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For Video Equipment Color Video Camera Synchronizing Signal Generator LSI Overview The generates color video camera synchronizing signals for the NTSC, PAL, and SECAM video systems. It divides the reference frequency to generate the horizontal synchronizing signal f H, the vertical synchronizing signal f V, and the composite synchronizing signal. A built-in 4f SC crystal oscillator circuit divides the frequency by four to generate the color subcarrier frequency signals SC1 and SC2. Features Supports CCDs with 420, 510, 590, and 670 H pixels Supports NTSC, PAL, and SECAM video systems PAL system 25Hz offset Includes built-in oscillator circuit using external crystal Generates 14 signals, including the horizontal and vertical synchronizing signals and the color subcarrier frequency signals. Applications Color video cameras Pin Assignment TEST1 TEST2 TEST3 V SS1 CLK V DD1 EO ED 34 35 36 37 38 39 40 41 42 43 44 CCDS2 CCDS1 CP2 TVMD2 S FMTP 33 32 31 30 29 28 27 26 25 24 23 WBKL (TOP VIEW) QFP044-P-1010 10 11 1 2 3 4 5 6 7 8 9 OSCI 22 21 20 19 18 17 16 15 14 13 12 TVMD1 LSW BFIDP WHD V SS2 SC2 SC1 V DD2 OSCO SDB00064BEM 1

For Video Equipment Block Diagram 34 35 36 TEST1 TEST2 TEST3 SC1 SC2 LSW V DD2 V DD1 CCDS2 CCDS1 15 16 21 14 39 30 29 38 4fSC 1/4 1/3 1/8 1/5 1/7 1/101 1/103 1/2 1/2 22 25 1/525 1/625 fv MIXER fh/fv (P) ød (N) 12 11 40 CLK TVMD1 202fH/206fH TVMD2 2fH 2fH fh (P) 1/2 V dec. H dec. (N) C dec. 1/2 1/910 17 37 42 18 26 23 9 27 28 24 6 20 1 OSCO OSCI EO V SS2 V SS1 HD WHD CP2 FMTP S BFIDP 2

For Video Equipment Pin Descriptions Pin No. Symbol Pin Name Function Description 39 V DD1 Power supply "H" level (5 V) power supply for horizontal and vertical synchronizing signal circuits 37 V SS1 Power supply "L" level (0 V) power supply for horizontal and vertical synchronizing signal circuits 14 V DD2 Power supply "H" level (5 V) power supply for color subcarrier circuits 17 V SS2 Power supply "L" level (0 V) power supply for color subcarrier circuits 11 OSCI Crystal oscillation input Connect these pins to a 4f SC crystal oscillator. The pins have built-in feedback resistors. 12 OSCO Crystal oscillation input If using an external clock, supply it to the OSCI pin and leave the OSCO pin open. 38 CLK Clock input Supply the reference clock for the horizontal and vertical synchronizing signals. 22 TVMD1 NTSC PAL SECAM Television system TVMD1 "H" "L" "L" 25 TVMD2 selection input TVMD2 "H" "L" The pins include built-in pull-up resistors. 29 CCDS1 420H 510H 590H 670H CCD scan lines CCDS1 "H" "H" "L" "L" 30 CCDS2 selection input CCDS2 "H" "L" "H" "L" The pins include built-in pull-up resistors. 34 TEST1 35 TEST2 Test input 36 TEST3 15 SC1 f SC (B-Y) output 16 SC2 f SC (R-Y) output 28 Composite synchronizing signal output 1 Vertical drive output 18 WHD Wide HD output 27 Composite blanking output 42 HD Horizontal drive output 26 CP2 Clamp pulse output Test inputs Keep these pins at "L" level. The pins include built-in pull-down resistors. This color subcarrier signal is formed by dividing the crystal oscillator frequency (4f SC ) by four. Color subcarrier signal If SC1 is the 180 signal, this signal has the following phase. NTSC system: 90 PAL system: 90 when LSW is at "L" level 270 when LSW is at "H" level Composite blanking signal Vertical drive signal Wide HD signal Preblanking signal Composite blanking signal Signal for erasing video signal Horizontal drive signal Clamp pulses for luminance and color difference signals Horizontal deflection start pulses 3

For Video Equipment Pin Descriptions (continued) Pin No. Symbol Pin Name Function Description 9 Composite wide blanking Composite wide blanking signal output 20 BFIDP Output for burst flag/ identification signal 6 Composite preblanking output 21 LSW Line switch signal output 23 FMTP Trigger signal output 24 S Subcarrier blanking signal output During NTSC operation, this pin remains at "L" level. 40 EO Phase comparator output Phase comparator output Operating Modes (1) Television system TVMD1 TVMD2 NTSC H PAL L H SECAM L L (2) CCD pixels and reference clock (CLK) frequencies CCD CLK frequency (MHz) Frequency divider ratio CCDS1 CCDS2 pixels NTSC PAL/SECAM for first stage 420H H H 510H H L 590H L H 670H L L This pin produces blanking pulses wider than the CELK pulses for both horizontal and vertical synchronization. For NTSC and PAL systems, this is the burst flag (BF) output, which gates the color subcarrier signal. For the SECAM system, this is the identification (IDP) signal, which switches the subcarrier waveform. Composite preblanking signal This pin produces blanking pulses narrower than the pulses for both horizontal and vertical synchronization. Line switch signal The chip generates this signal for each horizontal scan line. During NTSC operation, this pin remains at "L" level. This pin provides the FM demodulator trigger signal for the SECAM system. During NTSC operation, this pin remains at "L" level. This pin provides the signal for erasing the subcarrier signal for the SECAM system. 15.891606 16.09375 (1010f H ) (1030f H ) 1/5 9.534964 9.65625 (606f H ) (618f H ) 1/3 22.248249 22.53125 (1414f H ) (1442f H ) 1/7 25.426570 25.75000 (1616f H ) (1648f H ) 1/8 4

For Video Equipment H Decoder Pulse Timing Chart for NTSC H-SYNC EO V-SER BF HD WHD CP2 4.72 1.57 1H=63.55µs Unit: µs 0 4.72 (*1) 2.20 5.35 7.87 7.24 8.50 9.44 9.12 17.52 *1 420 H : 2.33 510 H : 2.31 590 H : 2.34 670 H : 2.36 5

For Video Equipment Pulse Timing Chart for NTSC Composite and Vertical Synchronizing Signals (1/2) 524 525 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 BF 21.0H + 11.0µs BF Pulse Timing Chart for NTSC Composite and Vertical Synchronizing Signals (2/2) 9H 9H 16H + 8.8µs 261 262 263 264 265 266 267 268 269 270 271 272 273 274 275 276 277 278 279 280 281 282 283 284 285 21.0H 16H 488 489 490 525 1 2 3 4 5 6 7 8 9 10 99 100 101 102 135.5H + 7.5µs 226 227 262 263 264 265 266 267 268 269 270 271 272 361 362 363 364 135.5H + 19.2µs 6

For Video Equipment H Decoder Pulse Timing Chart for PAL/SECAM H-SYNC EO V-SER BF HD WHD CP2 IDP S FMTP 1H=64µs Unit: µs 0 4.66 (*1) 4.66 5.59 7.77 1.55 2.17 8.38 10.56 6.70 17.40 0.31 5.29 13.0 *1 420 H : 2.30 510 H : 2.28 590 H : 2.31 670 H : 2.33 7

For Video Equipment Pulse Timing Chart for PAL/SECAM Composite and Vertical Synchronizing Signals (1/2) BF-(1) BF-(3) IDP S LSW(1) LSW(3) BF-(2) BF-(4) IDP S LSW(2) LSW(4) 620 621 622 623 624 625 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 25H 7.5H 308 309 310 311 312 313 314 315 316 317 318 319 320 321 322 323 324 325 326 327 328 329 330 331 332 333 334 335 336 337 338 339 7.5H 21H + 8.8µs 25H + 12.1µs 21H 8

For Video Equipment Pulse Timing Chart for PAL/SECAM Composite and Vertical Synchronizing Signals (2/2) 584 585 586 622 623 624 625 1 2 3 4 5 6 97 98 99 100 137.5H + 7.2µs 272 273 274 310 311 312 313 314 315 316 317 318 409 410 411 412 413 137.5H + 19.0µs 9

For Video Equipment Application Circuit Example 5V Reference clock input 34 TEST1 35 TEST2 36 TEST3 37 V SS1 38 CLK 39 V DD1 40 EO 41 42 HD 43 44 33 32 31 30 29 28 27 26 25 24 23 CCDS2 CCDS1 CP2 TVMD2 S FMTP OSCI 1 2 3 4 5 6 7 8 9 10 11 TVMD1 22 LSW 21 BFIDP 20 19 WHD 18 V SS2 17 SC2 16 SC1 15 V DD2 14 13 OSCO 12 10

For Video Equipment Package Dimensions (Unit: mm) QFP044-P-1010 10.0±0.2 0.8 10=8.0 1.05±0.2 10.0±0.2 2.0±0.2 0.1±0.1 12.3±0.4 11.1±0.2 10.0±0.2 0.15 +0.1 0.2 min. 0.35±0.1 0.8±0.1-0.05 0 to 7 Note) The package of this product will be changed to the following lead-free type (QFP044-P-1010E). 11

For Video Equipment New Package Dimensions (Unit: mm) QFP044-P-1010E (Lead-free package) 12.30±0.40 10.00±0.20 33 23 34 44 (1.00) 1 0.80 11 0.35±0.10 22 (1.00) 12 10.00±0.20 2.00±0.20 0.10±0.10 12.30±0.40 2.10±0.30 0.10 Seating plane 0.15 +0.10-0.05 1.15±0.20 0 to 10 0.60±0.20 12

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.