TG 3 Status Report. C. Cattadori on behalf of TG3

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Transcription:

TG 3 Status Report C. Cattadori on behalf of TG3

Status of FE circuits T [ns] Range[MeV] ENC rms [e-] R with crystal [kev] Output F-CSA104 Fully integrated 20 ns 0-11 MeV 270 @ LN (20 µs) 310 @ 20 C 5.4 Diff. PZ -0 (holes readout) AMS HV 0.8 mm CZX FE FET not integrated Rf, Cf not integrated 15 ns 0-6 MeV 110 @ LN (10 µs) No test availab le Singl. Ended PZ-1 (e-,h+ readout) AMS HV 0.8 mm CZX FE FET integrated Rf not integrated Active reset 12 ns 0-6 MeV 160 @LN (12 µs) 150 @LN (DPLMS) No test availab le Diff Singl. ended IPA4 (e -,h + ) Monolithic JFET Rf,Cf and polarizing components not integrated 40 ns 0-5 MeV 100 @ LN (6 ms) 3.9 kev Crystal high LC Singl. end

How they look like PZ-0 F-CSA104 PZ-1

Program to test the FE circuit with crystal Along 2007 FE Test Program has been in conflict with study of LAriiLC. New bench test for FE electronic was prepared but we decided to use it to double the LAriiLC bench tests. build another bench test and found another crystal. Up to now INFN didn t funded a crystal for FE tests (because of our large engagement in plants and infrastructures we are not receiving money for detector/equippment). After a long loan request procedure, on 18th October E. Bellotti and A. D Andragora went to pick up in Cologne one of the Ge capsule of former EUROBALL (property of INFN Milano). Purpose of new bench test: Perform test of FE circuits in same conditions and with same signal conditioning chain, cables (HV, LV, signal) HV feedthrough LV, signal feedthrough: Fisher 102 sealed series Junction box comparison and choise

New Dewar + closed chamber ready (since 3 months) at LNGS to be the electronic test facility but crystal is missing. Urgent to start to build the first complete read-out chain, from FE to PSA.

Measured resolution@ Cologne (warm Agata CSA) = 2.2 kev -2.4 kev.

Cables: HV and signal. Work in progress Criteria to choose them: Accomplish following requirements electrical (impedence at LAr T, and keep needed HV), radioactivity (< 10 mbq/kg), mechanical minimize the mass/ unit length (typical g/m) HV test OK OK OK

Work and hardware needed to start up the encapsulated detector bench test Dewar 130 cm height (available): detector is encapsulated so we do not need any glove box above dewar Build a new cold finger (needed to regulate the cooling rate (10-20 0 C/h) (ongoing) Build flange and suspension system (ongoing) Cooling down test (TBD) First Test of PZ-1 foreseen in week of 26 November (TBD): difficult to keep the schedule. Insulation from vibrations.

HV flanges against discharges: Break through in Argon gas: 0.8kV/mm (Air: 4kV/mm) Back view Developed and patented by INFN- PD. 9 flanges 4-ch each in preparation for GERDA. 2 flanges 1-ch, available and dispersion to GND tested at pa level (OK) Front view Other option: SHV Stycast insulated. Demonstrated to work at LNGS 1 month run+ multiple HV cycles in Ar atmosphere

Cable Feed Through HV feed through: Break through in Argon gas: 0.8kV/mm (Air: 4kV/mm) Feed through needs a lot of space, 5mm for 6kV Many commercial feed-through were tested but only one was working. one big flange mounted on a vessel to check two feed through systems. Vessel was first evacuated and than filled with Argon gas. HV was applied to the feed through 2 x CF 16 flanges 1 x CF 35 flange These are solutions for bringing HV into the GERDA system filled with Ar gas

Submission of revised versions of ASIC CSAs on 10.10.2007 3x3 mm² AMS HV CMOS 0.8 µm CZX technology chip layout On chip: PZ-1v.2.1: Circuit consisting of two key elements: a very lownoise preamplifier with integrated input transistors and a fully differential operational amplifier with complete rail to rail output signal capability for light differential loads. Possibility of tuning of the fundamental bias currents by switching on/off parallel current generators controlled by digital signals (external pins). PZ-1v.2.2: A similar font-end electronics with a 1 pf feedback poly-capacitor which connect the output and the input of low-noise preamplifier stage to avoid to have an external component on PCB. PZ-0v.3.0: N 4 front-end single transistor option (input FET is not on chip) preamplifier for string of germanium detectors, with 1.4 pf compensative capacitor. 300 MOhm fully integrated resistor so to have a feedback component determiningτfall C. Cattadori, directly GERDA on meeting, chip in stead to use a discrete external component LNGS 4-6 (tonovember used2007 both with PZ-0 and PZ1)

Next steps Extensively test FE circuits mounted in final mountings and PCB (start with preliminar ones to choose circuits) Test junctions of Crystal Cables - J CSA J Signal cables (POGO PINS vs others) Test the complete signal conditioning line up to FADC. Schedule: answer in late spring 2008. In time for final production FE for LARGE and string tests 16 +4 ch of PZ-0 available need to be bonded mounted in ceramic carrier PCB 8 ch of PZ-1v.0

What is urgently needed γ-ray spectrometry of ceramic carriers for chips. components that we actually are going to use full circuit All these samples will be available in low mass samples (10-50 g)