 1.5 2 2.5 3 Frequency (GHz) Measured on AGILENT 4291B/4287 using the 16196A test fixture Measured on AGILENT 4291B/4287 using the 16196A test fixture L85 Typical Q vs. Frequency L85 Typical Inductance vs. Frequency L85 14 12 1 1 1.2nH Q 8 6 4 1.5nH 1.8nH 5.6nH 1nH Inductance (nh) 1 22nH 15nH 1nH 5.6nH 15nH 2 22nH 1.8nH.1 1 Frequency (GHz) Measured on HP4291A and Boonton 34A Coaxial Line 1 1.1.1 1 1 Frequency (GHz) Measured on HP4291A and Wiltron 36 Vector Analyzer Maximum Temperature Rise at 25 C ambient temperature (on FR-4) L85 2 1 15nH 1nH 6.8nH 4.7nH 2.7nH T ( C) 1 1.5 1 1.5 2 2.5 3 3.5 Current (A) Temperature rise will typically be no higher than shown by the graph 38

Accu-L 63 and 85 SMD High-Q RF Inductor FINAL QUALITY INSPECTION Finished parts are tested for electrical parameters and visual/ mechanical characteristics. Parts are 1% tested for inductance at 45MHz. Parts are 1% tested for R DC. Each pro duc tion lot is eval u at ed on a sample basis for: Q at test frequency Static Humidity Resistance: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours 2 ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Solderability Components completely immersed in a solder bath at 235 ± 5 C for 2 secs. Terminations to be well tinned. No visible damage. Leach Resistance Components completely immersed in Dissolution of termination faces a solder bath at 26 ±5 C for 6 secs. 15% of area. Dissolution of termination edges 25% of length. Storage 12 months minimum with components stored in as received packaging. Good solderability Shear Components mounted to a substrate. No visible damage A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Rapid Change of Temperature Components mounted to a substrate. 5 cycles -55 C to +125 C. No visible damage Tested as shown in diagram Bend Strength No visible damage 1mm deflection 45mm Temperature Component placed in + to +125 ppm/ C L Coefficient of environmental chamber (typical) TCL = 2 -L 1 1 6 Inductance -55 C to +125 C. L T (TCL) 1 = 25 C 1 (T 2 -T 1 ) 45mm 39

2 Accu-L Application Notes HANDLING SMD chips should be handled with care to avoid dam age or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. CIRCUIT BOARD TYPE All flexible types of circuit boards may be used (e.g. FR-4, G-1) and also alumina. For other circuit board materials, please consult factory. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during sol der ing. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is per mis si ble to decrease this to as low as 85% of component width but it is not advisable to go be low this. b. Pad overlap about.3mm. c. Pad extension about.3mm for reflow. Pad ex ten sion about.8mm for wave soldering. REFLOW SOLDERING DIMENSIONS: millimeters (inches) 21 Accu-L.78 (.31).26 (.1).26 (.1).26 (.1).34 (.13) 42 Accu-L.6 (.24) 1.6 (.63).4 (.15).6 (.24).7 (.28) 2.3 (.91) 63 Accu-L PREHEAT & SOLDERING The rate of preheat in production should not exceed 4 C/second. It is recommended not to exceed 2 C/sec ond. Temperature differential from preheat to soldering should not exceed 15 C. For further specific application or process advice, please consult AVX..9 (.35).5 (.2).9 (.35).8 (.31) 2.8 (.11) 85 Accu-L.7 (.28) 1.4 (.55).7 (.28) 1.5 (.59) HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 1 C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a tem per a - ture controlled model not exceeding 3 watts should be used and set to not more than 26 C. Max i mum al lowed time at temperature is 1 minute. When hand sol der ing, the base side (white side) must be sol dered to the board. COOLING After soldering, the assembly should preferably be al lowed to cool naturally. In the event of assisted cool ing, similar conditions to those rec om mend ed for pre heat ing should be used. CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thor - ough ly cleaned of flux residues, especially the space be neath the device. Such residues may otherwise be come conductive and effectively offer a lossy bypass to the de vice. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids...... i-propanol, ethanol, acetylacetone, water, and other standard PCB cleaning liquids. Ultrasonic conditions.. power 2w/liter max. frequency 2kHz to 45kHz. Temperature......... 8 C maximum (if not oth er wise limited by chosen sol vent system). Time............... 5 minutes max. STORAGE CONDITIONS Recommended storage conditions for Accu-L prior to use are as follows: Temperature......... 15 C to 35 C Humidity........... 65% Air Pressure......... 86mbar to 16mbar RECOMMENDED SOLDERING PROFILE For recommended soldering profile see page 29 4 4

Thin-Film RF/Microwave Directional Couplers CP32/CP42/CP63/CP85 and DB63N/DB85 3dB 9 41

Thin Film Directional Couplers Wide Band High Directivity CP42W27FNTR ITF TECHNOLOGY The ITF High Directivity Wide Band LGA Coupler is based on thinfilm multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The Wide Band High Directivity Coupler displays a stable coupling factor over a wide frequency band. 3 HOW TO ORDER CP 42 W Type Wide Band QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Lead Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE -4 C to +85 C POWER RATING 3W RF Continuous XXXX Frequency (MHz) X Sub- Type N LGA Termination Sn1 TR Taped & Reeled APPLICATIONS Mobile communications Satellite TV receivers GPS Vehicle location systems Wireless LAN s DIMENSIONS (Bottom View) T A W B TERMINALS (Top View).2 (.8) GND Out.31 (.12) H L LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation S L W T A B S, H Coupling Recommended Pad Layout Dimensions mm (inches) IN mm (inches) 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2).2±.5 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2).15 (.6) 42.53 (.21)

Thin Film Directional Couplers Wide Band High Directivity CP42W27FNTR Directional Coupler Type CP42W27FNTR I. Loss Return Frequency Coupling Directivity P/N max. Loss [MHz] [db] [db] [db] [db] CP42W27FNTR 7-2,7 24±2.3 18 2 Coupling R Loss Isolation db -1-2 -2-4 -3-6 -4-8 -5-1 -6-12 5 1, 1,5 2, 2,5 3, I Loss db 3 Frequency MHz 43

Thin Film Directional Couplers Wide Band High Directivity CP42W27FNTR Test Jigs GENERAL DESCRIPTION These jigs are designed for testing the CP42W27FNTR High Directivity Couplers using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.254mm (.1") from the microstrips. The substrate used is Neltec s NH9338ST254C1BC. The connectors are SMA type (female), Johnson Components Inc. Product P/N: 142-71-841. Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2. Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. 3 Place the coupler on the measurement jig as follows: GND (Coupler) Connector 1 (Jig) IN (Coupler) Connector 3 (Jig) Coupling (Coupler) Connector 2 (Jig) Out (Coupler) Connector 4 (Jig) To measure I. Loss connect: Connector 3 (Jig) Port 1 (VNA) Connector 4 (Jig) Port 2 (VNA) Connector 2 (Jig) 5Ω To measure R. Loss and Coupling connect: Connector 3 (Jig) Port 1 (VNA) Connector 4 (Jig) 5Ω Connector 2 (Jig) Port 2 (VNA) To measure Isolation connect: Connector 4 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) Port 2 (VNA) Measurement Jig Calibration Jig Connector 4 OPEN HS Connector 1 (not used) TH Connector 2 Open Line Short Line to GND. OPEN HS TH Connector Johnson P/N 142-71-841 Load & Through Connector 3 Load & Through 44

Thin Film Directional Couplers WiFi Band High Directivity CP32P5425ENTR / CP32A5425ENTR / CP42Q5425ENTR / CP63Q5425ENTR HIGH DIRECTIVITY DIRECTIONAL COUPLERS FOR WIFI BANDS TECHNOLOGY These High Directivity LGA Couplers are based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The WiFi Bands Couplers are offered in 32, 42 and 63 standard sizes having identical electrical performance. APPLICATIONS: WiFi PART NUMBERS CP32P5425ENTR CP32A5425ENTR CP42Q5425ENTR CP63Q5425ENTR QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance : 125 C, IR, 4 hours TERMINATION Nickel/Lead-Free Solder coating (Sn1) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE -4 C to +85 C TERMINALS (Top View) OUT 5 OHM OUT 5 OHM DIMENSIONS (Bottom View) mm (inches) T L W T A B S, H A W B H L CP32 CP42 CP63.65±.4 1.±.5 1.6±.1 (.26±.2) (.4±.2) (.63±.4).5±.4.58±.4.84±.1 (.2±.2) (.23±.2) (.33±.4).25±.5.35±.5.6±.1 (.1±.2) (.14±.2) (.24±.4).2±.5.2±.5.25±.5 (.8±.2) (.8±.2) (.1±.2).1±.4.18±.5.2±.5 (.4±.2) (.7±.2) (.8±.2).25±.25.5±.5.5±.5 (.1±.1) (.2±.2) (.2±.2) RECOMMENDED PAD LAYOUT DIMENSTIONS mm (inches) CP32.2 (.8).3 (.12) S.25 (.1) 3 IN CP32 COUPLING IN CP42 COUPLING.2 (.8) OUT 5 OHM CP42 / CP63: see pages 49 / 53 IN COUPLING CP63 45

Thin Film Directional Couplers WiFi Band High Directivity ELECTRICAL CHARACTERISTICS P/N CP32P5425ENTR I. Loss Return Frequency Coupling Directivity max. Loss [MHz] [db] [db] [db] [db] 2,4-2,496-2±.5 -.2-3 2 4,9-5,95-13±.5 -.4-25 2 P/N CP32A5425ENTR I. Loss Return Frequency Coupling Directivity max. Loss [MHz] [db] [db] [db] [db] 2,4-2,496-2±1 -.2-3 2 4,9-5,95-13±1 -.4-25 2 3 P/N I. Loss Return Frequency Coupling Directivity max. Loss [MHz] [db] [db] [db] [db] CP42Q5425ENTR 2,4-2,496-2±1 -.3-3 2 CP63Q5425ENTR 4,9-5,95-13±1 -.4-25 2 Coupling R Loss Isolation db -1-2 -3-4 -5-6 -7 1 2 3 4 5 6-1 -2-3 -4-5 -6-7 I Loss db [GHz] 46

Thin Film Directional Coupler CP42P High Directivity, Tight Coupling Tolerance GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The CP42P Series High Directivity, Tight Coupling Tolerance LGA Coupler is based on the proprietary RFAP Thin-Film multilayer technology. The technology provides a miniature part with excellent high frequency performance and ugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. DIMENSIONS: (Bottom View) A B millimeters (inches) S APPLICATIONS Wireless communications Wireless LAN s GPS WiMAX HOW TO ORDER CP 42 LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Power Rating 3W RF Continuous P XXXX T X L W T W 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2) N A B S L.2±.5 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2) TR 3 Style Size 42 Type ±.5dB Tight Tolerance Frequency MHz Sub-Type Termination LGA Lead-Free Taped & Reeled QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINALS (Top View) OUT 5 OHM LEAD-FREE COMPATIBLE COMPONENT TERMINATION Nickel/Lead-Free Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE: -4 C to +85 C IN.2 (.8).31 (.12) COUPLING Recommended Pad Layout Dimensions mm (inches).15 (.6).53 (.21) 47

Thin Film Directional Coupler CP42P High Directivity, Tight Coupling Tolerance Coupler P/N CP42PxxxxAN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP42P836AN 824-849 19.1±.5.25 32 CP42P881AN 869-894 18.6±.5.25 31 GSM CP42P92AN 89-915 18.5±.5.25 31 CP42P947AN 935-96 18.±.5.25 31 E-GSM CP42P897AN 88-915 18.5±.5.25 31 CP42P942AN 925-96 18.±.5.25 31 PDC CP42P1441AN 1429-1453 14.5±.5.4 28 21 CP42P1747AN 171-1785 13.±.5.5 26 PCN CP42P1842AN 185-188 12.5±.5.5 26 PCS CP42P188AN 185-191 12.3±.5.5 25 CP42P196AN 193-199 12.±.5.5 25 PHP CP42P197AN 1895-192 12.3±.5.5 25 DECT CP42P189AN 188-19 12.3±.5.5 25 Wireless LAN CP42P2442AN 24-2484 1.3±.5.7 23 CP42P35AN 345-355 7.6±.5 1.3 15 14 WiFi CP42P5AN 495-55 5.±.5 1.5 15 13 CP42P55AN 545-555 4.6±.5 1.5 14 13 CP42P6AN 595-65 4.±.5 1.5 14 13 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP42PxxxxANTR -6-72.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -12-24 -36-48 -6 I Loss [db] 3 Coupler P/N CP42PxxxxBN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42P836BN 824-849 22.±.5.2 28 CP42P881BN 869-894 21.7±.5.2 28 GSM CP42P92BN 89-915 21.5±.5.2 28 CP42P947BN 935-96 21.±.5.25 27 E-GSM CP42P897BN 88-915 21.5±.5.2 28 CP42P942BN 925-96 21.±.5.25 27 PDC CP42P1441BN 1429-1453 17.5±.5.25 24 27 PCN CP42P1747BN 171-1785 16.±.5.3 23 CP42P1842BN 185-188 15.5±.5.35 23 PCS CP42P188BN 185-191 15.5±.5.35 23 CP42P196BN 193-199 15.±.5.35 22 PHP CP42P197BN 1895-192 15.5±.5.35 23 DECT CP42P189BN 188-19 15.5±.5.35 23 Wireless LAN CP42P2442BN 24-2484 13.3±.5.4 21 CP42P35BN 345-355 9.4±.5.8 18 14 WiFi CP42P5BN 495-55 7.4±.5 1.2 14 13 CP42P55BN 545-555 6.7±.5 1.6 14 13 CP42P6BN 595-65 6.1±.5 2. 14 13 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP42PxxxxBNTR -6-24.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -4-8 -12-16 -2 I Loss [db] Coupler P/N CP42PxxxxEN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42P836EN 824-849 27.2±.5.2 35 CP42P881EN 869-894 26.8±.5.2 34 GSM CP42P92EN 89-915 26.5±.5.2 34 CP42P947EN 935-96 26.±.5.2 34 25 E-GSM CP42P897EN 88-915 26.5±.5.2 34 CP42P942EN 925-96 26.±.5.2 34 PDC CP42P1441EN 1429-1453 22.3±.5.25 29 PCN CP42P1747EN 171-1785 2.5±.5.25 27 CP42P1842EN 185-188 2.3±.5.25 26 PCS CP42P188EN 185-191 2.±.5.25 26 CP42P196EN 193-199 2.±.5.25 26 23 PHP CP42P197EN 1895-192 2.±.5.25 26 DECT CP42P189EN 188-19 2.±.5.25 26 Wireless LAN CP42P2442EN 24-2484 18.±.5.35 23 CP42P35EN 345-355 15.±.5.37 2 16 WiFi CP42P5EN 495-55 12.5±.5.5 18 13 CP42P55EN 545-555 11.5±.5.65 16 13 CP42P6EN 595-65 11.1±.5.7 15 13 Coupling, Return Loss, Isolation, [db] -1-2 -3 I. Loss Coupling R. Loss -4-5 Isolation CP42PxxxxENTR -6-12.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -2-4 -6-8 -1 I Loss [db] 48

Thin-Film Directional Couplers CP42 High Directivity LGA Termination GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF High Directivity LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP Style Directional Coupler 42 Size 42 QUALITY INSPECTION X Type Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Sn9Pb1 or Lead-Free Sn1 Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. ORIENTATION IN TAPE FEATURES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Operating/Storage Temp -4 C to +85 C Power Rating 3W RF Cont **** Frequency (MHz) DIMENSIONS: (Bottom View) T L W T X Sub Type W N LGA Termination L = LGA Sn9, Pb1 **N = LGA Sn1 TERMINALS (Top View) OUT IN.31 (.12) A 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2) B **RoHS compliant 5 OHM COUPLING Recommended Pad Layout Dimensions millimeters (inches) A B S L TR S.2±.5 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2) Packaging Code TR = Tape and Reel Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. mm (inches) 3 OUT 5 OHM OUT 5 OHM.2 (.8).15 (.6) IN CP IN CP.53 (.21) *The recommended distance to the PCB Ground Plane is.254mm (.1") 49

Thin-Film Directional Couplers CP42 High Directivity LGA Termination CP42 - TYPE SELECTION CHART Coupling vs. Frequency -5-1 CP42AxxxxAN CP42AxxxxBN CP42AxxxxCN CP42AxxxxDN CP42AxxxxEN 3 Coupling [db] -15-2 CP42AxxxxFN -25-3 -35-4.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Frequency [GHz] Intermediate coupling factors are readily available. Please contact factory. 5

Thin-Film Directional Couplers CP42 High Directivity LGA Termination Coupler P/N CP42AxxxxAN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP42A836AN 824-849 19.1.25 32 CP42A881AN 869-894 18.6.25 31 GSM CP42A92AN 89-915 18.5.25 31 CP42A947AN 935-96 18..25 31 E-GSM CP42A897AN 88 915 18.5.25 31 CP42A942AN 925 96 18..25 31 PDC CP42A1441AN 1429-1453 14.5.4 28 21 CP42A1747AN 171-1785 13..5 26 PCN CP42A1842AN 185-188 12.5.5 26 PCS CP42A188AN 185-191 12.3.5 25 CP42A196AN 193-199 12..5 25 PHP CP42A197AN 1895-192 12.3.5 25 DECT CP42A189AN 188-19 12.3.5 25 Wireless LAN CP42A2442AN 24-2484 1.3.7 23 CP42A35AN 345-355 7.6 1.3 15 14 WiFi CP42A5AN 495-55 5. 1.5 15 13 CP42A55AN 545-555 4.6 1.5 14 13 CP42A6AN 595-65 4. 1.5 14 13 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP42AxxxxANTR -6-72.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -12-24 -36-48 -6 I Loss [db] Coupler P/N CP42AxxxxBN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836BN 824-849 22..2 28 CP42A881BN 869-894 21.7.2 28 GSM CP42A92BN 89-915 21.5.2 28 CP42A947BN 935-96 21..25 27 E-GSM CP42A897BN 88 915 21.5.2 28 CP42A942BN 925 96 21..25 27 PDC CP42A1441BN 1429-1453 17.5.25 24 27 CP42A1747BN 171-1785 16..3 23 PCN CP42A1842BN 185-188 15.5.35 23 PCS CP42A188BN 185-191 15.5.35 23 CP42A196BN 193-199 15..35 22 PHP CP42A197BN 1895-192 15.5.35 23 DECT CP42A189BN 188-19 15.5.35 23 Wireless LAN CP42A2442BN 24-2484 13.3.4 21 CP42A35BN 345-355 9.4.8 18 14 WiFi CP42A5BN 495-55 7.4 1.2 14 13 CP42A55BN 545-555 6.7 1.6 14 13 CP42A6BN 595-65 6.1 2. 14 13 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP42AxxxxBNTR 7.318" -6-24.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -4-8 -12-16 -2 I Loss [db] 3 Coupler P/N CP42AxxxxCN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836CN 824-849 23.6.2 33 CP42A881CN 869-894 23..2 33 GSM CP42A92CN 89-915 23..2 26 CP42A947CN 935-96 22.5.2 33 22 E-GSM CP42A897CN 88 915 23..2 25 CP42A942CN 925 96 22.5.2 32 PDC CP42A1441CN 1429-1453 19..25 31 PCN CP42A1747CN 171-1785 17.2.25 3 CP42A1842CN 185-188 17..25 3 PCS CP42A188CN 185-191 16.8.25 3 CP42A196CN 193-199 16.5.25 29 19 PHP CP42A197CN 1895-192 16.8.25 29 DECT CP42A189CN 188-19 16.8.25 3 Wireless LAN CP42A2442CN 24-2484 14.7.45 28 CP42A35CN 345-355 1.97.67 23 17 WiFi CP42A5CN 495-55 8. 1. 21 16 CP42A55CN 545-555 7.5 1.1 21 15 CP42A6CN 595-65 7.1 1.3 23 15 Coupling, Return Loss, Isolation, [db] I. Loss -1-2 -3-4 Coupling R. Loss -5 Isolation CP42AxxxxCNTR -6-24.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -4-8 -12-16 -2 I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 51

Thin-Film Directional Couplers CP42 High Directivity LGA Termination Coupler P/N CP42AxxxxDN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP42A836DN 824-849 25.2.2 29 CP42A881DN 869-894 24.8.2 28 GSM CP42A92DN 89-915 24.7.2 28 CP42A947DN 935-96 24.1.2 28 2 E-GSM CP42A897DN 88 915 24.7.2 28 CP42A942DN 925 96 24.1.2 28 PDC CP42A1441DN 1429-1453 2.5.2 25 PCN CP42A1747DN 171-1785 19..2 24 CP42A1842DN 185-188 18.5.25 23 PCS CP42A188DN 185-191 18.2.25 23 CP42A196DN 193-199 18..25 23 18 PHP CP42A197DN 1895-192 18.1.25 23 DECT CP42A189DN 188-19 18.2.25 23 Wireless LAN CP42A2442DN 24-2484 16..35 22 CP42A35DN 345-355 12.5.46 21 17 WiFi CP42A5DN 495-55 1..65 21 16 CP42A55DN 545-555 9.6.76 2 15 CP42A6DN 595-65 9.1.84 2 15 Coupling, Return Loss, Isolation, [db] -1-2 -4-5 I. Loss Coupling -3 R. Loss CP42AxxxxDNTR Isolation -6-12.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -2-4 -6-8 -1 I Loss [db] 3 Coupler P/N CP42AxxxxEN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836EN 824-849 27.2.2 35 CP42A881EN 869-894 26.8.2 34 GSM CP42A92EN 89-915 26.5.2 34 CP42A947EN 935-96 26..2 34 25 E-GSM CP42A897EN 88 915 26.5.2 34 CP42A942EN 925 96 26..2 34 PDC CP42A1441EN 1429-1453 22.3.25 29 PCN CP42A1747EN 171-1785 2.5.25 27 CP42A1842EN 185-188 2.3.25 26 PCS CP42A188EN 185-191 2..25 26 CP42A196EN 193-199 2..25 26 23 PHP CP42A197EN 1895-192 2..25 26 DECT CP42A189EN 188-19 2..25 26 Wireless LAN CP42A2442EN 24-2484 18..35 23 CP42A35EN 345-355 15..37 2 16 WiFi CP42A5EN 495-55 12.5.5 18 13 CP42A55EN 545-555 11.5.65 16 13 CP42A6EN 595-65 11.1.7 15 13 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP42AxxxxENTR -6-12.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -2-4 -6-8 -1 I Loss [db] Coupler P/N CP42AxxxxFN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] AMPS CP42A836FN 824-849 31..2 29.1 CP42A881FN 869-894 3.7.2 28.6 GSM CP42A92FN 89-915 3.6.2 28.5 CP42A947FN 935-96 3..2 28.1 E-GSM CP42A897FN 88 915 3.6.2 28.5 CP42A942FN 925 96 3..2 28.1 PDC CP42A1441FN 1429-1453 26.5.2 25. 11 PCN CP42A1747FN 171-1785 25..2 23.8 CP.42A1842FN 185-188 24.5.2 23.6 PCS CP42A188FN 185-191 24.2.2 23.5 CP42A196FN 193-199 24..2 23.3 PHP CP42A197FN 1895-192 24.2.2 23.4 DECT CP42A189FN 188-19 24.2.2 23.5 Wireless LAN CP42A2442FN 24-2484 22..25 22.6 CP42A35FN 345-355 18..27 22. 9 WiFi CP42A5FN 495-55 15.7.3 23.1 8 CP42A55FN 545-555 15.2.3 2.36 7.5 CP42A6FN 595-65 14.5.3 18.94 7.5 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss R. Loss Coupling Isolation CP42AxxxxFNTR -6-6.8 1.6 2.4 3.2 4 4.8 5.6 6.4-1 -2-3 -4-5 I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 52

Thin-Film Directional Couplers CP63 High Directivity LGA Termination GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. DIMENSIONS: (Bottom View) A B millimeters (inches) S APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP 63 FEATURES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Operating/Storage Temp -4 C to +85 C Power Rating 3W RF Cont X **** T L W T X W 1.6±.1 (.63±.4).84±.1 (.33±.4).6±.1 (.24±.4) N A B S L.25±.5 (.1±.2).2±.5 (.8±.2).5±.5 (.2±.2) TR 3 Style Directional Coupler Size 63 Type Frequency (MHz) Sub Type Termination Code L = LGA Sn9, Pb1 **N = LGA Sn1 Packaging Code TR = Tape and Reel **RoHS compliant QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Sn9Pb1 or Lead-Free Sn1 Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. ORIENTATION IN TAPE TERMINALS (Top View) OUT IN 5 OHM COUPLING Recommended Pad Layout Dimensions Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. mm (inches) OUT IN 5 OHM CP OUT IN 5 OHM CP 1.75 (.69).5 (.2).4 (.16) 1.1 (.43) *The recommended distance to the PCB Ground Plane is.254mm (.1") 53

Thin-Film Directional Couplers CP63 High Directivity LGA Termination CP63 - TYPE SELECTION CHART Coupling vs. Frequency -5-1 CP63AxxxxCN CP63AxxxxHN CP63AxxxxKN CP63AxxxxAN CP63AxxxxDN CP63AxxxxBN CP63AxxxxMN CP63AxxxxEN CP63AxxxxLN -15 CP63AxxxxFN 3 db -2 CP63AxxxxGN -25-3 -35-4.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Frequency [GHz] Intermediate coupling factors are readily available. Please contact factory. 54

Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxAN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836AN 824-849 2..25 28 CP63A881AN 869-894 19.7.25 28 GSM CP63A92AN 89-915 19.4.25 27 CP63A947AN 935-96 19..25 27 E-GSM CP63A897AN 88-915 19.4.25 28 CP63A942AN 925-96 19..25 27 PDC CP63A1441AN 1429-1453 15.5.4 24 22 CP63A1747AN 171-1785 14..5 22 PCN CP63A1842AN 185-188 13.5.5 22 PCS CP63A188AN 185-191 13.2.5 22 CP63A196AN 193-199 13..55 21 PHP CP63A197AN 1895-192 13.2.5 22 DECT CP63A189AN 188-19 13.2.5 22 Wireless LAN CP63A2442AN 24-2484 11.5.75 2 CP63A35AN 345-355 8.6 1.3 17 2 WiFi CP63A5AN 495-55 6.1 2.2 13 14 CP63A55AN 545-555 5.5 2.5 15 13 CP63A6AN 595-65 5 3 11.6 13 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP63AxxxxANTR -6-48.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -8-16 -24-32 -4 I Loss [db] Coupler P/N CP63AxxxxBN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836BN 824-849 23..2 31 CP63A881BN 869-894 22.7.2 31 GSM CP63A92BN 89-915 22.5.2 31 CP63A947BN 935-96 22..2 3 24 E-GSM CP63A897BN 88-915 22.5.2 31 CP63A942BN 925-96 22..2 3 PDC CP63A1441BN 1429-1453 18.5.25 27 PCN CP63A1747BN 171-1785 17..25 25 CP63A1842BN 185-188 16.4.25 25 PCS CP63A188BN 185-191 16.2.25 25 CP63A196BN 193-199 16..25 24 21 PHP CP63A197BN 1895-192 16.1.25 25 DECT CP63A189BN 188-19 16.2.25 25 Wireless LAN CP63A2442BN 24-2484 14.2.35 23 CP63A35BN 345-355 11.2.6 2 2 WiFi CP63A5BN 495-55 8.4 1.1 16.7 17 CP63A55BN 545-555 7.8 1.4 15.7 16 CP63A6BN 595-65 7.2 1.6 15 15 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 I. Loss Coupling R. Loss CP63AxxxxBNTR Isolation -5-1.8 1.6 2.4 3.2 4. 4.8 5.6 6.4 Frequency [GHz] -2-4 -6-8 I Loss [db] 3 Coupler P/N CP63AxxxxCN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836CN 824-849 15.2.35 23 CP63A881CN 869-894 15..35 23 GSM CP63A92CN 89-915 14.7.35 23 CP63A947CN 935-96 14.3.4 22 23 E-GSM CP63A897CN 88-915 14.7.35 23 CP63A942CN 925-96 14.3.4 22 PDC CP63A1441CN 1429-1453 11..7 19 PCN CP63A1747CN 171-1785 9.5.8 18 CP63A1842CN 185-188 9..9 17 PCS CP63A188CN 185-191 8.8.9 17 CP63A196CN 193-199 8.5 1. 17 21 PHP CP63A197CN 1895-192 8.8.9 17 DECT CP63A189CN 188-19 8.8.9 17 Wireless LAN CP63A2442CN 24-2484 7. 1.4 15 CP63A35CN 345-355 4.8 2. 23 2 WiFi CP63A5CN 495-55 3. 3.6 21 17 CP63A55CN 545-555 3. 4. 2.6 16 CP63A6CN 595-65 2.5 4.5 2.5 16 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP63AxxxxCNTR -6-12.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -2-4 -6-8 -1 I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 55

Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxDN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836DN 824-849 22..25 31 CP63A881DN 869-894 21.8.25 3 GSM CP63A92DN 89-915 21.3.25 3 CP63A947DN 935-96 21..3 3 3 E-GSM CP63A897DN 88-915 21.3.25 3 CP63A942DN 925-96 21..3 3 PDC CP63A1441DN 1429-1453 17.7.4 27 PCN CP63A1747DN 171-1785 16..4 25 CP63A1842DN 185-188 15.4.4 25 PCS CP63A188DN 185-191 15.2.4 24 CP63A196DN 193-199 15..4 24 25 PHP CP63A197DN 1895-192 15.2.4 24 DECT CP63A189DN 188-19 15.2.4 24 Wireless LAN CP63A2442DN 24-2484 13.3.55 22 CP63A35DN 345-355 1.1.66 25.3 2 WiFi CP63A5DN 495-55 7.8 1.17 21.1 18 CP63A55DN 545-555 6.8 1.39 19.9 18 CP63A6DN 595-65 6.3 1.64 18.8 17 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP63AxxxxDNTR -6-24.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -4-8 -12-16 -2 I Loss [db] 3 Coupler P/N CP63AxxxxEN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836EN 824-849 25.8.2 32 CP63A881EN 869-894 25.3.2 32 GSM CP63A92EN 89-915 25..2 32 CP63A947EN 935-96 24.7.2 31 E-GSM CP63A897EN 88-915 26..2 32 CP63A942EN 925-96 24.7.2 31 PDC CP63A1441EN 1429-1453 22..25 28 21 PCN CP63A1747EN 171-1785 19.5.3 26 CP63A1842EN 185-188 19..3 26 PCS CP63A188EN 185-191 18.8.3 26 CP63A196EN 193-199 18.5.3 26 PHP CP63A197EN 1895-192 18.7.3 26 DECT CP63A189EN 188-19 18.8.3 26 Wireless LAN CP63A2442EN 24-2484 17..4 24 CP63A35EN 345-355 13.2.5 18 2 WiFi CP63A5EN 495-55 1.7.9 13 16 CP63A55EN 545-555 1.2 1.2 12 15 CP63A6EN 595-65 9.7 1.4 12 14 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP63AxxxxENTR -6-24.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -4-8 -12-16 -2 I Loss [db] Coupler P/N CP63AxxxxFN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836FN 824-849 31.2.2 32 CP63A881FN 869-894 3.8.2 32 GSM CP63A92FN 89-915 3.5.2 3 CP63A947FN 935-96 3.2.2 3 E-GSM CP63A897FN 88-915 3.5.2 3 CP63A942FN 925-96 3.2.2 3 PDC CP63A1441FN 1429-1453 27..25 28 12 CP63A1747FN 171-1785 25..25 27 PCN CP63A1842FN 185-188 26.5.25 27 PCS CP63A188FN 185-191 24.3.25 27 CP63A196FN 193-199 24..25 28 PHP CP63A197FN 1895-192 24.2.25 27 DECT CP63A189FN 188-19 24.2.25 27 Wireless LAN CP63A2442FN 24-2484 21.5.25 25 CP63A35FN 345-355 17.8.33 2. 13 WiFi CP63A5FN 495-55 15.4.62 14.86 12 CP63A55FN 545-555 14.8.86 13.58 12 CP63A6FN 595-65 14.3 1.2 12.58 11 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP63AxxxxFNTR -6-24.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -4-8 -12-16 -2 I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 56

Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxGN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836GN 824-849 34.2.2 3 CP63A881GN 869-894 33.8.2 3 GSM CP63A92GN 89-915 33.6.2 3 CP63A947GN 935-96 33.2.2 29 E-GSM CP63A897GN 88-915 33.6.2 3 CP63A942GN 925-96 33.2.2 29 PDC CP63A1441GN 1429-1453 3..25 25 13 CP63A1747GN 171-1785 28.5.25 24 PCN CP63A1842GN 185-188 28..25 24 PCS CP63A188GN 185-191 27.7.25 24 CP63A196GN 193-199 27.5.25 23 PHP CP63A197GN 1895-192 27.6.25 24 DECT CP63A189GN 188-19 27.7.25 24 Wireless LAN CP63A2442GN 24-2484 25.5.25 22 CP63A35GN 345-355 21.6.31 2 13 WiFi CP63A5GN 495-55 19.39 16 12 CP63A55GN 545-555 18.5.57 15 12 CP63A6GN 595-65 18..74 14 11 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss R. Loss Coupling Isolation CP63AxxxxGNTR -6-24.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -4-8 -12-16 -2 I Loss [db] Coupler P/N CP63AxxxxHN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836HN 824-849 17.3.3 26 CP63A881HN 869-894 17..3 25 GSM CP63A92HN 89-915 16.7.3 25 CP63A947HN 935-96 16.3.35 25 26 E-GSM CP63A897HN 88-915 17..35 25 CP63A942HN 925-96 16.3.35 25 PDC CP63A1441HN 1429-1453 13..55 22 PCN CP63A1747HN 171-1785 11.4.75 2 CP63A1842HN 185-188 11..75 2 PCS CP63A188HN 185-191 1.8.75 19 CP63A196HN 193-199 1.5.75 19 24 PHP CP63A197HN 1895-192 1.7.75 19 DECT CP63A189HN 188-19 1.8.75 19 Wireless LAN CP63A2442HN 24-2484 8.8 1. 17 CP63A35HN 345-355 5.9 1.48 25 21 WiFi CP63A5HN 495-55 4.4 2.59 22 18 CP63A55HN 545-555 4 2.95 22 17 CP63A6HN 595-65 3.5 3.37 21 17 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 I. Loss Coupling R. Loss CP63AxxxxHNTR Isolation -5-5.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -1-2 -3-4 I Loss [db] 3 Coupler P/N CP63AxxxxMN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836MN 824-849 24.2.2 33 CP63A881MN 869-894 23.8.2 32 GSM CP63A92MN 89-915 23.4.2 32 CP63A947MN 935-96 23.2.2 32 23 E-GSM CP63A897MN 88-915 23.4.2 32 CP63A942MN 925-96 23.2.2 32 PDC CP63A1441MN 1429-1453 2..25 28 PCN CP63A1747MN 171-1785 18.4.25 27 CP63A1842MN 185-188 18..25 26 PCS CP63A188MN 185-191 17.8.25 26 CP63A196MN 193-199 17.5.25 26 2 PHP CP63A197MN 1895-192 17.7.25 26 DECT CP63A189MN 188-19 17.8.25 26 Wireless LAN CP63A2442MN 24-2484 15.6.35 24 CP63A35MN 345-355 12.8.58 18 2 WiFi CP63A5MN 495-55 1.2 1. 15 16 CP63A55MN 545-555 9.7 1.2 15 14 CP63A6MN 595-65 8.9 1.5 13.5 9 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP63AxxxxMNTR -6-12.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -2-4 -6-8 -1 I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 57

Thin-Film Directional Couplers CP63 High Directivity LGA Type Coupler P/N CP63AxxxxLN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836LN 824-849 26.89.8 32.5 CP63A881LN 869-894 26.55.8 32.2 GSM CP63A92LN 89-915 26.2.9 31.9 CP63A947LN 935-96 25.87.9 31.5 18 E-GSM CP63A897LN 88-915 26.2.9 31.9 CP63A942LN 925-96 25.87.9 31.5 PDC CP63A1441LN 1429-1453 22.31.12 28.1 17.5 PCN CP63A1747LN 171-1785 2.51.15 26.4 CP63A1842LN 185-188 2.3.15 26 PCS CP63A188LN 185-191 19.87.16 26 CP63A196LN 193-199 19.57.17 25.5 16.5 PHP CP63A197LN 1895-192 19.77.16 25.7 DECT CP63A189LN 188-19 19.87.16 25.8 Wireless LAN CP63A2442LN 24-2484 17.7.22 23.9 CP63A35LN 345-355 14.85.56 2.6 16 CP63A5LN 495-55 12.4.95 17.8 11 WiFi CP63A55LN 545-555 11.83 1.2 17.1 9 CP63A6LN 595-65 11.8 1.33 15.9 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 -5 I. Loss Coupling R. Loss Isolation CP63AxxxxLNTR -6-24.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -4-8 -12-16 -2 I Loss [db] 3 Coupler P/N CP63AxxxxKN Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples* [MHz] [db] [db] AMPS CP63A836KN 824-849 18.5.14 3 CP63A881KN 869-894 18.1.14 29 26 GSM CP63A92KN 89-915 17.6.15 29 CP63A947KN 935-96 17.3.15 29 E-GSM CP63A897KN 88-915 17.9.147 29 CP63A942KN 925-96 17.6.15 29 25 PDC CP63A1441KN 1429-1453 14.27 25 PCN CP63A1747KN 171-1785 12.4.36 23 CP63A1842KN 185-188 12.39 22.5 PCS CP63A188KN 185-191 11.8.4 22 CP63A196KN 193-199 11.4.44 22 24 PHP CP63A197KN 1895-192 11.5.43 22 DECT CP63A189KN 188-19 11.7.41 22 Wireless LAN CP63A2442KN 24-2484 9.7.6 19 23 CP63A35KN 345-355 7.2 1.15 15 19 WiFi CP63A5KN 495-55 4.7 2.15 15 CP63A55KN 545-555 4.2 2.5 17 13 CP63A6KN 595-65 3.7 2.8 19 Coupling, Return Loss, Isolation, [db] -1-2 -3-4 I. Loss Coupling R. Loss CP63AxxxxKNTR Isolation -5-6.8 1.6 2.4 3.2 4 4.8 5.6 6.4 Frequency [GHz] -12-24 -36-48 I Loss [db] Important: Couplers can be used at any frequency within the indicated range. 58

Thin-Film Directional Couplers CP42 / CP63 High Directivity Couplers Test Jigs GENERAL DESCRIPTION These jigs are designed for testing the CP42 and CP63 High Directivity Couplers using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.254mm (.1") from the microstrips. The substrate used is Neltec s NH9338ST254C1BC. The connectors are SMA type (female), Johnson Components Inc. Product P/N: 142-71-841. Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2. Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Place the coupler on the measurement jig as follows: Input (Coupler) Connector 1 (Jig) Termination (Coupler) Connector 3 (Jig) Output (Coupler) Connector 2 (Jig) Coupling (Coupler) Connector 4 (Jig) 3 To measure I. Loss connect: Connector 1 (Jig) Port 1 (VNA) Connector 2 (Jig) Port 2 (VNA) Connector 3 (Jig) 5Ω Connector 4 (Jig) 5Ω To measure R. Loss and Coupling connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) To measure Isolation connect: Connector 1 (Jig) 5Ω Connector 2 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) Measurement Jig Calibration Jig Connector 4 Connector 1 Connector 2 Open Line Short Line to GND. OPEN HS TH Connector Johnson P/N 142-71-841 Load & Through Connector 3 Load & Through 59

Thin-Film Directional Couplers CP63 SMD Type 3 GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF SMD Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s HOW TO ORDER CP Style Directional Coupler 63 Size 63 FEATURES Miniature Size: 63 Frequency Range: 8MHz - 3GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4ºC to +85ºC Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled X Type **** Frequency MHz DIMENSIONS: T X B1 L Sub Type B Bottom View A W 63 L 1.6±.1 (.63±.4) W.84±.1 (.33±.4) T.6±.1 (.28±.4) A.35±.15 (.14±.6) B.175±.1 (.7±.4) B1.+.1/-. (.+.4/-.) S Termination Code W = Sn9, Pb1 **S = Sn1 millimeters (inches) Top View TR Packaging Code TR = Tape and Reel **RoHS compliant QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. Recommended Pad Layout Dimensions mm (inches) 1.85 (.73).45 (.18) TERMINALS (Top View) OUT 5 OHM IN COUPLING Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style..28 (.11) 1.8 (.43) Orientation in tape 6 6

Thin-Film Directional Couplers CP63 SMD Type Coupler P/N CP63A****AS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836AS 824-849 18.5±1 CP63A881AS 869-894 18.5±1.25 GSM CP63A92AS 89-915 18±1 CP63A947AS 935-96 17.5±1 E-GSM CP63A897AS 88-915 18±1 CP63A942AS 925-96 17.5±1 PDC CP63A1441AS 1429-1453 14±1.4 PCN CP63A1747AS 171-1785 12.5±1 1.2 CP63A1842AS 185-188 12±1.6 PCS CP63A188AS 185-191 12±1 CP63A196AS 193-199 11.5±1.65 PHP CP63A197AS 1895-192 12±1.6 DECT CP63A189AS 188-19 12±1 Wireless LAN CP63A2442AS 24-2484 1±1.85 Coupling, Return Loss, Isolation (db) -1-2 -3-4 -5 I. Loss Coupling CP63A **** AS Isolation Return Loss -6.5 1. 1.5 2. 2.5 Frequency (GHz) -2-4 -6-8 -1-12 3. 3.5 I. Loss (db) Coupler P/N CP63A****BS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836BS 824-849 16±1 CP63A881BS 869-894 15.5±1.25 1.2 GSM CP63A92BS 89-915 15.5±1 CP63A947BS 935-96 15±1 E-GSM CP63A897BS 88-915 15.5±1 CP63A942BS 925-96 15±1 PDC CP63A1441BS 1429-1453 11.5±1.55 PCN CP63A1747BS 171-1785 1±1 1.3 CP63A1842BS 185-188 9.5±1 PCS CP63A188BS 185-191 9±1 CP63A196BS 193-199 9±1.8 PHP CP63A197BS 1895-192 9±1 1.4 DECT CP63A189BS 188-19 9±1 Wireless LAN CP63A2442BS 24-2484 7.5±1 1.1 Coupling, Return Loss, Isolation (db) I. Loss -1 Coupling -2-3 -4-5 CP63A **** BS Return Loss Isolation -6.5 1. 1.5 2. 2.5 Frequency (GHz) -2-4 -6-8 -1-12 3. I. Loss (db) 3 Coupler P/N CP63A****CS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836CS 824-849 21±1 CP63A881CS 869-894 2.5±1.25 GSM CP63A92CS 89-915 2.5±1 CP63A947CS 935-96 2±1 E-GSM CP63A897CS 88-915 2.5±1 CP63A942CS 925-96 2±1 PDC CP63A1441CS 1429-1453 16.5±1.4 1.2 PCN CP63A1747CS 171-1785 15±1 CP63A1842CS 185-188 14.5±1 PCS CP63A188CS 185-191 14.5±1 CP63A196CS 193-199 14±1.5 PHP CP63A197CS 1895-192 14.5±1 DECT CP63A189CS 188-19 14.5±1 Wireless LAN CP63A2442CS 24-2484 12.5±1.65 Coupler P/N CP63A****DS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63A836DS 824-849 15.±1 CP63A881DS 869-894 14.5±1.4 1.2 GSM CP63A92DS 89-915 14.5±1 CP63A947DS 935-96 14±1 E-GSM CP63A897DS 88-915 14.5±1 CP63A942DS 925-96 14±1 PDC CP63A1441DS 1429-1453 1.5±1.7 1.3 PCN CP63A1747DS 171-1785 9±1 CP63A1842DS 185-188 8.5±1.9 PCS CP63A188DS 185-191 8.5±1 CP63A196DS 193-199 8±1 1. 1.5 PHP CP63A197DS 1895-192 8.5±1 DECT CP63A189DS 188-19 8.5±1 Wireless LAN CP63A2442DS 24-2484 6.5±1 1.5 Important: Couplers can be used at any frequency within the indicated range. Coupling, Return Loss, Isolation (db) Coupling, Return Loss, Isolation (db) -1-2 -3-4 -5-6 I. Loss Coupling CP63A **** CS Isolation Return Loss -7.5 1. 1.5 2. 2.5 Frequency (GHz) CP63A **** DS -1-2 -3-4 -5-6 -7-8 -9-1 -11-12 3. 3.5 I. Loss -1-1 -2 Coupling Return Loss -3-2 -4 Isolation -5-3 -6-7 -4-8 -9-5 -1-11 -6-12.5.7.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 Frequency (GHz) I. Loss (db) I. Loss (db) 61 61

Thin-Film Directional Couplers CP63 SMD Type Coupler P/N CP63B****AS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836AS 824-849 24.5±1 CP63B881AS 869-894 24±1 GSM CP63B92AS 89-915 24±1.2 CP63B947AS 935-96 23.5±1 E-GSM CP63B897AS 88-915 24±1 CP63B942AS 925-96 23.5±1 PDC CP63B1441AS 1429-1453 2±1 1.2.25 CP63B1747AS 171-1785 18±1 PCN CP63B1842AS 185-188 17.5±1 PCS CP63B188AS 185-191 17.5±1 CP63B196AS 193-199 17.5±1.3 PHP CP63B197AS 1895-192 17.5±1 DECT CP63B189AS 188-19 17.5±1 Wireless LAN CP63B2442AS 24-2484 15.5±1.45 Coupling, Return Loss, Isolation (db) -1-2 -3-4 -5 CP63B **** AS I. Loss Coupling -6.5 1. 1.5 2. 2.5 Isolation Frequency (GHz) Return Loss -1-3 -5-7 -9-11 -13 3. 3.5 4. I. Loss (db) 3 Coupler P/N CP63B****BS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836BS 824-849 25.5±1 CP63B881BS 869-894 25±1 GSM CP63B92BS 89-915 25±1 CP63B947BS 935-96 24.5±1.2 E-GSM CP63B897BS 88-915 25±1 CP63B942BS 925-96 24.5±1 PDC CP63B1441BS 1429-1453 21±1 1.2 PCN CP63B1747BS 171-1785 19±1 CP63B1842BS 185-188 19±1 PCS CP63B188BS 185-191 18.5±1.25 CP63B196BS 193-199 18.5±1 PHP CP63B197BS 1895-192 18.5±1 DECT CP63B189BS 188-19 18.5±1 Wireless LAN CP63B2442BS 24-2484 16.5±1.35 Coupling, Return Loss, Isolation (db) CP63B **** BS -5 I. Loss -1-15 Coupling -2-25 Return Loss -3-35 -4 Isolation -45-5.5 1. 1.5 2. 2.5 Frequency (GHz) -2-4 -6-8 -1 3. 3.5 4. I. Loss (db) Coupler P/N CP63B****CS Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP63B836CS 824-849 26.5±1 CP63B881CS 869-894 26±1 GSM CP63B92CS 89-915 26±1 CP63B947CS 935-96 25.5±1.2 E-GSM CP63B897CS 88-915 26±1 CP63B942CS 925-96 25.5±1 PDC CP63B1441CS 1429-1453 22±1 1.2 PCN CP63B1747CS 171-1785 2.5±1 CP63B1842CS 185-188 2±1 PCS CP63B188CS 185-191 2±1 CP63B196CS 193-199 19.5±1.25 PHP CP63B197CS 1895-192 2±1 DECT CP63B189CS 188-19 2±1 Wireless LAN CP63B2442CS 24-2484 18±1.35 1.3 Coupling, Return Loss, Isolation (db) CP63B **** CS -5 I. Loss -1-15 -2 Coupling -25-3 -35-4 Return Loss Isolation -45-5.5 1. 1.5 2. 2.5 Frequency (GHz) -2-4 -6-8 -1 3. 3.5 4. I. Loss (db) Important: Couplers can be used at any frequency within the indicated range. 62 62

Thin-Film Directional Couplers CP63 SMD Type High Directivity Coupler P/N CP63D****AS Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] CP63D836AS 824-849 13.5 23 AMPS CP63D881AS 869-894 13. CP63D92AS 89-915 GSM CP63D947AS 935-96 12.5.5 22 21 E-GSM CP63D897AS 88-915 13. CP63D942AS 925-96 12.5 PDC CP63D1441AS 1429-1453 9. 1. 18 19 CP63D1747AS 171-1785 8. 18 PCN 17 CP63D1842AS 185-188 7.5 CP63D188AS 185-191 PCS CP63D196AS 193-199 1.4 17 PHP CP63D197AS 1895-192 7. 16 DECT CP63D189AS 188-19 Wireless LAN CP63D2442AS 24-2484 5.5 2. 15 15 Coupling, Return Loss, Isolation (db) -5-1 -15-2 -25-3 -35 I. Loss Coupling Return Loss CP63D **** AS Isolation -2-4 -6-8 -1-12 -14-4 -16.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 Frequency (GHz) I. Loss (db) Coupler P/N CP63D****BS Application Frequency Coupling I. Loss Return Directivity P/N Band [db] max. Loss [db] Examples [MHz] [db] [db] CP63D836BS 824-849 2. AMPS 36 CP63D881BS 869-894 19.5 CP63D92BS 89-915 GSM.25 35 CP63D947BS 935-96 19. CP63D897BS 88-915 19.5 36 E-GSM CP63D942BS 925-96 19. 35 19 PDC CP63D1441BS 1429-1453 15.5.4 3 PCN CP63D1747BS 171-1785 14..5 28 CP63D1842BS 185-188 PCS CP63D188BS 185-191 13.5 CP63D196BS 193-199.55 27 PHP CP63D197BS 1895-192 DECT CP63D189BS 188-19 13. Wireless LAN CP63D2442BS 24-2484 11..7 24 Coupling, Return Loss, Isolation (db) -5-1 -15-2 -25-3 I. Loss Coupling Return Loss CP63D **** BS -35-7 -4 Isolation -8-45 -9.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 Frequency (GHz) -1-2 -3-4 -5-6 I. Loss (db) 3 Important: Couplers can be used at any frequency within the indicated range. 63

Thin-Film Directional Couplers CP85 SMD Type 3 GENERAL DESCRIPTION ITF (Integrated Thin-Film) TECHNOLOGY The ITF SMD Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small Size: 85 Frequency Range: 8MHz - 3GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4 C to +85 C Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled HOW TO ORDER CP 85 APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s A 92 DIMENSIONS: (Top View) A T L A W B 85 L 2.3±.1 (.8±.4) W 1.55±.1 (.61±.4) T.98±.1 (.39±.4) A.56±.25 (.22±.1) B.35±.15 (.14±.6) S millimeters (inches) TR Style Directional Coupler Not RoHS Compliant Size 85 Layout Type (see layout types) Frequency MHz Sub Type (see layout sub-types) Termination Code W = Nickel/Solder (Sn/Pb) **S = Nickel / Lead Free Solder (Sn1) Packaging Code TR = Tape and Reel **RoHS compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/Solder coating (Sn, Pb) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. Recommended Pad Layout Dimensions mm (inches) 2.33 (.92).6 (.24) 2.25.65 (.89) (.26) NOTE: Components must be mounted on the board with the white (Alumina) side DOWN. 64

Thin-Film Directional Couplers CP85 Layout Types LAYOUT Sn1 LAYOUT LAYOUT Sn1 LAYOUT COUP Port 5 OHM (External Resistor) COUP 5 OHM COUP Port 5 OHM (External Resistor) COUP 5 OHM RF IN Port db RF OUT Port Type: A Sub-Type: A -5 I. Loss -1-15 -2 Coupling R. Loss -25-3 -35 Isolation -4-45 -5.6.8 1. 1.2 1.4 Frequency (GHz) RF IN Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836AW 824-849 16.5±1 CP85A881AW 869-894 16±1.25 GSM CP85A92AW 89-915 16±1 CP85A947AW 935-96 15.5±1 1.2 E-GSM CP85A897AW 88-915 16±1 CP85A942AW 925-96 15.5±1 PDC CP85A1441AW 1429-1453 12±1.5 1.3 PCN CP85A1747AW 171-1785 1.5±1.7 CP85A1842AW 185-188 1±1.8 PCS CP85A188AW 185-191 9.5±1 1.4 CP85A196AW 193-199 9.5±1 PHP CP85A197AW 1895-192 9.5±1 DECT CP85A189AW 188-19 9.5±1 1.6 C -1 1.8 2. RF OUT I. Loss (db) RF IN Port db -5-1 -15-2 -25-3 -35-4 -45 RF OUT Port Type: A Sub-Type: B I. Loss Coupling Isolation R. Loss RF IN -5.6.8 1. 1.2 1.4 Frequency (GHz) Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836BW 824-849 19±1 CP85A881BW 869-894 18.5±1.25 1.2 GSM CP85A92BW 89-915 18±1 CP85A947BW 935-96 18±1 E-GSM CP85A897BW 88-915 18.5±1 CP85A942BW 925-96 18±1 PDC CP85A1441BW 1429-1453 14.5±1.35 PCN CP85A1747BW 171-1785 12.5±1.5 CP85A1842BW 185-188 12.5±1 PCS CP85A188BW 185-191 12±1.6 CP85A196BW 193-199 11.5±1.7 1.4 PHP CP85A197BW 1895-192 12±1.6 DECT CP85A189BW 188-19 12±1 Wireless LAN CP85A2442BW 24-2484 1±1.9 1.6 M RF OUT -1-2 -3-4 -5-6 -7-8 -9-1 1.8 2. I. Loss (db) 3 LAYOUT Sn1 LAYOUT COUP 5 OHM COUP 5 OHM db Type: A Sub-Type: C -5-1 -15-2 I. Loss Coupling Isolation -25-3 R. Loss -35-4 -45-5.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 Frequency (GHz) Important: Couplers can be used at any frequency within the indicated range. IN OUT RF IN Y RF OUT Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836CW 824-849 14±1 CP85A881CW 869-894 13.5±1.5 GSM CP85A92CW 89-915 13.5±1 CP85A947CW 935-96 13±1 1.4 E-GSM CP85A897CW 88-915 13.5±1 CP85A942CW 925-96 13±1 PDC CP85A1441CW 1429-1453 9.5±1 1.15 1.8 PCN CP85A1747CW 171-1785 8±1 1.6 CP85A1842CW 185-188 8±1 PCS CP85A188CW 185-191 7.5±1 1.75 2.2 Cp85A196CW 193-199 7.5±1 PHP CP85A197CW 1895-192 7.5±1 DECT CP85A189CW 188-19 7.5±1 Wireless LAN CP85A2442CW 24-2484 6±1 2.5 65

Thin-Film Directional Couplers CP85 Layout Types LAYOUT Sn1 LAYOUT LAYOUT Sn1 LAYOUT COUP 5 OHM COUP 5 OHM COUP 5 OHM COUP 5 OHM IN OUT RF IN F RF OUT IN OUT RF IN K RF OUT Type: A Sub-Type: D Type: A Sub-Type: E db -5-1 -15-2 -25-3 -35 I. Loss Coupling Isolation R. Loss db -5-1 -15-2 I. Loss Coupling Isolation I. Loss (db) 3-4 -45-5.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 Frequency (GHz) -25 R. Loss -3.5.75 1. 1.25 1.5 Frequency (GHz) 1.75 2. Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836DW 824-849 13.±1 CP85A881DW 869-894 12.5±1.5 1.4 GSM CP85A92DW 89-915 12.5±1 CP85A947DW 935-96 12±1 E-GSM CP85A897DW 88-915 12.5±1 CP85A942DW 925-96 12±1 PDC CP85A1441DW 1429-1453 8.5±1 1.25 1.8 PCN CP85A1747DW 171-1785 7±1 CP85A1842DW 185-188 7±1 1.85 PCS CP85A188DW 185-191 7±1 Cp85A196DW 193-199 6.5±1 2.15 2.1 PHP CP85A197DW 1895-192 6.5±1 DECT CP85A189DW 188-19 7±1 1.85 1.8 Wireless LAN CP85A2442DW 24-2484 5.5±1 2.4 2.1 db Type: B Sub-Type: A -5 I. Loss -1-15 Coupling -2-25 R. Loss -3-35 Isolation -4-45 -5 1. 1.2 1.4 1.6 1.8 2. Frequency (GHz) -1-2 -3-4 -5-6 -7-8 -9-1 2.2 2.4 Important: Couplers can be used at any frequency within the indicated range. I. Loss (db) Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85A836EW 824-849 11±1 CP85A881EW 869-894 1.5±1.85 1.4 GSM CP85A92EW 89-915 1.5±1 CP85A947EW 935-96 1±1 E-GSM CP85A897EW 88-915 1.5±1 CP85A942EW 925-96 1±1 PDC CP85A1441EW 1429-1453 7±1 1.8 1.8 PCN CP85A1747EW 171-1785 5.5±1 CP85A1842EW 185-188 5.5±1 2.7 2.2 PCS CP85A188EW 185-191 5±1 Cp85A196EW 193-199 5±1 PHP CP85A197EW 1895-192 5±1 3.15 2.4 DECT CP85A189EW 188-19 5±1 Wireless LAN CP85A2442EW 24-2484 4±1 4.2 RF IN Port RF OUT Port LAYOUT COUP Port 5 OHM (External Resistor) Sn1 LAYOUT RF IN RF OUT T COUP 5 OHM Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836AW 824-849 21.5±1 CP85B881AW 869-894 21±1 GSM CP85B92AW 89-915 21±1 CP85B947AW 935-96 2.5±1.25 E-GSM CP85B897AW 88-915 21±1 CP85B942AW 925-96 2.5±1 PDC CP85B1441AW 1429-1453 17±1 PCN CP85B1747AW 171-1785 15.5±1 1.2 Cp85B1842AW 185-188 15.5±1.3 PCS CP85B188AW 185-191 15±1 CP85B196AW 193-199 14.5±1.4 PHP CP85B197AW 1895-192 15±1.3 DECT CP85B189AW 188-19 15±1 Wireless LAN CP85B2442AW 24-2484 13±1.4 66

Thin-Film Directional Couplers CP85 Layout Types LAYOUT Sn1 LAYOUT LAYOUT Sn1 LAYOUT RF IN Port COUP Port RF IN COUP RF IN Port COUP Port RF IN COUP RF OUT Port db 5 OHM (External Resistor) Type: B Sub-Type: B -5 I. Loss -1-15 -2 Coupling -25-3 R. Loss -35-4 Isolation -45-5 1. 1.2 1.4 1.6 1.8 2. Frequency (GHz) RF OUT V -1-2 -3-4 -5-6 -7-8 -9-1 2.2 2.4 2.6 I. Loss (db) 5 OHM RF OUT Port db 5 OHM (External Resistor) RF OUT Type: B Sub-Type: C -5 I. Loss -1-15 -2 Coupling -25-3 R. Loss -35-4 Isolation -45-5 1.1 1.3 1.5 1.7 1.9 2.1 Frequency (GHz) L -1-2 -3-4 -5-6 -7-8 -9-1 2.3 2.5 5 OHM I. Loss (db) 3 Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836BW 824-849 23.5±1 CP85B881BW 869-894 23±1 GSM CP85B92BW 89-915 22.5±1 CP85B947BW 935-96 22±1 E-GSM CP85B897BW 88-915 23±1 CP85B942BW 925-96 22±1.25 PDC CP85B1441BW 1429-1453 18.5±1 PCN CP85B1747BW 171-1785 17±1 CP85B1842BW 185-188 16.5±1 1.2 PCS CP85B188BW 185-191 16.5±1 CP85B196BW 193-199 16±1 PHP CP85B197BW 1895-192 16±1 DECT CP85B189BW 188-19 16±1 Wireless LAN CP85B2442BW 24-2484 14±1.4 Application P/N Frequency Coupling I. Loss VSWR Examples Band [MHz] [db] max max AMPS CP85B836CW 824-849 25±1 CP85B881CW 869-894 24.5±1 GSM CP85B92CW 89-915 24±1 CP85B947CW 935-96 24±1 E-GSM CP85B897CW 88-915 24.5±1 CP85B942CW 925-96 24±1.25 PDC CP85B1441CW 1429-1453 2±1 PCN CP85B1747CW 171-1785 18.5±1 Cp85B1842CW 185-188 18.5±1 1.2 PCS CP85B188CW 185-191 18±1 Cp85B196CW 193-199 17.5±1 PHP CP85B197CW 1895-192 18±1 DECT CP85B189CW 188-19 18±1 Wireless LAN CP85B2442CW 24-2484 16±1.4 Important: Couplers can be used at any frequency within the indicated range. 67

Thin-Film Directional Couplers CP85 Layout Types VHF DIRECTIONAL COUPLER CP85L155ASTR Sn1 LAYOUT UHF DIRECTIONAL COUPLER CP85L436BSTR Sn1 LAYOUT IN COUP COUP 5 OHM OUT A 5 OHM IN E OUT I. Loss Frequency Coupling R. Loss Directivity P/N max [MHz] [db] [db] [db] [db] CP85L155ASTR 155 17.1±1 24.35 22 I. Loss Frequency Coupling R. Loss Directivity P/N max [MHz] [db] [db] [db] [db] CP85L436BSTR 43-47 15.85±1 35.25 22 3 db -1-2 -3 I. Loss Coupling R. Loss -4-8 -12 I. Loss (db) db -1-2 -3-4 I. Loss Coupling Isolation -1-2 -3-4 I. Loss (db) -4-16 Isolation -5-2 1 2 3 4 5 6 Frequency (MHz) -5 R. Loss -6-6 2 3 4 5 6 7 8 Frequency (MHz) -5 Important: Couplers can be used at any frequency within the indicated range. 68

Thin-Film Directional Couplers CP85 and CP63 Test Jig ITF TEST JIG FOR COUPLER TYPES 85 AND 63 SMD GENERAL DESCRIPTION MEASUREMENT PROCEDURE This jig is designed for the testing of CP85 and CP63 series Directional Couplers using a vector network analyzer. It consists of a FR4 multi-layer substrate, having 5Ω microstrips as conducting lines and a ground plane in the middle layer, located at a distance of.2mm from the microstrips. The connectors are SMA type (female), Johnson Components Inc. Product P/N: 142-71-881. The jig is designed for a full 2-port calibration. LOAD calibration can be done either by a 5Ω SMA termination, or by soldering a 5Ω chip resistor at the 5Ω ports. When measuring a component, it can be either soldered or pressed by a non-metallic stick until all four ports touch the appropriate pads. To measure the coupling (and the R. Loss) place the component on the Port 1 & Port 2 pads. Use two SMA 5Ω terminations (male) to terminate the ports, which are not connected to the network analyzer, and connect the network analyzer to the two ports. A 9 rotation of the component on its pads allows measuring a second parameter (I. Loss). Load & Thru Calibration Area Short Port 1 Coupler 85 5 Open 5 Connector (1 of 12) P/N 142-71-881 Port 2 3 Port 1 Coupler 63 5 5 Port 2 CP85 SERIES DIRECTIONAL COUPLERS Orientation and Tape and Reel Packaging Specification (Top View) CP85xxxxxxSTR (Sn1) (Top View) COUP RF IN 5 OHM RF OUT COUP RF IN 5 OHM RF OUT COUP RF IN C 5 OHM RF OUT COUP RF IN M 5 OHM RF OUT TYPE AA TYPE AB TYPE AA TYPE AB COUP 5 OHM COUP 5 OHM COUP 5 OHM COUP 5 OHM COUP 5 OHM COUP 5 OHM RF IN RF OUT RF IN RF OUT RF IN RF OUT RF IN Y RF OUT RF IN F RF OUT RF IN K RF OUT TYPE AC TYPE AD TYPE AE TYPE AC TYPE AD TYPE AE RF IN RF OUT COUP 5 OHM RF IN RF OUT COUP 5 OHM RF IN RF OUT TYPE BA TYPE BB TYPE BC The parts should be mounted on the PCB with White (Alumina) side down and the "dark" side up. COUP 5 OHM RF IN RF OUT T COUP 5 OHM RF IN RF OUT V COUP 5 OHM RF IN RF OUT L TYPE BA TYPE BB TYPE BC COUP 5 OHM The parts should be mounted on the PCB with printed side up. 69

Thin-Film Directional Couplers DB63N 3dB 9 Couplers GENERAL DESCRIPTION RFAP TECHNOLOGY The DB63N 3dB 9 Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The RFAP LGA 3dB 9 Coupler will be offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Balanced Amplifiers and Signal Distribution in Wireless Communications FEATURES Miniature 63 size Low I. Loss High Isolation Surface Mountable RoHS Compliant Supplied on T&R Power Rating: 1W RF Continuous DIMENSIONS: millimeters (inches) LAND GRID ARRAY ADVANTAGES: Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation Bottom View 3 Recommended Pad Layout Dimensions.4 (.16) mm (inches) 1.1 (.43) L W T A B S 1.6±.1 (.63±.4).84±.1 (.33±.4).6±.1 (.24±.4).25±.5 (.1±.2).2±.5 (.8±.2).5±.5 (.2±.2) T W A B L S 1.75 (.69).5 (.2) ORIENTATION IN TAPE 5 OHM OUT 1 IN OUT 2 ELECTRICAL PARAMETERS Part Number Frequency Port Return Loss Isolation Insertion Loss Ampltidue Phase Balance Power MHz Impedance [db] [db] [db] Balance (Relative to 9º) Handing Ω [db] Deg Watts Min. Max. Typ. Min. Typ. Min. Typ. Typ. Max. Typ. Max. Typ. Max Max. DB63N214ANTR 24 224 5 15 26 15 23.3.4.5.8 2 3 1 DB63N24ANTR 23 25 5 12 17 15 23.25.35.3.8 2 3 1 DB63N26ANTR 24 28 5 12 17 15 23.25.35.3.8 2 3 1 DB63N3ANTR 285 315 5 12 15 15 26.2.3.3.8 2 3 1 DB63N35ANTR 33 37 5 12 15 15 26.2.3.3.8 2 3 1 DB63N46ANTR 42 5 5 12 16 12 15.5.7.4 1. 1.5 3 1 DB63N55ANTR 51 59 5 12 16 1 14.6.8.8 1.5 1 3 1 DB63N58ANTR 56 6 5 12 16 12 17.4.9.3.9 2 3 1 NOTE: Additional Frequencies Available Upon Request 7

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 24MHz to 224MHz DB63N214ANTR -2 Return Loss - Input -22-24 db -26-28 -3 23 26 29 212 215 218 221 224 Frequency (MHz) Insertion Loss 3 -.6 db -1.2-1.8 23 26 29 212 215 218 221 224 Frequency (MHz) 2 Amplitude Balance 1 db -1-2 23 26 29 212 215 218 221 224 Frequency (MHz) 71

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 24MHz to 224MHz DB63N214ANTR Phase Balance 8 4 db -4-8 23 26 29 212 215 218 221 224 3 Frequency (MHz) Isolation -16-18 -2 db -22-24 -26 23 26 29 212 215 218 221 224 Frequency (MHz) 72

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 22MHz to 26MHz DB63N24ANTR -1 Return Loss - Input -12-14 db -16-18 -2 22 23 24 25 26 Frequency (MHz) Insertion Loss 3 -.6 db -1.2-1.8 22 23 24 25 26 Frequency (MHz) Amplitude Balance 2 1 db -1-2 22 23 24 25 26 Frequency (MHz) 73

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 22MHz to 26MHz DB63N24ANTR 8 Phase Balance 4 db -4-8 22 23 24 25 26 3 Frequency (MHz) Isolation -2-22 -24 db -26-28 -3 22 23 24 25 26 Frequency (MHz) 74

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 24MHz TO 28MHz DB63N26ANTR -1 Return Loss - Input -12-14 db -16-18 -2 24 25 26 27 Frequency (MHz) 28 Insertion Loss 3 -.6 db -1.2-1.8 24 25 26 27 28 Frequency (MHz) 2 Amplitude Balance 1 db -1-2 24 25 26 27 28 Frequency (MHz) 75

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 24MHz TO 28MHz DB63N26ANTR 8 Phase Balance 4 db -4-8 24 25 26 27 28 Frequency (MHz) 3-2 Isolation -22 db -24-26 -28-3 24 25 26 27 28 Frequency (MHz) 76

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 285MHz to 315MHz DB63N3ANTR -1 Return Loss - Input -12-14 db -16-18 -2 28 29 3 31 32 Frequency (MHz) Insertion Loss 3 -.6 db -1.2-1.8 28 29 3 31 32 Frequency (MHz) 2 Amplitude Balance 1 db -1-2 28 29 3 31 32 Frequency (MHz) 77

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 285MHz to 315MHz DB63N3ANTR Phase Balance 8 4 db -4-8 28 29 3 31 32 3 Frequency (MHz) Isolation -2-22 -24 db -26-28 -3 28 29 3 31 32 Frequency (MHz) 78

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 32MHz to 38MHz DB63N35ANTR -1 Return Loss - Input -12-14 db -16-18 -2 32 33 34 35 36 37 38 Frequency (MHz) Insertion Loss 3 -.6 db -1.2-1.8 32 33 34 35 36 37 38 Frequency (MHz) 2 Amplitude Balance 1 db -1-2 32 33 34 35 36 37 38 Frequency (MHz) 79

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 32MHz to 38MHz DB63N35ANTR 8 Phase Balance 4 db -4-8 32 33 34 35 36 37 38 3 Frequency (MHz) Isolation -2-22 -24 db -26-28 -3 32 33 34 35 36 37 38 Frequency (MHz) 8

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 42MHz TO 5MHz DB63N46ANTR -12 Return Loss - Input -14 db -16-18 -2 42 44 46 48 5 Frequency (MHz) -12 Isolation 3-14 db -16-18 42 44 46 48 5 Frequency (MHz) Insertion Loss -.2 db -.4 -.6 -.8 42 44 46 48 5 Frequency (MHz) 81

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 42MHz TO 5MHz DB63N46ANTR 1 Amplitude Balance.5 db -.5-1 42 44 46 48 5 Frequency (MHz) 3 3 2 1 Phase Balance deg -1-2 -3 42 44 46 48 5 Frequency (MHz) 82

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 51MHz TO 59MHz DB63N55ANTR -12 Return Loss - Input -14 db -16-18 -2 51 52 53 54 55 56 57 58 59 Frequency (MHz) -1 Isolation 3-12 db -14-16 -18 51 52 53 54 55 56 57 58 59 Frequency (MHz) -.2 Insertion Loss -.4 db -.6 -.8 51 52 53 54 55 56 57 58 59 Frequency (MHz) 83

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 51MHz TO 59MHz DB63N55ANTR 1.5 Amplitude Balance 1 db.5 51 52 53 54 55 56 57 58 59 Frequency (MHz) 3 3 2 1 Phase Balance db -1-2 -3 51 52 53 54 55 56 57 58 59 Frequency (MHz) 84

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 56MHz TO 6MHz DB63N58ANTR -1 Return Loss - Input -12-14 db -16-18 -2 56 57 58 59 6 Frequency (MHz) -12 Isolation 3-14 db -16-18 -2 56 57 58 59 6 Frequency (MHz) Insertion Loss -.2 -.4 db -.6 -.8-1 56 57 58 59 6 Frequency (MHz) 85

Thin-Film Directional Couplers DB63N 3dB 9 Couplers 56MHz TO 6MHz DB63N58ANTR 1 Amplitude Balance.5 db -.5-1 56 57 58 59 6 Frequency (MHz) 3 3 2 1 Phase Balance deg -1-2 -3 56 57 58 59 6 Frequency (MHz) 86

Thin-Film Directional Couplers DB85 3dB 9 Couplers GENERAL DESCRIPTION ITF TECHNOLOGY The ITF SMD 3dB 9 Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF 3dB 9 Coupler is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. Recommended Pad Layout Dimensions 2.24 (.88).7 (.28) GROUND mm (inches) 1.76.64 (.69) (.25) APPLICATIONS Balanced Amplifiers and Signal Distribution in Mobile Communications DIMENSIONS: millimeters (inches) L W T A B 2.3±.1 (.8±.4) 1.55±.1 (.61±.4).98±.15 (.37±.6).56±.25 (.22±.1).35±.15 (.14±.6) T FEATURES Miniature 85 size Low I. Loss High Isolation Power Handling: 1W RF CW Surface Mountable Supplied on Tape and Reel Operating Temperature -4 C to +85 C Bottom View L A B W 3.15 (.6) TYP. TERMINALS (Top View) Orientation in Tape 5 OHM IN OUT1 OUT2 5 OHM IN OUT1 OUT2 Code Letter Marking ELECTRICAL PARAMETERS* Part Number** Frequency F O I. Loss @ F O Phase Balance Code Letter [MHz] [db] [deg] max. Marking DB85A88ASTR 88±3.35 3 Y DB85A915ASTR 915±3.35 3 V DB85A967ASTR 967±3.35 3 V DB85A135ASTR 135±5.35 3 C DB85A165ASTR 165±5.35 3 F DB85A18ASTR 18±5.3 3 F DB85A185ASTR 185±5.3 3 K DB85A19ASTR 19±5.3 3 K DB85A195ASTR 195±5.25 3 K DB85A214ASTR 214±5.25 3 L DB85A2325ASTR 2325±5.25 3 T *With Recommended Pad Layout ** LEAD FREE TERMINATION PART NUMBERS: DB85AxxxxASTR LEAD-FREE COMPATIBLE COMPONENT NOTE: Additional Frequencies Available Upon Request 87

Thin-Film Directional Couplers DB85 3dB 9 Couplers 88 ± 3MHz DB85A88ASTR -3. -3.2 I. Loss 1 db -3.4 I. Loss 2-3.6 3-3.8 85 865 88 895 91 Frequency (MHz) db -1-12 -14-16 -18-2 -22 R. Loss Isolation -24-26 -28-3 85 855 88 95 93 Frequency (MHz) 88

Thin-Film Directional Couplers DB85 3dB 9 Couplers 915 ± 3MHz DB85A915ASTR -2.8-3. -3.2 db -3.4 I. Loss 1-3.6 I. Loss 2 3-3.8 885 9 915 93 945 Frequency (MHz) db -1-12 -14-16 -18-2 -22 Isolation R. Loss -24-26 -28-3 865 89 915 94 965 Frequency (MHz) 89

Thin-Film Directional Couplers DB85 3dB 9 Couplers 967± 3MHz DB85A967ASTR -2.8-3. -3.2 db I. Loss 1-3.4 I. Loss 2 3-3.6-3.8 937 952 967 982 997 Frequency (MHz) db -1-12 -14-16 -18-2 -22 R. Loss Isolation -24-26 -28-3 917 942 967 992 117 Frequency (MHz) 9

Thin-Film Directional Couplers DB85 3dB 9 Couplers 135 ± 5MHz DB85A135ASTR -3. -3.2 I. Loss 1 db -3.4 I. Loss 2-3.6-3.8 13 135 14 Frequency (MHz) 3 db -1-12 -14-16 -18-2 -22 Isolation R. Loss -24-26 -28-3 13 135 14 Frequency (MHz) 91

Thin-Film Directional Couplers DB85 3dB 9 Couplers 165 ± 5MHz DB85A165ASTR -2.8-3. I. Loss 1 db -3.2 3-3.4 I. Loss 2-3.6 155 16 165 17 175 Frequency (MHz) db -1-12 -14-16 -18-2 -22 Isolation R. Loss -24-26 -28-3 155 16 165 17 175 Frequency (MHz) 92

Thin-Film Directional Couplers DB85 3dB 9 Couplers 18 ± 5MHz DB85A18ASTR -2.8-3. I. Loss 1 db -3.2 I. Loss 2-3.4-3.6 175 1775 18 1825 185 Frequency (MHz) 3 db -1-12 -14-16 -18-2 -22 Isolation R. Loss -24-26 -28-3 175 1775 18 1825 185 Frequency (MHz) 93

Thin-Film Directional Couplers DB85 3dB 9 Couplers 185 ± 5MHz DB85A185ASTR -2.8-3. db -3.2 I. Loss 1-3.4 I. Loss 2 3-3.6 18 1825 185 1875 19 Frequency (MHz) db -1-12 -14-16 -18 R. Loss -2 Isolation -22-24 -26-28 -3 18 1825 185 1875 19 Frequency (MHz) 94

Thin-Film Directional Couplers DB85 3dB 9 Couplers 19 ± 5MHz DB85A19ASTR -3. I. Loss 1-3.2 db I. Loss 2-3.4 3-3.6 185 1875 19 1925 195 Frequency (MHz) db -1-12 -14-16 -18-2 -22 Isolation R. Loss -24-26 -28-3 185 1875 19 1925 195 Frequency (MHz) 95

Thin-Film Directional Couplers DB85 3dB 9 Couplers 195 ± 5MHz DB85A195ASTR -2.8-3. db -3.2 I. Loss 1 I. Loss 2-3.4 3-3.6 19 1925 195 1975 2 Frequency (MHz) db -1-12 -14-16 -18-2 -22 R. Loss Isolation -24-26 -28-3 19 1925 195 1975 2 Frequency (MHz) 96

Thin-Film Directional Couplers DB85 3dB 9 Couplers 214 ± 5MHz DB85A214ASTR -2.6-2.8-3. db -3.2-3.4 I. Loss 1 I. Loss 2-3.6-3.8 24 29 214 219 224 Frequency (MHz) 3 db -1-12 -14-16 -18 R. Loss -2-22 Isolation -24-26 -28-3 214 29 214 219 224 Frequency (MHz) 97

Thin-Film Directional Couplers DB85 3dB 9 Couplers 2325 ± 5MHz DB85A2325ASTR -3. -3.1 I. Loss 1-3.2 db -3.3 3 I. Loss 2-3.4-3.5 2275 23 2325 235 2375 Frequency (MHz) db -1-12 -14-16 -18-2 R. Loss Isolation -22-24 -26-28 -3 2275 23 2325 235 2375 Frequency (MHz) 98

Thin-Film Directional Couplers DB85 3dB 9 Test Jigs GENERAL DESCRIPTION These jigs are designed for testing the DB85 3dB 9 Couplers using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.254mm from the microstrips. The substrate used is Neltec s NH9338ST254C1BC. The connectors are SMA type (female), Johnson Components Inc. Product P/N: 142-71-841. Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2. Follow the VNA s instruction manual and use the calibration jig to perform a full 2-port calibration in the required bandwidths. Place the coupler on the measurement jig as follows: Input (Coupler) Connector 1 (Jig) Output 1 (Coupler) Connector 3 (Jig) 5Ω (Coupler) Connector 2 (Jig) Output 2 (Coupler) Connector 4 (Jig) 3 To measure R. Loss and I. Loss 1 connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) Port 2 (VNA) Connector 2 (Jig) 5Ω Connector 4 (Jig) 5Ω To measure R. Loss and I. Loss 2 connect: Connector 1 (Jig) Port 1 (VNA) Connector 3 (Jig) 5Ω Connector 2 (Jig) 5Ω Connector 4 (Jig) Port 2 (VNA) To measure Isolation connect: Connector 1 (Jig) 5Ω Connector 2 (Jig) 5Ω Connector 3 (Jig) Port 1 (VNA) Connector 4 (Jig) Port 2 (VNA) Measurement Jig Connector 1 Calibration Jig Load & Through Connector 2 Connector Johnson P/N 142-71-841 Connector 4 Load & Through Short Line to GND Connector 3 Open Line 99

Thin-Film RF/Microwave Harmonic Low Pass Filter LP42/LP63/LP85 1

Thin-Film Low Pass Filter LP42N Series Harmonic Lead-Free LGA Termination RFAP TECHNOLOGY The LP42N Series Harmonic Low Pass Filter is based on the proprietary RFAP Thin-Film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The RFAP Harmonic Low Pass Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. APPLICATIONS Wireless communications Wireless LAN s GPS WiMAX LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation HOW TO ORDER LP 42 N XXXX X N TR Style Size Type Frequency MHz Sub-Type Termination LGA Lead Free Taped & Reeled QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85ºC, 85% RH, 16 hours Endurance: 125ºC, IR, 4 hours TERMINATION Nickel/Lead-Free solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. LEAD-FREE COMPATIBLE COMPONENT 4 11

Thin-Film Low Pass Filter LP42N Series Harmonic Lead-Free LGA Termination DIMENSIONS: millimeters (inches) (Bottom View) TERMINALS (Top View) B S A IN GND L OUT GND T W RECOMMENDED PAD LAYOUT (mm) L W T 1.±.5 (.4±.2).58±.4 (.23±.2).35±.5 (.14±.2) A B S.2±.6 (.8±.2).18±.5 (.7±.2).5±.5 (.2±.2).2 (.8).3 (.12).15 (.6) 4.51 (.2) ELECTRICAL CHARACTERISTICS (Guaranteed over 4 C to +85 C Operating Temperature Range) P/N LP42N2442ANTR 24-2484 LP42N269ANTR 264-274 LP42N35ANTR 34-36 LP42N52ANTR 55-535 LP42N55ANTR 535-565 LP42N58ANTR 56-6 Frequency Band I. Loss R. Loss [MHz] [db] [db] NOTE: Additional Frequencies Available Upon Request.35 typ.5 max.35 typ.5 max.3 typ.5 max.2 typ.5 max.2 typ.5 max.2 typ.5 max Attenuation Attenuation @ 2xF @ 3xF [db] [db] 2 3 17 2 3 2 19 3 2 19 3 2 15 3 16 25 12

Thin-Film Low Pass Filter LP42N Series Harmonic Lead-Free LGA Termination LP42N2442ANTR -5 F -1-2 S21 S11-25 (db) 3F -3-35 -4 2F -45 2 4 6 8 1 12 Frequency (GHz) LP42N58ANTR -5 F -1-2 S21 S11-25 (db) -3-35 -4-45 2F 2 4 6 8 1 12 14 16 Frequency (GHz) LP42N269ANTR LP42N35ANTR -1 S21-2 S11 (db) -3 F -1 F S21-2 3F S11 (db) -3 3F -4 2F -4 2F -5-5 2 4 6 8 1 12 14 2 4 6 8 1 12 14 Frequency (GHz) Frequency (GHz) 4 LP42N55ANTR LP42N52ANTR -5-1 -2 S21 S11-25 (db) -3-35 -4 F -1 S21-2 S11 (db) -3-4 F -45 2F -5 2 4 6 8 1 12 14 2 4 6 8 1 12 14 Frequency (GHz) Frequency (GHz) 13

Thin-Film Low Pass Filter LP42N Series Harmonic Lead-Free LGA Termination Test Jig TEST JIG FOR LP42 LOW PASS FILTER GENERAL DESCRIPTION These jigs are designed for testing the LP63 LGA Low Pass Filters using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.127mm from the microstrips. The substrate used is Neltec s NH9338ST127C1BC (or similar). The connectors are SMA type (female), Johnson Components Inc. Product P/N: 142-71-841 (or similar). Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Solder the filter to the measurement jig as follows: Input Ë Connector 1 (Jig) GND (Filter) Ë GND (Jig) (Filter) Output Ë Connector 2 (Jig) GND (Filter) Ë GND (Jig) (Filter) Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2 (using an RF cable). Measurement Calibration Jig 4 Connector 1 Short line to GND Open line Connector Johnson P/N 142-71-841 Connector 2 Load & Through Load & Through 14

Thin-Film Low Pass Filter LP63 Lead-Free LGA Type GENERAL DESCRIPTION The LP63 ITF (Integrated Thin Film) Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Low Pass Filters are offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Miniature Size: 63 Frequency Range: 9MHz-5.5HGz Characteristic Impedance: 5 Ohm Operating/Storage Temperature: -4 C to +85 C Power Rating: 3W Continuous Low Profile Rugged Construction Lead Free Taped and Reeled APPLICATIONS Mobile communications Satellite TV receivers GPS Vehicle location systems Wireless LANs RFID LAND GRID ARRAY ADVANTAGES Inherent Low Profile Self Alignment during Reflow Excellent Solderability Low Parasitics Better Heat Dissipation HOW TO ORDER LP Style 63 Size 63 A Type A or N XXXX Frequency MHz A Sub-Type N Termination LGA **Ni/Lead Free Solder TR Taped & Reeled 4 FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, IR, 4 hours **RoHS compliant LEAD-FREE COMPATIBLE COMPONENT TERMINATION Nickel/Lead-Free Solder coating compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. 15

Thin-Film Low Pass Filter LP63 Lead-Free LGA Type DIMENSIONS: millimeters (inches) (Bottom View) A B S TERMINALS AND ORIENTATION IN TAPE (Top View) IN GND IN GND L OUT GND OUT GND T W RECOMMENDED PAD LAYOUT (mm) L W T 1.6±.1 (.63±.4).84±.1 (.33±.4).6±.1 (.24±.4) A B S.25±.5 (.1±.2).2±.5 (.8±.2).5±.5 (.2±.2) 1.1 (.43).4 (.16) 4 1.75 (.69).5 (.2) ELECTRICAL CHARACTERISTICS (Guaranteed over 4 C to +85 C Operating Temperature Range) P/N Frequency I. Loss VSWR Attentuation Band [MHz] [db] max typ. [db] [db] LP63A92ANTR 89-915.35 typ (.5 max) 1.4 25 @ 2xF 14 @ 3xF LP63A947ANTR 935-96.35 typ (.5 max) 1.4 25 @ 2xF 17 @ 3xF LP63A1747ANTR 171-1785.3 typ (.5 max) 1.4 25 @ 2xF 17 @ 3xF LP63A1842ANTR 185-188.3 typ (.5 max) 1.4 27 @ 2xF 15 @ 3xF LP63A188ANTR 184-192.3 typ (.5 max) 1.4 25 @ 2xF 17 @ 3xF LP63A195ANTR 192-198.3 typ (.5 max) 1.4 27 @ 2xF 15 @ 3xF LP63A214ANTR 211-217.3 typ (.5 max) 1.4 27 @ 2xF 17 @ 3xF LP63A2442ANTR 2412-2472.3 typ (.5 max) 1.4 25 @ 2xF 17 @ 3xF LP63N35ANTR 34-36 -.3 typ. -.5 max. 1.4 3 @ 2xF 2 @ 3xF LP63N52ANTR 55-535 -.2 typ. -.5 max. 1.4 3 @ 2xF 2 @ 3xF LP63N55ANTR 535-565 -.2 typ. -.5 max. 1.4 3 @ 2xF 2 @ 3xF NOTE: Additional Frequencies Available Upon Request 16

Thin-Film Low Pass Filter LP63 Lead-Free LGA Type LP63A92ANTR LP63A947ANTR F F -13-13 S21 S11 (db) -25 3F S21 S11 (db) -25 3F -38 2F -38 2F -5.25.5.75 1. 1.25 1.5 1.75 2. 2.25 2.5 2.75 3. 3.25 3.5 3.75 4. Frequency (GHz) -5.25.5.75 1. 1.25 1.5 1.75 2. 2.25 2.5 2.75 3. 3.25 3.5 3.75 4. Frequency (GHz) LP63A1747ANTR LP63A1842ANTR F F S21 S11 (db) -13-25 -38 2F -5.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. 7.5 8. 8.5 9. 3F Frequency (GHz) S21 S11 (db) -13-25 -38 2F -5.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. 7.5 8. Frequency (GHz) 3F 4 S21 S11 (db) -5-1 -15-2 -25-3 -35-4 -45 F LP63A188ANTR 2F -5.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. 7.5 8. Frequency (GHz) 3F S21 S11 (db) -13-25 -38 F LP63A195ANTR -5.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. 7.5 8. 2F Frequency (GHz) 3F 17

Thin-Film Low Pass Filter LP63 Lead-Free LGA Type S21 S11 (db) -5-1 -15-2 -25-3 -35-4 -45 F LP63A214ANTR -5.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. 7.5 8. Frequency (GHz) 2F 3F S21 S11 (db) -5-1 -15-2 -25-3 -35-4 -45 F LP63A2442ANTR -5.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. 7.5 8. 8.5 9. 9.5 1. 2F Frequency (GHz) 3F 4 S21 S11 (db) -5-1 -15-2 -25-3 -35-4 -45 F LP63N35ANTR -5 1 2 3 4 5 6 7 8 9 1 11 12 13 2F Frequency (GHz) 3F S21 S11 (db) -5-1 -15-2 -25-3 -35-4 -45 LP63N52ANTR F -5 1 2 3 4 5 6 7 8 9 1 11 12 13 Frequency (GHz) 2F S21 S11 (db) -5-1 -15-2 -25-3 -35-4 -45 LP63N55ANTR F -5 1 2 3 4 5 6 7 8 9 1 11 12 13 Frequency (GHz) 2F 18

Thin-Film Low Pass Filter LP63 Lead-Free LGA Type Test Jig TEST JIG FOR LP63 LEAD-FREE LGA LOW PASS FILTER GENERAL DESCRIPTION These jigs are designed for testing the LP63 LGA Low Pass Filters using a Vector Network Analyzer. They consist of a dielectric substrate, having 5Ω microstrips as conducting lines and a bottom ground plane located at a distance of.127mm from the microstrips. The substrate used is Neltec s NH9338ST127C1BC (or similar). The connectors are SMA type (female), Johnson Components Inc. Product P/N: 142-71-841 (or similar). Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5Ω SMA termination. MEASUREMENT PROCEDURE Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Solder the filter to the measurement jig as follows: Input Ë Connector 1 (Jig) GND (Filter) Ë GND (Jig) (Filter) Output Ë Connector 2 (Jig) GND (Filter) Ë GND (Jig) (Filter) Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2 (using an RF cable). Measurement Calibration Jig Connector 1 Short line to GND Open line 4 Connector Johnson P/N 152-71-841 Connector 2 Load & Through Load & OUT 19

Thin-Film Low Pass Filter LP85 Type Harmonic 4 GENERAL DESCRIPTION The ITF (Integrated Thin-Film) SMD Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small Size: 85 Frequency Range: 8MHz - 3.5GHz Characteristic Impedance: 5Ω Operating / Storage Temp.: -4 C to +85 C Power Rating: 3W Continuous Low Profile Rugged Construction Taped and Reeled APPLICATIONS Mobile Communications Satellite TV Receivers GPS Vehicle Location Systems Wireless LAN s DIMENSIONS: millimeters (inches) PAD LAYOUT See CP85 pad layout on page 64. FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual/mechanical characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R 4 hours TERMINATION Nickel/Solder coating (Sn, Pb) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. L W T A B 2.3±.1 (.8±.4) 1.55±.1 (.61±.4) 1.2±.1 (.4±.4).56±.25 (.22±.1).35±.15 (.14±.6) HOW TO ORDER LP 85A 92 AW TR Style Low Pass Size 85 Frequency MHz Termination AW= Nickel/Solder (SnPb) **AS = Nickel/ Lead Free Solder (Sn1) Packaging Code TR = Tape and Reel Not RoHS Compliant **RoHS compliant TERMINALS AND LAYOUT (Top View) Orientation in Tape LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. TYPE A TYPE D TYPE E TYPE F (Sn1) IN GND IN GND IN GND IN GND A MARKING CODE OUT GND OUT GND OUT GND OUT GND 11

Thin-Film Low Pass Filter LP85 Type Harmonic ELECTRICAL CHARACTERISTICS Application Part Frequency I. Loss VSWR Attenuation Layout Type Layout Type F Number Band (MHz) max max (db) Typical (SnPb) Marking Code E-GSM LP85A897AS 88-915 A E LP85A942AS 925-96 A F LP85A92AS 89-915 A E GSM LP85A947AS 935-96 A F LP85A1119AS 111-1137 A H AMPS LP85A836AS 824-849 A A LP85A881AS 869-894 A C PCN LP85A1747AS 171-1785.4dB 1.7 3 @ 2XFo D I LP85A1842AS 185-188 (.3dB typ) 2 @ 3xFo D J PCS LP85A188AS 185-191 D K LP85A196AS 193-199 D M PHP LP85A197AS 1895-192 D L DECT LP85A189AS 188-19 D K 3G LP85A215AS 195-218 D N Wireless LAN LP85A2442AS 24-2484 D S WLL LP85A35AS 34 ~ 36 E X Typical Electrical Performance db LP85A836ASTR Fo -1-2 -3-4 3Fo -5 2Fo -6-7.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) db LP85A881ASTR Fo -1-2 -3-4 3Fo -5 2Fo -6-7.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) db LP85A92ASTR Fo -1-2 -3-4 3Fo -5 2Fo -6-7.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) 4 LP85A967ASTR LP85A1747ASTR LP85A1842ASTR -1 Fo -1 Fo -1 Fo -2-2 -2 db -3-4 -5-6 2Fo 3Fo db -3-4 -5-6 2Fo 3Fo db -3-4 -5-6 2Fo 3Fo -7.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) -7 1 2 3 4 5 6 7 8 9 1 Frequency (GHz) -7 1 2 3 4 5 6 7 8 9 1 Frequency (GHz) db LP85A195ASTR Fo -1-2 -3 3Fo -4-5 2Fo -6-7 1 2 3 4 5 6 7 8 9 1 Frequency (GHz) db LP85A2442ASTR Fo -1-2 -3 3Fo -4-5 -6 2Fo -7 1 2 3 4 5 6 7 8 9 1 Frequency (GHz) db LP85A35ASTR Fo -1-2 -3-4 3Fo -5 2Fo -6-7 1 2 3 4 5 6 7 8 9 1 11 12 13 Frequency (GHz) -1 LP85A1119ASTR Fo -1 Fo LP85A215ASTR -2-2 db -3-4 -5 2Fo 3Fo db -3-4 -5 2Fo 3Fo -6-6 -7.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) -7 1 2 3 4 5 6 7 8 9 1 Frequency (GHz) 111

Thin-Film Low Pass Filter LP85 Test Jig ITF TEST JIG FOR LOW PASS FILTER 85 GENERAL DESCRIPTION These jigs are designed for testing the LPF85 Low Pass Filters using a Vector Network Analyzer. They consist of a dielectric substrate, having 5W microstrips as conducting lines and a bottom ground plane located at a distance of.254 mm from the microstrips. The substrate used is RF-35-1-C1B17 (or similar). The connectors are SMA type (female), Johnson Components Inc. Product P/N: 142-71-841(or similar). Both a measurement jig and a calibration jig are provided. The calibration jig is designed for a full 2-port calibration, and consists of an open line, short line and through line. LOAD calibration can be done by a 5W SMA termination. MEASUREMENT PROCEDURE Follow the VNA s instruction manual and use the calibration jig to perform a full 2-Port calibration in the required bandwidths. Solder the filter to the measurement jig as follows: Input Ë Connector 1 (Jig) GND (Filter) Ë GND (Jig) (Filter) Output Ë Connector 2 (Jig) GND (Filter) Ë GND (Jig) (Filter) Set the VNA to the relevant frequency band. Connect the VNA using a 1dB attenuator on the jig terminal connected to port 2 (using an RF cable). Measurement Calibration Jig Connector 1 Short line to GND Open line 4 Connector Johnson P/N 142-71-841 Connector 2 Load Through Load Through 112

High Performance Harmonic Low Pass Filter LP126A512BNTR ITF TECHNOLOGY The ITF LGA Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small size: 126 Frequency: 512MHz Characteristic impedance: 5Ω Operating/Storage temp: -4 C to +85 C Low profile Rugged construction Taped and reeled RoHS compliant APPLICATIONS Mobile communications Satellite TV receivers GPS Vehicle location systems Wireless LAN s DIMENSIONS (Bottom View) mm (inches) HOW TO ORDER LP 126 A Type XXXX Frequency (MHz) FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual/mechanical characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours B Sub- Type N Termination TR Taped & Reeled B H S A L T W TERMINALS (Top View) IN GND L W T A B H, S 3.1±.1 (.122±.4) 1.6±.1 (.63±.4).6±.3 (.24±.12).39±.1.15±.4.33±.1.13±.4.5±.5 (.2±.2) 4 TERMINATION Nickel/ Lead free Solder coating (Sn1) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. OUT GND Orientation Marking POWER RATING 3W RF Continuous ORIENTATION IN TAPE IN GND Recommended Pad Layout Dimensions mm (inches).7 (.28).8 (.31).6 (.24) OUT GND 1.8 (.71) 11515 113

High Performance Harmonic Low Pass Filter LP126A512BNTR TERMINALS (Top View) Parameter Value Unit Notes Fc 512 MHz Rejection @ 9MHz -35 db Min. (72MHz to 2GHz) Insertion Loss.8 db Max. VSWR 2.3: 1 Max. (all ports) Power Handling 3 W Continuous Impedance 5 Ohm Operating Temp. -4 to +85 ºC Size 126 TYPICAL ELECTRICAL PERFORMANCE m1-1 -2 m1 freq = 512 MHz S21 = -.78 db m2 freq = 72 MHz S21 = -39 db 4 S11 (db) S12 (db) -3-4 -5 m2-6 -7-8 1 5 9 13 17 21 25 Frequency (MHz) 114 11515

High Performance Low Pass Filter LP126A7ANTR ITF TECHNOLOGY The ITF LGA Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The ITF Filter is offered in a variety of frequency bands compatible with various types of high frequency wireless systems. FEATURES Small size: 126 Frequency: 7MHz Characteristic impedance: 5Ω Operating/Storage temp: -4 C to +85 C Low profile Rugged construction Taped and reeled RoHS compliant APPLICATIONS Mobile communications Satellite TV receivers GPS Vehicle location systems Wireless LAN s DIMENSIONS (Bottom View) mm (inches) HOW TO ORDER LP 126 A Type XXXX Frequency (MHz) A Sub- Type N Termination FINAL QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual/mechanical characteristics. Each production lot is evaluated on a sample basis for: Static Humidity: 85 C, 85% RH, 16 hours Endurance: 125 C, I R, 4 hours TERMINATION Nickel/ Lead free Solder coating (Sn1) compatible with automatic soldering technologies: reflow, wave soldering, vapor phase and manual. POWER RATING 3W RF Continuous ORIENTATION IN TAPE TR Taped & Reeled T A W B TERMINALS (Top View) IN OUT.7 (.28).8 (.31) H L GND GND S L W T A B H, S Orientation Marking Recommended Pad Layout Dimensions mm (inches) 3.1±.1 (.122±.4) 1.6±.1 (.63±.4).6±.3 (.24±.12).39±.1.15±.4.33±.1.13±.4.5±.5 (.2±.2).6 (.24) 4 IN OUT GND GND 1.8 (.71) 11515 115

High Performance Low Pass Filter LP126A7ANTR TERMINALS (Top View) Parameter Value Unit Notes Fc 7 MHz Rejection @ 9MHz -35 db Min. (9MHz to 2GHz) Insertion Loss.9 db Max. VSWR 2.3: 1 Max. (all ports) Power Handling 3 W Continuous Impedance 5 Ohm Operating Temp. -4 to +85 ºC Size 126 TYPICAL ELECTRICAL PERFORMANCE -1 m1 m1: Frequency = 7.MHz S21 = -.8dB m2: Frequency = 9.MHz S21 = -39.5dB 4 S11 (db) S21 (db) -2-3 -4 m2-5.4.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 Frequency (GHz) 116 11515

Thin-Film RF/Microwave Products Designer Kits Accu-P /Accu-L Kits 117

RF/Microwave Thin-Film Products Designer Kits (Special Kits Available Upon Request) Accu-P Designer Kit Type 17LF Order Number: Accu-P 21KITL2 Accu-P Designer Kit Type 18LF Order Number: Accu-P 21KITL3 Accu-P Designer Kit Type 13LF Order Number: Accu-P 42KITL1 Accu-P Designer Kit Type 14LF Order Number: Accu-P 42KITL2 Volts Capacitors Tolerance Value (pf).1 P.2 P 1.3 P.4 P.5 P.6 P.7 P.8 P.9 P 5 1. P 1.1 A 1.2 A 1.3 A 1.5 A 1.8 A 2. B 2.2 B 2.4 B 2.7 B 3. B 25 3.3 B 3.6 B 3.9 B 4.7 B 5.6 B 6.8 B 7.5 B 16 8.2 1. B G 12. G 6 Capacitors, 2 each of 3 values Tolerance P =.2pF A = ±.5pF B = ±.1pF G = ± 2% Volts Capacitors Tolerance Value (pf) 1. A 1.1 A 1.2 A 5 1.3 A 1.4 A 1.5 A 1.6 A 1.7 A 1.8 A 1.9 A 2. A 2.1 B 2.2 B 2.3 B 2.4 B 2.5 B 2.6 B 2.7 B 25 2.8 B 2.9 B 3. B 3.1 B 3.3 B 3.4 B 3.6 B 3.9 B 4.1 B 4.3 B 4.5 B 4.7 B 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF Volts Capacitors Tolerance Value (pf).1 P.2 P.3 P.4 P.5 P.6 P 1.7.8 P P.9 P 1. P 1.1 A 1.2 A 1.5 A 1.8 A 2. A 2.2 B 2.4 B 2.7 B 3. B 5 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B 8.2 B 1. G 25 12. 15. G G 18. G 16 22. G 6 Capacitors, 2 each of 3 values Tolerance P = ±.2pF A = ±.5pF B = ±.1pF G = ± 2% Volts Capacitors Tolerance Value (pf) 1. A 1.1 A 1.2 A 1.3 A 1 1.4 A 1.5 A 1.6 A 1.7 A 1.8 A 1.9 A 2. A 2.1 B 2.2 B 2.3 B 2.4 B 2.5 B 2.6 B 2.7 B 5 2.8 B 2.9 B 3. B 3.1 B 3.3 B 3.4 B 3.6 B 3.9 B 4.1 B 4.3 B 4.5 B 4.7 B 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF Accu-P Designer Kit Type 9LF Order Number: Accu-P 63KITL1 Accu-P Designer Kit Type 8LF Order Number: Accu-P 85KITL2 Accu-P Designer Kit Type 28LF Order Number: Accu-P 21KITL5 Accu-P Designer Kit Type 27LF Order Number: Accu-P 42KITL4 5 Volts Capacitors Tolerance Value (pf).1 A.2 A.3 A.4 B.5 B.6 B.7 B.8 B.9 B 1. B 1 1.1 B 1.2 B 1.5 B 1.8 B 2. B 2.2 B 2.4 B 2.7 B 3. B 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B 5 8.2 B 1. G 12. G 15. G 18. G 25 22. G 6 Capacitors, 2 each of 3 values Tolerance A = ±.5pF B = ±.1pF G = ± 2% Volts Capacitors Tolerance Value (pf).1 A.2 A.3 A.4 A.5 B.7 B.8 B.9 B 1. B 1.2 B 1 1.5 B 1.8 B 2. B 2.2 B 2.7 B 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B 8.2 B 1. G 12. G 15. G 18. G 22. G 5 27. J 33. J 39. J 47. J 3 Capacitors, 1 each of 3 values Tolerance A = ±.5pF G = ± 2% B = ±.1pF J = ±5% Volts Capacitors Tolerance Value (pf).5 Z.1 Z.15 Z.2 Z 1.25.3 Z Z.35 Z.4 Z.45 Z.5 Z.55 P.6 P.65 P.7 P.75 P.8 P.85 P.9 P 5.95 P 1. P 1.1 P 1.2 P 1.3 P 1.4 P 1.5 P 1.6 P 1.7 P 1.8 P 25 1.9 P 2. P 6 Capacitors, 2 each of 3 values Tolerance Z = ±.1pF P = ±.2pF Volts Capacitors Tolerance Value (pf).5 Z.1 Z.15 Z.2 Z.25 Z.3 Z.35 Z.4 Z.45 Z.5 Z.55 P.6 P.65 P 1.7.75 P P.8 P.85 P.9 P.95 P 1. P 1.1 P 1.2 P 1.3 P 1.4 P 1.5 P 1.6 P 1.7 P 1.8 P 5 1.9 2. P P 6 Capacitors, 2 each of 3 values Tolerance Z = ±.1pF P = ±.2pF 118

RF/Microwave Thin-Film Products Designer Kits (Special Kits Available Upon Request) Accu-P Designer Kit Type 22LF Order Number: Accu-P 63KITL2 Accu-P Designer Kit Type 7 Order Number: Accu-P 121KIT2 Accu-P 15 Designer Kit Type 31LF Order Number: Accu-P C5KITL1 Volts Capacitors Tolerance Value (pf).5 P.1 P.15 P.2 P.25 P.3 P.35 P 1.4 P.45 P.5 P.55 P.6 P.65 P.7 P.75 P Volts Capacitors Tolerance Value (pf) 1. B 1.5 B 1.8 B 2.2 B 2.7 B 3.3 B 4.7 B 1 5.6 B 6.8 B 1. G 12. G 18. G 22. G 27. G 33. G Volts Capacitors Tolerance Value (pf).5 P.1 P.2 P.3 P.4 P.5 P.6 P 16.7 P.8 P.9 P 1. Q 1.2 Q 1.5 Q 1.8 Q 2.2 Q 3 Capacitors, 2 each of 15 values Tolerance P = ±.2pF 15 Capacitors, 1 each of 15 values Tolerance B = ±.1pF G = ± 2% 75 Capacitors, 5 each of 15 values Tolerance P = ±.2pF Q = ±.3pF Accu-L 21 Designer Kit Type 32 Order Number: Accu-L 21KIT1 Inductance Value (nh) Tolerance.33 A.39 A.47 A.56 A.68 A.82 A 1. A 1.2 A 1.5 B 1.8 B 2.2 B 2.7 B 3.3 B 26 Inductors, 2 each of 13 values Tolerance A = ±.5nH B = ±.1nH Accu-L Designer Kit Type 25 Order Number: Accu-L L42KIT1 Inductance Value (nh) Tolerance.82 A 1. A 1.2 A 1.5 A 1.8 A 2.2 A 2.7 A 3.3 B 3.9 B 4.7 B 5.6 B 6.8 B 24 Inductors, 2 each of 12 values Tolerance A = ±.5nH B = ±.1nH Accu-L Designer Kit Type 16LF Order Number: Accu-L 63KITL2 Inductance Value (nh) Tolerance 1.2 C 1.5 C 1.8 C 2.2 C 2.7 C 3.3 C 3.9 C 4.7 C 5.6 C 6.8 C 8.2 C 1 G 12 G 15 G 28 Inductors, 2 each of 14 values Tolerance C = ±.2nH G = ±2% 5 Accu-L Designer Kit Type 11LF Order Number: Accu-L 85KITL2 Inductance Value (nh) Tolerance 1.8 C 2.2 C 2.7 C 3.3 C 3.9 C 4.7 C 5.6 C 6.8 D 8.2 D 1. J 12. J 15. J 18. J 22. J 28 Inductors, 2 each of 14 values Tolerance C = ±.2nH D = ±.5nH J = ±5% 119

Multilayer Organic (MLO TM ) Technology MLO TM Capacitors MLO TM Diplexers MLO TM Inductors MLO TM SMT Crossovers 12

Multi-Layer Organic Capacitors Based on its patented multilayer low loss organic (MLO TM ) technology. These new capacitors represent a paradigm shift from traditional ceramic and thin film passive SMD components. Multilayer Organic Capacitors (MLOC) are polymer based capacitors that use high conductivity copper interconnects in a multilayer fashion. The ability to fabricate these components on large area substrates and state of the art laser direct imaging allow for improved cost benefits and tolerance control. The end result is a state of the art low ESR and high SRF low profile RF capacitor that can support frequencies well above one GHz. Additionally MLOCs are expansion matched to printed circuit boards to allow for improved reliability. FEATURES Low ESR Hi-Q High Self Resonance Tight Tolerance Low Dielectric Absorption (.15%) APPLICATIONS RF Power Amplifiers Low Noise Amplifiers Filter Networks Instrumentation HOW TO ORDER ML 3 7 1 1R8 P A T 2A AVX Style Case Size 3 = 63 Voltage Code 5 = 5V V = 25V 7 = 5V Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Failure Rate Code A = Not Applicable Packaging Code 2A = 7" Reel Unmarked R T Temperature Coefficient Code 1 = ±3ppm Capacitance Tolerance Code P = ±.2 pf A = ±.5 pf B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% Termination Style Code T = Ni, Sin W B L LEAD-FREE COMPATIBLE COMPONENT 6 MECHANICAL DIMENSIONS: inches (millimeters) Case Length (L) Width (W) Thickness (T) Band Width (B) Castellation Radius (R) 63.63 ±.4 (1.6 ±.12).33 ±.4 (.838 ±.12).25 ±.4 (.635 ±.12).15 ±.5 (.381 ±.127).8 ±.2 (.23 ±.51) TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). 8mm carrier 7" reel, 3, pcs per reel 121

Multi-Layer Organic Capacitors ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Life (Endurance) MIL-STD-22F 125 C, 2U R, 1 hours No visible damage C/C 2% for C 5pF Method 18A C/C.25pF for C<5pF Accelerated Damp Heat Steady 85 C, 85% RH, U R, 1 hours No visible damage C/C 2% for C 5pF State MIL-STD-22F Method 13B C/C.25pF for C<5pF Temperature Cycling 55 C to +125 C, 15 cycles MLO TM No visible damage C/C 2% for C 5pF MIL-STD-22F Method 17E C/C.25pF for C<5pF MIL-STD-883D Method 11.7 Resistance to Solder Heat 26 C ± 5 C for 1 secs. C remains within initial limits IEC-68-2-58 MECHANICAL SPECIFICATIONS TEST CONDITIONS REQUIREMENT Solderability IEC-68-2-58 Components completely immersed in Terminations to be well tinned, minimum 95% a solder bath at 235 C for 2 secs. coverage Leach Resistance IEC-68-2-58 Components completely immersed in Dissolution of termination faces 15% of area a solder bath at 26±5 C for 6 secs. Dissolution of termination edges 25% of length Adhesion MIL-STD-22F A force of 5N applied for 1 secs. No visible damage Method 211A Termination Bond Strength Tested as shown in diagram No visible damage C/C 2% for C 5pF IEC-68-2-21 Amend. 2 C/C.25pF for C<5pF Robustness of Termination A force of 5N applied for 1 secs. No visible damage IEC-68-2-21 Amend. 2 Storage 12 months minimum with components Good solderability stored in as received packaging 6 QUALITY & RELIABILITY MLO TM capacitors utilize high density interconnect wiring technology on well established low loss organic materials. FINAL QUALITY INSPECTION Finished parts are tested for standard electrical parameters and visual/mechanical characteristics. Each production lot is 1% evaluated for: capacitance and proof voltage at 2.5 U R. In addition, production is periodically evaluated for: Average capacitance with histogram printout for capacitance distribution; IR and Breakdown Voltage distribution; Temperature Coefficient; Solderability; Dimensional, mechanical and temperature stability. QUALITY ASSURANCE The reliability of these multilayer organic capacitors has been extensively studied. Various methods and standards have been used to ensure a high quality component including JEDEC, Mil Spec and IPC testing. AVX s quality assurance policy is based on well established international industry standards. The reliability of the capacitors is determined by accelerated testing under the following conditions: Life (Endurance) 125 C, 2U R, 1 hours Accelerated Damp 85 C, 85% RH, U R, Heat Steady State 1 hours. TABLE I: CASE SIZE ML3 Cap. pf Cap. Tol. WVDC.1 P, A, B 5, 25, 5.2 P, A, B 5, 25, 5.3 P, A, B 5, 25, 5.4 P, A, B 5, 25, 5.5 P, A, B, C 5, 25, 5.6 P, A, B, C 5, 25, 5.7 P, A, B, C 5, 25, 5.8 P, A, B, C 5, 25, 5.9 P, A, B, C 5, 25, 5 1. P, A, B, C 5, 25, 5 1.1 P, A, B, C 5, 25, 5 1.2 P, A, B, C 5, 25, 5 122 Cap. pf Cap. Tol. WVDC 1.3 P, A, B, C 5, 25, 5 1.4 P, A, B, C 5, 25, 5 1.5 P, A, B, C 5, 25, 5 1.6 P, A, B, C 5, 25, 5 1.7 P, A, B, C 5, 25, 5 1.8 P, A, B, C 5, 25, 5 1.9 P, A, B, C 5, 25, 5 2. P, A, B, C 5, 25, 5 2.2 P, A, B, C 5, 25, 5 2.4 P, A, B, C 5, 25, 5 2.5 P, A, B, C 5, 25, 5 2.7 P, A, B, C 5, 25 Cap. pf Cap. Tol. WVDC 3. P, A, B, C 5, 25 3.3 P, A, B, C 5, 25 3.6 P, A, B, C 5, 25 3.9 P, A, B, C 5, 25

Multi-Layer Organic Capacitors 1. Typical ESR vs. vs. Frequency MLO OPC TM 63 63 Ohm 1..1.4 pf.7 pf.9 pf 1.4 pf 1.7 pf 2.2 pf.1..2.4.6.8 1. 1.2 1.4 1.6 1.8 2. GHz 1 Typical Q vs. Frequency MLO TM 63 1 2.5 pf Q 1 1 2. pf 1.5 pf 1.pF.5pF 6 1.1-1 1 1 Frequency (GHz) 123

Multi-Layer Organic Capacitors 1 Typical Typical Self Self Resonant Resonant Frequency Frequency vs. Capacitance vs Capacitance MLOOPC TM 63 63 GHz 1 1.1 1 1 pf 6 124

Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer HOW TO ORDER DP Type 3 Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni Au, Ni Sn and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. 1 2 3 B Design POWER CAPACITY 4.5W Maximum 6 5 4 5425 Frequency (MHz) ORIENTATION IN TAPE Top View 1 2 3 6 5 4 7 Finish 7 = Au T = NiSn 1 2 3 MLO TM TECHNOLOGY The 63 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors, and capacitors in a multilayer stack up. The MLO diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, GSM, and BT. These diplexers are less than.5mm in height and are ideally suited for band switching for dual band systems. All diplexers are expansion matched to printed circuit boards thereby resulting in improved reliability vs. ceramic and Si components. 6 5 4 TR Packaging Tape & Reel Bottom View PART NUMBER: DP3B54257TR APPLICATIONS Multiband applications including WiFi, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics High Heat Dissipation COMPONENT DIMENSIONS AND FUNCTIONS.2±.1.3±.1.64±.5.23±.1 (.8±.4) (.12±.4) (.25±.2) (.9±.4) 1 2 3.88±.2 (.35±.8) 1.28±.2.46±.1 (.5±.8)(.18±.4).61±.5 (.24±.2).95±.5 (.37±.2).51±.5 (.2±.2).2±.1 (.8±.4) 6 5 4 2.12±.2 1.65±.2 (.65±.8).4±.4 (.2±.2).6±.1 (.2±.4).25±.1 (.1±.4).15±.2 (.6±.1).44±.1 (.17±.4).45±.1 (.18±.4) Side Side View.45±.1.55±.1 (.18±.4) (.22±.4) (.83±.8) Unit: mm (inches) Terminal No. Terminal Name 1 GND 2 Common 3 GND 4 Low Frequency Port 5 GND 6 High Frequency Port Electrical Characteristics @ 25ºC Unit: mm (inches) No. Parameter Freq. (MHz) Port Specification Typ. value Unit 1 Insertion 24-2496 Low.55 max.4 db 2 Loss 49-595 High 1.2 max.8 db 3 5-27 High 28 min 35 db Attenuation 4 98-119 High 1 min 14 db 6 48-4992 Low 2 min 25 db 7 Attenuation 49-595 Low 23 min 27 db 8 72-75 Low 26 min 3 db 9 5-27 Low-High 28 min 35 db Isolation 1 49-595 Low-High 22 min 25 db 11 VSWR 24-25 Ant 2. max 1.5-12 VSWR 49-595 Ant 2. max 1.3-13 VSWR 24-25 Low 2. max 1.5-14 VSWR 49-595 High 2. max 1.3 - Mechanical Characteristics @ 25ºC Size [mm(inches)] 1.65 x.88 (.65 x.35) Height [mm(inches)].42 (.17) Volume (mm^3).77 6 125

Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer S PARAMETER MEASUREMENTS LOW BAND PORT ATTENUATION HIGH BAND PORT ATTENUATION Low Band Attenuation Frequency Attenuation 4.8 GHz 25.32 4.992 GHz 29.935 4.9 GHz 27.471 5.4 GHz 32.647 5.59 GHz 26.99 7.2 GHz 34.531 7.488 GHz 26.86 High Band Attenuation Frequency Attenuation.5 GHz 35.133 2.4 GHz 39.19 2.45 GHz 41.46 2.496 GHz 42.793 2.7 GHz 31.67 9.8 GHz 13.967 11.9 GHz 28.352 LOW BAND INSERTION LOSS HIGH BAND INSERTION LOSS 6 Low Band Insertion Loss Frequency Insertion Loss 2.4 GHz.44 2.45 GHz.418 2.496 GHz.42 High Band Insertion Loss Frequency Insertion Loss 4.9 GHz.99 5.4 GHz.577 5.95 GHz.562 126

Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer S PARAMETER MEASUREMENTS COMMON PORT RETURN LOSS ISOLATION Common Return Loss Frequency Return Loss VSWR 2.4 GHz 14.66 1.494 2.45 GHz 14.162 1.487 2.496 GHz 14.325 1.476 4.9 GHz 12.75 1.599 5.4 GHz 24.63 1.125 5.95 GHz 21.31 1.188 Isolation Frequency Attenuation.5 GHz 32.253 1.55 GHz 28.144 2.4 GHz 28.913 2.45 GHz 43.562 2.496 GHz 52.47 2.7 GHz 31.566 4.9 GHz 27.731 5.4 GHz 34.34 5.95 GHz 26.249 LOW BAND RETURN LOSS HIGH BAND RETURN LOSS 6 Low Band Return Loss Frequency Return Loss VSWR 2.4 GHz 14.232 1.482 2.45 GHz 14.429 1.469 2.496 GHz 14.572 1.459 High Band Return Loss Frequency Return Loss VSWR 4.9 GHz 12.587 5.4 GHz 27.577 1.87 5.95 GHz 22.533 1.161 127

Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer 6 HOW TO ORDER DP Type 3 Size QUALITY INSPECTION MLO TM TECHNOLOGY Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni Au, Ni Sn and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. 1 2 3 A Design POWER CAPACITY 4.5W Maximum 6 5 4 5425 Frequency (MHz) ORIENTATION IN TAPE Top View 1 2 3 6 5 4 7 Finish 7 = Au T = NiSn 1 2 3 The 63 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors, and capacitors in a multilayer stack up. The MLO diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, GSM, and BT. These diplexers are less than.5mm in height and are ideally suited for band switching for dual band systems. All diplexers are expansion matched to printed circuit boards thereby resulting in improved reliability vs. ceramic and Si components. 6 5 4 TR Packaging Tape & Reel Bottom View APPLICATIONS Multiband applications including WiFi, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics High Heat Dissipation COMPONENT DIMENSIONS AND FUNCTIONS.2±.1.3±.1.64±.5.23±.1 (.8±.4) (.12±.4) (.25±.2) (.9±.4) 1 2 3.88±.2 (.35±.8) 1.28±.2.46±.1 (.5±.8)(.18±.4).61±.5 (.24±.2).95±.5 (.37±.2).51±.5 (.2±.2).2±.1 (.8±.4) 6 5 4 2.12±.2 1.65±.2 (.65±.8).4±.4 (.2±.2).6±.1 (.2±.4).25±.1 (.1±.4).15±.2 (.6±.1).44±.1 (.17±.4).45±.1 (.18±.4) Side Side View.45±.1.55±.1 (.18±.4) (.22±.4) (.83±.8) Unit: mm (inches) Terminal No. Terminal Name 1 Low Frequency Port 2 GND 3 High Frequency Port 4 GND 5 Common 6 GND PART NUMBER: DP3A54257TR Unit: mm (inches) Electrical Characteristics @ 25ºC No. Parameter Freq. (MHz) Port Specification Typ. value Unit 1 Insertion 24-2496 Low.55 max.4 db 2 Loss 49-595 High 1.2 max.8 db 3 5-27 High 28 min 35 db Attenuation 4 98-119 High 1 min 14 db 6 48-4992 Low 2 min 25 db 7 Attenuation 49-595 Low 23 min 27 db 8 72-75 Low 26 min 3 db 9 5-27 Low-High 28 min 35 db Isolation 1 49-595 Low-High 22 min 25 db 11 VSWR 24-25 Ant 2. max 1.5-12 VSWR 49-595 Ant 2. max 1.3-13 VSWR 24-25 Low 2. max 1.5-14 VSWR 49-595 High 2. max 1.3 - Mechanical Characteristics @ 25ºC Size [mm(inches)] 1.65 x.88 (.65 x.35) Height [mm(inches)].42 (.17) Volume (mm^3).77 128

Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer S PARAMETER MEASUREMENTS LOW BAND PORT ATTENUATION HIGH BAND PORT ATTENUATION Low Band Attenuation Frequency Attenuation 4.8 GHz 25.32 4.992 GHz 29.935 4.9 GHz 27.471 5.4 GHz 32.647 5.59 GHz 26.99 7.2 GHz 34.531 7.488 GHz 26.86 High Band Attenuation Frequency Attenuation.5 GHz 35.133 2.4 GHz 39.19 2.45 GHz 41.46 2.496 GHz 42.793 2.7 GHz 31.67 9.8 GHz 13.967 11.9 GHz 28.352 LOW BAND INSERTION LOSS HIGH BAND INSERTION LOSS 6 Low Band Insertion Loss Frequency Insertion Loss 2.4 GHz.44 2.45 GHz.418 2.496 GHz.42 High Band Insertion Loss Frequency Insertion Loss 4.9 GHz.99 5.4 GHz.577 5.95 GHz.562 129

Multilayer Organic (MLO TM ) 63 WLAN/BT Diplexer S PARAMETER MEASUREMENTS COMMON PORT RETURN LOSS ISOLATION Common Return Loss Frequency Return Loss VSWR 2.4 GHz 14.66 1.494 2.45 GHz 14.162 1.487 2.496 GHz 14.325 1.476 4.9 GHz 12.75 1.599 5.4 GHz 24.63 1.125 5.95 GHz 21.31 1.188 Isolation Frequency Attenuation.5 GHz 32.253 1.55 GHz 28.144 2.4 GHz 28.913 2.45 GHz 43.562 2.496 GHz 52.47 2.7 GHz 31.566 4.9 GHz 27.731 5.4 GHz 34.34 5.95 GHz 26.249 LOW BAND RETURN LOSS HIGH BAND RETURN LOSS 6 Low Band Return Loss Frequency Return Loss VSWR 2.4 GHz 14.232 1.482 2.45 GHz 14.429 1.469 2.496 GHz 14.572 1.459 High Band Return Loss Frequency Return Loss VSWR 4.9 GHz 12.587 5.4 GHz 27.577 1.87 5.95 GHz 22.533 1.161 13

Multilayer Organic (MLO TM ) 85 CDMA Diplexer MLO TM TECHNOLOGY The 85 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO TM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed passive elements such as inductors and capacitors in a multilayer stack up. The MLO TM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, and GSM and are less than.6mm in thickness. These components are ideally suited for band switching for dual band systems. All diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. APPLICATIONS Multiband applications including WCDMA, WLAN, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Low Insertion Loss Excellent Solderability Low Parasitics Low Profile HOW TO ORDER DP 5 A 192 7 TR COMPONENT DIMENSIONS AND FUNCTIONS.2±.1 (.8±.4) Bottom View.64±.5 (.25±.2) Side View Type Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC Design TERMINATION Frequency (MHz) Finish 7 = Au T = NiSn Packaging Tape & Reel TR = 3 Kpcs TR/5 = 5 pcs Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. ORIENTATION IN TAPE 6 5 4 POWER CAPACITY 4.5W Maximum 1 2 3 Top View 6 5 4 1 2 3 1.28±.2 (.5±.8).95±.5 (.37±.2).2±.1 (.8±.4) 2.12±.2 (.83±.8) PART NUMBER: DP5A1927TR.4±.4 (.2±.2).25±.1 (.1±.4).44±.1 (.17±.4) Terminal No. Terminal Name 1 High Frequency Port 2 GND 3 Low Frequency Port 4 GND 5 Common Port 6 GND.55±.1 (.22±.4) Unit: mm (inches) Specification @ 25ºC Size [mm(inches)] 2.12 x 1.28 (.83 x.5) Height [mm(inches)].55 (.21) Volume (mm^3) 1.5 Frequency Range (F1) (MHz) 859±35 Frequency Range (F2) (MHz) 192±7 Insertion Loss (F1, at Fc) (db) -.4 Insertion Loss (F2, at Fc) (db) -.6 Attenuation (F1) at (F2) (db) -23 Attenuation (F2) at (F1) (db) -23 VSWR (Input @ F1) 1.4 VSWR (Input @ F2) 1.3 VSWR (Lowband @ F1) 1.4 VSWR (Highband @ F2) 1.4 6 131

Multilayer Organic (MLO TM ) 85 CDMA Diplexer S PARAMETER MEASUREMENTS db(s(1,1) db(s(3,1) -5-1 -15-2 -25-3 Low Band Return Loss -35.4.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 2.6 freq, GHz db(s(1,1) db(s(2,1) -5-1 -15-2 -25-3 -35-4.4.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 2.6 freq, GHz High Band Return Loss db(s(2,3)) -12-14 -16-18 -2-22 -24-26 Isolation -28-3 -32.4.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 2.6 freq, GHz 6 Note: Measurements were taken using an Anritsu 4 port VNA; Diplexer was mounted on a custom evaluation board. To reduce systematic errors from the VNA, the coaxial measurement cables, and evaluation board, a Short-Open-Load-Thru (SOLT) calibration was performed, using a custom fabricated calibration substrate. This is the most common coaxial calibration methods. 132

Multilayer Organic (MLO TM ) 85 WCDMA Diplexer MLO TM TECHNOLOGY The 85 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO TM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed passive elements such as inductors and capacitors in a multilayer stack up. The MLO TM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, and GSM and are less than.6mm in thickness. These components are ideally suited for band switching for dual band systems. All diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. APPLICATIONS Multiband applications including WCDMA, WLAN, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Low Insertion Loss Excellent Solderability Low Parasitics Low Profile HOW TO ORDER DP Type 5 Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. 6 5 4 A Design POWER CAPACITY 4.5W Maximum 1 2 3 194 Frequency (MHz) ORIENTATION IN TAPE Top View 7 Finish 7 = Au T = NiSn 6 5 4 1 2 3 TR Packaging Tape & Reel TR = 3 Kpcs TR/5 = 5 pcs COMPONENT DIMENSIONS AND FUNCTIONS.2±.1 (.8±.4).2±.1 (.8±.4) 1.28±.2 (.5±.8).95±.5 (.37±.2).2±.1 (.8±.4).2±.1 (.8±.4) Bottom View.64±.5 (.25±.2) 1 2 3 6 5 4 2.12±.2 (.83±.8) Unit: mm (inches) Terminal No. Terminal Name 1 High Frequency Port 2 GND 3 Low Frequency Port 4 GND 5 Common Port 6 GND PART NUMBER: DP5A1947TR.4±.4 (.2±.2).25±.1 (.1±.4).44±.1 (.17±.4) Side View.55±.1 (.22±.4) Specification @ 25ºC Size [mm(inches)] 2.12 x 1.28 (.83 x.5) Height [mm(inches)].55 (.21) Volume (mm^3) 1.5 Frequency Range (F1) (MHz) 892±68 Frequency Range (F2) (MHz) 194±23 Insertion Loss (F1, at Fc) (db) -.4 Insertion Loss (F2, at Fc) (db) -.65 Attenuation (F1) at (F2) (db) -23 Attenuation (F2) at (F1) (db) -2 VSWR (Input @ F1) 1.3 VSWR (Input @ F2) 1.4 VSWR (Lowband @ F1) 1.4 VSWR (Highband @ F2) 1.2 6 133

Multilayer Organic (MLO TM ) 85 WCDMA Diplexer S PARAMETER MEASUREMENTS db(s(1.1) db(s(3.1) -5-1 -15-2 -25 Low Band -3 Return Loss -35.4.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 2.6 freq, GHz db(s(1.1) db(s(2.1) -1-2 -3-4 -5 High Band Return Loss -6.4.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 2.6 freq, GHz -5-1 db(s(2.3)) -15-2 -25 Isolation -3-35.4.6.8 1. 1.2 1.4 1.6 1.8 2. 2.2 2.4 2.6 freq, GHz 6 Note: Measurements were taken using an Anritsu 4 port VNA; Diplexer was mounted on a custom evaluation board. To reduce systematic errors from the VNA, the coaxial measurement cables, and evaluation board, a Short-Open-Load-Thru (SOLT) calibration was performed, using a custom fabricated calibration substrate. This is the most common coaxial calibration methods. 134

Multilayer Organic (MLO TM ) 85 WLAN Diplexer MLO TM TECHNOLOGY The 85 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO TM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors and capacitors in a multilayer stack up. The MLO TM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN and GSM. These components which are less than.6mm in thickness are ideally suited for band switching for dual band systems. All diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. APPLICATIONS Multiband applications including WiFi, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Low Insertion Loss Excellent Solderability Low Parasitics Low Profile HOW TO ORDER DP Type 5 Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. 6 5 4 A Design POWER CAPACITY 4.5W Maximum 1 2 3 525 Frequency (MHz) ORIENTATION IN TAPE Top View 7 Finish 7 = Au T = NiSn 6 5 4 1 2 3 TR Packaging Tape & Reel TR = 3 Kpcs TR/5 = 5 pcs COMPONENT DIMENSIONS AND FUNCTIONS.2±.1 (.8±.4).2±.1 (.8±.4) 1.28±.2 (.5±.8).95±.5 (.37±.2).2±.1 (.8±.4).2±.1 (.8±.4) Terminal No. Bottom View.64±.5 (.25±.2) 1 2 3 6 5 4 2.12±.2 (.83±.8) PART NUMBER: DP5A5257TR.4±.4 (.2±.2).25±.1 (.1±.4) Side View.55±.1.44±.1 (.22±.4) (.17±.4) Unit: mm (inches) Terminal Name 1 High Frequency Port 2 GND 3 Low Frequency Port 4 GND 5 Common Port 6 GND Specification @ 25ºC Size [mm(inches)] 2.12 x 1.28 (.83 x.5) Height [mm(inches)].55 (.21) Volume (mm^3) 1.5 Frequency Range (F1) (MHz) 245±5 Frequency Range (F2) (MHz) 525±1 Insertion Loss (F1) (db) -.5 Insertion Loss (F2) (db) -.5 Attenuation (F1) at (F2) (db) -2 Attenuation (F2) at (F1) (db) -2 Return Loss (Lowband @ F1) (db) -12 Return Loss (Highband @ F2) (db) -12 Isolation (Lowband @ F1) (db) -25 Isolation (Highband @ F2) (db) -21 6 135

Multilayer Organic (MLO TM ) 85 WLAN Diplexer S PARAMETER MEASUREMENTS -5 Low Band -5 High Band -1-1 db_s11 db_s21-15 Return Loss db_s11 db_s31-15 -2-2 Return Loss -25-25 -3 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. freq, GHz -3 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. freq, GHz -5-1 db_s23-15 -2-25 Isolation -3 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. 6.5 7. freq, GHz 6 136

Multilayer Organic (MLO TM ) 85 WLAN/BT Diplexer MLO TM TECHNOLOGY The 85 MLO TM diplexer is best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO TM diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors and capacitors in a multilayer stack up. The MLO TM diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN and GSM. These components which are less than.5mm in thickness are ideally suited for band switching for dual band systems. All MLO TM diplexers are expansion matched to FR4 thereby resulting in improved reliability over standard Si and ceramic devices. APPLICATIONS Multiband applications including WiFi, BT, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Low Insertion Loss Excellent Solderability Low Parasitics Matched CTE to PCB HOW TO ORDER DP Type 5 Size QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -4ºC to +85ºC TERMINATION Finishes available in Ni/Sn, Immersion Sn, Immersion Au and OSP coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. 1 2 3 B Design POWER CAPACITY 4.5W Maximum 6 5 4 5425 Frequency (MHz) ORIENTATION IN TAPE Top View 7 Finish 7 = Au T = NiSn 1 2 3 6 5 4 TR Packaging Tape & Reel TR = 3 Kpcs TR/5 = 5 pcs COMPONENT DIMENSIONS AND FUNCTIONS.2±.1 (.8±.4).2±.1 (.8±.4) 1.28±.2 (.5±.8).95±.5 (.37±.2).2±.1 (.8±.4).2±.1 (.8±.4) Bottom View.64±.5 (.25±.2) 1 2 3 6 5 4 2.12±.2 (.83±.8) Unit: mm (inches) Terminal No. Terminal Name 1 Low Frequency Port 2 GND 3 High Frequency Port 4 GND 5 Common Port 6 GND PART NUMBER: DP5B54257TR.4±.4 (.2±.2).25±.1 (.1±.4).44±.1 (.17±.4) Side View.55±.1 (.22±.4) Specification @ 25ºC Size [mm(inches)] 2.12 x 1.28 (.83 x.5) Height [mm(inches)].55 (.21) Volume (mm^3) 1.5 Pass Band Range (F1) (MHz) 245 +/-5MHz Pass Band Range (F2) (MHz) 5425 +/-525MHz Insertion Loss (F1) (db) -.5 Insertion Loss (F2) (db) -1. Attenuation (F1) 48MHz - 6MHz (db) -36 Attenuation 3 x (F1) (db) -31 Attenuation (F2) 18MHz - 25MHz (db) -26 Attenuation 2 x (F2) (db) -13 Attenuation 3 x (F2) (db) -15 VSWR (Input @ F1) 1.2 VSWR (Input @ F2) 1.7 VSWR (Lowband @ F1) 1.2 VSWR (Highband @ F2) 1.7 6 137

Multilayer Organic (MLO TM ) 85 WLAN/BT Diplexer S PARAMETER MEASUREMENTS 4.95 GHz -1.218 db 5.45 GHz -.6133 db 5.95 GHz -1.178 db -1-2 2.5 GHz -.454 db 1.8 GHz -17.255 db db -3-4 -5 1.8 GHz -25.611 db 2.5 GHz -28.13 7.5 GHz -24.673 db 11.95 GHz -16.991 db 16.3 GHz -23.6 db -6-7 -8 4.8 GHz -69.659 db High Band Low Band Return Loss 5.E+8 3.E+9 5.E+9 7.E+9 9.E+9 1.E+1 1.E+1 1.E+1 1.E+1 Frequency (.5-17GHz) 6 138

Multilayer Organic (MLO TM ) AUTOMATED SMT ASSEMBLY The following section describes the guidelines for automated SMT assembly of MLO TM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages. Control of solder and solder paste volume is critical for surface mount assembly of MLO TM RF devices onto the PCB. SMT REFLOW PROFILE Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3 C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO TM devices onto the PCB. may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Tp Ramp-up tp Critical Zone T L to Tp Temperature TL Ts max Ts min ts Preheat t L Ramp-down 25 t 25ºC to Peak Time Figure A. Typical Lead Free Profile and Parameters Profile Parameter Pb free, Convection, IR/Convection Ramp-up rate (Tsmax to Tp 3ºC/second max. Preheat temperature (Ts min to Ts max) 15ºC to 2ºC Preheat time (ts) 6 18 seconds Time above T L, 217ºC (t L ) 6 12 seconds Peak temperature (Tp) 26 C Time within 5ºC of peak temperature (tp) 1 2 seconds Ramp-down rate 4ºC/second max. Time 25ºC to peak temperature 6 minutes max. 6 139

MLO TM Tight Tolerance Inductors The Multilayer Organic Tight Tolerance Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLO TM Tight Tolerance Inductor series of components are based on AVX s patented multilayer organic technology (US patent 6,987,37). MLO TM Tight Tolerance Inductors incorporate very low loss organic materials which allow for high Q and high stability over frequency. MLO TM Tight Tolerance Inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLO TM Tight Tolerance Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS Mobile communications Satellite Applications GPS Collision Avoidance Wireless LAN s FEATURES Tight Tolerance High Frequency High Withstanding Voltage Low DC Resistance Surface Mountable 42 Case Size RoHS Compliant Finishes Available in Tape and Reel SURFACE MOUNT ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation Expansion Matched to PCB HOW TO ORDER HL 2 XXX X T TR Style Tight Tolerance Size 2 = 42 Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = 22 4.7nH = 4R7 Tolerance A = ±.5nH B = ±.1nH G = ±2% Termination Sn1 Packaging 5pcs T&R 6 DIMENSIONS mm (inches) QUALITY INSPECTION.23 (.9) Finished parts are 1% tested for electrical parameters and visual characteristics..59 (.23).46 (.18) TERMINATION RoHS compliant Sn finish. 1. (.39) OPERATING TEMPERATURE -55ºC to +125ºC 14 5916

MLO TM Tight Tolerance Inductors RECOMMENDED FOOTPRINT D1 D2 D3 D4 D5 mm (inches) Case Size D1 D2 D3 D4 D5 21.85 (.33).3 (.12).25 (.1).3 (.12).35 (.14) 42 1.7 (.67).6 (.24).5 (.2).6 (.24).5 (.2) 63 2.3 (.91).8 (.31).7 (.28).8 (.31).75 (.3) 85 3. (.118) 1. (.39) 1. (.39) 1. (.39) 1.25 (.49) 126 4. (.157) 1. (.39) 2. (.79) 1. (.39) 1.6 (.63) 121 4. (.157) 1. (.39) 2. (.79) 1. (.39) 2.5 (.98) 188 5.6 (.22) 1. (.39) 3.6 (.142) 1. (.39) 2. (.79) 1812 5.6 (.22) 1. (.39) 3.6 (.142) 1. (.39) 3. (.118) 1825 5.6 (.22) 1. (.39) 3.6 (.142) 1. (.39) 6.35 (.25) 222 6.6 (.26) 1. (.39) 4.6 (.181) 1. (.39) 5. (.197) 2225 6.6 (.26) 1. (.39) 4.6 (.181) 1. (.39) 6.35 (.25) Component Pad Design Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. Pad overlap.5mm beneath component. Pad extension.5mm beyond components for relow and 1.mm to wave soldering. 42 ELECTRICAL SPECIFICATIONS Available L (nh) Inductance Tolerance Q Idc max Rdc max SRF min 45MHz A = ±.5nH, B = ±.1nH 45MHz (ma) (mω) (GHz) G = ±2%.8 ±.5nH, ±.1nH 15 45 1 7.9 ±.5nH, ±.1nH 15 45 1 7 1 ±.5nH, ±.1nH 15 42 1 7 1.1 ±.5nH, ±.1nH 15 41 1 7 1.2 ±.5nH, ±.1nH 15 41 11 7 1.3 ±.5nH, ±.1nH 15 295 13 7 1.5 ±.5nH, ±.1nH 15 295 15 7 1.6 ±.5nH, ±.1nH 15 23 15 7 1.8 ±.5nH, ±.1nH 15 295 16 7 2 ±.5nH, ±.1nH 15 23 18 7 2.2 ±.5nH, ±.1nH 15 23 2 7 2.4 ±.5nH, ±.1nH 15 23 2 7 2.7 ±.5nH, ±.1nH 15 23 25 7 3 ±.5nH, ±.1nH 15 2 3 7 3.3 ±.5nH, ±.1nH 15 2 34 7 3.6 ±.5nH, ±.1nH 15 18 35 7 3.9 ±.5nH, ±.1nH 15 18 4 7 4.7 ±.1nH 15 17 48 7 5.6 ±.1nH 15 15 5 7 6.8 ±.1nH 15 14 6 7 8.2 ±.1nH 15 115 8 6 1 ±2% 15 15 1 5 12 ±2% 15 95 11 4 15 ±2% 15 95 12 4 18 ±2% 15 85 15 3 22 ±2% 15 75 19 3 27 ±2% 15 75 21 3 3 ±2% 15 65 22 2 32 ±2% 15 65 22 2 6 Specifications based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. 5916 141

MLO TM High Current Inductors The Multilayer Organic High Current Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. Based on AVX s patented multilayer organic technology (US patent 6,987,37), the 42 size Multilayer Organic High Current Inductor allows for much higher current handling over similar multilayer ceramic chip inductors, a 5% average increase in current handling over comparable thin film products with similar Q, and current handling approaching that of wire wound ceramic chip inductors. MLO TM High Current Inductors incorporate very low loss organic materials which allow for high Q and high stability over frequency. They are surface mountable and are expansion matched to FR4 printed wiring boards. MLO TM High Current Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS Mobile communications Satellite Applications GPS Collision Avoidance Wireless LAN s FEATURES High Q High SRF High Frequency High Current Handling Low DC Resistance Surface Mountable 42 Case Size RoHS Compliant Finishes Available in Tape and Reel SURFACE MOUNT ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation Expansion Matched to PCB HOW TO ORDER HLC 2 XXX X T TR Type HLC = High Current Size 2 = 42 Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = 22 4.7nH = 4R7 Tolerance B = ±.1nH C = ±.2nH D = ±.5nH G = ±2% H = ±3%. J = ±5% Termination Sn1 Packaging 5pcs T&R 6 DIMENSIONS R QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. L T TERMINATION RoHS compliant Sn finish. W mm (inches) L W T R 1.±.1.58±.75.35±.1.125±.5 (.4±.4) (.23±.3) (.14±.4) (.5±.2) OPERATING TEMPERATURE -55ºC to +125ºC 142

MLO TM High Current Inductors 42 ELECTRICAL SPECIFICATIONS 45 MHz 9 MHz 19 MHz 24 MHz Test Frequency Test Frequency Test Frequency Test Frequency Available SRF Min Rdc Max Idc Max Inductance Tolerance Q L (nh) Q L (nh) Q L (nh) Q (GHz) (mω) (ma) L (nh) B = ±.1nH, C = ±.2nH 45 MHz 9 MHz 9 MHz 19 MHz 19 MHz 24 MHz 24 MHz 45 MHz D = ±.5nH, G = ±2% H = ±3%, J = ±5%.8 ±.1nH, ±.2nH, ±.5nH 3.8 42.8 55.8 61 >2 1 875.9 ±.1nH, ±.2nH, ±.5nH 26.9 36.9 47.9 52 >2 1 835 1 ±.1nH, ±.2nH, ±.5nH 25 1. 34 1. 45 1. 5 >2 1 8 1.1 ±.1nH, ±.2nH, ±.5nH 24 1.1 33 1.1 43 1.1 48 2 1 782 1.2 ±.1nH, ±.2nH, ±.5nH 24 1.2 33 1.2 44 1.2 48 2 11 751 1.3 ±.1nH, ±.2nH, ±.5nH 25 1.3 34 1.3 44 1.3 49 19 13 725 1.5 ±.1nH, ±.2nH, ±.5nH 25 1.5 35 1.5 45 1.5 5 19 15 679 1.6 ±.1nH, ±.2nH, ±.5nH 25 1.6 35 1.6 45 1.6 49 18 15 66 1.8 ±.1nH, ±.2nH, ±.5nH 25 1.8 35 1.8 45 1.8 49 18 16 626 2 ±.1nH, ±.2nH, ±.5nH 26 2. 35 2. 45 2.1 49 17 18 596 2.2 ±.1nH, ±.2nH, ±.5nH 27 2.2 36 2.2 46 2.2 5 16 2 571 2.4 ±.1nH, ±.2nH, ±.5nH 27 2.4 37 2.4 47 2.4 5 15 2 549 2.7 ±.1nH, ±.2nH, ±.5nH 27 2.7 36 2.7 46 2.7 48 14 25 521 3 ±.1nH, ±.2nH, ±.5nH 27 3. 36 3. 44 3.1 46 12 3 497 3.3 ±.1nH, ±.2nH, ±.5nH 27 3.3 36 3.3 44 3.4 46 11 34 476 3.6 ±.1nH, ±.2nH, ±.5nH 27 3.6 37 3.7 45 3.8 46 1 35 457 3.9 ±.1nH, ±.2nH, ±.5nH 28 3.9 38 4. 46 4.1 47 1 4 441 4.7 ±.1nH, ±.2nH, ±.5nH 29 4.7 39 4.9 45 5.1 44 9 48 45 5.6 ±.1nH, ±.2nH, ±.5nH 3 5.7 4 6. 44 6.3 42 8 5 375 6.8 ±2%, ±3%, ±5% 3 6.9 39 7.5 41 8. 37 7 6 343 8.2 ±2%, ±3%, ±5% 29 8.4 37 9.4 37 1.4 31 6 8 315 1 ±2%, ±3%, ±5% 3 1.3 38 12. 35 13.9 27 5 1 29 12 ±2%, ±3%, ±5% 32 12.5 4 15.7 31 19.8 19 4 11 265 15 ±2%, ±3%, ±5% 32 15.9 38 22.3 24 33. 9 4 12 24 18 ±2%, ±3%, ±5% 28 19.4 32 31.1 15 6..3 3 15 21 22 ±2%, ±3%, ±5% 3 24. 34 44.7 11 n/a n/a 3 19 22 27 ±2%, ±3%, ±5% 29 3.5 3 n/a n/a n/a n/a 3 21 184 3 ±2%, ±3%, ±5% 28 34. 27 n/a n/a n/a n/a 2 22 18 32 ±2%, ±3%, ±5% 28 37.7 27 n/a n/a n/a n/a 2 22 175 Specifications based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. Idc max: Maximum 15ºC rise in component temperature over ambient. 6 143

MLO TM Hi-Q Inductors The Multilayer Organic Hi-Q Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLO TM Hi-Q Inductor series of components are based on AVX s patented multilayer organic technology (US patent 6,987,37 and 7,439,84). MLO TM Hi-Q Inductors incorporate very low loss organic materials and low profile copper which allow for high Q and high stability over frequency. MLO TM Hi- Q Inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLO TM Hi-Q Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS Mobile communications Satellite Applications GPS Collision Avoidance Wireless LAN s FEATURES High Q High SRF High Frequency Low DC Resistance Surface Mountable 42 Case Size RoHS Compliant Finishes Available in Tape and Reel SURFACE MOUNT ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation Expansion Matched to PCB HOW TO ORDER HLQ 2 XXX X T TR Type HLQ = High Q Size 2 = 42 Inductance Expressed in nh (2 significant digits + number of zeros) for values <1nH, letter R denotes decimal point. Example: 22nH = 22 4.7nH = 4R7 Tolerance B = ±.1nH C = ±.2nH H = ±3% Termination Sn1 Packaging 5pcs T&R 6 DIMENSIONS R QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. L T TERMINATION RoHS compliant Sn finish. W mm (inches) L W T R 1.±.1.58±.75.35±.1.125±.5 (.4±.4) (.23±.3) (.14±.4) (.5±.2) OPERATING TEMPERATURE -55ºC to +125ºC 144

MLO TM Hi-Q Inductors 42 ELECTRICAL SPECIFICATIONS Available L (nh) Inductance Tolerance Q min SRF min Rdc max Idc max 45MHz B = ±.1nH, C = ±.2nH 45MHz (GHz) (mω) (ma) H = ±3%.8 ±.1nH, ±.2nH 17 7 1 35.9 ±.1nH, ±.2nH 17 7 1 35 1 ±.1nH, ±.2nH 17 7 1 33 1.1 ±.1nH, ±.2nH 17 7 1 33 1.2 ±.1nH, ±.2nH 17 7 11 33 1.3 ±.1nH, ±.2nH 17 7 13 33 1.5 ±.1nH, ±.2nH 17 7 15 33 1.6 ±.1nH, ±.2nH 17 7 15 3 1.8 ±.1nH, ±.2nH 17 7 16 3 2 ±.1nH, ±.2nH 17 7 18 245 2.2 ±.1nH, ±.2nH 17 7 2 245 2.4 ±.1nH, ±.2nH 17 7 2 245 2.7 ±.1nH, ±.2nH 17 7 25 245 3 ±.1nH, ±.2nH 17 7 3 225 3.3 ±.1nH, ±.2nH 17 7 34 225 3.6 ±.1nH, ±.2nH 17 7 35 2 3.9 ±.1nH, ±.2nH 17 7 4 2 4.7 ±.1nH, ±.2nH 17 7 48 195 5.6 ±.1nH, ±.2nH 17 7 5 17 6.8 ±3% 17 7 6 16 8.2 ±3% 17 6 8 13 1 ±3% 17 5 1 12 12 ±3% 17 4 11 11 15 ±3% 17 4 12 11 18 ±3% 17 3 15 11 22 ±3% 17 3 19 95 27 ±3% 17 3 21 95 3 ±3% 17 2 22 85 32 ±3% 17 2 22 85 Specifications based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. Idc max: Maximum 15ºC rise in component temperature over ambient. 6 145

MLO TM Inductors MLO TM INDUCTOR PERFORMANCE CHARACTERISTICS Q 6 5 4 3 2 1 Typical Performance: 2.nH Inductance @ 45MHz 2.nH Max Q 53-5 2 4 6 8 1 12 Frequency (GHz) SRF 1.85 5 4 3 2 1-1 -2-3 -4 Inductance (nh) Q 5 45 4 35 3 25 2 15 1 5 Typical Performance: 4.7nH 12 SRF 5.65 1 8 6 4 2-2 -4-6 -8-1 2 4 6 8 1 12 Max Q 45 Inductance @ 45MHz 4.7nH Frequency (GHz) Inductance (nh) 6 Q 45 4 35 3 25 2 15 1 5 Typical Performance: 18.2nH Max Q 32 Inductance @ 45MHz 18.2nH SRF 2.38 4 3 2 1-1 -2-3 Inductance (nh) -4.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) 146

MLO TM Inductors AUTOMATED SMT ASSEMBLY The following section describes the guidelines for automated SMT assembly of MLO TM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT packages. Control of solder and solder paste volume is critical for surface mount assembly of MLO TM RF devices onto the PCB. SMT REFLOW PROFILE Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3 C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO TM devices onto the PCB. may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Tp Ramp-up tp Critical Zone T L to Tp Temperature TL Ts max Ts min ts Preheat t L Ramp-down 25 t 25ºC to Peak Time Figure A. Typical Lead Free Profile and Parameters Profile Parameter Pb free, Convection, IR/Convection Ramp-up rate (Tsmax to Tp 3ºC/second max. Preheat temperature (Ts min to Ts max) 15ºC to 2ºC Preheat time (ts) 6 18 seconds Time above T L, 217ºC (t L ) 6 12 seconds Peak temperature (Tp) 26 C Time within 5ºC of peak temperature (tp) 1 2 seconds Ramp-down rate 4ºC/second max. Time 25ºC to peak temperature 6 minutes max. 6 147

MLO TM RF-DC SMT Crossover GENERAL DESCRIPTION The MLO TM SMT RF-DC Crossover is a very low profile crossover that intersects an RF and DC circuit trace in an SMT package. The RF-DC Crossover is a low cost solution for applications where a critical RF circuit trace intersects a DC circuit precluding the need for an expensive multilayer printed circuit board. The SMT package can support frequencies up to 6 GHz. MLO TM crossovers have been subjected to JEDEC reliability standards and 1% electrically tested. The RF-DC crossovers are available in NiSn. FEATURES DC 6. GHz RF DC Crossover Low Loss DC Isolation Surface Mountable Tape and Reel 1% Tested APPLICATIONS Mobile communications GPS Vehicle location systems Wireless LAN s LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation TOP VIEW HOW TO ORDER X2A 22 RFDC T Series Size Type Packaging T = 1pcs T&R T/25 = 25pcs T&R B = Bulk Frequency Port Ins. Return Loss Power θjc Operating (GHz) Impedance Loss (db min) (Watts) (ºC /Watts) Temperature (ohms) (db max) (ºC) DC -2.5 5.5 2 3 14-55 to +85 2.5 4. 5.1 2 19 14-55 to +85 4. 6. 5.15 15 9 14-55 to +85 * Specification based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. 6 QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. TERMINATION NiSn compatible with automatic soldering technologies: Pb free reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE - 55ºC to +85ºC 148 5416

MLO TM RF-DC SMT Crossover MECHANICAL OUTLINE TOP BOTTOM RF IN/OUT 4.98 ±.25 (.196 ±.1) RF IN/OUT 1.12 ±.1 (.44 ±.4).4 ±.4 (.16 ±.2) GND GND GND GND.74 ±.1 X4 (.29 ±.4 X4) 4.98 ±.25 (.196 ±.1) GND GND GND RF IN/OUT GND.99 ±.2 X4 SQ (.39 ±.8 X4 SQ).76 ±.1 X4 (.3 ±.4 X4) SIDE RF IN/OUT.4 ±.4 (.16 ±.2) X4) 6 5416 149

MLO TM RF-DC SMT Crossover RF-DC SMT CROSSOVER PERFORMANCE:.3 GHZ TO 6 GHZ. RF/DC Crossover Insertion Loss -.1 Insertion Loss (db) -.2 -.3 -.4 -.5.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. Frequency (GHz) -1- RF/DC Crossover Return Loss -2 Return Loss (db) -3-4 -5-6.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. Frequency (GHz) 6 MOUNTING PROCEDURE MLO TM SMT crossovers require 5Ω transmission lines leading to and from all of the RF ports. Proper grounding is required in order to ensure optimal device performance. If these conditions are not met then performance parameters including insertion loss, return loss and any isolation may not meet published values. All of the MLO TM components utilize castellated interconnects which allow for high yield assembly, expansion matched and halogen free dielectric. When mounting the user must be mindful of the following: a) ensure the RF pads of the device are in contact with the circuit trace of the printed circuit board and b) the ground plane of neither the component nor the PCB is in contact with the RF signal. Parts are specifically oriented in the tape and reel. MOUNTING FOOTPRINT To ensure proper electrical and thermal performance there must be a ground plane with 1% solder connection underneath the part. 1.6 SQ TYP (.63).86 TYP (.34) 3.75 (.148) DC Line Dimensions are in mm (inches) Multiple plated thru holes to ground 5 Transmission Line 15 5416

MLO TM RF-RF SMT Crossover GENERAL DESCRIPTION The MLO TM SMT RF-RF Crossover is a very low profile crossover that intersects an RF and RF circuit trace in an SMT package. The RF-RF Crossover is a low cost solution for applications where a critical RF circuit trace intersects a RF circuit precluding the need for an expensive multilayer printed circuit board. The SMT package can support frequencies up to 6 GHz. MLO TM crossovers have been subjected to JEDEC reliability standards and 1% electrically tested. The RF-RF crossovers are available in NiSn. FEATURES DC 6. GHz RF RF Crossover Low Loss High Isolation Surface Mountable Tape and Reel 1% Tested APPLICATIONS Mobile communications GPS Vehicle location systems Wireless LAN s LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation TOP VIEW HOW TO ORDER X2B 22 RFRF T Series Size Type Packaging T = 1pcs T&R T/25 = 25pcs T&R B = Bulk Frequency Port Ins. Return Loss Isolation Power θjc Operating (GHz) Impedance Loss (db min) (db min) (Watts) (ºC /Watts) Temperature (ohms) (db max) (ºC) DC -2.5 5.5 2 5 3 15-55 to +85 2.5 4. 5.1 18 3 19 15-55 to +85 4. 6. 5.15 1 2 9 15-55 to +85 * Specification based on performance of component assembled properly on printed circuit board with 5Ω nominal impedance. QUALITY INSPECTION Finished parts are 1% tested for electrical parameters and visual characteristics. TERMINATION NiSn compatible with automatic soldering technologies: Pb free reflow, wave soldering, vapor phase and manual. OPERATING TEMPERATURE - 55ºC to +85ºC 6 5416 151

MLO TM RF-RF SMT Crossover MECHANICAL OUTLINE.552 (.22).552 (.22) TOP.74 (.29).21 (.8) BOTTOM.74 (.29).21 (.8).75 (.3).75 (.3) 2.49 (.98).462 x 4 (.18 x 4) 2.49 (.98).462 x 4 (.18 x 4) 4.978 (.196) 3.5 (.138) 4.978 (.196) 3.5 (.138) 2.49 (.95) 3. (.118).564 x 4 (.22 x 4) 2.49 (.95) 3. (.118).564 x 4 (.22 x 4).739 (.29).75 (.3) 4.126 (.162).462 x 4 (.18 x 4).739 (.29).75 (.3) 4.126 (.162).462 x 4 (.18 x 4) 2.214 (.87) 2.49 (.98) 2.866 (.16) 4.978 (.196) 2.214 (.87) 2.49 (.98) 2.866 (.16) 4.978 (.196) SIDE.4 ±.4 (.16 ±.2) 6 152 5416

MLO TM RF-RF SMT Crossover RF-RF SMT CROSSOVER PERFORMANCE:.3 GHZ TO 6 GHZ RF/RF Crossover Insertion Loss RF/RF Crossover Return Loss.2-1 -.2-2 Insertion Loss 2 (db) Insertion Loss 1 (db) -.7 -.12 -.17 Return Loss 2 (db) Return Loss 1 (db) -3-4 -5-6 -.22.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. Frequency (GHz) -7.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. Frequency (GHz) RF/RF Crossover Isolation RF/RF Crossover Phase Balance -2 6-3 4-4 2 Isolation (db) -5-6 Phase Balance (ºC) -2-7 -4-8.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. Frequency (GHz) -6.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 6. Frequency (GHz) MOUNTING PROCEDURE MLO TM SMT crossovers require 5Ω transmission lines leading to and from all of the RF ports. Proper grounding is required in order to ensure optimal device performance. If these conditions are not met then performance parameters including insertion loss, return loss and any isolation may not meet published values. All of the MLO TM components utilize castellated interconnects which allow for high yield assembly, expansion matched and halogen free dielectric. When mounting the user must be mindful of the following: a) ensure the RF pads of the device are in contact with the circuit trace of the printed circuit board and b) the ground plane of neither the component nor the PCB is in contact with the RF signal. Parts are specifically oriented in the tape and reel. 5416 MOUNTING FOOTPRINT To ensure proper electrical and thermal performance there must be a ground plane with 1% solder connection underneath the part. TYP 34) 1.6 8Q TYP (.63).86 TYP (.34) 1.7 TYP (.42) Multiple plated thru holes to ground 4 x 5 Transmission Line Dimensions are in mm (inches) 153 6

MLO TM SMT Crossover AUTOMATED SMT ASSEMBLY The following section describes the guidelines for automated SMT assembly of MLO TM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT packages. Control of solder and solder paste volume is critical for surface mount assembly of MLO TM RF devices onto the PCB. Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO TM devices onto the PCB. SMT REFLOW PROFILE Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3 C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below: Tp Ramp-up tp Critical Zone T L to Tp Temperature T L Ts max Ts min ts Preheat tl Ramp-down 25 t 25ºC to Peak Time 6 Profile Parameter Pb free, Convection, IR/Convection Ramp-up rate (Tsmax to Tp) 3ºC/second max. Preheat temperature (Ts min to Ts max) 15ºC to 2ºC Preheat time (ts) 6 18 seconds Time above T L, 217ºC (t L ) 6 12 seconds Peak temperature (Tp) 26 C Time within 5ºC of peak temperature (tp) 1 2 seconds Ramp-down rate 4ºC/second max. Time 25ºC to peak temperature 6 minutes max. 154 5416

RF Inductors AL Series - Air Core Inductors AS Series - Square Air Core Inductors LCWC - Wire Wound Chip Inductors 155

Air Core RF Inductors AL Series GENERAL DESCRIPTION AVX Air Core RF Inductors, part of the wound air core inductor family, are ideal for RF circuits, broadband I/O filtering, frequency selection, or impedance matching. The air core inductor provides better performance over solid core inductors with higher Q, and better current handling capabilities. FEATURES Air Core Construction High Q High Current Excellent SRF Many inductance values ranging from 1.65nH to 538nH APPLICATIONS RF Applications RF Circuits Broadband I/O Filtering Impedance Matching/Tuning Decoupling/Bypassing HOW TO ORDER AL 5A 2N5 G T R Air Core Inductor Size Size 5A = 65 5B = 65 12A = 1212 12B = 1212 16 = 1516 23 = 2523 Inductance 2N5 = 2.5nH 12N5 = 12.5nH 13N = 13nH Tolerance G = 2% J = 5% K = 1% Termination T = Sn/Ag over Cu (96.5% Sn, 3% Ag,.5% Cu) Packaging R = 7" reel S = 13" reel* *AL16 & AL23 Only ELECTRICAL SPECIFICATIONS Technical Data All technical data related to an ambient temperature of +25 C Inductance Range 1.65nH to 538nH Inductance Tolerance 2%, 5%, 1% Rated Current 1.5A to 4.A Operating Temperature -4 C to +125 C Termination 96.5% Tin/3% Silver over.5% Copper 7 156

Air Core RF Inductors AL Series ELECTRICAL SPECIFICATIONS AVX P/N Turns Inductance Tolerance Q Q Test Freq. DCR max SRF Ir max (nh) (%) min. typ. (MHz) (mω) GHz (min.) Amps AL5A1N65KTR 2 1.65 K 1-8 4 1 1.6 AL5A2N55*TR 3 2.55 J, K 1-8 5 8.2 1.6 AL5A3N85*TR 4 3.85 G, J, K 1-8 6 7.5 1.6 AL5A5N45*TR 5 5.45 G, J 1-8 8 7 1.6 AL5B5N6*TR 6 5.6 G, J 1-8 9 6.5 1.6 AL5B7N15*TR 7 7.15 G, J 1-8 1 6 1.6 AL5B8N8*TR 8 8.8 G, J 1-8 12 6 1.6 AL5B9N85*TR 9 9.85 G, J 1-8 13 5.2 1.6 AL5B12N5*TR 1 12.55 G, J 1-8 14 4.6 1.6 AL12A2N5KTR 1 2.5 K 145-15 1.1 12.5 4. AL12A5N*TR 2 5 J, K 14-15 1.8 6.5 4. AL12A8N*TR 3 8 G, J 14-15 2.6 5 4. AL12A12N5*TR 4 12.5 G, J 137-15 3.4 3.3 4. AL12A18N5*TR 5 18.5 G, J 132-15 3.9 2.5 4. AL12B17N5*TR 6 17.5 G, J 1-15 4.5 2.2 4. AL12B22N*TR 7 22 G, J 12-15 5.2 2.1 4. AL12B28N*TR 8 28 G, J 15-15 6 1.8 4. AL12B35N5*TR 9 35.5 G, J 112-15 6.8 1.5 4. AL12B43N*TR 1 43 G, J 16-15 7.9 1.2 4. AL1622N*TS 4 22 G, J 1 135 15 4.2 3.2 3. AL1627N*TS 5 27 G, J 1 135 15 4 2.7 3.5 AL1633N*TS 5 33 G, J 1 13 15 4.8 2.5 3. AL1639N*TS 6 39 G, J 1 135 15 4.4 2.1 3. AL1647N*TS 6 47 G, J 1 135 15 5.6 2.1 3. AL1656N*TS 7 56 G, J 1 125 15 6.2 1.5 3. AL1668N*TS 7 68 G, J 1 12 15 8.2 1.5 2.5 AL1682N*TS 8 82 G, J 1 12 15 9.4 1.3 2.5 AL161N*TS 9 1 G, J 1 115 15 12.3 1.2 1.7 AL1612N*TS 9 12 G, J 1 125 15 17.3 1.1 1.5 AL239N*TS 9 9 G, J 95 114 5 15 1.14 3.5 AL23111N*TS 1 111 G, J 87 14 5 15 1.2 3.5 AL2313N*TS 11 13 G, J 87 14 5 2.9 3. AL23169N*TS 12 169 G, J 95 114 5 25.875 3. AL2326N*TS 13 26 G, J 95 114 5 3.8 3. AL23222N*TS 14 222 G, J 92 11 5 35.73 3. AL23246N*TS 15 246 G, J 95 114 5 35.685 3. AL2337N*TS 16 37 G, J 95 114 5 35.66 3. AL2338N*TS 17 38 G, J 95 114 5 5.59 2.5 AL23422N*TS 18 422 G, J 95 114 5 6.54 2.5 AL23491N*TS 19 491 G, J 95 114 5 65.535 2. AL23538N*TS 2 538 G, J 87 14 5 9.49 2. *Tolerance: G= ± 2%, J: ± 5%, K: ± 1% a. Test Equipment: L/Q: HP-4291B With HP16193A test fixture or equivalent. SRF: HP8753E /HP872D or equivalent. RDC: Chroma 1652 or equivalent. b. Operating temperature range: -4ºC to +125ºC. c. For Temperature Rise: 15ºC d. Storage Temp.: -4ºC to +85ºC. f. MSL: Level 1 7 157

Air Core RF Inductors AL Series PHYSICAL DIMENSIONS AL12A, AL12B, AL16, AL23 Tinned Length SIDE END TOP 18 A B D 3 E C AL5A, AL5B SIDE END TOP A F B G D 18 E C Measure Line 3 Co-Plane.1 (.4) TINNED LENGTH BETWEEN 3º AND 18º mm (inches) Part Number A B C D E F G AL5A 1.42 ±.13 1.37 ±.15.89 ±.25 2.21 ±.25 1.83 ±.25.51 max..35 min. (.56 ±.5) (.56 ±.5) (.35 ±.1) (.87 ±.1) (.72 ±.1) (.2 max.) (.14 min.) AL5B 1.42 ±.13 1.37 ±.15.89 ±.25 4.4 ±.3 3.66 ±.3.51 max..35 min. (.56 ±.5) (.56 ±.5) (.35 ±.1) (.159 ±.12) (.144 ±.12).2 max..14 min. AL12A 3.5 max. 3.18 max..58 ±.38 3.68 max. 2.92 ±.25 (.12 max.) (.125 max.) (.23 ±..15) (.145 max.) (.115 ±.1) AL12B 3.5 max. 3.18 max..58 ±.38 6.86 max. 5.84 ±.25 (.12 max.) (.125 max.) (.23 ±.15) (.27 max.) (.23 ±.1) AL16 3.81 4.2 max. 1.53 ±.39 4.83 max. 4.32 ±.39 (.15) (.165 max.) (.6 ±.15) (.19 max.) (.17 ±.15) AL23 6.35 max. 5.9 max. 1.2 ±.39 1.55 max. 7.98 ±.51 (.25 max.) (.232 max.) (.4 ±.15) (.415 max.) (.314 ±.2) RECOMMENDED LAND PATTERNS mm (inches) 7 Part Number A B C D E AL5A 2.62 2.46 1.4 1.2.79 (.13) (.97) (.41) (.4) (.31) AL5B 4.45 2.46 2.87 1.2.79 (.175) (.97) (.113) (.4) (.31) AL12A 4.19 3.3 1.65 2.79 1.27 (.165) (.13) (.65) (.11) (.5) AL12B 7.24 3.3 4.7 2.79 1.27 (.285) (.13) (.185) (.11) (.5) AL16 5.8 5.16 2.85 2.62 1.48 (.228) (.23) (.112) (.13) (.58) AL23 1. 4.7 5.95 2.42 2.4 (.394) (.185) (.234) (.95) (.8) d b c a e 158

Air Core RF Inductors AL Series PERFORMANCE SPECIFICATIONS AL5A Inductance vs. Frequency Typical Q vs. Frequency 8 2 Inductance (nh) 6 4 2 Q 15 1 5 5.45nH 3.85nH 2.55nH 1.65nH 1 1 1 1 1 1 1 1 1 Frequency (MHz) Frequency (MHz) AL5B Inductance vs. Frequency Typical Q vs. Frequency 18 15 15 Inductance (nh) 12 9 6 3 Q 1 5 5.6nH 7.15nH 8.8nH 9.85nH 12.6nH 1 1 1 1 1 1 1 1 Frequency (MHz) Frequency (MHz) AL12A Inductance vs. Frequency Typical Q vs. Frequency 3 21 Inductance (nh) 25 2 15 1 5 Q 18 15 12 9 6 3 2.5nH 5.nH 8.nH 12.5nH 18.5nH 1 1 1 1 Frequency (MHz) 1 1 1 Frequency (MHz) 7 159

Air Core RF Inductors AL Series PERFORMANCE SPECIFICATIONS AL12B Inductance (nh) 2 15 1 5 Inductance vs. Frequency 1 1 1 1 Frequency (MHz) Q Typical Q vs. Frequency 14 12 1 8 6 4 2 1 1 Frequency (MHz) 17.5nH 22.nH 28.nH 35.5nH 43.nH Inductance (nh) 25 2 15 1 5 Inductance vs. Frequency 1 1 1 1 Frequency (MHz) AL16 Q Typical Q vs. Frequency 3 25 2 15 1 5 1 1 1 1 Frequency (MHz) 22.nH 39.nH 47.nH 56.nH 68.nH 82.nH 12nH 7 Inductance (nh) 1 8 6 4 2 Inductance vs. Frequency 1 1 1 1 Frequency (MHz) AL23 Q Typical Q vs. Frequency 16 14 12 1 8 6 4 1 1 1 Frequency (MHz) 9.nH 169nH 37nH 538nH 16

Air Core RF Inductors AL Series TYPICAL RoHS REFLOW PROFILE 3 25 Time within 5ºC of peak temperature (3 seconds) Temperature (ºC) 217 2 15 1 Preheat / Soak (6 12 seconds) Ramp-Up 3ºC/sec max Reflow Time above 217ºC (6 15 seconds) Ramp-Down 6ºC/sec max Peak Temperature 255 26ºC 5 3 6 9 12 15 18 21 24 27 3 Time (seconds) 7 161

Air Core RF Inductors AL Series PACKAGING SPECIFICATIONS Thickness (t).1 (.4) max Embossed Cavity The force for tearing off cover tape is 1 to 13 grams in the arrow direction Top Cover Tape 165 to 18 End Embossed Carrier Base Tape Start No Components Components 16 (6.299) min Cover Tape User Direction of Feed No Components 39 (15.354) min 56 (22.47) max CARRIER TAPE REELS DIMENSIONS OF CARRIER TAPE MATERIAL: PLASTIC G 4. ±.1 (.157 ±.4) 2. ±.1 (.79 ±.4) 1.75 ±.1 (.69 ±.4) 1.5 +.1/- (.59 +.4/-) t A B N C W 5 P 5 C T mm (inches) 7 Series ITEM A B C N G T W P t AL5A DIM. 178 21 13 75 8.4 12.5 8 4.3 TOL. ±2. ±.8 ±.8 ±2. +1.5 +1.5 ±.3 ±.1 ±.5 AL5B DIM. 18 21 13 5 12.4 18.4 12 4.35 TOL. MAX ±.8 +.5/-.2 MIN +2. MAX ±.3 ±.1 ±.5 AL12A DIM. 178 25 15 75 12.5 16.4 12 8.25 TOL. ±2. ±1. ±.5 ±2. +1.5 +1.5 ±.2 ±.1 ±.5 AL12B DIM. 178 5 15 75 16.5 2.4 16 8.25 TOL. ±2. ±1. ±.5 ±2. +1.5 +1.5 ±.2 ±.1 ±.5 AL16 DIM. 34 2.2 13 1 16.5 25.5 16 12.3 TOL. MAX MIN ±.5 REF ±.5 ±.5 ±.3 ±.1 ±.5 AL23 DIM. 34 2.2 13 1 24.5 3.4 24. 12..35 TOL. MAX MIN ±.5 REF ±.5 ±.5 ±.3 ±.1 ±.5 162

Square Air Core RF Inductors AS Series GENERAL DESCRIPTION AVX Square Air Core RF Inductors, part of the wound air core inductor family, are ideal for RF circuits, broadband I/O filtering, frequency selection, or impedance matching. The unique square cross section of the air core inductor provides better performance, and offers manufacturing advantages over toroidal coils. FEATURES Square cross section construction Available in 86, 87, and 98 sizes 2 Inducance values ranging from 5.5nH to 27.3nH High Q High Current Excellent SRF APPLICATIONS RF Applications RF Circuits Broadband I/O Filtering Impedance Matching HOW TO ORDER AS 6 5N5 J T R Air Core Inductor (Square Cross Section) Size Size 6 = 86 7 = 87 8 = 98 Inductance 5N5 =5.5nH 6N = 6.nH 12N3 = 12.3nH Tolerance G = 2% J = 5% K = 1% Termination T = Sn/Ag over Cu (96.5% Sn, 3% Ag,.5% Cu) Packaging R = 7 inch reel (2 pieces per reel) ELECTRICAL SPECIFICATIONS Technical Data All technical data related to an ambient temperature of +25 C Inductance Range 5.5nH to 27.3nH Inductance Tolerance 2%, 5%, 1% Rated Current 2.7A, 2.9A, 4.4A Operating Temperature -4 C to +125 C Termination 96.5% Tin/3% Silver over.5% Copper ELECTRICAL SPECIFICATIONS Note: AVX P/N Turns Inductance Tolerance Q Test Freq. DCR max SRF Ir max (nh) (%) min. (MHz) (mω) (GHz) (A) AS65N5*TR 3 5.5 G, J, K 6 4 3.4 4.9 2.9 AS66N*TR 3 6 G, J, K 64 4 6 5.2 2.9 AS68N9*TR 4 8.9 G, J, K 9 4 7 4.3 2.9 AS612N3*TR 5 12.3 G, J, K 9 4 8 4.8 2.9 AS615N7*TR 6 15.7 G, J, K 9 4 9 4.4 2.9 AS619N4*TR 7 19.4 G, J, K 9 4 1 4 2.9 AS76N9*TR 3 6.9 G, J, K 1 4 6 4.6 2.7 AS71N2*TR 4 1.2 G, J, K 1 4 7 4 2.7 AS711N2*TR 4 11.2 G, J, K 9 4 6.3 3.6 2.7 AS713N7*TR 5 13.7 G, J, K 1 4 8 4.3 2.7 AS717N*TR 6 17 G, J, K 1 4 9 4 2.7 AS722N*TR 7 22 G, J, K 1 4 1 3.5 2.7 AS88N1*TR 3 8.1 G, J, K 13 4 6 5.2 4.4 AS812N1*TR 4 12.1 G, J, K 13 4 7 4.3 4.4 AS814N7*TR 4 14.7 G, J, K 9 4 7.2 3 4.4 AS816N6*TR 5 16.6 G, J, K 13 4 8 3.4 4.4 AS821N5*TR 6 21.5 G, J, K 13 4 9 3.7 4.4 AS823N*TR 6 23 G, J, K 13 4 1 2.6 4.4 AS825N*TR 7 25 G, J, K 13 4 1 2.5 4.4 AS827N3*TR 7 27.3 G, J, K 13 4 1 3.2 4.4 1. *Tolerance: G=±2%, J=±5%, K=±1% 2. Inductance & Q measured on the HP4291B. With HP16193A test fixture. 3. SRF measured using the HP8753E 4. Operating Temperature range: -4 C to +125 C 5. Electrical Specifications at 25 C 6. MSL: Level 1 7 163

Square Air Core RF Inductors AS Series PHYSICAL DIMENSIONS A D MAX. MIN. C E B F 7 mm (inches) Part Number A B C D E F AS65N5*TR 1.346±.12 1.829±.254 1.397±.12.962 2.6.51 (.53±.4) (.72±.1) (.55±.4) (.38) (.12) (.2) AS66N*TR 1.295±.12 1.829±.254 1.397±.12.99 2.6.51 (.51±.4) (.72±.1) (.55±.4) (.39) (.12) (.2) AS68N9*TR 1.626±.152 1.829±.254 1.397±.12 1.27 2.6.51 (.64±.6) (.72±.1) (.55±.4) (.5) (.12) (.2) AS612N3*TR 1.93±.152 1.829±.254 1.397±.12 1.63 2.6.51 (.76±.6) (.72±.1) (.55±.4) (.64) (.12) (.2) AS615N7*TR 2.286±.152 1.829±.254 1.397±.12 1.96 2.6.51 (.9±.6) (.72±.1) (.55±.4) (.7) (.12) (.2) AS619N4*TR 2.591±.152 1.829±.254 1.397±.12 2.29 2.6.51 (.12±.6) (.72±.1) (.55±.4) (.9) (.12) (.2) AS76N9*TR 1.295±.12 1.829±.254 1.524±.254 1.2 2.6.51 (.51±.4) (.72±.1) (.6±.1) (.4) (.12) (.2) AS71N2*TR 1.626±.152 1.829±.254 1.524±.254 1.32 2.6.51 (.64±.6) (.72±.1) (.6±.1) (.52) (.12) (.2) AS711N2*TR 1.549±.152 1.829±.254 1.524±.254 1.24 2.6.51 (.61±.6) (.72±.1) (.6±.1) (.49) (.12) (.2) AS713N7*TR 1.93±.152 1.829±.254 1.524±.254 1.57 2.6.51 (.76±.6) (.72±.1) (.6±.1) (.62) (.12) (.2) AS717N*TR 2.286±.152 1.829±.254 1.524±.254 1.93 2.6.51 (.9±.6) (.72±.1) (.6±.1) (.76) (.12) (.2) AS722N*TR 2.591±.152 1.829±.254 1.524±.254 2.29 2.6.51 (.12±.6) (.72±.1) (.6±.1) (.9) (.12) (.2) AS88N1*TR 1.473±.152 2.134±.152 1.829±.152 1.12 2.8.64 (.58±.6) (.84±.6) (.72±.6) (.44) (.11) (.25) AS812N*TR 1.854±.152 2.134±.152 1.829±.152 1.45 2.8.64 (.73±.6) (.84±.6) (.72±.6) (.57) (.11) (.25) AS814N7*TR 1.549±.152 2.134±.152 1.829±.152 1.24 2.8.64 (.61±.6) (.84±.6) (.72±.6) (.49) (.11) (.25) AS816N6*TR 2.21±.152 2.134±.152 1.829±.152 1.83 2.8.64 (.87±.6) (.84±.6) (.72±.6) (.72) (.11) (.25) AS821N5*TR 2.565±.152 2.134±.152 1.829±.152 2.18 2.8.64 (.11±.6) (.84±.6) (.72±.6) (.86) (.11) (.25) AS823N*TR 2.235±.152 2.134±.152 1.829±.152 1.9 2.8.64 (.88±.6) (.84±.6) (.72±.6) (.75) (.11) (.25) AS825N*TR 2.972±.152 2.134±.152 1.829±.152 2.57 2.8.64 (.117±.6) (.84±.6) (.72±.6) (.11) (.11) (.25) AS827N3*TR 2.972±.152 2.134±.152 1.829±.152 2.57 2.8.64 (.117±.6) (.84±.6) (.72±.6) (.11) (.11) (.25) 164

Square Air Core RF Inductors AS Series PERFORMANCE SPECIFICATIONS AS6 Inductance vs. Frequency Typical Q vs. Frequency 3 16 Inductance (nh) 25 2 15 1 5 Q 14 12 1 8 6 4 2 19N4 15N7 8N9 5N5 1 1 1 1 1 1 1 1 Frequency (MHz) Frequency (MHz) AS7 Inductance vs. Frequency Typical Q vs. Frequency 3 25 25 2 Inductance (nh) 2 15 1 5 Q 15 1 5 22N 17N 11N2 6N9 1 1 1 1 1 1 1 1 Frequency (MHz) Frequency (MHz) AS8 Inductance vs. Frequency Typical Q vs. Frequency Inductance (nh) 8 75 7 65 6 55 5 45 4 35 3 25 2 15 1 5 1 1 1 1 Frequency (MHz) Q 5 45 4 35 3 25 2 15 1 5 1 1 1 1 Frequency (MHz) 27N3 16N6 12N1 8N1 7 165

Square Air Core RF Inductors AS Series TYPICAL RoHS REFLOW PROFILE 3 25 Time within 5ºC of peak temperature (3 seconds) Temperature (ºC) 217 2 15 1 Preheat / Soak (6 12 seconds) Ramp-Up 3ºC/sec max Reflow Time above 217ºC (6 15 seconds) Ramp-Down 6ºC/sec max Peak Temperature 255 26ºC 5 3 6 9 12 15 18 21 24 27 3 Time (seconds) 7 166

Square Air Core RF Inductors AS Series PACKAGING SPECIFICATIONS Thickness (t).1 (.4) max Embossed Cavity The force for tearing off cover tape is 1 to 13 grams in the arrow direction Top Cover Tape 165 to 18 Embossed Carrier Base Tape End Start No Components Components 16 (6.299) min Cover Tape User Direction of Feed No Components 39 (15.354) min 56 (22.47) max CARRIER TAPE REELS G DIMENSIONS OF CARRIER TAPE D P2 P E t A B N C F W 5 C E T ITEM A B C G N T W E F P1 P2 P D D1 t DIM. 178 25 15 12.5 75 16.4 12. 1.75 5.5 4. 2. 4. 1.5 1..23 (7.8) (.984) (.591) (.492) (2.953) (.646) (.472) (.69) (.217) (.157) (.79) (.157) (.59) (.39) (.9) ±2. ±1. ±.5 +1.5 ±2. +1.5 ±.2 ±.1 ±.1 ±.1 ±.1 ±.1 +.1 ±.1 ±.5 TOL. (.79) (.39) (.2) (.59) (.79) (.59) (.8) (.4) (.4) (.4) (.4) (.4) (.4) (.4) (.2) D1 P1 mm (inches) 7 167

Wire Wound Chip Inductor LCWC Series FEATURES Ceramic base provide high SRF Ultra-compact inductors provide high Q factors Low profile, high current are available Miniature SMD chip inductor for fully automated assembly Outstanding endurance from Pull-up force, mechanical shock and pressure Tighter tolerance down to ±2% Smaller size of 42 (15) DIMENSIONS APPLICATIONS RF Products: Cellular Phone (CDMA/GSM/PHS) Cordless Phone (DECT/CT1CT2) Remote Control, Security System Wireless PDA Smart Phone WLL, Wireless LAN / Mouse / Keyboard / Earphone VCO, RF Module & Other Wireless Products CONSTRUCTION Base Station, Repeater GPS Receiver Broad Band Applications: CATV Filter, Tuner Cable Modem/ XDSL Tuner Set Top Box IT Applications: USB 2. IEEE 1394 COLOR CODING Overall B C H A F G I J Pad Layout UV Glue Color Coding E Terminal F I D Terminal Wraparound: Approx..7 inches.18 (.7) Both Ends Magnet Wire Ceramic Core Electrode (Ag/Pd+Ni+Sn) STANDARD mm (inches) Type Size A B C D Weight (g) E F G H I J (inch) Max. Max. Max. Ref. (1pcs) 42 42 1.27.76.61.15.51.23.56.66.5.46 (.5) (.3) (.24) (.6) (.2) (.9) (.22) (.26) (.2) (.18).8 63 63 1.8 1.12 1.2.38.76.33.86 1.2.64.64 (.71) (.44) (.4) (.15) (.3) (.13) (.34) (.4) (.25) (.25) 3.46 85 85 2.29 1.73 1.52.51 1.27.44 1.2 1.78 1.2.76 (.9) (.68) (.6) (.2) (.5) (.17) (.4) (.7) (.4) (.3) 12.13 18 18 2.92 2.79 2.13.65 2.3.51 1.52 2.54 1.2 1.27 (.115) (.11) (.84) (.26) (.8) (.2) (.6) (.1) (.4) (.5) 3.73 126 126 3.45 1.9 1.4.5 1.6.5 2.2 1.93 1.2 1.78 (.136) (.75) (.55) (.2) (.63) (.2) (.87) (.76) (.4) (.7) 4 7 LOW PROFILE mm (inches) Type Size A B C D (inch) Max. Max. Max. Ref. E F G H I J 85 85 2.29 1.73 1.3.51 1.27.44 1.2 1.78 1.2.76 (.9) (.68) (.41) (.2) (.5) (.17) (.4) (.7) (.4) (.3) 18 18 2.92 2.79 1.4.65 2.3.51 1.52 2.54 1.2 1.27 (.115) (.11) (.55) (.26) (.8) (.2) (.6) (.1) (.4) (.5) HIGH CURRENT/HIGH Q mm (inches) Type Size A B C D (inch) Max. Max. Max. Ref. E F G H I J 63 63 1.8 1.12 1.2.38.76.33.86 1.2.64.64 (.71) (.44) (.4) (.15) (.3) (.13) (.34) (.4) (.25) (.25) 85 85 2.29 1.73 1.52.51 1.27.44 1.2 1.78 1.2.76 (.9) (.68) (.6) (.2) (.5) (.17) (.4) (.7) (.4) (.3) 18 18 2.92 2.79 2.3.65 2.3.51 1.52 2.54 1.2 1.27 (.115) (.11) (.8) (.26) (.8) (.2) (.6) (.1) (.4) (.5) 168

Wire Wound Chip Inductor LCWC Series HOW TO ORDER LC WC 42 K 11 G T A R Family LC = Chip Inductor Series WC = WW Ceramic Size 42 63 85 18 126 Tolerance G = 2% J = 5% K = 1% Inductance 3N9 = 3.9nH 39N = 39nH R39 = 39nH 3R9 = 39nH 153 = 15nH Style G = Standard Q = High Q/ Current R = Low Profile Termination T = Sn Plate Special A = Standard Packaging R = 7" Reel STANDARD ELECTRICAL SPECIFICATIONS 42 lnductance Tolerance L Freq. Quality Factor SRF DCR ldc 9MHz 1.7GHz (nh) (MHz) Min. Factor (Ω) max. (ma) max. L Q L Q 1. ±1% 25 16 12.7.45 136 1.2 77 1.2 69 1.9 ±1% 25 16 11.3.7 14 1.72 68 1.74 82 2. ±1% 25 16 11.1.7 14 1.93 54 1.93 75 2.2 ±1% 25 19 1.8.7 96 2.19 59 2.23 1 2.4 ±1% 25 15 1.5.7 79 2.24 51 2.27 68 2.7 ±1% 25 16 1.4.12 64 2.23 42 2.25 61 3.3 ±1% 25 19 7..66 84 3.1 65 3.12 87 3.6 ±5, ±1% 25 19 6.8.66 84 3.56 45 3.62 71 3.9 ±5, ±1% 25 19 5.8.66 84 3.89 5 4. 75 4.3 ±5, ±1% 25 18 6..91 7 4.19 47 4.3 71 4.7 ±5, ±1% 25 18 4.7.13 64 4.55 48 4.68 68 5.1 ±5, ±1% 25 2 4.8.83 8 5.15 56 5.25 82 5.6 ±5, ±1% 25 2 4.8.83 76 5.16 54 5.28 81 6.2 ±5, ±1% 25 2 4.8.83 76 6.16 52 6.37 76 6.8 ±5, ±1% 25 2 4.8.83 68 6.56 63 6.93 78 7.5 ±5, ±1% 25 22 4.8.14 68 7.91 6 8.22 88 8.2 ±5, ±1% 25 22 4.4.14 68 8.5 57 8.85 84 8.7 ±5, ±1% 25 18 4.1.2 48 8.78 54 9.21 73 9. ±5, ±1% 25 22 4.16.14 68 9.7 62 9.53 78 9.5 ±5, ±1% 25 18 4..2 48 9.42 54 9.98 69 1 ±2, ±5, ±1% 25 21 3.9.195 48 9.8 5 1.1 67 11 ±2, ±5, ±1% 25 24 3.68.12 64 1.7 52 11.2 78 12 ±2, ±5, ±1% 25 24 3.6.12 64 11.9 53 12.7 71 13 ±2, ±5, ±1% 25 24 3.45.21 44 13.4 51 14.6 57 15 ±2, ±5, ±1% 25 24 3.28.172 56 14.6 55 15.5 77 16 ±2, ±5, ±1% 25 24 3.1.22 56 16.6 46 18.8 47 18 ±2, ±5, ±1% 25 25 3.1.23 42 18.3 57 2.3 62 19 ±2, ±5, ±1% 25 24 3.4.22 48 19.1 5 21.1 67 2 ±2, ±5, ±1% 25 25 3..25 42 2.7 52 23.7 53 22 ±2, ±5, ±1% 25 25 2.8.3 4 23.2 53 26.8 53 23 ±2, ±5, ±1% 25 24 2.72.3 4 23.8 49 26.9 64 24 ±2, ±5, ±1% 25 25 2.7.3 4 25.1 51 29.5 5 27 ±2, ±5, ±1% 25 24 2.48.3 4 28.7 49 33.5 63 3 ±2, ±5, ±1% 25 25 2.35.35 4 31.1 46 38.5 39 33 ±2, ±5, ±1% 25 24 2.35.35 4 34.9 31 41.7 32 36 ±2, ±5, ±1% 25 24 2.32.44 32 39.5 44 48.4 53 39 ±2, ±5, ±1% 25 25 2.1.55 2 41.7 47 5.2 45 4 ±2, ±5, ±1% 25 24 2.24.5 32 39. 44 47.4 33 43 ±2, ±5, ±1% 25 25 2.3.81 1 45.8 46 61.6 34 47 ±2, ±5, ±1% 25 25 2.1.83 15 5. 38 55.8 37 51 ±2, ±5, ±1% 25 25 1.75.82 1 5.4 47 59.4 37 56 ±2, ±5, ±1% 25 25 1.76.97 1 57.4 49 72.4 4 68 ±2, ±5, ±1% 25 22 1.62 1.12 1 69.6 45 83.4 38 7 169

Wire Wound Chip Inductor LCWC Series 7 63 lnductance L Freq. Quality Factor SRF DCR ldc 9MHz 1.7GHz Color Tolerance (nh) (MHz) Min. Factor (Ω) max. (ma) max. L Q L Q Code 1.6 ±5, ±1% 25 24 12.5.3 7 1.53 35 1.58 55 Blue 1.8 ±5, ±1% 25 16 12.5.45 7 1.63 35 1.66 5 Black 2.2 ±5, ±1% 25 15 6..1 7 2.18 41 2.2 64 White 2.3 ±5, ±1% 25 16 >4..14 7 2.32 32 2.35 4 Yellow 3.3 ±2, ±5, ±1% 25 22 >6..8 7 3.35 47 3.4 65 Red 3.6 ±2, ±5, ±1% 25 22 5.8.63 7 3.53 49 3.58 65 Violet 3.9 ±2, ±5, ±1% 25 22 >6..8 7 3.95 49 3.96 67 Brown 4.3 ±2, ±5, ±1% 25 22 5.8.63 7 4.32 49 4.43 67 Orange 4.5 ±2, ±5, ±1% 25 2 5.8.12 7 4.74 55 4.87 92 Gray 4.7 ±2, ±5, ±1% 25 25 5.8.12 7 4.65 53 4.8 67 Violet 5.1 ±2, ±5, ±1% 25 2 5.8.16 7 5.13 47 5.36 56 Green 5.6 ±2, ±5, ±1% 25 2 5.8.17 7 5.53 56 5.86 77 Yellow 6.2 ±2, ±5, ±1% 25 25 5.8.11 7 6.28 6 6.4 85 Black 6.3 ±2, ±5, ±1% 25 25 5.8.11 7 6.67 41 6.86 61 Black 6.8 ±2, ±5, ±1% 25 27 5.8.11 7 6.75 6 7.1 81 Red 7.5 ±2, ±5, ±1% 25 28 4.8.16 7 7.7 6 7.82 65 Brown 8.2 ±2, ±5, ±1% 25 27 4.8.11 7 8.25 64 8.4 81 Green 8.7 ±2, ±5, ±1% 25 28 4.8.19 7 8.86 62 9.32 58 Yellow 9.1 ±2, ±5, ±1% 25 35 4.8.13 7 9.2 7 9.7 8 Black 9.5 ±2, ±5, ±1% 25 28 5.4.135 7 9.7 59 9.92 61 Blue 1 ±2, ±5, ±1% 25 31 4.8.13 7 1. 66 1.6 83 Orange 11 ±2, ±5, ±1% 25 31 4..86 7 11.3 53 12.1 56 Gray 12 ±2, ±5, ±1% 25 35 4..13 7 12.3 72 13.5 83 Yellow 15 ±2, ±5, ±1% 25 35 4..17 7 15.4 64 16.8 89 Green 16 ±2, ±5, ±1% 25 35 3.3.11 7 16.5 55 18. 52 White 17 ±2, ±5, ±1% 25 35 3.2.17 7 17.6 56 19.4 44 Red 18 ±2, ±5, ±1% 25 35 3.1.17 7 18.7 7 21.4 69 Blue 2 ±2, ±5, ±1% 25 4 3..19 7 2.7 8 23.5 3 Green 22 ±2, ±5, ±1% 25 38 3..19 7 22.8 73 26.1 71 Violet 23 ±2, ±5, ±1% 25 38 2.85.19 7 24.1 71 28. 71 Orange 24 ±2, ±5, ±1% 25 38 2.8.13 7 25.7 45 3.9 4 Black 27 ±2, ±5, ±1% 25 4 2.8.22 6 29.2 74 34.6 65 Gray 3 ±2, ±5, ±1% 25 4 2.8.15 6 31.4 47 39.8 28 Brown 33 ±2, ±5, ±1% 25 4 2.3.22 6 36. 67 49.5 42 White 36 ±2, ±5, ±1% 25 37 2.3.25 6 39.1 47 48.9 24 Red 39 ±2, ±5, ±1% 25 4 2.2.25 6 42.7 6 6.2 4 Black 43 ±2, ±5, ±1% 2 38 2..28 6 46.9 44 6.3 21 Orange 47 ±2, ±5, ±1% 2 38 2..28 6 52.2 62 77.2 35 Brown 51 ±2, ±5, ±1% 2 38 1.9.28 6 55.5 69 82.2 34 Blue 56 ±2, ±5, ±1% 2 38 1.9.31 6 62.5 56 97. 26 Red 62 ±2, ±5, ±1% 2 37 1.8.34 6 68. 4 11 1 Gray 68 ±2, ±5, ±1% 2 37 1.7.34 6 8.5 54 168 21 Orange 72 ±2, ±5, ±1% 15 34 1.7.49 6 82. 53 135 2 Yellow 82 ±2, ±5, ±1% 15 34 1.7.54 4 96.2 54 177 21 Green 91 ±2, ±5, ±1% 15 3 1.7.5 4 11. 5 416.4 6 Brown 1 ±2, ±5, ±1% 15 34 1.4.58 4 124. 49 319.5 13 Blue 11 ±2, ±5, ±1% 15 32 1.35.61 3 138. 43 342.7 15 Violet 12 ±2, ±5, ±1% 15 32 1.3.65 3 166. 39 529.3 8 Gray 13 ±2, ±5, ±1% 15 3 1.4.72 3 185. 6 - - White 14 ±2, ±5, ±1% 1 28 1.3.87 28 19. 8 - - Blue 15 ±2, ±5, ±1% 1 28 1.3.95 28 23. 25 - - White 16 ±2, ±5, ±1% 1 25 1.3 1.4 28 215. 2 - - Yellow 18 ±2, ±5, ±1% 1 25 1.25 1.4 25 35. 22 - - Black 22 ±2, ±5, ±1% 1 25 1.2 1.6 25 377. 21 - - Brown 26 ±2, ±5, ±1% 1 25 1. 2. 2 469. 21 - - Violet 27 ±2, ±5, ±1% 1 25.9 2.1 2 523. 19 - - Red 28 ±2, ±5, ±1% 1 25 1. 2.4 1 524. 18 - - Green 3 ±2, ±5, ±1% 1 25.75 2.5 15 539.7 21 - - Orange 33 ±2, ±5, ±1% 1 25.9 3.8 1 68.4 2 - - Blue 39 ±2, ±5, ±1% 1 25.9 4.35 1 734.5 29 - - Yellow 47 ±2, ±5, ±1% 1 23.6 3.6 8 - - - - White 17

Wire Wound Chip Inductor LCWC Series 85 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 2.7 ±5, ±1% 25 8 @ 15MHz 7.9.6 8 Brown 2.8 ±5, ±1% 25 8 @ 15MHz 7.9.6 8 Gray 3. ±5, ±1% 25 65 @ 15MHz 7.9.6 8 White 3.3 ±5, ±1% 25 5 @ 15MHz 6..8 6 Black 5.6 ±5, ±1% 25 65 @ 1MHz 5.5.8 6 Orange 6.2 ±5, ±1% 25 5 @ 1MHz 5.5.11 6 Green 6.8 ±5, ±1% 25 5 @ 1MHz 5.5.11 6 Brown 7.5 ±5, ±1% 25 5 @ 1MHz 4.5.14 6 Green 8.2 ±5, ±1% 25 5 @ 1MHz 4.7.12 6 Red 8.7 ±5, ±1% 25 5 @ 1MHz 4..21 4 White 1 ±2, ±5, ±1% 25 6 @ 5MHz 4.2.1 6 Blue 12 ±2, ±5, ±1% 25 5 @ 5MHz 4..15 6 Orange 15 ±2, ±5, ±1% 25 5 @ 5MHz 3.4.17 6 Yellow 18 ±2, ±5, ±1% 25 5 @ 5MHz 3.3.2 6 Green 22 ±2, ±5, ±1% 25 55 @ 5MHz 2.6.22 5 Blue 24 ±2, ±5, ±1% 25 5 @ 5MHz 2..22 5 Gray 27 ±2, ±5, ±1% 25 55 @ 5MHz 2.5.25 5 Violet 33 ±2, ±5, ±1% 25 6 @ 5MHz 2.5.27 5 Gray 36 ±2, ±5, ±1% 25 55 @ 5MHz 1.7.27 5 Orange 39 ±2, ±5, ±1% 25 6 @ 5MHz 2..29 5 White 43 ±2, ±5, ±1% 2 6 @ 5MHz 1.65.34 5 Yellow 47 ±2, ±5, ±1% 2 6 @ 5MHz 1.65.31 5 Black 56 ±2, ±5, ±1% 2 6 @ 5MHz 1.55.34 5 Brown 68 ±2, ±5, ±1% 2 6 @ 5MHz 1.45.38 5 Red 72 ±2, ±5, ±1% 15 65 @ 5MHz 1.4.4 5 Green 82 ±2, ±5, ±1% 15 65 @ 5MHz 1.3.42 4 Orange 91 ±2, ±5, ±1% 15 65 @ 5MHz 1.2.48 4 Black 1 ±2, ±5, ±1% 15 65 @ 5MHz 1.2.46 4 Yellow 11 ±2, ±5, ±1% 15 5 @ 25MHz 1..48 4 Brown 12 ±2, ±5, ±1% 15 5 @ 25MHz 1.1.51 4 Green 15 ±2, ±5, ±1% 1 5 @ 25MHz.92.56 4 Blue 18 ±2, ±5, ±1% 1 5 @ 25MHz.87.64 4 Violet 2 ±2, ±5, ±1% 1 5 @ 25MHz.86.66 4 Orange 22 ±2, ±5, ±1% 1 5 @ 25MHz.85.7 4 Gray 24 ±2, ±5, ±1% 1 44 @ 25MHz.69 1. 35 Red 25 ±2, ±5, ±1% 1 5 @ 25MHz.68 1. 35 Green 27 ±2, ±5, ±1% 1 48 @ 25MHz.65 1. 35 White 3 ±2, ±5, ±1% 1 48 @ 25MHz.62 1.2 33 Yellow 33 ±2, ±5, ±1% 1 48 @ 25MHz.6 1.4 31 Black 36 ±2, ±5, ±1% 1 48 @ 25MHz.58 1.45 3 Green 39 ±2, ±5, ±1% 1 48 @ 25MHz.56 1.5 29 Brown 43 ±2, ±5, ±1% 5 33 @ 1MHz.43 1.7 23 Blue 47 ±2, ±5, ±1% 5 33 @ 1MHz.375 1.7 25 Red 56 ±2, ±5, ±1% 25 23 @ 5MHz.34 1.9 23 Orange 6 ±2, ±5, ±1% 25 23 @ 5MHz.26 1.6 45 White 62 ±2, ±5, ±1% 25 23 @ 5MHz.22 2.2 21 Yellow 68 ±2, ±5, ±1% 25 23 @ 5MHz.2 2.2 19 Green 75 ±2, ±5, ±1% 25 23 @ 5MHz.2 2.3 18 Blue 82 ±2, ±5, ±1% 25 23 @ 5MHz.2 2.35 18 Violet 1 ±2, ±5, ±1% 25 2 @ 5MHz.1 2.5 17 Gray 12 ±2, ±5, ±1% 7.9 18 @ 25MHz.1 2.5 17 White 15 ±2, ±5, ±1% 7.9 16 @ 25MHz.1 2.5 17 Black 18 ±2, ±5, ±1% 7.9 16 @ 7.9MHz.8 2.5 17 Brown 22 ±2, ±5, ±1% 7.9 16 @ 7.9MHz.6 2.7 16 Red 27 ±2, ±5, ±1% 7.9 16 @ 7.9MHz.5 3.1 15 Orange 33 ±2, ±5, ±1% 7.9 15 @ 7.9MHz.4 4.4 9 Blue 47 ±2, ±5, ±1% 7.9 15 @ 7.9MHz.4 6.4 9 Green 7 171

Wire Wound Chip Inductor LCWC Series 7 18 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code *5.6 ±5, ±1% 5 5 @ 15MHz 4..15 1 Black *1 ±2, ±5, ±1% 5 5 @ 5MHz 4.1.8 1 Brown *12 ±2, ±5, ±1% 5 5 @ 5MHz 3.3.9 1 Red *15 ±2, ±5, ±1% 5 5 @ 5MHz 2.5.11 1 Orange *18 ±2, ±5, ±1% 5 5 @ 35MHz 2.4.12 1 Yellow *22 ±2, ±5, ±1% 5 55 @ 35MHz 2.4.12 1 Green 24 ±2, ±5, ±1% 5 55 @ 35MHz 1.9.13 1 Blue *27 ±2, ±5, ±1% 5 55 @ 35MHz 1.6.13 1 Violet *33 ±2, ±5, ±1% 5 6 @ 35MHz 1.6.14 1 Gray 36 ±2, ±5, ±1% 5 6 @ 35MHz 1.6.15 1 Orange *39 ±2, ±5, ±1% 5 6 @ 35MHz 1.5.15 1 White *47 ±2, ±5, ±1% 5 65 @ 35MHz 1.5.16 1 Black *56 ±2, ±5, ±1% 5 65 @ 35MHz 1.3.18 1 Brown *62 ±2, ±5, ±1% 5 65 @ 35MHz 1.25.2 1 Blue *68 ±2, ±5, ±1% 5 65 @ 35MHz 1.3.2 1 Red 75 ±2, ±5, ±1% 5 6 @ 35MHz 1.1.21 1 White *82 ±2, ±5, ±1% 5 6 @ 35MHz 1..22 1 Orange 91 ±2, ±5, ±1% 5 5 @ 35MHz 1..45 1 White *1 ±2, ±5, ±1% 25 6 @ 35MHz 1..56 65 Yellow *12 ±2, ±5, ±1% 25 6 @ 35MHz.95.63 65 Green *15 ±2, ±5, ±1% 25 45 @ 1MHz.85.7 8 Blue *18 ±2, ±5, ±1% 25 45 @ 1MHz.75.77 62 Violet *22 ±2, ±5, ±1% 25 45 @ 1MHz.7.84 5 Gray *24 ±2, ±5, ±1% 25 45 @ 1MHz.65.88 5 White *27 ±2, ±5, ±1% 25 45 @ 1MHz.6.91 69 Black *3 ±2, ±5, ±1% 25 45 @ 1MHz.585 1. 45 Brown *33 ±2, ±5, ±1% 25 45 @ 1MHz.57 1.5 45 Red *36 ±2, ±5, ±1% 25 45 @ 1MHz.53 1.1 47 Orange *39 ±2, ±5, ±1% 25 45 @ 1MHz.5 1.12 63 Yellow *43 ±2, ±5, ±1% 25 45 @ 1MHz.48 1.15 47 Green *47 ±2, ±5, ±1% 25 45 @ 1MHz.45 1.19 47 Blue *56 ±2, ±5, ±1% 25 45 @ 1MHz.415 1.33 58 Violet *62 ±2, ±5, ±1% 25 45 @ 1MHz.375 1.4 3 Gray *68 ±2, ±5, ±1% 25 45 @ 1MHz.375 1.47 54 White *75 ±2, ±5, ±1% 25 45 @ 1MHz.36 1.54 36 Black *82 ±2, ±5, ±1% 25 45 @ 1MHz.35 1.61 4 Brown *91 ±2, ±5, ±1% 25 35 @ 5MHz.32 1.68 38 Red *1 ±2, ±5, ±1% 25 35 @ 5MHz.29 1.75 37 Orange *12 ±2, ±5, ±1% 7.9 35 @ 5MHz.25 2. 31 Yellow *15 ±2, ±5, ±1% 7.9 28 @ 5MHz.2 2.3 33 Green *18 ±2, ±5, ±1% 7.9 28 @ 5MHz.16 2.6 3 Blue *22 ±2, ±5, ±1% 7.9 28 @ 5MHz.16 2.8 28 Violet *27 ±2, ±5, ±1% 7.9 22 @ 25MHz.14 3.2 29 Gray *33 ±2, ±5, ±1% 7.9 22 @ 25MHz.11 3.4 29 White *39 ±2, ±5, ±1% 7.9 18 @ 25MHz.1 3.6 26 Black *47 ±2, ±5, ±1% 7.9 18 @ 25MHz.9 4. 26 Brown 56 ±2, ±5, ±1% 7.9 16 @ 7.96MHz.2 4. 24 Red 68 ±2, ±5, ±1% 7.9 15 @ 7.96MHz.4 4.9 2 Orange 82 ±2, ±5, ±1% 7.9 15 @ 7.96MHz.25 6. 17 Yellow 1 ±2, ±5, ±1% 2.52 15 @ 7.96MHz.2 9. 15 Green 12 ±2, ±5, ±1% 2.52 15 @ 7.96MHz.18 1.5 13 Blue 15 ±2, ±5, ±1% 2.52 15 @ 7.96MHz.15 11.5 12 Violet *Test Methods I Instrument: Network I Spectrum Analyzer 172

Wire Wound Chip Inductor LCWC Series 126 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 6.8 ±5, ±1% 1 3 @ 3MHz 5.5.7 1 Brown 1 ±5, ±1% 1 4 @ 3MHz 4..8 1 Red 12 ±5, ±1% 1 4 @ 3MHz 3.2.8 1 Orange 15 ±5, ±1% 1 4 @ 3MHz 3.2.1 1 Yellow 18 ±5, ±1% 1 5 @ 3MHz 2.8.1 1 Green 22 ±5, ±1% 1 5 @ 3MHz 2.2.1 1 Blue 24 ±5, ±1% 1 5 @ 3MHz 2..1 1 Red 27 ±2, ±5, ±1% 1 5 @ 3MHz 1.8.11 1 Violet 33 ±2, ±5, ±1% 1 55 @ 3MHz 1.8.11 1 Gray 39 ±2, ±5, ±1% 1 55 @ 3MHz 1.8.12 1 White 47 ±2, ±5, ±1% 1 55 @ 3MHz 1.5.13 1 Black 56 ±2, ±5, ±1% 1 55 @ 3MHz 1.45.14 1 Brown 62 ±2, ±5, ±1% 1 55 @ 3MHz 1.2.2 1 Violet 68 ±2, ±5, ±1% 1 55 @ 3MHz 1.2.26 95 Red 82 ±2, ±5, ±1% 1 55 @ 3MHz 1.2.21 92 Orange 91 ±2, ±5, ±1% 1 55 @ 3MHz 1.1.24 9 White 1 ±2, ±5, ±1% 1 55 @ 3MHz 1.1.26 85 Yellow 12 ±2, ±5, ±1% 1 55 @ 3MHz.75.26 8 Green 15 ±2, ±5, ±1% 1 6 @ 3MHz.95.31 75 Blue 18 ±2, ±5, ±1% 5 55 @ 3MHz.9.43 7 Violet 22 ±2, ±5, ±1% 5 55 @ 3MHz.76.5 67 Gray 27 ±2, ±5, ±1% 5 55 @ 3MHz.74.56 63 White 3 ±2, ±5, ±1% 5 5 @ 15MHz.68.6 6 Green 33 ±2, ±5, ±1% 5 45 @ 15MHz.65.62 59 Black 36 ±2, ±5, ±1% 5 45 @ 15MHz.6.65 55 Blue 39 ±2, ±5, ±1% 5 45 @ 15MHz.6.75 53 Brown 47 ±2, ±5, ±1% 5 45 @ 15MHz.55 1.3 49 Red 56 ±2, ±5, ±1% 35 45 @ 15MHz.47 1.34 46 Orange 62 ±2, ±5, ±1% 35 45 @ 15MHz.47 1.58 46 Gray 68 ±2, ±5, ±1% 35 45 @ 15MHz.45 1.58 43 Yellow 75 ±2, ±5, ±1% 35 45 @ 15MHz.44 2.25 32 White 82 ±2, ±5, ±1% 35 45 @ 15MHz.42 1.82 4 Green 91 ±2, ±5, ±1% 35 45 @ 15MHz.41 2.95 31 Green 1 ±2, ±5, ±1% 35 45 @ 15MHz.4 2.8 32 Blue 12 ±2, ±5, ±1% 35 45 @ 15MHz.38 3.2 3 Violet 7 173

Wire Wound Chip Inductor LCWC Series LOW PROFILE ELECTRICAL SPECIFICATIONS 85 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 1.8 ±5% 25 55 @ 15MHz 9.4.3 8 Black 3.9 ±5, ±1% 25 6 @ 1MHz 6.1.6 8 Brown 4.7 ±5, ±1% 25 5 @ 1MHz 5.5.6 8 Red 6.8 ±5, ±1% 25 5 @ 1MHz 5.5.8 8 Orange 8.2 ±5, ±1% 25 5 @ 1MHz 4.8.8 8 Yellow 1 ±2, ±5, ±1% 25 55 @ 75MHz 3.3.8 8 Green 12 ±2, ±5, ±1% 25 55 @ 75MHz 3.8.1 8 Blue 15 ±2, ±5, ±1% 25 5 @ 5MHz 2.95.1 8 Violet 18 ±2, ±5, ±1% 25 5 @ 5MHz 3.1.13 8 Gray 22 ±2, ±5, ±1% 25 5 @ 5MHz 2.9.15 8 Whit 27 ±2, ±5, ±1% 25 5 @ 5MHz 2.45.23 6 Black 33 ±2, ±5, ±1% 25 5 @ 5MHz 2.35.28 6 Brown 39 ±2, ±5, ±1% 25 5 @ 5MHz 2.2.33 6 Red 47 ±2, ±5, ±1% 2 5 @ 5MHz 2..39 6 Orange 56 ±2, ±5, ±1% 2 5 @ 5MHz 1.85.39 5 Yellow 68 ±2, ±5, ±1% 2 5 @ 5MHz 1.5.4 5 Green 82 ±2, ±5, ±1% 15 5 @ 5MHz 1.5.44 5 Blue 1 ±2, ±5, ±1% 15 5 @ 5MHz 1.2.64 4 Violet 12 ±2, ±5, ±1% 15 4 @ 25MHz 1.15.68 3 Gray 15 ±2, ±5, ±1% 15 4 @ 25MHz 1.5.8 3 Whit 1 ±2, ±5, ±1% 25 16 @ 5MHz.8 3.5 17 Black 18 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 3.3 ±5, ±1% 5 42 @ 15MHz 6..3 1 White 4.2 ±5, ±1% 5 42 @ 15MHz 6..15 1 Black 6.8 ±5, ±1% 5 5 @ 15MHz 5.4.17 1 Brown 8.2 ±5, ±1% 5 5 @ 15MHz 5..22 1 Red 15 ±5, ±1% 5 57 @ 5MHz 3..22 1 Orange 18 ±5, ±1% 5 5 @ 35MHz 2.4.12 1 Gray 2 ±5, ±1% 5 72 @ 5MHz 2.4.33 1 Yellow 27 ±5, ±1% 5 5 @ 35MHz 1.6.13 85 Green 3 ±5, ±1% 5 69 @ 5MHz 2.4.38 6 Blue 4 ±5, ±1% 5 67 @ 5MHz 2..43 6 Violet 5 ±2, ±5, ±1% 5 72 @ 5MHz 1.9.48 6 Gray 6 ±2, ±5, ±1% 5 75 @ 5MHz 1.8.52 6 White 7 ±2, ±5, ±1% 5 68 @ 5MHz 1.7.55 51 Black 8 ±2, ±5, ±1% 5 75 @ 5MHz 1.4.56 51 Brown 18 ±2, ±5, ±1% 5 5 @ 35MHz.9.4 45 Blue 56 ±2, ±5, ±1% 25 4 @ 1MHz.415 1.33 4 Red 7 174

Wire Wound Chip Inductor LCWC Series HIGH CURRENT ELECTRICAL SPECIFICATIONS 63 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 1.6 ±5, ±1% 25 24 12.5.3 24 Black 3.6 ±5, ±1% 25 24 5.9.48 23 Brown 3.9 ±5, ±1% 25 25 5.9.54 22 Red 6.8 ±5, ±1% 25 35 5.8.54 21 Orange 7.5 ±5, ±1% 25 38 3.7.59 21 Yellow 8.2 ±5, ±1% 25 38 3.7.6 2 White 1 ±2, ±5, ±1% 25 38 3.7.71 2 Green 12 ±2, ±5, ±1% 25 38 3..75 2 Blue 15 ±2, ±5, ±1% 25 38 2.8.8 19 Violet 18 ±2, ±5, ±1% 25 4 2.8.99 19 Gray 22 ±2, ±5, ±1% 25 42 2.4.99 18 White 24 ±2, ±5, ±1% 25 42 2.4.15 18 Black HIGH Q ELECTRICAL SPECIFICATIONS 85 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 2.5 ±5, ±1% 25 8 @ 15MHz 6..2 16 Black 5.6 ±5, ±1% 25 98 @ 15MHz 6..35 16 Brown 6.2 ±5, ±1% 25 88 @ 1MHz 4.75.35 16 Red 6.8 ±5, ±1% 25 8 @ 1MHz 4.4.35 16 White 8.2 ±5, ±1% 25 75 @ 1MHz 3..75 1 Gray 1 ±5, ±1% 25 8 @ 1MHz 3..6 16 Black 12 ±5, ±1% 25 8 @ 1MHz 3..45 16 Orange 15 ±2, ±5, ±1% 25 8 @ 1MHz 2.8.1 12 Black 16 ±2, ±5, ±1% 25 72 @ 5MHz 2.95.6 15 Yellow 18 ±2, ±5, ±1% 25 75 @ 5MHz 2.55.6 14 Green 2 ±2, ±5, ±1% 25 7 @ 5MHz 2.5.55 14 Blue 22 ±2, ±5, ±1% 25 8 @ 5MHz 2..1 12 Black 27 ±2, ±5, ±1% 25 75 @ 5MHz 2..7 13 Violet 3 ±2, ±5, ±1% 25 65 @ 5MHz 1.95.95 12 Gray 39 ±2, ±5, ±1% 25 65 @ 5MHz 1.6.11 11 White 48 ±2, ±5, ±1% 2 65 @ 5MHz 1.4.95 12 Black 51 ±2, ±5, ±1% 2 65 @ 5MHz 1.4.12 1 Brown 18 Inductance L Freq. Quality Factor SRF DCR IDC Tolerance (nh) (MHz) min. (GHz) min. (Ω) max. (ma) max. Color Code 3. ±5, ±1% 5 7 @ 15MHz 6..4 16 Black 3.9 ±5, ±1% 5 75 @ 15MHz 6..5 16 White 4.1 ±5, ±1% 5 75 @ 15MHz 6..5 16 Brown 7.8 ±5, ±1% 5 75 @ 5MHz 3.8.5 16 Red 1 ±2, ±5, ±1% 5 6 @ 5MHz 3.6.6 16 Orange 12 ±2, ±5, ±1% 5 7 @ 5MHz 2.8.6 15 Yellow 18 ±2, ±5, ±1% 5 62 @ 35MHz 2.7.7 14 Green 22 ±2, ±5, ±1% 5 62 @ 35MHz 2.5.7 14 Blue 33 ±2, ±5, ±1% 5 75 @ 35MHz 1.7.9 13 Violet 39 ±2, ±5, ±1% 5 75 @ 35MHz 1.3.9 13 Gray 47 ±2, ±5, ±1% 5 75 @ 35MHz 1.45.12 12 White 56 ±2, ±5, ±1% 5 75 @ 35MHz 1.23.12 12 Black 68 ±2, ±5, ±1% 5 8 @ 35MHz 1.15.13 11 Brown 82 ±2, ±5, ±1% 5 8 @ 35MHz 1.6.16 11 Red 1 ±2, ±5, ±1% 5 5 @ 35MHz.82.16 1 Orange 7 175

Wire Wound Chip Inductor LCWC Series ENVIRONMENTAL CHARACTERISTICS MECHANICAL PERFORMANCE TEST Items Requirement Test Methods Inductance HP4286 Q HP4286 SRF Refer to standard electrical HP4287 DC Resistance RDC characteristic spec. Micro-Ohm meter (Gom-81G) Rated Current IDC Applied the current to coils, The inductance change should be less than 1% to initial value Over Load Inductors shall have no evidence of Applied 2 times of rated allowed DC current electrical and mechanical damage to inductor for a period of 5 minutes Withstanding Voltage Inductors shall be no evidence of AC voltage of 5 VAC applied between inductors electrical and mechanical damage. terminal and case for 1 min. Insulation Resistance 1M ohm min. 1 VDC applied between inductor terminal and case and case MECHANICAL PERFORMANCE TEST Items Requirement Test Methods Test device shall be soldered on the substrate Oscillation Frequency: 1 to 55 to 1Hz for 1 min. Vibration Appearance: No damage Amplitude: 1.5 mm L change: within ±5% Time: 2 hrs for each axis (X, Y &Z), total 6 hrs Q change: within ±1% Resistance to Solder Temperature: 26±5ºC Soldering Heat Immersion Time: 1±2 seconds The device should be soldered (26±5 for 1 seconds) 1 lbs. For 42 to a tinned copper subs rate. A dynamiter force gauge Component Adhesion 2 lbs. For 63 should be applied to the side of the component. The (Push Test) 3 lbs. For the rest device must with stand a minimum force of 2 or 4 pounds without a failure of adhesion on termination Dropping chip by each side and each corner. Drop No damage Drop 1 times in total Drop height: 1 cm Drop weight: 125 g Solderability 9% covered with solder Inductor shall be dipped in a melted solder bath at 245±5 for 3 seconds Resistance to Solvent No damage on appearance and marking MIL-STD22F, Method 215D 7 CLIMATIC TEST Items Requirement Test Methods Temperature Characteristic -4 ~ +125 C Temperature: 4±2 C Humidity Relative Humidity: 9 ~ 95% Time: 96±2 hrs Measured after exposure in the room condition for 2 hrs Temperature: -4±2 C Low Temperature Storage Appearance: No damage Time: 96±2 hrs L change: within ±1% Inductors are tested after 1 hour at room temperature Q change: within ±2% One cycle: Thermal Shock High Temperature Storage High Temperature Load Life Damp Heat with Load Step Temperature ( C) Time (min.) 1-25±3 3 2 25±2 15 3 125±3 3 4 25±2 15 Total: 5 cycles Temperature: 125±2 C Time: 96±2 hrs Measured after exposure in the room condition for 1 hour Temperature: 85±2 C Time: 1±12 hrs There should be no evidence of Load: Allowed DC current short of open circuit. Temperature: 4±2 C Relative Humidity: 9 ~ 95% Time: 1±12 hrs Load: Allowed DC current 176

Wire Wound Chip Inductor LCWC Series REEL DIMENSIONS AND PACKAGING QUANTITY D: 21.8 ±.8 (.858 ±.31) Label 1.2 ±.2 (.47 ±.8) Thickness (t).1 (.4) max D: 13. ±.3 (.512 ±.12) 6. ±.5 (2.362 ±.2) Embossed Cavity 2. ±.5 (.79 ±.2) 9. ±.3 (.354 ±.112) 11.4 ± 1. (.449 ±.39) Embossed Carrier PAPER TAPE SPECIFICATION AND PACKAGING QUANTITY φ 1.5 P1 P 1.75 ±.1 (.69 ±.4) B F W H A P mm (inches) Type A B H F P P P1 W ReeI (EA) LCWC42.72 1.19.6 3.5 4. 4. 2. 8. (.28) (.47) (.24) (.138) (.157) (.147) (.79) (.315) 4, LCWC63 1.35 1.95.95 3.5 4. 4. 2. 8. (.53) (.77) (.37) (.138) (.157) (.147) (.79) (.315) 4, EMBOSSED PLASTIC PAPER TAPE SPECIFICATION AND PACKAGING QUANTITY 4. ±.1 (.157 ±.4) ø1.5 G F I A E D ø1.5 C B H mm (inches) Type A B C D E F G H I ReeI (EA) LCWC85 8. ±.2 1.85 ±.1 4. ±.1 2.3 ±.1 3.5 ±.5 1.75 ±.1 2. ±.5 1.45 ±.5.23 ±.5 (.315 ±.8) (.73 ±.73) (.157 ±.73) (.91 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.57 ±.2) (.9 ±.2) 2, LCWC85 (R) 8. ±.2 1.8 ±.1 4. ±.1 2.3 ±.1 3.5 ±.5 1.75 ±.1 2. ±.5.9 ±.5.23 ±.5 (.315 ±.8) (.71 ±.73) (.157 ±.73) (.91 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.35 ±.2) (.9 ±.2) 2, LCWC85 (Q) 8. ±.2 1.85 ±.1 4. ±.1 2.3 ±.1 3.5 ±.5 1.75 ±.1 2. ±.5 1.45 ±.5.23 ±.5 (.315 ±.8) (.73 ±.73) (.157 ±.73) (.91 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.57 ±.2) (.9 ±.2) 2, LCWC126 8. ±.2 1.95 ±.1 4. ±.1 3.5 ±.1 3.5 ±.5 1.75 ±.1 2. ±.5 1.5 ±.5.23 ±.5 (.315 ±.8) (.77 ±.73) (.157 ±.73) (.138 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.59 ±.2) (.9 ±.2) 2, LCWC18 8. ±.2 2.7 ±.1 4. ±.1 2.8 ±.1 3.5 ±.5 1.75 ±.1 2. ±.5 2. ±.5.23 ±.5 (.315 ±.8) (.16 ±.73) (.157 ±.73) (.11 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.79 ±.2) (.9 ±.2) 2, LCWC18 (R) 8. ±.2 2.7 ±.1 4. ±.1 2.8 ±.1 3.5 ±.5 1.75 ±.1 2. ±.5 1.5 ±.5.23 ±.5 (.315 ±.8) (.16 ±.73) (.157 ±.73).11 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.59 ±.2) (.9 ±.2) 2, LCWC18 (Q) 8. ±.2 2.7 ±.1 4. ±.1 2.8 ±.1 3.5 ±.5 1.75 ±.1 2. ±.5 2. ±.5.23 ±.5 (.315 ±.8) (.16 ±.73) (.157 ±.73).11 ±.73) (.138 ±.2) (.69 ±.73) (.79 ±.2) (.79 ±.2) (.9 ±.2) 2, 7 177

RF/Microwave Capacitors RF/Microwave Multilayer Capacitors (MLC) RF/Microwave CG (NP) Capacitors RF/Microwave U Series Designer Kits 178

Microwave MLCs UQ Series High Q Ultra Low ESR MLC FEATURES: Ultra Low ESR High Q High Self Resonance Capacitance Range.1 pf to 1 pf APPLICATIONS: RF Power Amplifiers Low Noise Amplifiers Filter Networks MRI Systems HOW TO ORDER UQ CB 7 A 1 J A T ME AVX Style W T bw A 11J Case Size CA = 65 CB = 121 CR = 79 CL = 42 CS = 63 CF = 85 See mechanical dimensions below L Voltage Code 5 = 5V 1 = 1V E = 15V 2 = 2V V = 25V 9 = 3V 7 = 5V Temperature Coefficient Code A = ±3ppm/ C Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Capacitance Tolerance Code A = ±.5 pf B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% MECHANICAL DIMENSIONS: inches (millimeters) Failure Rate Code A = Not Applicable Termination Style Code J = Nickel Barrier Sn/Pb (6/4) **T = 1% Tin **C = Non-Magnetic Barrier/Tin **RoHS compliant Packaging Code ME = 7" Reel Marked (65, 121 & 79 only) 2A = 7" Unmarked (42, 63, & 85 only) * Vertical T&R available Case Length (L) Width (W) Thickness (T) Band Width (bw) UQCA.55 +.15 -.1 (1.4+.381 -.254).55±.15 (1.4±.381).57 (1.45) max..1 +.1 -.5 (.254 +.254 -.127) UQCB.11 +.2 -.1 (2.79 +.58 -.254).11±.15 (2.79±.381).12 (2.59) max..15±.1 (.381±.254) UQCR.7 ±.15 (1.78 ±.381).9±.1 (2.29±.254).115 (2.92) max..1 +.1 -.5 (.254 +.254 -.127) UQCL.4 ±.4 (1.2 ±.1).2±.4 (.51±.1).24 (.6) max..1 ±.6 (.25 ±.15) UQCS.63 ±.6 (1.6 ±.15).32±.6 (.81±.15).35 (.89) max..14 ±.6 (.36 ±.15) UQCF.79 ±.8 (2.1 ±.2).49±.8 (1.24±.2).51 (1.3) max..2 ±.1 (.51 ±.25) TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). 8mm carrier 7" reel: UQCA = 5 or 4 pc T&R UQCL = 5, 4 or 1, pc T&R UQCB = 5 or 1 pc T&R UQCS = 5 or 4 pc T&R UQCR = 5 or 1 pc T&R UQCF = 5 or 4 pc T&R LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. Also available in: Not RoHS Compliant 179 8

Microwave MLCs UQ Series High Q Ultra Low ESR MLC ELECTRICAL SPECIFICATIONS Temperature Coefficient (TCC) Capacitance Range Operating Temperature Quality Factor (Q) Insulation Resistance (IR) Working Voltage (WVDC) Dielectric Withstanding Voltage (DWV) Aging Effects Piezoelectric Effects Capacitance Drift Temperature Characteristic Code A (A) ± 3 PPM/ºC (A).1 pf to 1 pf.1 pf to 1 pf: from -55ºC to +125ºC Greater than 2, at 1 MHz.1 pf to 1 pf 1 5 Megohms min. @ 25ºC at rated WVDC 1 4 Megohms min. @ 125ºC at rated WVDC See Capacitance Values table 25% of rated WVDC for 5 secs None None ± (.2% or.2 pf), whichever is greater ENVIRONMENTAL CHARACTERISTICS AVX UQ will meet and exceed the requirements of EIA-198, MIL-PRF-55681 and MIL-PRF-123 Thermal Shock Mil-STD-22, Method 17, Condition A Moisture Resistance Mil-STD-22, Method 16 Low Voltage Humidity Mil-STD-22, Method 13, condition A, with 1.5 VDC applied while subjected to an environment of 85ºC with 85% relative humidity for 24 hours Life Test Mil-STD-22, Method 18, for 2 hours at 125ºC 2% WVDC Shock Mil-STD-22, Method 213, Condition J Vibration Mil-STD-22, Method 24, Condition B Immersion Mil-STD-22, Method 14, Condition B Salt Spray Mil-STD-22, Method 11, Condition B Solderability Mil-STD-22, Method 28 Terminal Strength Mil-STD-22, Method 211 Temperature Cycling Mil-STD-22, Method 12, Condition C Barometric Pressure Mil-STD-22, Method 15, Condition B Resistance to Solder Heat Mil-STD-22, Method 21, Condition C 8 18

Microwave MLCs UQ Series High Q Ultra Low ESR MLC TABLE I: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 B 25.2 B 25.3 B,C 25.4 B,C 25.5 B, C, D 25.6 B, C, D 25.7 B, C, D 25.8 B, C, D 25.9 B, C, D 25 1. B, C, D 25 1.1 B, C, D 25 1.2 B, C, D 25 1.3 B, C, D 25 1.4 B, C, D 25 1.5 B, C, D 25 TABLE II: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 B 5.2 B 5.3 B,C 5.4 B,C 5.5 B, C, D 5.6 B, C, D 5.7 B, C, D 5.8 B, C, D 5.9 B, C, D 5 1. B, C, D 5 1.1 B, C, D 5 1.2 B, C, D 5 1.3 B, C, D 5 1.4 B, C, D 5 1.5 B, C, D 5 1.6 B, C, D 5 1.7 B, C, D 5 1.8 B, C, D 5 1.9 B, C, D 5 2. B, C, D 5 2.2 B, C, D 5 2.4 B, C, D 5 2.7 B, C, D 5 3. B, C, D 5 3.3 B, C, D 5 TABLE III: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC 1. B, C, D 5 1.1 B, C, D 5 1.2 B, C, D 5 1.3 B, C, D 5 1.4 B, C, D 5 1.5 B, C, D 5 1.6 B, C, D 5 1.7 B, C, D 5 1.8 B, C, D 5 1.9 B, C, D 5 2. B, C, D 5 2.1 B, C, D 5 2.2 B, C, D 5 2.4 B, C, D 5 2.7 B, C, D 5 Cap. pf Cap. Tol. WVDC 1.6 B, C, D 25 1.7 B, C, D 25 1.8 B, C, D 25 1.9 B, C, D 25 2. B, C, D 25 2.2 B, C, D 25 2.4 B, C, D 25 2.7 B, C, D 25 3. B, C, D 25 3.3 B, C, D 25 3.6 B, C, D 25 3.9 B, C, D 25 4.3 B, C, D 25 4.7 B, C, D 25 5.1 B, C, D 25 Cap. pf Cap. Tol. WVDC 3.6 B, C, D 5 3.9 B, C, D 5 4.3 B, C, D 5 4.7 B, C, D 5 5.1 B, C, D 5 5.6 B, C, D 5 6.2 B, C, D 5 6.8 B, C, J, K 5 7.5 B, C, J, K 5 8.2 B, C, J, K 5 9.1 B, C, J, K 5 1 F, G, J, K, M 5 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 Cap. pf Cap. Tol. WVDC 3. B, C, D 5 3.3 B, C, D 5 3.6 B, C, D 5 3.9 B, C, D 5 4.3 B, C, D 5 4.7 B, C, D 5 5.1 B, C, D 5 5.6 G, J, K, M 5 6.2 G, J, K, M 5 6.8 G, J, K, M 5 7.5 G, J, K, M 5 8.2 G, J, K, M 5 9.1 G, J, K, M 5 1 G, J, K, M 5 11 G, J, K, M 5 Case Size A Case Size B Case Size R Cap. pf Cap. Tol. WVDC 5.6 B, C, D 25 6.2 B, C, D 25 6.8 B, C, J, K 25 7.5 B, C, J, K 25 8.2 B, C, J, K 25 9.1 B, C, J, K 25 1 F, G, J, K, M 25 11 F, G, J, K, M 25 12 F, G, J, K, M 25 13 F, G, J, K, M 25 15 F, G, J, K, M 25 16 F, G, J, K, M 25 18 F, G, J, K, M 25 2 F, G, J, K, M 25 22 F, G, J, K, M 25 Cap. pf Cap. Tol. WVDC 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 3 12 F, G, J, K, M 3 13 F, G, J, K, M 3 15 F, G, J, K, M 3 16 F, G, J, K, M 3 18 F, G, J, K, M 3 2 F, G, J, K, M 3 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 3 F, G, J, K, M 2 33 F, G, J, K, M 2 36 F, G, J, K, M 2 39 F, G, J, K, M 2 Cap. pf Cap. Tol. WVDC 12 G, J, K, M 5 13 G, J, K, M 5 15 G, J, K, M 5 16 G, J, K, M 5 18 G, J, K, M 5 2 G, J, K, M 5 22 G, J, K, M 5 24 G, J, K, M 5 27 G, J, K, M 5 3 G, J, K, M 5 33 G, J, K, M 5 36 G, J, K, M 5 39 G, J, K, M 5 43 G, J, K, M 5 47 G, J, K, M 5 Cap. pf Cap. Tol. WVDC 24 F, G, J, K, M 25 27 F, G, J, K, M 25 3 F, G, J, K, M 25 33 F, G, J, K, M 25 36 F, G, J, K, M 25 39 F, G, J, K, M 25 43 F, G, J, K, M 25 47 F, G, J, K, M 25 51 F, G, J, K, M 25 56 F, G, J, K, M 25 62 F, G, J, K, M 25 68 F, G, J, K, M 25 75 F, G, J, K, M 25 82 F, G, J, K, M 25 91 F, G, J, K, M 25 1 F, G, J, K, M 25 Cap. pf Cap. Tol. WVDC 43 F, G, J, K, M 2 47 F, G, J, K, M 2 51 F, G, J, K, M 1 56 F, G, J, K, M 1 62 F, G, J, K, M 1 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 Cap. pf Cap. Tol. WVDC 51 G, J, K, M 5 56 G, J, K, M 5 62 G, J, K, M 5 68 G, J, K, M 5 75 G, J, K, M 5 82 G, J, K, M 5 91 G, J, K, M 5 1 G, J, K, M 5 8 181

Microwave MLCs UQ Series High Q Ultra Low ESR MLC 8 TABLE IV: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 A, B 2.2 A, B 2.3 A, B, C 2.4 A, B, C 2.5 A, B, C 2.6 A, B, C 2.7 A, B, C 2.8 A, B, C 2.9 A, B, C 2 1. A, B, C, D 2 1.1 A, B, C, D 2 1.2 A, B, C, D 2 1.3 A, B, C, D 2 1.5 A, B, C, D 2 TABLE V: Cap. pf Cap. Tol. WVDC.1 A, B 25.2 A, B 25.3 A, B, C 25.4 A, B, C 25.5 A, B, C 25.6 A, B, C 25.7 A, B, C 25.8 A, B, C 25.9 A, B, C 25 1. A, B, C, D 25 1.1 A, B, C, D 25 1.2 A, B, C, D 25 1.3 A, B, C, D 25 1.5 A, B, C, D 25 1.6 A, B, C, D 25 1.8 A, B, C, D 25 2. A, B, C, D 25 2.2 A, B, C, D 25 2.4 A, B, C, D 25 TABLE VI: Cap. pf Cap. Tol. WVDC.1 A, B 25.2 A, B 25.3 A, B, C 25.4 A, B, C 25.5 A, B, C 25.6 A, B, C 25.7 A, B, C 25.8 A, B, C 25.9 A, B, C 25 1. A, B, C, D 25 1.1 A, B, C, D 25 1.2 A, B, C, D 25 1.3 A, B, C, D 25 1.5 A, B, C, D 25 1.6 A, B, C, D 25 1.8 A, B, C, D 25 2. A, B, C, D 25 2.2 A, B, C, D 25 2.4 A, B, C, D 25 2.7 A, B, C, D 25 3. A, B, C, D 25 Cap. pf Cap. Tol. WVDC 1.6 A, B, C, D 2 1.8 A, B, C, D 2 2. A, B, C, D 2 2.2 A, B, C, D 2 2.4 A, B, C, D 2 2.7 A, B, C, D 2 3. A, B, C, D 2 3.3 A, B, C, D 2 3.6 A, B, C, D 2 3.9 A, B, C, D 2 4.3 A, B, C, D 2 4.7 A, B, C, D 2 5.1 A, B, C, D 2 5.6 A, B, C, D 2 Cap. pf Cap. Tol. WVDC 2.7 A, B, C, D 25 3. A, B, C, D 25 3.3 A, B, C, D 25 3.6 A, B, C, D 25 3.9 A, B, C, D 25 4.3 A, B, C, D 25 4.7 A, B, C, D 25 5.1 A, B, C, D 25 5.6 A, B, C, D 25 6.2 A, B, C, D 25 6.8 B, C, J, K 25 7.5 B, C, J, K 25 8.2 B, C, J, K 25 9.1 B, C, J, K 25 1 F, G, J, K, M 25 11 F, G, J, K, M 25 12 F, G, J, K, M 25 15 F, G, J, K, M 25 18 F, G, J, K, M 25 Cap. pf Cap. Tol. WVDC 3.3 A, B, C, D 25 3.6 A, B, C, D 25 3.9 A, B, C, D 25 4.3 A, B, C, D 25 4.7 A, B, C, D 25 5.1 A, B, C, D 25 5.6 A, B, C, D 25 6.2 A, B, C, D 25 6.8 B, C, J, K 25 7.5 B, C, J, K 25 8.2 B, C, J, K 25 9.1 B, C, J, K 25 1 F, G, J, K, M 25 11 F, G, J, K, M 25 12 F, G, J, K, M 25 15 F, G, J, K, M 25 18 F, G, J, K, M 25 2 F, G, J, K, M 25 22 F, G, J, K, M 25 24 F, G, J, K, M 25 27 F, G, J, K, M 25 Case Size L Case Size S Case Size F Cap. pf Cap. Tol. WVDC 6.2 A, B, C, D 2 6.8 B, C, J, K 2 7.5 B, C, J, K 2 8.2 B, C, J, K 2 9.1 B, C, J, K 2 1 F, G, J, K, M 2 11 F, G, J, K, M 2 12 F, G, J, K, M 2 15 F, G, J, K, M 2 18 F, G, J, K, M 2 2 F, G, J, K, M 2 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 Cap. pf Cap. Tol. WVDC 2 F, G, J, K, M 25 22 F, G, J, K, M 25 24 F, G, J, K, M 25 27 F, G, J, K, M 25 3 F, G, J, K, M 25 33 F, G, J, K, M 25 36 F, G, J, K, M 25 39 F, G, J, K, M 25 43 F, G, J, K, M 25 47 F, G, J, K, M 25 51 F, G, J, K, M 25 56 F, G, J, K, M 25 62 F, G, J, K, M 25 68 F, G, J, K, M 25 75 F, G, J, K, M 25 82 F, G, J, K, M 25 91 F, G, J, K, M 25 1 F, G, J, K, M 25 Cap. pf Cap. Tol. WVDC 3 F, G, J, K, M 25 33 F, G, J, K, M 25 36 F, G, J, K, M 25 39 F, G, J, K, M 25 43 F, G, J, K, M 25 47 F, G, J, K, M 25 51 F, G, J, K, M 25 56 F, G, J, K, M 25 62 F, G, J, K, M 25 68 F, G, J, K, M 25 75 F, G, J, K, M 25 82 F, G, J, K, M 25 91 F, G, J, K, M 25 1 F, G, J, K, M 25 11 F, G, J, K, M 25 12 F, G, J, K, M 25 15 F, G, J, K, M 25 18 F, G, J, K, M 25 2 F, G, J, K, M 25 22 F, G, J, K, M 25 24 F, G, J, K, M 25 182

Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CA ESR vs. Frequency UQ CA FSR & FPR vs. Capacitance 8 183

Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CB ESR vs. Frequency UQ CB FSR & FPR vs. Capacitance 8 184

Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CR ESR vs. Frequency UQ CR Resonance Horizontal Orientation 8 185

Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CL ESR vs. Frequency UQ CL Resonance Frequency 8 186

Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CS ESR vs. Frequency UQ CS ESR vs. Frequency 8 187

Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CS Q vs. Capacitance UQ CS Resonant Frequency 8 188

Microwave MLCs UQ Series High Q Ultra Low ESR MLC UQ CF ESR vs. Frequency UQ CF Resonant Frequency 8 189

Microwave MLCs UQ Series High Q Ultra Low ESR MLC B A C D MOUNTING PAD DIMENSIONS CASE CA: inches (millimeters) Pad Size A min B min C min D min Vertical Mount Normal.7 (1.778).5 (1.27).3 (.762).13 (3.32) High Density.5 (1.27).3 (.762).3 (.762).9 (2.286) Horizontal Mount Normal.8 (2.32).5 (1.27).3 (.762).13 (3.32) High Density.6 (1.524).3 (.762).3 (.762).9 (2.286) MOUNTING PAD DIMENSIONS CASE CB: inches (millimeters) Cap Value Pad Size A min B min C min D min Vertical Mount.1 pf Normal.65 (1.651).5 (1.27).75 (1.95).175 (4.445) High Density.45 (1.143).3 (.762).75 (1.95).135 (3.429).2 pf Normal.9 (2.286).5 (1.27).75 (1.95).175 (4.445) High Density.7 (1.778).3 (.762).75 (1.95).135 (3.429).3 to Normal.11 (2.794).5 (1.27).75 (1.95).175 (4.445) 51 pf High Density.9 (2.286).3 (.762).75 (1.95).135 (3.429) > 51 pf Normal.12 (3.48).5 (1.27).75 (1.95).175 (4.445) High Density.1 (2.54).3 (.762).75 (1.95).135 (3.429) Horizontal Mount All Normal.13 (3.32).5 (1.27).75 (1.95).175 (4.445) Values High Density.11 (2.794).3 (.762).75 (1.95).135 (3.429) MOUNTING PAD DIMENSIONS CASE CL, CS & CF: inches (millimeters) T L W A B C B Case A min. B min. C min. D min. 42 (15).275 (.7).354 (.9).157 (.4).866 (2.2) 63 (168).393 (1.).433 (1.1).3236 (.6).11 (2.8) 85 (212).59 (1.5).512 (1.3).236 (.6).1259 (3.2) D 8 19

Microwave MLCs UQ Series High Q Ultra Low ESR MLC DESIGN KITS Kit # Compliance Description Cap Value Tol. (pf) KITUQ8LF KITUQ81LF KITUQ82LF KITUQ83LF KITUQ84LF KITUQ85LF KITUQ36LF KITUQ37LF KITUQ38LF KITUQ25LF KITUQ26LF KITUQ27LF KITUQ32LF KITUQ33LF KITUQ34LF KITUQ35LF LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT LEAD-FREE COMPATIBLE COMPONENT UQCA 55 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCA 55 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCA 55 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCB 1111 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCB 1111 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCB 1111 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values,15 pcs min. per value UQCL 42 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCL 42 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCL 42 Series Ultra-Low ESR High Q Microwave Capacitors 8 different values, 15 pcs min. per value UQCS 63 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCS 63 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCS 63 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCF 85 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCF 85 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCF 85 Series Ultra-Low ESR High Q Microwave Capacitors 16 different values, 15 pcs min. per value UQCF 85 Series Ultra-Low ESR High Q Microwave Capacitors 7 different values, 15 pcs min. per value.1 to 2. 1. to 1 pf ±.1 ±.25 ±.1 ±.25 ±5% 1 to 1 pf ±5% 1. to 1 pf ±.1 ±.25 ±5% 1 to 1 pf ±5% 1 to 1 pf.1 to 2. 1. to 1 ±5% ±1% ±.1 ±.25 ±.1 ±.25 ±5% 1 to 27 ±5%.1 to 2. 1. to 1 ±.1 ±.25 ±.1 ±.25 ±5% 1 to 1 ±5%.1 to 2. 1. to 1 ±.1 ±.25 ±.1 ±.25 ±5% 1 to 1 ±5% 1 to 24 ±5% 8 187

RF/Microwave MLC s SQ Series Ultra Low ESR MLC HOW TO ORDER SQ CA 7 FEATURES: M 1 J A Low ESR High Q High Self Resonance Capacitance Range.1 pf to 51 pf 175ºC Capability SQCB (Standard voltages only) APPLICATIONS: RF Power Amplifiers Low Noise Amplifiers Filter Networks MRI Systems T 1A AVX Style Case Size CA = 55 CB = 1111 See mechanical dimensions below Voltage Code 5 = 5V 1 = 1V E = 15V 2 = 2V V = 25V 9 = 3V 7 = 5V C = 6V A = 1V S = 15V Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Temperature Coefficient Code M = +9±2ppm/ C A = ±3ppm/ C C = 15% ( J Termination only) Capacitance Tolerance Code B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% N = ±3% Failure Rate Code A = Not Applicable Termination Style Code **T = 1% Tin J = Nickel Barrier Sn/Pb (6/4) **7 = Ag/Ni/Au H = Cu/Sn (Non-Magnetic) **RoHS compliant Packaging Code 1A = 7" Reel Unmarked 6A = Waffle Pack Unmarked ME = 7" Reel Marked WE = Waffle Pack Marked * Vertical T&R available MECHANICAL DIMENSIONS: inches (millimeters) T W bw L Case Length (L) Width (W) Thickness (T) Band Width (bw) SQCA*.55 +.15 -.1 (1.4+.381 -.254).55±.15 (1.4±.381).2/.57 (.58/1.45).1 +.1 -.5 (.254 +.254 -.127) SQCB*.11 +.2 -.1 (2.79 +.58 -.254).11±.1 (2.79±.254).3/.12 (.762/2.59).15±.1 (.381±.254) 8 TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). 8mm carrier 7" reel: SQCA/SQCB = 1 pcs WAFFLE PACK SQCA 1 pcs SQCB 1 pcs Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. 192 62116

RF/Microwave MLC s SQ Series Ultra Low ESR MLC ELECTRICAL SPECIFICATIONS Dielectric M & A C Temperature Coefficient (TCC) (M) +9 ± 2 PPM/ºC ( -55ºC to +125ºC) ±15% (-55ºC to 125ºC) (M) +9 ± 3 PPM/ºC ( +125ºC to +175ºC)* (A) ± 3 PPM/ºC Capacitance Range (M).1 pf to 1 pf.1μf to.1μf (A).1 pf to 51 pf Operating Temperature A Case: -55ºC to +125ºC* -55 C to +125 C B Case (M Dielectric):.1 pf to 33 pf: from -55ºC to +175ºC 36 pf to 51 pf: from -55ºC to +125ºC B Case (A Dielectric):.1 pf to 2 pf: from -55ºC to +175ºC 22 pf to 51 pf: from -55ºC to +125ºC Quality Factor (Q) M Dielectric A & B Case Greater than 1, at 1 MHz 2.5% @ 1kHz A Dielectric B Case Greater than 1, at 1 MHz.1-2 pf Greater than 2, at 1 MHz 22-1 pf Greater than 2, at 1 KHz 11-51 pf A Dielectric A Case Greater than 1, at 1 MHz.1-1 pf Greater than 2, at 1 MHz 11-1 pf Insulation Resistance (IR).2 pf to 47 pf 1 4 Megohms min. @ 25ºC at rated WVDC 1 6 Megohms min. @ 25ºC at rated WVDC 1 3 Megohms min. @ 125ºC at rated WVDC 1 5 Megohms min. @ 125ºC at rated WVDC 51 pf to 51 pf 1 5 Megohms min. @ 25ºC at rated WVDC 1 4 Megohms min. @ 125ºC at rated WVDC Working Voltage (WVDC) See Capacitance Values table See Capacitance Values table Dielectric Withstanding Voltage (DWV) WVDC 5V or less: 25% of rated WVDC for 5 seconds 25% of rated WVDC for 5 secs WVDC 125V or less: 15% of rated WVDC for 5 seconds WVDC > 125V: 12% of rated WVDC for 5 seconds Aging Effects None <3% per decade hour Piezoelectric Effects None None Capacitance Drift ± (.2% or.2 pf), whichever is greater Not Applicable * 175 SQCB only ENVIRONMENTAL CHARACTERISTICS AVX SQ will meet and exceed the requirements of EIA-198, MIL-PRF-55681 and MIL-PRF-123 Themal Shock Mil-STD-22, Method 17, Condition A Moisture Resistance Mil-STD-22, Method 16 Low Voltage Humidity Mil-STD-22, Method 13, condition A, with 1.5 VDC applied while subjected to an environment of 85ºC with 85% relative humidity for 24 hours Life Test Mil-STD-22, Method 18, for 2 hours at 125ºC Shock Mil-STD-22, Method 213, Condition J Vibration Mil-STD-22, Method 24, Condition B Immersion Mil-STD-22, Method 14, Condition B Salt Spray Mil-STD-22, Method 11, Condition B Solderability Mil-STD-22, Method 28 Terminal Strength Mil-STD-22, Method 211 Temperature Cycling Mil-STD-22, Method 12, Condition C Barometric Pressure Mil-STD-22, Method 15, Condition B Resistance to Solder Heat Mil-STD-22, Method 21, Condition C 8 62116 193

RF/Microwave MLC s SQ Series Ultra Low ESR MLC Case Size A TABLE I: TC: M (+9±2PPM/ C) Cap. pf Cap. Tol. WVDC* STD HV.1 B 15 25.2 B 15 25.3 B,C 15 25.4 B,C 15 25.5 B, C, D 15 25.6 B, C, D 15 25.7 B, C, D 15 25.8 B, C, D 15 25.9 B, C, D 15 25 1. B, C, D 15 25 1.1 B, C, D 15 25 1.2 B, C, D 15 25 1.3 B, C, D 15 25 1.4 B, C, D 15 25 1.5 B, C, D 15 25 1.6 B, C, D 15 25 TABLE II: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC* STD HV.1 B 15 25.2 B 15 25.3 B,C 15 25.4 B,C 15 25.5 B, C, D 15 25.6 B, C, D 15 25.7 B, C, D 15 25.8 B, C, D 15 25.9 B, C, D 15 25 1. B, C, D 15 25 1.1 B, C, D 15 25 1.2 B, C, D 15 25 1.3 B, C, D 15 25 1.4 B, C, D 15 25 1.5 B, C, D 15 25 1.6 B, C, D 15 25 1.7 B, C, D 15 25 1.8 B, C, D 15 25 1.9 B, C, D 15 25 2. B, C, D 15 25 2.2 B, C, D 15 25 2.4 B, C, D 15 25 TABLE III: TC: C (±15%) Cap. pf Cap. Tol. WVDC STD 1 K, M, N 5 12 K, M, N 5 15 K, M, N 5 18 K, M, N 5 2 K, M, N 5 *STD = Standard voltage rating; HV = High voltage rating Cap. pf Cap. Tol. WVDC* STD HV 1.7 B, C, D 15 25 1.8 B, C, D 15 25 1.9 B, C, D 15 25 2. B, C, D 15 25 2.2 B, C, D 15 25 2.4 B, C, D 15 25 2.7 B, C, D 15 25 3. B, C, D 15 25 3.3 B, C, D 15 25 3.6 B, C, D 15 25 3.9 B, C, D 15 25 4.3 B, C, D 15 25 4.7 B, C, D 15 25 5.1 B, C, D 15 25 5.6 B, C, D 15 25 Cap. pf Cap. Tol. WVDC* STD HV 2.7 B, C, D 15 25 3. B, C, D 15 25 3.3 B, C, D 15 25 3.6 B, C, D 15 25 3.9 B, C, D 15 25 4.3 B, C, D 15 25 4.7 B, C, D 15 25 5.1 B, C, D 15 25 5.6 B, C, D 15 25 6.2 B, C, D 15 25 6.8 B, C, J, K 15 25 7.5 B, C, J, K 15 25 8.2 B, C, J, K 15 25 9.1 B, C, J, K 15 25 1 F, G, J, K 15 25 11 F, G, J, K 15 25 12 F, G, J, K 15 25 13 F, G, J, K 15 25 15 F, G, J, K 15 25 16 F, G, J, K 15 25 18 F, G, J, K 15 25 Cap. pf Cap. Tol. WVDC STD 22 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 47 K, M, N 5 Cap. pf Cap. Tol. WVDC* STD HV 6.2 B, C, D 15 25 6.8 B, C, J, K 15 25 7.5 B, C, J, K 15 25 8.2 B, C, J, K 15 25 9.1 B, C, J, K 15 25 1 F, G, J, K 15 25 11 F, G, J, K 15 25 12 F, G, J, K 15 25 13 F, G, J, K 15 25 15 F, G, J, K 15 25 16 F, G, J, K 15 25 18 F, G, J, K 15 25 2 F, G, J, K 15 25 22 F, G, J, K 15 25 24 F, G, J, K 15 25 Cap. pf Cap. Tol. WVDC* STD HV 2 F, G, J, K 15 25 22 F, G, J, K 15 25 24 F, G, J, K 15 25 27 F, G, J, K 15 25 3 F, G, J, K 15 25 33 F, G, J, K 15 25 36 F, G, J, K 15 25 39 F, G, J, K 15 25 43 F, G, J, K 15 25 47 F, G, J, K 15 25 51 F, G, J, K 15 25 56 F, G, J, K 15 25 62 F, G, J, K 15 2 68 F, G, J, K 15 2 75 F, G, J, K 15 2 82 F, G, J, K 15 2 91 F, G, J, K 15 2 1 F, G, J, K 15 11 F, G, J, K 15 12 F, G, J, K 15 13 F, G, J, K 15 Cap. pf Cap. Tol. WVDC STD 51 K, M, N 5 56 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 Cap. pf Cap. Tol. WVDC* STD HV 27 F, G, J, K 15 25 3 F, G, J, K 15 25 33 F, G, J, K 15 25 36 F, G, J, K 15 25 39 F, G, J, K 15 25 43 F, G, J, K 15 25 47 F, G, J, K 15 25 51 F, G, J, K 15 25 56 F, G, J, K 15 25 62 F, G, J, K 15 2 68 F, G, J, K 15 2 75 F, G, J, K 15 2 82 F, G, J, K 15 2 91 F, G, J, K 15 2 1 F, G, J, K 15 2 Cap. pf Cap. Tol. WVDC* STD HV 15 F, G, J, K 15 16 F, G, J, K 15 18 F, G, J, K 15 2 F, G, J, K 15 22 F, G, J, K 15 24 F, G, J, K 15 27 F, G, J, K 15 3 F, G, J, K 15 33 F, G, J, K 15 36 F, G, J, K 15 39 F, G, J, K 15 43 F, G, J, K 15 47 F, G, J, K 15 51 F, G, J, K 15 56 F, G, J, K 15 62 F, G, J, K 15 68 F, G, J, K 5 75 F, G, J, K 5 82 F, G, J, K 5 91 F, G, J, K 5 1 F, G, J, K 5 8 194 62116

RF/Microwave MLC s SQ Series Ultra Low ESR MLC Case Size B TABLE IV: TC: M (+9±2PPM/ C) Cap. pf Cap. Tol. WVDC* STD HV.1 B 5 15.2 B 5 15.3 B,C 5 15.4 B,C 5 15.5 B, C, D 5 15.6 B, C, D 5 15.7 B, C, D 5 15.8 B, C, D 5 15.9 B, C, D 5 15 1. B, C, D 5 15 1.1 B, C, D 5 15 1.2 B, C, D 5 15 1.3 B, C, D 5 15 1.4 B, C, D 5 15 1.5 B, C, D 5 15 1.6 B, C, D 5 15 1.7 B, C, D 5 15 1.8 B, C, D 5 15 1.9 B, C, D 5 15 2. B, C, D 5 15 2.2 B, C, D 5 15 2.4 B, C, D 5 15 TABLE V: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC* STD HV.1 B 5 15.2 B 5 15.3 B,C 5 15.4 B,C 5 15.5 B, C, D 5 15.6 B, C, D 5 15.7 B, C, D 5 15.8 B, C, D 5 15.9 B, C, D 5 15 1. B, C, D 5 15 1.1 B, C, D 5 15 1.2 B, C, D 5 15 1.3 B, C, D 5 15 1.4 B, C, D 5 15 1.5 B, C, D 5 15 1.6 B, C, D 5 15 1.7 B, C, D 5 15 1.8 B, C, D 5 15 1.9 B, C, D 5 15 2. B, C, D 5 15 2.2 B, C, D 5 15 2.4 B, C, D 5 15 2.7 B, C, D 5 15 3. B, C, D 5 15 3.3 B, C, D 5 15 3.6 B, C, D 5 15 Cap. pf Cap. Tol. WVDC* STD HV 2.7 B, C, D 5 15 3. B, C, D 5 15 3.3 B, C, D 5 15 3.6 B, C, D 5 15 3.9 B, C, D 5 15 4.3 B, C, D 5 15 4.7 B, C, D 5 15 5.1 B, C, D 5 15 5.6 B, C, D 5 15 6.2 B, C, D 5 15 6.8 B, C, J, K 5 15 7.5 B, C, J, K 5 15 8.2 B, C, J, K 5 15 9.1 B, C, J, K 5 15 1 F, G, J, K 5 15 11 F, G, J, K 5 15 12 F, G, J, K 5 15 13 F, G, J, K 5 15 15 F, G, J, K 5 15 16 F, G, J, K 5 15 18 F, G, J, K 5 15 Cap. pf Cap. Tol. WVDC* STD HV 3.9 B, C, D 5 15 4.3 B, C, D 5 15 4.7 B, C, D 5 15 5.1 B, C, D 5 15 5.6 B, C, D 5 15 6.2 B, C, D 5 15 6.8 B, C, J, K 5 15 7.5 B, C, J, K 5 15 8.2 B, C, J, K 5 15 9.1 B, C, J, K 5 15 1 F, G, J, K 5 15 11 F, G, J, K 5 15 12 F, G, J, K 5 15 13 F, G, J, K 5 15 15 F, G, J, K 5 15 16 F, G, J, K 5 15 18 F, G, J, K 5 15 2 F, G, J, K 5 15 22 F, G, J, K 5 15 24 F, G, J, K 5 15 27 F, G, J, K 5 15 3 F, G, J, K 5 15 33 F, G, J, K 5 15 36 F, G, J, K 5 15 39 F, G, J, K 5 15 43 F, G, J, K 5 15 Cap. pf Cap. Tol. WVDC* STD HV 2 F, G, J, K 5 15 22 F, G, J, K 5 15 24 F, G, J, K 5 15 27 F, G, J, K 5 15 3 F, G, J, K 5 15 33 F, G, J, K 5 15 36 F, G, J, K 5 15 39 F, G, J, K 5 15 43 F, G, J, K 5 15 47 F, G, J, K 5 15 51 F, G, J, K 5 15 56 F, G, J, K 5 15 62 F, G, J, K 5 15 68 F, G, J, K 5 15 75 F, G, J, K 5 15 82 F, G, J, K 5 15 91 F, G, J, K 5 15 1 F, G, J, K 5 15 11 F, G, J, K 3 15 12 F, G, J, K 3 1 13 F, G, J, K 3 1 Cap. pf Cap. Tol. WVDC* STD HV 47 F, G, J, K 5 15 51 F, G, J, K 5 1 56 F, G, J, K 5 1 62 F, G, J, K 5 1 68 F, G, J, K 5 1 75 F, G, J, K 5 1 82 F, G, J, K 5 1 91 F, G, J, K 5 1 1 F, G, J, K 5 1 11 F, G, J, K 3 1 12 F, G, J, K 3 1 13 F, G, J, K 3 1 15 F, G, J, K 3 1 16 F, G, J, K 3 1 18 F, G, J, K 3 1 2 F, G, J, K 3 1 22 F, G, J, K 2 24 F, G, J, K 2 27 F, G, J, K 2 3 F, G, J, K 2 33 F, G, J, K 2 36 F, G, J, K 2 39 F, G, J, K 2 43 F, G, J, K 2 47 F, G, J, K 2 51 F, G, J, K 1 Cap. pf Cap. Tol. WVDC* STD HV 15 F, G, J, K 3 1 16 F, G, J, K 3 1 18 F, G, J, K 3 1 2 F, G, J, K 3 1 22 F, G, J, K 2 1 24 F, G, J, K 2 6 27 F, G, J, K 2 6 3 F, G, J, K 2 6 33 F, G, J, K 2 6 36 F, G, J, K 2 6 39 F, G, J, K 2 6 43 F, G, J, K 2 6 47 F, G, J, K 2 6 51 F, G, J, K 1 3 56 F, G, J, K 1 3 62 F, G, J, K 1 3 68 F, G, J, K 5 3 75 F, G, J, K 5 3 82 F, G, J, K 5 3 91 F, G, J, K 5 3 1 F, G, J, K 5 3 Cap. pf Cap. Tol. WVDC* STD HV 56 F, G, J, K 1 62 F, G, J, K 1 68 F, G, J, K 5 75 F, G, J, K 5 82 F, G, J, K 5 91 F, G, J, K 5 1 F, G, J, K 5 11 F, G, J, K 5 12 F, G, J, K 5 13 F, G, J, K 5 15 F, G, J, K 5 16 F, G, J, K 5 18 F, G, J, K 5 2 F, G, J, K 5 22 F, G, J, K 5 24 F, G, J, K 5 27 F, G, J, K 5 3 F, G, J, K 5 33 F, G, J, K 5 36 F, G, J, K 5 39 F, G, J, K 5 43 F, G, J, K 5 47 F, G, J, K 5 5 F, G, J, K 5 51 F, G, J, K 5 TABLE VI: TC: C (±15%) Cap. pf Cap. Tol. WVDC STD 5 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 12 K, M, N 5 *STD = Standard voltage rating; HV = High voltage rating Cap. pf Cap. Tol. WVDC STD 15 K, M, N 5 18 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 Cap. pf Cap. Tol. WVDC STD 47 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 8 62116 195

RF/Microwave MLC s SQ Series Ultra Low ESR MLC 1 Typical ESR SQCA ESR (ohms) 1.1.1 1pF 4.7pF 1pF 22pF 1pF.1 1 1 1 Frequency (Mhz) 1 Typical ESR SQCB ESR (ohms).1.1 4.7pF 1pF 22pF 1pF 1pF.1 1 1 1 Frequency (Mhz) 8 196 62116

RF/Microwave MLC s SQ Series Ultra Low ESR MLC 1 SQCA Max Current Max Current (amps) 1.1 1pF 4.7pF 1pF 22pF 1pF.1 1 1 1 1 Frequency (Mhz) 1 SQCB Max Current Max Current (amps) 1 1 4.7pF 1pF 22pF 1pF 1pF.1 1 1 1 1 Frequency (Mhz) 8 6216 197

SRF (Mhz) RF/Microwave MLC s SQ Series Ultra Low ESR MLC 1 Series Resonant Frequency 1 SQCA SQCB 1 1 1 1 1 Capacitance (pf) A B C D MOUNTING PAD DIMENSIONS: inches (millimeters) Case A min B min C min D min SQCA.82 (2.83).51 (1.295).32 (.813).13 (3.32) SQCB.131 (3.327).51 (1.295).74 (1.88).177 (4.496) SQCS.38 (.965).43 (1.92).25 (.635).112 (2.845) SQCF.59 (1.499).51 (1.295).24 (.61).125 (3.175) SQCA & SQCB DESIGN KITS 8 PN Series Diel Term Range KITSQ1LF P9 1% Tin SQCA KITSQ4LF CG RoHS.1 to 2pF KITSQ2LF P9 1% Tin SQCA KITSQ5LF CG RoHS 1 to 1pF KITSQ3LF P9 1% Tin SQCA KITSQ6LF CG RoHS 1 to 1pF KITSQ7LF SQCA CG 1% Tin RoHS 1 to 1pF KITSQ8LF KITSQ11LF KITSQ9LF KITSQ12LF KITSQ1LF KITSQ13LF SQCB SQCB SQCB P9 CG P9 CG P9 CG KITSQ14LF SQCB CG 1% Tin RoHS 1% Tin RoHS 1% Tin RoHS 1% Tin RoHS 1 to 1pF 1 to 1pF 1 to 1pF 1 to 51 pf 198 62116

Microwave MLC s SQCS (63) SQCF (85) Ultra Low ESR MLC HOW TO ORDER SQ CS V FEATURES: A 1 J A Low ESR High Q High Self Resonance Capacitance Range.1 pf to 24 pf EIA Size APPLICATIONS: RF Power Amplifiers Low Noise Amplifiers Filter Networks Point to Point Radios T 1A AVX Style Case Size CS = 63 CF = 85 Voltage Code V = 25V Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Failure Rate Code A = Not Applicable Packaging Code 1A = 7" Reel Unmarked ME = 7" Reel Marked * Vertical T&R available * 5 piece reels available Temperature Coefficient Code A = ±3ppm/ C Capacitance Tolerance Code A = ±.5 pf B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% Termination Style Code **7 = Ag/Ni/Au J = Nickel Barrier Sn/Pb (6/4) **T = 1% Tin (Standard) **RoHS compliant T W bw A 11J L MECHANICAL DIMENSIONS: inches (millimeters) Case Length (L) Width (W) Thickness (T) Band Width (bw) SQCS.63±.6.32±.6.3 Max..14±.6 (1.6±.152) (.813±.152) (.762) (.357±.152) SQCF.79±.8.49±.8.45 Max..14±.6 (2.1±.2) (1.24±.2) (1.14) (.357±.152) TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). 8mm carrier 7" reel = 4 pcs (5 piece options) Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. 8 92916 199

Microwave MLC s Low ESR MLC Capacitors ELECTRICAL SPECIFICATIONS Temperature Coefficient (TCC) (A) ± 3 PPM/ºC Operating Temperature -55ºC to +125ºC Quality Factor (Q) Greater than 1, at 1 MHz Insulation Resistance (IR).1 pf to 24 pf 1 5 Megohms min. @ 25ºC at rated WVDC 1 4 Megohms min. @ 125ºC at rated WVDC Working Voltage (WVDC) See Capacitance Values table Dielectric Withstanding Voltage (DWV) 25% of rated WVDC for 5 secs Aging Effects None Piezoelectric Effects None Capacitance Drift ± (.2% or.2 pf), whichever is greater ENVIRONMENTAL CHARACTERISTICS AVX SQ will meet and exceed the requirements of EIA-198, MIL-PRF-55681 and MIL-PRF-123 Themal Shock Mil-STD-22, Method 17, Condition A Moisture Resistance Mil-STD-22, Method 16 Low Voltage Humidity Mil-STD-22, Method 13, condition A, with 1.5 VDC applied while subjected to an environment of 85ºC with 85% relative humidity for 24 hours Life Test Mil-STD-22, Method 18, for 2 hours at 125ºC Shock Mil-STD-22, Method 213, Condition J Vibration Mil-STD-22, Method 24, Condition B Immersion Mil-STD-22, Method 14, Condition B Salt Spray Mil-STD-22, Method 11, Condition B Solderability Mil-STD-22, Method 28 Terminal Strength Mil-STD-22, Method 211 Temperature Cycling Mil-STD-22, Method 12, Condition C Barometric Pressure Mil-STD-22, Method 15, Condition B Resistance to Solder Heat Mil-STD-22, Method 21, Condition C 8 2 92916

Microwave MLC s SQ Series Available Capacitance/Size/WVDC/T.C. TABLE I: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 A, B 25.2 A, B 25.3 A, B 25.4 A, B 25.5 A, B, C 25.6 A, B, C 25.7 A, B, C 25.8 A, B, C 25.9 A, B, C 25 1. A, B, C 25 1.1 A, B, C 25 1.2 A, B, C 25 1.3 A, B, C 25 1.4 A, B, C 25 1.5 A, B, C 25 1.6 A, B, C 25 1.7 A, B, C 25 1.8 A, B, C 25 1.9 A, B, C 25 2. A, B, C 25 2.2 A, B, C 25 CASE SIZE S Cap. pf Cap. Tol. WVDC 2.4 A, B, C 25 2.7 A, B, C 25 3. A, B, C 25 3.3 A, B, C 25 3.6 A, B, C 25 3.9 A, B, C 25 4.3 A, B, C 25 4.7 A, B, C 25 5.1 A, B, C 25 5.6 A, B, C 25 6.2 A, B, C 25 6.8 B, C, D 25 7.5 B, C, D 25 8.2 B, C, D 25 9.1 B, C, D 25 1 F, G, J 25 11 F, G, J 25 12 F, G, J 25 13 F, G, J 25 15 F, G, J 25 16 F, G, J 25 Cap. pf Cap. Tol. WVDC 18 F, G, J 25 2 F, G, J 25 22 F, G, J 25 24 F, G, J 25 27 F, G, J 25 3 F, G, J 25 33 F, G, J 25 36 F, G, J 25 39 F, G, J 25 43 F, G, J 25 47 F, G, J 25 51 F, G, J 25 56 F, G, J 25 62 F, G, J 25 68 F, G, J 25 75 F, G, J 25 82 F, G, J 25 91 F, G, J 25 1 F, G, J 25 TABLE II: TC: A (±3PPM/ C) Cap. pf Cap. Tol. WVDC.1 A, B 25.2 A, B 25.3 A, B 25.4 A, B 25.5 A, B, C 25.6 A, B, C 25.7 A, B, C 25.8 A, B, C 25.9 A, B, C 25 1. A, B, C 25 1.1 A, B, C 25 1.2 A, B, C 25 1.3 A, B, C 25 1.4 A, B, C 25 1.5 A, B, C 25 1.6 A, B, C 25 1.7 A, B, C 25 1.8 A, B, C 25 1.9 A, B, C 25 2. A, B, C 25 2.2 A, B, C 25 CASE SIZE F Cap. pf Cap. Tol. WVDC 2.4 A, B, C 25 2.7 A, B, C 25 3. A, B, C 25 3.3 A, B, C 25 3.6 A, B, C 25 3.9 A, B, C 25 4.3 A, B, C 25 4.7 A, B, C 25 5.1 A, B, C 25 5.6 A, B, C 25 6.2 A, B, C 25 6.8 B, C, D 25 7.5 B, C, D 25 8.2 B, C, D 25 9.1 B, C, D 25 1 F, G, J 25 11 F, G, J 25 12 F, G, J 25 13 F, G, J 25 15 F, G, J 25 16 F, G, J 25 Cap. pf Cap. Tol. WVDC 18 F, G, J 25 2 F, G, J 25 22 F, G, J 25 24 F, G, J 25 27 F, G, J 25 3 F, G, J 25 33 F, G, J 25 36 F, G, J 25 39 F, G, J 25 43 F, G, J 25 47 F, G, J 25 51 F, G, J 25 56 F, G, J 25 62 F, G, J 25 68 F, G, J 25 75 F, G, J 25 82 F, G, J 25 91 F, G, J 25 1 F, G, J 25 11 F, G, J 25 12 F, G, J 25 Cap. pf Cap. Tol. WVDC 15 F, G, J 25 18 F, G, J 25 2 F, G, J 25 22 F, G, J 25 24 F, G, J 25 8 92916 21

Microwave MLC s SQCS (63) SQCF (85) Ultra Low ESR MLC 1 Typical ESR SQCS ESR (ohms).1 1pF 4.7pF 1pF 22pF 1pF.1 1 1 1 Frequency (Mhz) 1 Typical ESR SQCF ESR (ohms).1.1.1 1 1 1 Frequency (Mhz) 1pF 4.7pF 1pF 1pF 24pF 8 22 92916

Microwave MLC s SQCS (63) SQCF (85) Ultra Low ESR MLC 1 Max Current SQCS Max Current (amps) 1 1 1pF 4.7pF 1pF 22pF 1pF.1 1 1 1 1 Frequency (Mhz) 1 Max Current SQCF Max Current (amps) 1 1.1 1 1 1 1 Frequency (Mhz) 1pF 4.7pF 1pF 1pF 24pF 8 92916 23

SRF (Mhz) Microwave MLC s SQCS (63) SQCF (85) Ultra Low ESR MLC 1 Series Resonant Frequency 1 1 SQCS SQCF 1 1 1 1 1 Capacitance (pf) A B C D MOUNTING PAD DIMENSIONS: inches (millimeters) Case A min B min C min D min SQCA.82 (2.83).51 (1.295).32 (.813).13 (3.32) SQCB.131 (3.327).51 (1.295).74 (1.88).177 (4.496) SQCS.38 (.965).43 (1.92).25 (.635).112 (2.845) SQCF.59 (1.499).51 (1.295).24 (.61).125 (3.175) SQCS & SQCF ENGINEERING KITS PN Series Diel Term Range Kit SQ18LF 1% Tin.1 to 1pF SQCF CG Kit SQ19LF RoHS 1 to 24pF Kit SQ15LF 1%Tin.1 to 1pF SQCS CG Kit SQ16LF RoHS 1 to 1pF Tolerance per PF: B from.1 to 3.3 J from 1 to 24 C from 3.9 to 8.2 8 24 92916

Microwave MLC s AQ Series These porcelain and ceramic dielectric multilayer capacitor (MLC) chips are best suited for RF/ Microwave applications typically ranging from 1 MHz to 4.2 GHz. Characteristic is a fine grained, high density, high purity dielectric material impervious to moisture with heavy internal palladium electrodes. These characteristics lend well to applications requiring: 1) high current carrying capabilities; 2) high quality factors; 3) very low equivalent series resistance; 4) very high series resonance; 5) excellent stability under stresses of changing voltage, frequency, time and temperature. MECHANICAL DIMENSIONS: inches (millimeters) T W bw A 11J L Case Length (L) Width (W) Thickness (T) Band Width (bw) AQ11.55±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45).1 +.1 -.5 (.254 +.254 -.127) AQ12.55 +.15 -.1 (1.4+.381 -.254).55±.15 (1.4±.381).2/.57 (.58/1.45).1 +.1 -.5 (.254 +.254 -.127) AQ13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) AQ14.11 +.2 -.1 (2.79 +.889 -.254).11±.1 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) HOW TO ORDER AQ 11 E M 1 J A 1 ME AVX Style AQ11, AQ12, AQ13, AQ14 Case Size (See Chart) Voltage Code 5 = 5V 1 = 1V E = 15V 2 = 2V 9 = 3V 7 = 5V Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Temperature Coefficient Code M = +9±2ppm/ C (AQ11/12/13/14) A = ±3ppm/ C (AQ11/12/13/14) C = 15% ( J Termination only) (AQ12/14) PACKAGING Standard Packaging = Waffle Pack (maximum quantity is 8) Capacitance Tolerance Code B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% N = ±3% Failure Rate Code A = Not Applicable Termination Style Code 7 = Ag/Ni/Au (AQ11/13 only) J = Nickel Barrier Sn/Pb (6/4) - (AQ12/14 only) T = 1% Tin (AQ12/14 only) Packaging* Code 3A = 13" Reel Unmarked ME = 7" Reel Marked RE = 13" Reel Marked WE = Waffle Pack Marked BE = Bulk Marked Not RoHS Compliant TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). Sizes SQCA through SQCB, CDR11/12 through 13/14. 8mm carrier 7" reel:.4" thickness = 2 pcs.75" thickness = 2 pcs 13" reel:.75" thickness = 1, pcs 92616 LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. 25 8

Microwave MLC s AQ Series ELECTRICAL SPECIFICATIONS AQ11, AQ12, AQ13, AQ14 M & A C Temperature Coefficient (TCC) (M) +9 ± 2 PPM/ºC ( -55ºC to +125ºC) ±15% (-55ºC to 125ºC) (M) +9 ± 3 PPM/ºC ( +125ºC to +175ºC) (A) ± 3 PPM/ºC Capacitance Range (M).1 pf to 1 pf.1μf to.1μf (A).1 pf to 51 pf Operating Temperature.1 pf to 33 pf: from -55ºC to +175ºC -55 C to +125 C 36 pf to 51 pf: from -55ºC to +125ºC Quality Factor (Q) M Dielectric A & B Case Greater than 1, at 1 MHz 2.5% @ 1kHz A Dielectric B Case Greater than 1, at 1 MHz.1-2 pf Greater than 2, at 1 MHz 22-1 pf Greater than 2, at 1 KHz 11-51 pf A Dielectric A Case Greater than 1, at 1 MHz.1-1 pf Greater than 2, at 1 MHz 11-1 pf Insulation Resistance (IR).1 pf to 47 pf 1 4 Megohms min. @ 25ºC at rated WVDC 1 6 Megohms min. @ 25ºC at rated WVDC 1 3 Megohms min. @ 125ºC at rated WVDC 1 5 Megohms min. @ 125ºC at rated WVDC 51 pf to 51 pf 1 5 Megohms min. @ 25ºC at rated WVDC 1 4 Megohms min. @ 125ºC at rated WVDC Working Voltage (WVDC) See Capacitance Values table See Capacitance Values table Dielectric Withstanding Voltage (DWV) 25% of rated WVDC for 5 secs 25% of rated WVDC for 5 secs (for 5V rated 15% of rated voltage) Aging Effects None <3% per decade hour Piezoelectric Effects None None Capacitance Drift ± (.2% or.2 pf), whichever is greater Not Applicable ENVIRONMENTAL CHARACTERISTICS AVX SQLB will meet and exceed the requirements of EIA-198, MIL-PRF-55681 and MIL-PRF-123 Themal Shock Mil-STD-22, Method 17, Condition A Moisture Resistance Mil-STD-22, Method 16 Low Voltage Humidity Mil-STD-22, Method 13, condition A, with 1.5 VDC applied while subjected to an environment of 85ºC with 85% relative humidity for 24 hours Life Test Mil-STD-22, Method 18, for 2 hours at 125ºC Shock Mil-STD-22, Method 213, Condition J Vibration Mil-STD-22, Method 24, Condition B Immersion Mil-STD-22, Method 14, Condition B Salt Spray Mil-STD-22, Method 11, Condition B Solderability Mil-STD-22, Method 28 Terminal Strength Mil-STD-22, Method 211 Temperature Cycling Mil-STD-22, Method 12, Condition C Barometric Pressure Mil-STD-22, Method 15, Condition B Resistance to Solder Heat Mil-STD-22, Method 21, Condition C 8 26 92616

Microwave MLC s AQ Series Available Capacitance/Size/WVDC/T.C. TABLE I: TC: M (+9±2PPM/ C) CASE SIZE 11, 12, 13 & 14 DIMENSIONS: inches (millimeters) Case Length Width Thickness Band Width Avail. Term. 11.55±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45).1 +.1 -.5 (.254 +.254 -.127) 1 & 7 12.55±.25 (1.4±.635).55±.15 (1.4±.381).2/.57 (.58/1.45).1 +.1 -.5 (.254 +.254 -.127) J 13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) 1 & 7 14.11 +.35 -.2 (2.79 +.889 -.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) J Case: AQ11, AQ12 Cap. pf Cap. Tol. WVDC.1 B 15.2 B 15.3 B,C 15.4 B,C 15.5 B, C, D 15.6 B, C, D 15.7 B, C, D 15.8 B, C, D 15.9 B, C, D 15 1. B, C, D 15 1.1 B, C, D 15 1.2 B, C, D 15 1.3 B, C, D 15 1.4 B, C, D 15 1.5 B, C, D 15 1.6 B, C, D 15 1.7 B, C, D 15 1.8 B, C, D 15 1.9 B, C, D 15 2. B, C, D 15 2.2 B, C, D 15 2.4 B, C, D 15 2.7 B, C, D 15 3. B, C, D 15 3.3 B, C, D 15 3.6 B, C, D 15 3.9 B, C, D 15 4.3 B, C, D 15 4.7 B, C, D 15 5.1 B, C, D 15 5.6 B, C, D 15 6.2 B, C, D 15 6.8 B, C, J, K, M 15 7.5 B, C, J, K, M 15 8.2 B, C, J, K, M 15 9.1 B, C, J, K, M 15 1 F, G, J, K, M 15 11 F, G, J, K, M 15 12 F, G, J, K, M 15 13 F, G, J, K, M 15 15 F, G, J, K, M 15 16 F, G, J, K, M 15 18 F, G, J, K, M 15 2 F, G, J, K, M 15 22 F, G, J, K, M 15 24 F, G, J, K, M 15 27 F, G, J, K, M 15 3 F, G, J, K, M 15 33 F, G, J, K, M 15 36 F, G, J, K, M 15 39 F, G, J, K, M 15 43 F, G, J, K, M 15 47 F, G, J, K, M 15 51 F, G, J, K, M 15 56 F, G, J, K, M 15 62 F, G, J, K, M 15 68 F, G, J, K, M 15 75 F, G, J, K, M 15 82 F, G, J, K, M 15 91 F, G, J, K, M 15 1 F, G, J, K, M 15 Cap. pf Cap. Tol. WVDC.1 B 5.2 B 5.3 B,C 5.4 B,C 5.5 B, C, D 5.6 B, C, D 5.7 B, C, D 5.8 B, C, D 5.9 B, C, D 5 1. B, C, D 5 1.1 B, C, D 5 1.2 B, C, D 5 1.3 B, C, D 5 1.4 B, C, D 5 1.5 B, C, D 5 1.6 B, C, D 5 1.7 B, C, D 5 1.8 B, C, D 5 1.9 B, C, D 5 2. B, C, D 5 2.2 B, C, D 5 2.4 B, C, D 5 2.7 B, C, D 5 3. B, C, D 5 3.3 B, C, D 5 3.6 B, C, D 5 3.9 B, C, D 5 4.3 B, C, D 5 4.7 B, C, D 5 5.1 B, C, D 5 5.6 B, C, D 5 6.2 B, C, D 5 6.8 B, C, J, K, M 5 7.5 B, C, J, K, M 5 8.2 B, C, J, K, M 5 9.1 B, C, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 Case: AQ13, AQ14 Cap. pf Cap. Tol. WVDC 1 F, G, J, K, M 5 11 F, G, J, K, M 3 12 F, G, J, K, M 3 13 F, G, J, K, M 3 15 F, G, J, K, M 3 16 F, G, J, K, M 3 18 F, G, J, K, M 3 2 F, G, J, K, M 3 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 3 F, G, J, K, M 2 33 F, G, J, K, M 2 36 F, G, J, K, M 2 39 F, G, J, K, M 2 43 F, G, J, K, M 2 47 F, G, J, K, M 2 51 F, G, J, K, M 15 56 F, G, J, K, M 15 62 F, G, J, K, M 15 68 F, G, J, K, M 15 75 F, G, J, K, M 15 82 F, G, J, K, M 15 91 F, G, J, K, M 15 1 F, G, J, K, M 15 8 92616 27

Microwave MLC s AQ Series Available Capacitance/Size/WVDC/T.C. TABLE II: TC: A (±3PPM/ C) CASE SIZE 11, 12, 13 & 14 DIMENSIONS: inches (millimeters) Case Length Width Thickness Band Width Avail. Term. 11.55±.15 (1.4±.381).55±.15 (1.4±.381).2/.57 (.58/1.45).1 +.1 -.5 (.254 +.254 -.127) 1 & 7 12.55±.25 (1.4±.635).55±.15 (1.4±.381).2/.57 (.58/1.45).1 +.1 -.5 (.254 +.254 -.127) J 13.11±.2 (2.79±.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) 1 & 7 14.11 +.35 -.2 (2.79 +.889 -.58).11±.2 (2.79±.58).3/.12 (.762/2.59).15±.1 (.381±.254) J Cap. pf Cap. Tol. WVDC.1 B 15.2 B 15.3 B,C 15.4 B,C 15.5 B, C, D 15.6 B, C, D 15.7 B, C, D 15.8 B, C, D 15.9 B, C, D 15 1. B, C, D 15 1.1 B, C, D 15 1.2 B, C, D 15 1.3 B, C, D 15 1.4 B, C, D 15 1.5 B, C, D 15 1.6 B, C, D 15 1.7 B, C, D 15 1.8 B, C, D 15 1.9 B, C, D 15 2. B, C, D 15 2.2 B, C, D 15 2.4 B, C, D 15 2.7 B, C, D 15 3. B, C, D 15 3.3 B, C, D 15 3.6 B, C, D 15 3.9 B, C, D 15 4.3 B, C, D 15 4.7 B, C, D 15 5.1 B, C, D 15 5.6 B, C, D 15 6.2 B, C, D 15 6.8 B, C, J, K, M 15 7.5 B, C, J, K, M 15 8.2 B, C, J, K, M 15 9.1 B, C, J, K, M 15 1 F, G, J, K, M 15 11 F, G, J, K, M 15 12 F, G, J, K, M 15 13 F, G, J, K, M 15 15 F, G, J, K, M 15 16 F, G, J, K, M 15 18 F, G, J, K, M 15 2 F, G, J, K, M 15 22 F, G, J, K, M 15 Case: AQ11, AQ12 Cap. pf Cap. Tol. WVDC 24 F, G, J, K, M 15 27 F, G, J, K, M 15 3 F, G, J, K, M 15 33 F, G, J, K, M 15 36 F, G, J, K, M 15 39 F, G, J, K, M 15 43 F, G, J, K, M 15 47 F, G, J, K, M 15 51 F, G, J, K, M 15 56 F, G, J, K, M 15 62 F, G, J, K, M 15 68 F, G, J, K, M 15 75 F, G, J, K, M 15 82 F, G, J, K, M 15 91 F, G, J, K, M 15 1 F, G, J, K, M 15 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 Cap. pf Cap. Tol. WVDC.1 B 5.2 B 5.3 B,C 5.4 B,C 5.5 B, C, D 5.6 B, C, D 5.7 B, C, D 5.8 B, C, D 5.9 B, C, D 5 1. B, C, D 5 1.1 B, C, D 5 1.2 B, C, D 5 1.3 B, C, D 5 1.4 B, C, D 5 1.5 B, C, D 5 1.6 B, C, D 5 1.7 B, C, D 5 1.8 B, C, D 5 1.9 B, C, D 5 2. B, C, D 5 2.2 B, C, D 5 2.4 B, C, D 5 2.7 B, C, D 5 3. B, C, D 5 3.3 B, C, D 5 3.6 B, C, D 5 3.9 B, C, D 5 4.3 B, C, D 5 4.7 B, C, D 5 5.1 B, C, D 5 5.6 B, C, D 5 6.2 B, C, D 5 6.8 B, C, J, K, M 5 7.5 B, C, J, K, M 5 8.2 B, C, J, K, M 5 9.1 B, C, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 Case: AQ13, AQ14 Cap. pf Cap. Tol. WVDC 51 F, G, J, K, M 5 56 F, G, J, K, M 5 62 F, G, J, K, M 5 68 F, G, J, K, M 5 75 F, G, J, K, M 5 82 F, G, J, K, M 5 91 F, G, J, K, M 5 1 F, G, J, K, M 5 11 F, G, J, K, M 3 12 F, G, J, K, M 3 13 F, G, J, K, M 3 15 F, G, J, K, M 3 16 F, G, J, K, M 3 18 F, G, J, K, M 3 2 F, G, J, K, M 3 22 F, G, J, K, M 2 24 F, G, J, K, M 2 27 F, G, J, K, M 2 3 F, G, J, K, M 2 33 F, G, J, K, M 2 36 F, G, J, K, M 2 39 F, G, J, K, M 2 43 F, G, J, K, M 2 47 F, G, J, K, M 2 51 F, G, J, K, M 15 56 F, G, J, K, M 15 62 F, G, J, K, M 15 68 F, G, J, K, M 15 75 F, G, J, K, M 15 82 F, G, J, K, M 15 91 F, G, J, K, M 15 1 F, G, J, K, M 15 11 F, G, J, K, M 5 12 F, G, J, K, M 5 13 F, G, J, K, M 5 15 F, G, J, K, M 5 16 F, G, J, K, M 5 18 F, G, J, K, M 5 2 F, G, J, K, M 5 22 F, G, J, K, M 5 24 F, G, J, K, M 5 27 F, G, J, K, M 5 3 F, G, J, K, M 5 33 F, G, J, K, M 5 36 F, G, J, K, M 5 39 F, G, J, K, M 5 43 F, G, J, K, M 5 47 F, G, J, K, M 5 5 F, G, J, K, M 5 51 F, G, J, K, M 5 8 TABLE III: TC: C (±15%) CASE SIZE 12 & 14 Case: AQ12 Cap. pf Cap. Tol. WVDC 1 K, M, N 5 12 K, M, N 5 15 K, M, N 5 18 K, M, N 5 2 K, M, N 5 Cap. pf Cap. Tol. WVDC 22 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 47 K, M, N 5 Cap. pf Cap. Tol. WVDC 51 K, M, N 5 56 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 Cap. pf Cap. Tol. WVDC 5 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 12 K, M, N 5 Case: AQ14 Cap. pf Cap. Tol. WVDC 15 K, M, N 5 18 K, M, N 5 27 K, M, N 5 33 K, M, N 5 39 K, M, N 5 Cap. pf Cap. Tol. WVDC 47 K, M, N 5 68 K, M, N 5 82 K, M, N 5 1 K, M, N 5 28 92616

Microwave MLC s CDR Series MIL-PRF-55681 (RF/Microwave Chips) MILITARY DESIGNATION PER MIL-PRF-55681 W L T W 1J L T A 47J bw bw CDR11/12 CDR13/14 CROSS REFERENCE: AVX/MIL-PRF-55681 Per MIL-C-55681 AVX Length (L) Width (W) Thickness (T) Termination Band (bw) Style Max Min Max Min CDR11 CDR12 CDR13 CDR14 AQ11 AQ12 AQ13 AQ14.55±.15.55±.15.57.2.2.5 (1.4±.381) (1.4±.381) (1.45) (.58) (.58) (.127).55±.25.55±.15.57.2.2.5 (1.4±.635) (1.4±.381) (1.45) (.58) (.58) (.127).11±.2.11±.2.12.3.25.5 (2.79±.58) (2.79±.58) (2.59) (.762) (.635) (.127).11 +.35 -.2.11±.2.12.3.25.5 (2.79 +.889 -.58) (2.79±.58) (2.59) (.762) (.635) (.127) HOW TO ORDER CDR12 BG 11 A K U S MIL Style CDR11, CDR12, CDR13, CDR14 Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Voltage Temperature Limits BG = +9±2 ppm/ C with and without rated voltage from -55 C to + 125 C BP = ±3ppm/ C with and without rated voltage from -55 C to +125 C PACKAGING Standard Packaging Quanity CDR11-12 = 1 pcs per waffle pack CDR13-14 = 8 pcs per waffle pack Rated Voltage Code A = 5V B = 1V C = 2V D = 3V E = 5V Capacitance Tolerance Code B = ±.1 pf C = ±.25 pf D = ±.5 pf F = ±1% G = ±2% J = ±5% K = ±1% M = ±2% Termination Finish (Military Designations) Code Failure Rate Level M = 1.% P =.1% R =.1% S =.1% M = Palladium silver N = Silver-nickel-gold S = Solder coated final with a minimum of 4 percent lead T = Silver U = Base metallization-barrier metal-solder coated (tin/lead alloy, with a minimum of 4 percent lead) W = Base metallization-barrier metal-tinned (tin or tin/lead alloy) Y = Base metallization-barrier metal-tin (1 percent) Z = Base metallization-barrier metal-tinned (tin/lead alloy, with a minimum of 4 percent lead) *See MIL-PRF-55681 Specification for more details TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). Sizes SQCA through SQCB, CDR11/12 through 13/14. 8mm carrier 7" reel:.4" thickness = 2 pcs.75" thickness = 2 pcs 13" reel:.75" thickness = 1, pcs Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. 29 8

Microwave MLC s CDR Series MIL-PRF-55681 (RF/Microwave Chips) TABLE I: STYLES CDR11 AND CDR12 CAPACITOR CHARACTERISTICS Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-R1AB--.1 B BG, BP 5 CDR1 -B-R2AB--.2 B BG, BP 5 CDR1 -B-R3A---.3 B, C BG, BP 5 CDR1 -B-R4A---.4 B, C BG, BP 5 CDR1 -B-R5A---.5 B, C, D BG, BP 5 CDR1 -B-R6A---.6 B, C, D BG, BP 5 CDR1 -B-R7A---.7 B, C, D BG, BP 5 CDR1 -B-R8A---.8 B, C, D BG, BP 5 CDR1 -B-R9A---.9 B, C, D BG, BP 5 CDR1 -B-1RA--- 1. B, C, D BG, BP 5 CDR1 -B-1R1A--- 1.1 B, C, D BG, BP 5 CDR1 -B-1R2A--- 1.2 B, C, D BG, BP 5 CDR1 -B-1R3A--- 1.3 B, C, D BG, BP 5 CDR1 -B-1R4A--- 1.4 B, C, D BG, BP 5 CDR1 -B-1R5A--- 1.5 B, C, D BG, BP 5 CDR1 -B-1R6A--- 1.6 B, C, D BG, BP 5 CDR1 -B-1R7A--- 1.7 B, C, D BG, BP 5 CDR1 -B-1R8A--- 1.8 B, C, D BG, BP 5 CDR1 -B-1R9A--- 1.9 B, C, D BG, BP 5 CDR1 -B-2RA--- 2. B, C, D BG, BP 5 CDR1 -B-2R1A--- 2.1 B, C, D BG, BP 5 CDR1 -B-2R2A--- 2.2 B, C, D BG, BP 5 CDR1 -B-2R4A--- 2.4 B, C, D BG, BP 5 CDR1 -B-2R7A--- 2.7 B, C, D BG, BP 5 CDR1 -B-3RA--- 3. B, C, D BG, BP 5 CDR1 -B-3R3A--- 3.3 B, C, D BG, BP 5 CDR1 -B-3R6A--- 3.6 B, C, D BG, BP 5 CDR1 -B-3R9A--- 3.9 B, C, D BG, BP 5 CDR1 -B-4R3A--- 4.3 B, C, D BG, BP 5 CDR1 -B-4R7A--- 4.7 B, C, D BG, BP 5 CDR1 -B-5R1A--- 5.1 B, C, D BG, BP 5 CDR1 -B-5R6A--- 5.6 B, C, D BG, BP 5 CDR1 -B-6R2A--- 6.2 B, C, D BG, BP 5 CDR1 -B-6R8A--- 6.8 B, C, J, K, M BG, BP 5 CDR1 -B-7R5A--- 7.5 B, C, J, K, M BG, BP 5 CDR1 -B-8R2A--- 8.2 B, C, J, K, M BG, BP 5 CDR1 -B-9R1A--- 9.1 B, C, J, K, M BG, BP 5 CDR1 -B-1A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-11A--- 11 F, G, J, K, M BG, BP 5 CDR1 -B-12A--- 12 F, G, J, K, M BG, BP 5 CDR1 -B-13A--- 13 F, G, J, K, M BG, BP 5 CDR1 -B-15A--- 15 F, G, J, K, M BG, BP 5 CDR1 -B-16A--- 16 F, G, J, K, M BG, BP 5 CDR1 -B-18A--- 18 F, G, J, K, M BG, BP 5 CDR1 -B-2A--- 2 F, G, J, K, M BG, BP 5 CDR1 -B-22A--- 22 F, G, J, K, M BG, BP 5 CDR1 -B-24A--- 24 F, G, J, K, M BG, BP 5 CDR1 -B-27A--- 27 F, G, J, K, M BG, BP 5 Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-3A--- 3 F, G, J, K, M BG, BP 5 CDR1 -B-33A--- 33 F, G, J, K, M BG, BP 5 CDR1 -B-36A--- 36 F, G, J, K, M BG, BP 5 CDR1 -B-39A--- 39 F, G, J, K, M BG, BP 5 CDR1 -B-43A--- 43 F, G, J, K, M BG, BP 5 CDR1 -B-47A--- 47 F, G, J, K, M BG, BP 5 CDR1 -B-51A--- 51 F, G, J, K, M BG, BP 5 CDR1 -B-56A--- 56 F, G, J, K, M BG, BP 5 CDR1 -B-62A--- 62 F, G, J, K, M BG, BP 5 CDR1 -B-68A--- 68 F, G, J, K, M BG, BP 5 CDR1 -B-75A--- 75 F, G, J, K, M BG, BP 5 CDR1 -B-82A--- 82 F, G, J, K, M BG, BP 5 CDR1 -B-91A--- 91 F, G, J, K, M BG, BP 5 CDR1 -B-11A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-111A--- 11 F, G, J, K, M BP 5 CDR1 -B-121A--- 12 F, G, J, K, M BP 5 CDR1 -B-131A--- 13 F, G, J, K, M BP 5 CDR1 -B-151A--- 15 F, G, J, K, M BP 5 CDR1 -B-161A--- 16 F, G, J, K, M BP 5 CDR1 -B-181A--- 18 F, G, J, K, M BP 5 CDR1 -B-21A--- 2 F, G, J, K, M BP 5 CDR1 -B-221A--- 22 F, G, J, K, M BP 5 CDR1 -B-241A--- 24 F, G, J, K, M BP 5 CDR1 -B-271A--- 27 F, G, J, K, M BP 5 CDR1 -B-31A--- 3 F, G, J, K, M BP 5 CDR1 -B-331A--- 33 F, G, J, K, M BP 5 CDR1 -B-361A--- 36 F, G, J, K, M BP 5 CDR1 -B-391A--- 39 F, G, J, K, M BP 5 CDR1 -B-431A--- 43 F, G, J, K, M BP 5 CDR1 -B-471A--- 47 F, G, J, K, M BP 5 CDR1 -B-511A--- 51 F, G, J, K, M BP 5 CDR1 -B-561A--- 56 F, G, J, K, M BP 5 CDR1 -B-621A--- 62 F, G, J, K, M BP 5 CDR1 -B-681A--- 68 F, G, J, K, M BP 5 CDR1 -B-751A--- 75 F, G, J, K, M BP 5 CDR1 -B-821A--- 82 F, G, J, K, M BP 5 CDR1 -B-911A--- 91 F, G, J, K, M BP 5 CDR1 -B-12A--- 1 F, G, J, K, M BP 5 1/Complete type designation will include additional symbols to indicate style, voltage-temperature limits, capacitance tolerance (where applicable), termination finish ( M or N for style CDR11, and S, U, W, Y or Z for style CDR12) and failure rate level. 8 21

Microwave MLC s CDR Series MIL-PRF-55681 (RF/Microwave Chips) TABLE II: STYLES CDR13 AND CDR14 CAPACITOR CHARACTERISTICS Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-R1*B--.1 B BG, BP 2/5 CDR1 -B-R2*B--.2 B BG, BP 2/5 CDR1 -B-R3*---.3 B, C BG, BP 2/5 CDR1 -B-R4*---.4 B, C BG, BP 2/5 CDR1 -B-R5*---.5 B, C, D BG, BP 2/5 CDR1 -B-R6*---.6 B, C, D BG, BP 2/5 CDR1 -B-R7*--.7 B, C, D BG, BP 2/5 CDR1 -B-R8*---.8 B, C, D BG, BP 2/5 CDR1 -B-R9*---.9 B, C, D BG, BP 2/5 CDR1 -B-1R*--- 1. B, C, D BG, BP 2/5 CDR1 -B-1R1*--- 1.1 B, C, D BG, BP 2/5 CDR1 -B-1R2*--- 1.2 B, C, D BG, BP 2/5 CDR1 -B-1R3*--- 1.3 B, C, D BG, BP 2/5 CDR1 -B-1R4*--- 1.4 B, C, D BG, BP 2/5 CDR1 -B-1R5*--- 1.5 B, C, D BG, BP 2/5 CDR1 -B-1R6*--- 1.6 B, C, D BG, BP 2/5 CDR1 -B-1R7*--- 1.7 B, C, D BG, BP 2/5 CDR1 -B-1R8*--- 1.8 B, C, D BG, BP 2/5 CDR1 -B-1R9*--- 1.9 B, C, D BG, BP 2/5 CDR1 -B-2R*--- 2. B, C, D BG, BP 2/5 CDR1 -B-2R1*--- 2.1 B, C, D BG, BP 2/5 CDR1 -B-2R2*-- 2.2 B, C, D BG, BP 2/5 CDR1 -B-2R4*--- 2.4 B, C, D BG, BP 2/5 CDR1 -B-2R7*--- 2.7 B, C, D BG, BP 2/5 CDR1 -B-3R*--- 3. B, C, D BG, BP 2/5 CDR1 -B-3R3*--- 3.3 B, C, D BG, BP 2/5 CDR1 -B-3R6*--- 3.6 B, C, D BG, BP 2/5 CDR1 -B-3R9*--- 3.9 B, C, D BG, BP 2/5 CDR1 -B-4R3*--- 4.3 B, C, D BG, BP 2/5 CDR1 -B-4R7*--- 4.7 B, C, D BG, BP 2/5 CDR1 -B-5R1*--- 5.1 B, C, D BG, BP 2/5 CDR1 -B-5R6*--- 5.6 B, C, D BG, BP 2/5 CDR1 -B-6R2*--- 6.2 B, C, D BG, BP 2/5 CDR1 -B-6R8*--- 6.8 B, C, J, K, M BG, BP 2/5 CDR1 -B-7R5*--- 7.5 B, C, J, K, M BG, BP 2/5 CDR1 -B-8R2*--- 8.2 B, C, J, K, M BG, BP 2/5 CDR1 -B-9R1*--- 9.1 B, C, J, K, M BG, BP 2/5 CDR1 -B-1*--- 1 F, G, J, K, M BG, BP 2/5 CDR1 -B-11*--- 11 F, G, J, K, M BG, BP 2/5 CDR1 -B-12*--- 12 F, G, J, K, M BG, BP 2/5 CDR1 -B-13*--- 13 F, G, J, K, M BG, BP 2/5 CDR1 -B-15*--- 15 F, G, J, K, M BG, BP 2/5 CDR1 -B-16*--- 16 F, G, J, K, M BG, BP 2/5 CDR1 -B-18*--- 18 F, G, J, K, M BG, BP 2/5 CDR1 -B-2*--- 2 F, G, J, K, M BG, BP 2/5 CDR1 -B-22*--- 22 F, G, J, K, M BG, BP 2/5 CDR1 -B-24*--- 24 F, G, J, K, M BG, BP 2/5 CDR1 -B-27*--- 27 F, G, J, K, M BG, BP 2/5 CDR1 -B-3*--- 3 F, G, J, K, M BG, BP 2/5 CDR1 -B-33*--- 33 F, G, J, K, M BG, BP 2/5 CDR1 -B-36*--- 36 F, G, J, K, M BG, BP 2/5 CDR1 -B-39*--- 39 F, G, J, K, M BG, BP 2/5 CDR1 -B-43*--- 43 F, G, J, K, M BG, BP 2/5 CDR1 -B-47*--- 47 F, G, J, K, M BG, BP 2/5 CDR1 -B-51*--- 51 F, G, J, K, M BG, BP 2/5 Type Rated temperature Designation Capacitance Capacitance and WVDC 1/ in pf tolerance V/Temperature CDR1 -B-56*--- 56 F, G, J, K, M BG, BP 2/5 CDR1 -B-62*--- 62 F, G, J, K, M BG, BP 2/5 CDR1 -B-68*--- 68 F, G, J, K, M BG, BP 2/5 CDR1 -B-75*--- 75 F, G, J, K, M BG, BP 2/5 CDR1 -B-82*--- 82 F, G, J, K, M BG, BP 2/5 CDR1 -B-91*--- 91 F, G, J, K, M BG, BP 2/5 CDR1 -B-11*--- 1 F, G, J, K, M BG, BP 2/5 CDR1 -B-111 --- 11 F, G, J, K, M BG, BP 2/3 CDR1 -B-121 --- 12 F, G, J, K, M BG, BP 2/3 CDR1 -B-131 --- 13 F, G, J, K, M BG, BP 2/3 CDR1 -B-151 --- 15 F, G, J, K, M BG, BP 2/3 CDR1 -B-161 --- 16 F, G, J, K, M BG, BP 2/3 CDR1 -B-181 --- 18 F, G, J, K, M BG, BP 2/3 CDR1 -B-21 --- 2 F, G, J, K, M BG, BP 2/3 CDR1 -B-221C--- 22 F, G, J, K, M BG, BP 2 CDR1 -B-241C--- 24 F, G, J, K, M BG, BP 2 CDR1 -B-271C--- 27 F, G, J, K, M BG, BP 2 CDR1 -B-31C--- 3 F, G, J, K, M BG, BP 2 CDR1 -B-331C--- 33 F, G, J, K, M BG, BP 2 CDR1 -B-361C--- 36 F, G, J, K, M BG, BP 2 CDR1 -B-391C--- 39 F, G, J, K, M BG, BP 2 CDR1 -B-431C--- 43 F, G, J, K, M BG, BP 2 CDR1 -B-471C--- 47 F, G, J, K, M BG, BP 2 CDR1 -B-511B--- 51 F, G, J, K, M BG, BP 1 CDR1 -B-561B--- 56 F, G, J, K, M BG, BP 1 CDR1 -B-621B--- 62 F, G, J, K, M BG, BP 1 CDR1 -B-681A--- 68 F, G, J, K, M BG, BP 5 CDR1 -B-751A--- 75 F, G, J, K, M BG, BP 5 CDR1 -B-821A--- 82 F, G, J, K, M BG, BP 5 CDR1 -B-911A--- 91 F, G, J, K, M BG, BP 5 CDR1 -B-12A--- 1 F, G, J, K, M BG, BP 5 CDR1 -B-112A--- 11 F, G, J, K, M BP 5 CDR1 -B-122A--- 12 F, G, J, K, M BP 5 CDR1 -B-132A--- 13 F, G, J, K, M BP 5 CDR1 -B-152A--- 15 F, G, J, K, M BP 5 CDR1 -B-162A--- 16 F, G, J, K, M BP 5 CDR1 -B-182A--- 18 F, G, J, K, M BP 5 CDR1 -B-22A--- 2 F, G, J, K, M BP 5 CDR1 -B-222A--- 22 F, G, J, K, M BP 5 CDR1 -B-242A--- 24 F, G, J, K, M BP 5 CDR1 -B-272A--- 27 F, G, J, K, M BP 5 CDR1 -B-32A--- 3 F, G, J, K, M BP 5 CDR1 -B-332A--- 33 F, G, J, K, M BP 5 CDR1 -B-362A--- 36 F, G, J, K, M BP 5 CDR1 -B-392A--- 39 F, G, J, K, M BP 5 CDR1 -B-432A--- 43 F, G, J, K, M BP 5 CDR1 -B-472A--- 47 F, G, J, K, M BP 5 CDR1 -B-52A--- 5 F, G, J, K, M BP 5 CDR1 -B-512A--- 51 F, G, J, K, M BP 5 1/Complete type designation will include additional symbols to indicate style, voltage-temperature limits, capacitance tolerance (where applicable), termination finish ( M or N for style CDR13, and S, U, W, Y or Z for style CDR14) and failure rate level. *C=2V; E=5V. C=2V; D=3V. 8 211

Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 Q ESR (ohms).1 1 1 1 1 Frequency (MHz) AVX CORPORATION 1 Picofarad 1 Picofarad 1 Picofarad.1 1 1 Frequency (MHz) AVX CORPORATION 3.3 Picofarad 1 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BG STANDARD - M 1 Q ESR (ohms).1 1 8 1 1 1 1 Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz.1 1 1 1 Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 212

Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BG STANDARD - M 1 TYPICAL ESR vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BG STANDARD - M 1 Q ESR (ohms).1 1 1 1 1 Frequency (MHz) AVX CORPORATION 1 Picofarad 1 Picofarad 47 Picofarad 33 Picofarad.1 1 1 Frequency (MHz) AVX CORPORATION 1 Picofarad 15 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BG STANDARD - M TYPICAL ESR vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BG STANDARD - M 1 1 Q ESR (ohms).1 1 1 1 1 1 Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz.1 1 1 1 Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 8 213

Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ11/12 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 Q ESR (ohms).1 1 1 1 1 Frequency (MHz).1 1 1 Frequency (MHz) AVX CORPORATION 1 Picofarad 15 Picofarad 1 Picofarad 15 Picofarad AVX CORPORATION 47 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BP STANDARD - A TYPICAL ESR vs. CAPACITANCE AQ11/12 MIL-PRF-55681E - BP STANDARD - A 1 1 Q ESR (ohms).1 1 8 1 1 1 1 Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz.1 1 1 1 Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 214

Microwave MLC s Performance Curves 1 TYPICAL Q vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. FREQUENCY AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 Q ESR (ohms).1 1 1 1 1 Frequency (MHz).1 1 1 Frequency (MHz) AVX CORPORATION 2 Picofarad 15 Picofarad 1 Picofarad 15 Picofarad AVX CORPORATION 47 Picofarad 1 Picofarad 1 TYPICAL Q vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 TYPICAL ESR vs. CAPACITANCE AQ13/14 MIL-PRF-55681E - BP STANDARD - A 1 Q ESR (ohms).1 1 1 1 1 1 Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz.1 1 1 1 Capacitance (pf) AVX CORPORATION 25 MHz 5 MHz 1 MHz 8 215

Microwave MLC s Performance Curves 1 TYPICAL RESONANT FREQUENCY vs. CAPACITANCE AVX AQ11-14 (CDR11-14) AQ13/14 AQ11/12 AQ11/12 Parallel Resonant Frequency Frequency (GHz) 1. AQ13/14 Series Resonant Frequency.1 1. 1 1 1 Capacitance (pf) 1 TYPICAL RESONANT FREQUENCY vs. CAPACITANCE AVX 63 Frequency (GHz) 1. Parallel Resonant Frequency Series Resonant Frequency.1 1 1 1 1 Capacitance (pf) 8 216

Microwave MLC s Automatic Insertion Packaging TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481 (equivalent to IEC 286 part 3). Sizes SQCA through SQCB, CDR11/12 through 13/14. 8mm carrier 7" reel:.4" thickness = 2 pcs.75" thickness = 2 pcs 13" reel:.75" thickness = 1, pcs REEL DIMENSIONS: millimeters (inches) U Series - 42/63/85/121 Size Chips 8mm carrier 7" reel: 42 = 1, pcs 63 & 85.4" thickness = 4 pcs 85..4" thickness & 121 = 2 pcs 13" reel:.75" thickness = 1, pcs Tape A B* C D* N W W 2 Size (1) Max. Min. Min. Min. 1 Max. W 3 7.9 Min. 8mm + 8.4 -. 1. 14.4 (.311) +.6 (.331 -. ) (.567) 1.9 Max. 33 1.5 13.±.2 2.2 5 (.429) (12.992) (.59) (.512±.8) (.795) (1.969) 11.9 Min. 12mm +2. 12.4 -. 18.4 (.469) (.488 +.76 -. ) (.724) 15.4 Max. (.67) EMBOSSED CARRIER CONFIGURATION 8 & 12 MM TAPE ONLY CONSTANT DIMENSIONS Tape D E P P2 T T1 G1 G2 Size Max. 8mm +.1 8.4 -. 1.75 ±.1 4. ±.1 2. ±.5.6.1.75.75 and +.4 (.59 -. ) (.69 ±.4) (.157 ±.4) (.79 ±.2) (.24) (.4) (.3) (.3) 12mm Max. Min. Min. VARIABLE DIMENSIONS Metric dimensions will govern. English measurements rounded and for reference only. (1) For tape sizes 16mm and 24mm (used with chip size 364) consult EIA RS-481 latest revision. See See Note 3 Note 4 Tape Size B1 D1 F P1 R T2 W ABK Max. Min. Min. See Note 6 See Note 5 See Note 2 +.3 8mm 4.55 1. 3.5 ±.5 4. ±.1 25 2.5 Max 8. -.1 +.12 (.179) (.39) (.138 ±.2) (.157 ±.4) (.984) (.98) (.315 -.4) See Note 1 12mm 8.2 1.5 5.5 ±.5 4. ±.1 3 6.5 Max 12. ±.3 (.323) (.59) (.217 ±.2) (.157 ±.4) (1.181) (.256) (.472 ±.12) See Note 1 NOTES: 1. A, B, and K are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A, B, and K) must be within.5 mm (.2) min. and.5 mm (.2) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 2 degrees (see sketches C & D). 2. Tape with components shall pass around radius R without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12mm embossed tape for reels with hub diameters approaching N min. (Table 4). 3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. 4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. 5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 6. B1 dimension is a reference dimension for tape feeder clearance only. 8 217

Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications PRODUCT OFFERING Hi-Q, high RF power, surface mount MLC capacitors from AVX Corporation are characterized with ultra-low ESR and dissipation factor at high frequencies. They are designed to handle high power and high voltage levels for applications in RF power amplifiers, inductive heating, high magnetic field environments (MRI coils), medical and industrial electronics. HOW TO ORDER HQCC A A 271 J A T 1A AVX Style HQCC HQCE HQLC HQLE Voltage 3V = 9 5V = 7 8V = U 1V = A 15V = S 25V = W 3V = H 36V = J 5V = K 72V = M Temperature Coefficient CG = A P9 = M Capacitance Code (2 significant digits + no. of zeros) Examples: 4.7 pf = 4R7 1 pf = 1 1 pf = 11 1, pf = 12 Capacitance Tolerance B =.1pf (<8.2pF) C = ±.25pF (<8.2pF) D = ±.5pF (<8.2pF) F = ±1% ( 1pF) G = ±2% J = ±5% K = ±1% M = ±2% Test Level A = Standard Termination* T = Plated Ni and Sn (RoHS Compliant) J = 5% Min Pb 7 = Plated Ni and Au A = Axial Ribbon M = Microstrip H = Cu/Sn (Non-Magnetic) 4 = Axial Ribbon (Non-Magnetic) 5 = Microstrip (Non-Magnetic) Packaging 1A = 7" Reel* 6A = Waffle Pack *HQCC & HQCE only DIMENSIONS MICROSTRIP L L T L W L W L L W T T AXIAL RIBBON L L T L t W L L W T 8 STYLE HQCC HQCE (L) Length 5.84 +.51 -.25 9.65 +.38 -.25 (.23 +.2 -.1) (.38 +.15 -.1) (W) Width 6.35 ±.38 9.65 ±.25 (.25 ±.15) (.38 ±.1) (T) Thickness 3.68 (.145) max. for Max. capacitance values 68pF 4.19 (.165) max. for 4.32 (.17) max. capacitance values > 68pF (t) Overlap 1.2 (.4) max. 1.2 (.4) max. Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style. mm (inches) mm (inches) STYLE HQLC HQLE (L) Length 6.22 ±.64 9.65 +.89 -.25 (.245 ±.25) (.38 +.35 -.1) (W) Width 6.35 ±.38 9.65 ±.25 (.25 ±.15) (.38 ±.1) (T) Thickness 3.68 (.145) max. for Max. capacitance values 68pF 4.19 (.165) max. for 4.32 (.17) max. capacitance values 68pF (L L ) Lead 12.7 min. 19.5 Length (.5) (.75) (W L ) Lead 6.1 ±.127 8.89 ±.25 Width (.24 ±.5) (.35 ±.1) (T L ) Lead.12 ±.25.25 ±.13 Thickness (.4 ±.1) (.1 ±.5) Lead High Purity Silver Leads High Purity Silver Leads Material Leads are attached with Leads are attached with High Temperature Solder High Temperature Solder 218 12616

Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications MOUNTING DIMENSIONS B B A C D HQCC mm (inches) Mounting Layout Orientation Type A min. B min. C min. D min. 7.112 1.27 5.8 7.62 Normal (.28) (.5) (.2) (.3) Horizontal High 6.64.762 5.8 6.64 Density (.26) (.3) (.2) (.26) 3.81 1.27 5.8 7.62 Vertical Normal (.15) (.5) (.2) (.3) (<68pF) High 3.32.762 5.8 6.64 Density (.13) (.3) (.2) (.26) 4.699 1.27 5.8 7.62 Vertical Normal (.185) (.5) (.2) (.3) (>68pF) High 4.191.762 5.8 6.64 Density (.165) (.3) (.2) (.26) HQCE Mounting Orientation Horizontal Vertical Layout Type mm (inches) A min. B min. C min. D min. Normal 1.287 1.27 8.255 1.795 (.45) (.5) (.325) (.425) High 9.779.762 8.255 9.779 Density (.385) (.3) (.325) (.385) Normal 4.699 1.27 8.255 1.795 (.185) (.5) (.325) (.425) High 4.191.762 8.255 9.779 Density (.165) (.3) (.325) (.385) DIELECTRIC PERFORMANCE CHARACTERISTICS Capacitance Range 1.pF to 2,7pF (25 C, 1. ±.2 Vrms at 1kHz, for 1 pf use 1MHz) Capacitance Tolerances ±.1pF, ±.25pF, ±.5pF, ±1%, ±2%, ±5%, ±1%, ±2% Dissipation Factor 25 C.1% Max (+25 C, 1. ±.2 Vrms at 1kHz, for 1 pf use 1MHz) Operating Temperature Range -55 C to +125 C Temperature Characteristic CG: ± 3 ppm/ C (-55 C to +125 C), P9: 9 ± 3 ppm/ C (-55 C to +125 C) Insulation Resistance 1K MΩ min. @ +25 C and 5VDC 1K MΩ min. @ +125 C and 5VDC Dielectric Strength 25% of WVDC for capacitors rated at 5 volts DC or less for 5 seconds. 15% of WVDC for capacitors rated at 125 volts DC or less for 5 seconds. 12% of WVDC for capacitors rated above 125 volts DC or less for 5 seconds. 8 12616 219

8 Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications HQCC CAPACITANCE VALUES (A DIELECTRIC) Cap Cap Rated Code (pf) Tol. WVDC 1R 1. 1R2 1.2 1R5 1.5 1R8 1.8 2R2 2.2 2R7 2.7 B, C, D 25 3R3 3.3 3R9 3.9 4R7 4.7 5R6 5.6 6R8 6.8 HQCE CAPACITANCE VALUES (A DIELECTRIC) Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 1R 1. 1R2 1.2 1R5 1.5 1R8 1.8 2R2 2.2 2R7 2.7 C, D 3R3 3.3 36 72 3R9 3.9 4R7 4.7 5R6 5.6 6R8 6.8 8R2 8.2 1 1 G, J, 12 12 K, M HQCE CAPACITANCE VALUES (M DIELECTRIC) Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 1R 1. 1R2 1.2 1R5 1.5 1R8 1.8 2R2 2.2 2R7 2.7 B, C, D 3R3 3.3 36 72 3R9 3.9 4R7 4.7 5R6 5.6 6R8 6.8 8R2 8.2 1 1 12 12 F, G, J, 15 15 K, M Cap Cap Rated Code (pf) Tol. WVDC 8R2 8.2 B, C, D 1 1 12 12 15 15 18 18 22 22 F, G, J 25 27 27 K, M 33 33 39 39 47 47 56 56 HQCC CAPACITANCE VALUES (M DIELECTRIC) Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 1R 1. 1R1 1.1 1R2 1.2 1R3 1.3 1R4 1.4 1R5 1.5 1R6 1.6 1R7 1.7 1R8 1.8 1R9 1.9 2R 2. 2R1 2.1 2R2 2.2 2R4 2.4 B, C, D 25 36 2R5 2.5 3R 3. 3R3 3.3 3R6 3.6 3R9 3.9 4R3 4.3 4R7 4.7 5R1 5.1 5R6 5.6 6R2 6.2 6R8 6.8 7R5 7.5 8R2 8.2 9R1 9.1 Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 1 1 11 11 12 12 13 13 15 15 16 16 18 18 2 2 22 22 24 24 27 27 3 3 33 33 36 36 F, G, J 39 39 K, M 43 43 25 36 47 47 51 51 56 56 62 62 68 68 75 75 82 82 91 91 11 1 111 11 121 12 131 13 3 151 15 Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 15 15 18 18 22 22 27 27 33 33 39 39 72 47 47 G, J, 56 56 K, M 36 68 68 82 82 11 1 121 12 151 15 5 181 18 Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 18 18 22 22 27 27 33 33 39 39 47 47 72 56 56 F, G, J, 36 68 68 K, M 82 82 11 1 121 12 151 15 5 181 18 221 22 271 27 36 Cap Cap Rated Code (pf) Tol. WVDC 68 68 82 82 11 1 121 12 151 15 F, G, J 25 181 18 K, M 221 22 271 27 331 33 391 39 15 Cap Cap Rated Code (pf) Tol. WVDC 471 47 15 561 56 681 68 821 82 1 12 1 F, G, J 122 12 K, M 152 15 182 18 5 222 22 272 27 3 Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 161 16 181 18 21 2 221 22 25 3 241 24 271 27 31 3 331 33 331 33 361 36 15 2 391 39 431 43 471 47 511 51 F, G, J 561 56 K, M 621 62 681 68 751 75 821 82 1 15 911 91 12 1 112 11 122 12 152 15 5 182 18 8 222 22 242 24 3 272 27 5 Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 221 22 271 27 331 33 36 391 39 471 47 561 56 25 G, J, 681 68 K, M 821 82 NA 12 1 122 12 152 15 1 182 18 222 22 Cap Cap Rated WVDC Code (pf) Tol. Standard Extended 331 33 391 39 36 471 47 561 56 25 681 68 821 82 F, G, J, 12 1 K, M NA 122 12 152 15 1 182 18 222 22 272 27 332 33 G, J 472 47 K, M 5 512 51 22 12616

Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications HQCC PERFORMANCE CHARACTERISTICS (A DIELECTRIC) 1 ESR VS. CAPACITANCE HQCC 1 Q VS. CAPACITANCE HQCC ESR (Ohms).1.1 5 MHz 15 MHz 3 MHz Q 1 1 3 MHz 15 MHz 1 (Typical).1 1 1 1 1 1 Capacitance (pf) 5 MHz (Typical) 1 1 1 1 1 1 Capacitance (pf) 1 SERIES RESONANCE VS. CAPACITANCE HQCC 1 CURRENT RATING VS. CAPACITANCE HQCC The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 15 C/W. A power dissipation of 4W will result in a case temperature of 125 C. Frequency (MHz) 1 1 RMS Current (Amps) 1 1 15 MHz 3 MHz 1 MHz 5 MHz (Typical) 1 1 1 1 1 1 Capacitance (pf) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms).1 1 1 1 1 1 Capacitance (pf) HQCC PERFORMANCE CHARACTERISTICS (M DIELECTRIC) 1 ESR VS. CAPACITANCE HQCC 1 Q VS. CAPACITANCE HQCC ESR (Ohms).1.1 5 MHz 15 MHz 3 MHz Q 1 1 3 MHz 15 MHz 1 (Typical).1 1 1 1 1 1 Capacitance (pf) 5 MHz (Typical) 1 1 1 1 1 1 Capacitance (pf) 8 12616 221

Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications 1 SERIES RESONANCE VS. CAPACITANCE HQCC 1 CURRENT RATING VS. CAPACITANCE HQCC The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 15 C/W. A power dissipation of 4W will result in a case temperature of 125 C. Frequency (MHz) 1 1 RMS Current (Amps) 1 1 15 MHz 3 MHz 1 MHz 5 MHz (Typical) 1 1 1 1 1 1 Capacitance (pf) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms).1 1 1 1 1 1 Capacitance (pf) HQCE PERFORMANCE CHARACTERISTICS (A DIELECTRIC) 1 ESR VS. CAPACITANCE HQCE 1 Q VS. CAPACITANCE HQCE ESR (Ohms).1 3 MHz Q 1 1 3 MHz (Typical).1 1 1 1 1 Capacitance (pf) (1. pf to 4 pf) (Typical) 1 1 1 1 1 Capacitance (pf) (1. pf to 4 pf).1 ESR VS. CAPACITANCE HQCE 1 Q VS. CAPACITANCE HQCE ESR (Ohms).1 3 MHz Q 1 3 MHz (Typical).1 1 1 1 Capacitance (pf) (43 pf to 22 pf) (Typical) 1 1 1 1 Capacitance (pf) (43 pf to 22 pf) 8 222 12616

Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications 1 SERIES RESONANCE VS. CAPACITANCE HQCE 1 CURRENT RATING VS. CAPACITANCE HQCE The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. Frequency (MHz) 1 1 RMS Current (Amps) 1 1 3 MHz 1 MHz 2 MHz (Typical) 1 1 1 1 1 1 Capacitance (pf) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms).1 1 1 1 1 Capacitance (pf) (1. pf to 4 pf) 1 CURRENT RATING VS. CAPACITANCE HQCE The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. 1 CURRENT RATING VS. CAPACITANCE HQCE The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. RMS Current (Amps) 1 1 MHz 3 MHz 2 MHz RMS Current (Amps) 1 1 3 MHz 1 MHz 2 MHz Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) 1 1 1 1 Capacitance (pf) (43 pf to 22 pf) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms).1 1 1 1 1 Capacitance (pf) (1. pf to 18 pf) HQCE PERFORMANCE CHARACTERISTICS (M DIELECTRIC) 1 ESR VS CAPACITANCE HQCE M Dielectric 1 Q VS CAPACITANCE HQCE M Dielectric ESR (Ohms).1 3 MHz Q 1 1 3 MHz.1 1 1 1 1 Capacitance (1. pf to 4 pf) (Typical) 1 1 1 1 1 Capacitance (1. pf to 4 pf) (Typical) 8 12616 223

Hi-Q High RF Power MLC Surface Mount Capacitors For 6V to 72V Applications 1 ESR VS CAPACITANCE HQCE M Dielectric 1 Q VS CAPACITANCE HQCE M Dielectric ESR (Ohms).1 3 MHz Q 1 3 MHz.1 1 1 1 Capacitance (43 pf to 51 pf) (Typical) 1 1 1 1 Capacitance (43 pf to 51 pf) (Typical) 1 SERIES RESONANCE VS CAPACITANCE HQCE M Dielectric 1 CURRENT RATING VS CAPACITANCE HQCE M Dielectric The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. Frequency (MHz) 1 1 RMS Current (Amps) 1 1 3 MHz 1 MHz 2 MHz 1 1 1 1 1 1 Capacitance (pf) (Typical) Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms).1 1 1 1 1 Capacitance (1. pf to 4 pf) RMS Current (Amps) 1 1 CURRENT RATING VS CAPACITANCE HQCE M Dielectric The current rating is based on a 65 C mounting surface and a device thermal resistance ( ) of 12 C/W. A power dissipation of 5W will result in a case temperature of 125 C. 1 MHz 3 MHz 2 MHz Dotted line = Power dissipation limited Solid line = Voltage limited (Vrms) 1 1 1 1 Capacitance (43 pf to 51 pf) 8 224 12616

RF/Microwave CG (NP) Capacitors (RoHS) Ultra Low ESR, CU Series, CG (NP) Chip Capacitors GENERAL INFORMATION CU Series capacitors are CG (NP) chip capacitors specially designed for Ultra low ESR for applications in the communications market. Sizes available are EIA chip sizes 15 and 21. LEAD-FREE COMPATIBLE COMPONENT DIMENSIONS: A 15 21 A B C B C D E D mm (inches) Size L W T g A (Length) (Width) (Max. Thickness) (min.) (Termination Min./Max.) 42.4±.2.2±.2.22.13.7/.14 (15) (.16±.8).8±.8) (.9) (.5) (.3/.6) 63.6±.3.3±.3.33.15.1/.2 (21) (.24±.1) (.12±.1) (.13) (.6) (.4/.8) HOW TO ORDER CU1 3 1 1 J A T 2 A Case Size CU1 = 15 CU1 = 21 Voltage Code 3 = 25V Y = 16V Dielectric 1 = ±3ppm CG (NP) Capacitance EIA Capacitance Code in pf. First two digits = significant figures or R for decimal place. Third digit = number of zeros or after R significant figures. Capacitance Tolerance Code A = ±.5pF B = ±.1pF C = ±.25pF D = ±.5pF G = ±2% J = ±5% Failure Rate Code A = Not Applicable Termination T = Plated Ni and Sn Packaging Code 2 = 7" Reel 4 = 13" Reel U = 7" Reel 4mm TR (15) Special A = Standard ELECTRICAL CHARACTERISTICS Capacitance Value Range: Size 15.2 to 24pF Size 21.2 to 24pF Temperature Coefficient of Capacitance (TC): ±3 ppm/ C (-55 to +125 C) Insulation Resistance (IR): 1 12 Ω min. @ 25 C and rated WVDC 1 11 Ω min. @ 125 C and rated WVDC Working Voltage (WVDC): Size Working Voltage 15-16V, 25V (.2pF-1pF), 16V (1pF-24pF) 21-25 WVDC 8 11116 225