PACKAGE DIMENSIONS 2 1 Top View.6 (1.5) G B R.17 (2.7) 3 4.127 (3.2) COMMON ANODE Side View RESIN.198 (.5).43 (1.1) Bottom View PCB.473 (1.2) ANODE SIDE.276 (.7) Pin 4 Die 1 Pin 1 (Red) Die 2 Pin 2 (Green) Die 3 Pin 3 (Blue) POLARITY NOTE: Dimensions for all drawings are in inches (mm). APPLICATIONS Keypad backlighting Push-button backlighting LCD backlighting DESCRIPTION This full-color surface mount chip LED is designed to fit industry standard footprint. Small size, low profile and wide viewing angle make this LED ideal for backlighting applications and panel illumination. FEATURES Miniature footprint - 3.2(L) X 2.7(W) X 1.1(H) mm AllnGaP and InGaN technology Wide viewing angle of 14 Diffused optics Moisture-proof packaging Available in.315" (8mm) width tape on 7" (178mm) diameter reel; 2, units per reel Page 1 of 7
ABSOLUTE MAXIMUM RATINGS (T A =25 C Unless otherwise specified) Parameter Symbol R G B Units Continuous Forward Current I F 3 2 2 ma Peak Forward Current (f = 1. KHz, Duty Factor = 1/1) I FM 1 8 8 ma Reverse Voltage (I R = 1 µa) V R 5 V Power Dissipation P D 72 78 78 mw Operating Temperature T OPR -3 to +8 C Storage Temperature T STG -4 to +85 C Lead Soldering Time T SOL 26 for 5 sec C ELECTRICAL / OPTICAL CHARACTERISTICS (T A =25 C) QTLP65D Parameter Symbol Condition R G B Luminous Intensity (mcd) min: 25 63 25 I V typ: 6 13 4 I F = 2mA Forward Voltage (V) typ: 1.9 3.3 3.3 V F max: 2.4 3.9 3.9 I F = 2mA Wavelength (nm) Peak: I P 63 52 468 Dominance: I D 624 525 47 I F = 2mA Typical Viewing Angle ( ) 2U1/2 14 I F = 2mA Page 2 of 7
TYPICAL PERFORMANCE CURVES Fig. 1A Forward Current vs. Forward Voltage Fig. 1B Forward Current vs. Forward Voltage 4 FORWARD CURRENT (ma) 1 1 1 RED.1 1. 1.4 1.8 2.2 2.6 FORWARD VOLTAGE (V) 35 3 25 2 15 1 5 BLUE & GREEN 2 3 4 5 FORWARD VOLTAGE (V) RELATIVE INTENSITY (%) 15 125 1 75 5 25 Fig. 2 Relative Intensity vs. Forward Current 5 1 15 2 25 3 35 4 FORWARD VOLTAGE (ma) FORWARD CURRENT (ma) 3 25 2 15 1 Fig. 3 Forward Current vs. Ambient Temperature BLUE & GREEN RED 5 3-2 2 4 6 8 1 AMBIENT TEMPERATURE ( C) Fig. 4 Relative Intensity vs. Peak Wavelength 1. RELATIVE INTENSITY.5 468 52 63 WAVELENGTH (nm) Page 3 of 7
TYPICAL PERFORMANCE CURVES Fig.5 Radiation Diagrams QTLP65D RGB -3 3-3 QTLP65D RGB 3-6 6 B R G -6 B 6 G R 1% 5% 5% 1% 1% 5% 5% 1% Page 4 of 7
RECOMMENDED PRINTED CIRCUIT BOARD PATTERN.181 (4.6).83 (2.1).114 (2.9).2 (.5) RECOMMENDED IR REFLOW SOLDERING PROFILE 5 sec MAX soldering time 24 C MAX +5 C/s MAX -5 C/s MAX 6-12 sec Preheating 12-15 C MAX Page 5 of 7
TAPE AND REEL DIMENSIONS 2.5±.5 +1.5 8.4 -. 11. +.5 -. Ø18±1 Ø62.±.5 2.5±.5 Ø12.75 +.25 -. Progressive direction 1.75 2.±.5 4. Ø1.55.±5.23 3.5±.5 8. 3.56 4. 2.95 1.65 Polarity Dimensional tolerance is ±.1mm unless otherwise specified Angle: ±.5 Unit: mm Page 6 of 7
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 7 of 7