TGP219 Applications X-Band Radar Satellite Communication Systems Product Features Functional Block Diagram Frequency Range: 8 to 12 GHz 6-Bit Digital Phase Shifter Bi-Directional 36 Coverage, LSB = 5.625 RMS Phase Error: 4 RMS Amplitude Error: 5 db Insertion Loss: 6 db Return Loss: 1 db IRL; 15 db ORL Input P1dB: 29 dbm Input IP3: >4 dbm IM3: < dbc Control Voltage: /+5 V Dimensions: 2.2 x 2.2 x.1 mm General Description The Qorvo TGP219 is a 6-bit digital phase shifter fabricated on Qorvo s high performance.15μm GaAs phemt process. It operates over 8 to 12 GHz and provides 36 of phase coverage with a LSB of 5.625. It also achieves a low RMS phase error of 4 with 6 db of insertion loss. The TGP219 was developed for simply system integration. It uses positive only switch logic; eliminating the need for a negative voltage rail. In addition, both ports are matched to 5 ohms with DC blocking capacitors. Ease of use along with low insertion loss and a high degree of resolution makes the TGP219 ideally suited for a variety of x-band phased array applications including commercial and military radars and phase array communication systems. The device is lead-free and RoHS compliant. Evaluation Boards are available upon request. Pad Configuration Pad No. Ordering Information Symbol 1 RF In 2 11 3, 9 REF 4 45 5 22 6 RF Out 7 5 8 18 1 9 Part ECCN Description TGP219 EAR99 8 12GHz 6-Bit Digital Phase Shifter Datasheet: Rev - 9-1 of 15 - Disclaimer: Subject to change without notice
TGP219 Absolute Maximum Ratings Parameter Value Control and Reference Voltage 6 V Control Current.5 ma Power Dissipation 1.5 W Input Power, CW, 5 Ω, 85 C 33 dbm Channel Temperature 2 C Mounting Temperature (3 Seconds) 32 C Storage Temperature 5 to 15 C Operation of this device outside the parameter ranges given above may cause permanent damage. These are stress ratings only, and functional operation of the device at these conditions is not implied. Recommended Operating Conditions Parameter Control Voltage (5, 11, 22, 45, 9, 18 ) Reference Voltage (VREF) Value /+5 V +5 V Current (IREF, ICTRL) < 5 µa Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all operating conditions. Electrical Specifications Test conditions unless otherwise noted: 25 C. Control Voltage (REF, 5, 11, 22, 45, 9, 18 ) = /+5 V; See Bias Truth Table. Parameter Min Typical Max Units Operational Frequency Range 8 12 GHz Insertion Loss 6 db Input Return Loss 1 db Output Return Loss 15 db RMS Phase Error 4 deg RMS Amplitude Error.5 db Input P1dB 29 dbm Input IP3 (Tone Spacing = 1 MHz, Pin/Tone = 16 dbm) > 4 dbm IM3 (Tone Spacing = 1 MHz, Pin/Tone = 16 dbm) < dbc Insertion Loss Temperature Coefficient.4 db/ C Bias Truth Table Logic = V, Logic 1 = VREF = +5 V Phase Shifter 5 11 22 45 9 18 REF (Reference) 1 1 1 1 1 5 1 1 1 1 1 1 11 1 1 1 1 1 1 22 1 1 1 1 45 1 1 1 1 9 1 1 1 1 18 1 1 1 1 355 1 1 1 Datasheet: Rev - 9-2 of 15 - Disclaimer: Subject to change without notice
TGP219 Thermal and Reliability Information Parameter Test Conditions Value Units Channel Temperature (TCH) 85 C TBASEPLATE = 85 C Median Lifetime (TM) 5.2E+9 Hrs Notes: Under normal (lifetime) operating conditions, self-heating is not a significant contributor to channel temperature. Median Lifetime 1E+15 Median Lifetime, T M (Hours) Median Lifetime vs. Channel Temperature 1E+14 1E+13 1E+12 1E+11 1E+1 1E+9 1E+8 1E+7 1E+6 1E+5 1E+4 FET5 1E+3 25 5 75 1 125 15 175 2 Channel Temperature, T CH ( C) Datasheet: Rev - 9-3 of 15 - Disclaimer: Subject to change without notice
TGP219 Typical Performance Small Signal Test conditions unless otherwise noted: 5V and 3V, 25 C RMS Phase Error vs. Freq. vs. Temp V REF = 5 V, All Phase States RMS Phase Error vs. Freq. vs. Temp V REF = 3 V, All Phase States 14 14 RMS Phase Error (degrees) 12 1 8 6 4 2 RMS Phase Error (degrees) 12 1 8 6 4 2 RMS Amplitude Error (db) 2.2 2. 1.8 1.6 1.4 1.2 1..8.6.4.2. RMS Amplitude Error vs. Freq vs. Temp. V REF = 5 V, All Phase States RMS Amplitude Error (db) 2.2 2. 1.8 1.6 1.4 1.2 1..8.6.4.2. RMS Amplitude Error vs. Freq vs. Temp. V REF = 3 V, All Phase States Avg. Insertion Loss vs. Freq. vs. Temp. V REF = 5 V, All Phase States Avg. Insertion Loss vs. Freq. vs. Temp. V REF = 3 V, All Phase States S21 (db) S21 (db) Datasheet: Rev - 9-4 of 15 - Disclaimer: Subject to change without notice
TGP219 Typical Performance Small Signal (Cont.) Test conditions unless otherwise noted: 5V and 3V, 25 C Avg. IRL vs. Freq. vs.temp. V REF = 5 V, All Phase States Avg. IRL vs. Freq. vs.temp. V REF = 3 V, All Phase States S11 (db) -2 S11 (db) -2 IRL vs. Freq. V REF = 5 V, All Phase States, 25 C IRL vs. Freq. V REF = 3 V, All Phase States, 25 C S11 (db) -2 S11 (db) -2 Peak Peak Average Average Avg. ORL vs. Freq. vs. Temp V REF = 5 V, All Phase States Avg. ORL vs. Freq. vs. Temp V REF = 3 V, All Phase States S22 (db) -2 S22 (db) -2 Datasheet: Rev - 9-5 of 15 - Disclaimer: Subject to change without notice
TGP219 Typical Performance Small Signal (Cont.) Test conditions unless otherwise noted: 5V and 3V, 25 C ORL vs. Freq. V REF = 5 V, All Phase States, 25 C ORL vs. Freq. V REF = 3 V, All Phase States, 25 C S22 (db) -2 S22 (db) -2 Peak Peak Average Average Datasheet: Rev - 9-6 of 15 - Disclaimer: Subject to change without notice
TGP219 Typical Performance Large Signal Test conditions unless otherwise noted: 5V and 3V, 25 C Gain vs. Pin vs. Temperature V REF = 5 V, Freq. = 1 GHz, Phase State = deg Gain vs. Pin vs. Temperature V REF = 3 V, Freq. = 1 GHz, Phase State = deg Gain (db) Gain (db) Gain vs. Pin vs. Frequency V REF = 5 V, 25 C, Phase State = deg Gain vs. Pin vs. Frequency V REF = 3 V, 25 C, Phase State = deg Gain (db) 7 GHz 8 GHz 9 GHz 1 GHz 11 GHz 12 GHz 13 GHz Gain (db) 7 GHz 8 GHz 9 GHz 1 GHz 11 GHz 12 GHz 13 GHz Gain vs. Pin vs. Major Phase States V REF = 5 V, Freq. = 1 GHz, 25 C Gain vs. Pin vs. Major Phase States V REF = 3 V, Freq. = 1 GHz, 25 C Gain (db) Gain (db) deg 5 deg 11 deg 22 deg deg 5 deg 11 deg 22 deg 45 deg 9 deg 18 deg 355 deg 45 deg 9 deg 18 deg 355 deg Datasheet: Rev - 9-7 of 15 - Disclaimer: Subject to change without notice
Typical Performance Large Signal (Cont.) Test conditions unless otherwise noted: 5V and 3V, 25 C 19 185 Phase vs. Pin vs. Temperature V REF = 5 V, Freq. = 1 GHz, Phase State = deg 19 185 TGP219 Phase vs. Pin vs. Temperature V REF = 3 V, Freq. = 1 GHz, Phase State = deg Phase (deg) 18 175 17 Phase (deg) 18 175 17 165 16 165 16 19 Phase vs. Pin vs. Frequency V REF = 5 V, 25 C, Phase State = deg 7 GHz 8 GHz 9 GHz 1 GHz 19 Phase vs. Pin vs. Frequency V REF = 3 V, 25 C, Phase State = deg 7 GHz 8 GHz 9 GHz 1 GHz 185 11 GHz 12 GHz 13 GHz 185 11 GHz 12 GHz 13 GHz Phase (deg) 18 175 17 Phase (deg) 18 175 17 165 165 16 16 36 Phase vs. Pin vs. Major Phase States V REF = 5 V, Freq. = 1 GHz, 25 C 36 Phase vs. Pin vs. Major Phase States V REF = 3 V, Freq. = 1 GHz, 25 C Phase (deg) 315 27 225 18 135 deg 5 deg 11 deg 22 deg 45 deg 9 deg 18 deg 355 deg Phase (deg) 315 27 225 18 135 deg 5 deg 11 deg 22 deg 45 deg 9 deg 18 deg 355 deg 9 9 45 45 Datasheet: Rev - 9-8 of 15 - Disclaimer: Subject to change without notice
TGP219 Typical Performance Large Signal (Cont.) Test conditions unless otherwise noted: 5V and 3V, 25 C Current I REF vs. Pin vs. Temperature V REF = 5 V, Freq. = 1 GHz, Phase State = deg Current I REF vs. Pin vs. Temperature V REF = 3 V, Freq. = 1 GHz, Phase State = deg.6.6.5.5 Current I REF (ma).4.3.2 Current I REF (ma).4.3.2.1.1.. Current I REF vs. Pin vs. Frequency V REF = 5 V, 25 C, Phase State = deg Current I REF vs. Pin vs. Frequency V REF = 3 V, 25 C, Phase State = deg.6 7 GHz 8 GHz 9 GHz 1 GHz.6 7 GHz 8 GHz 9 GHz 1 GHz.5 11 GHz 12 GHz 13 GHz.5 11 GHz 12 GHz 13 GHz Current I REF (ma).4.3.2 Current I REF (ma).4.3.2.1.1.. Current I REF vs. Pin vs. Phase States V REF = 5 V, Freq. = 1 GHz, 25 C Current I REF vs. Pin vs. Phase States V REF = 3 V, Freq. = 1 GHz, 25 C.6 deg 5 deg 11 deg 22 deg.6 deg 5 deg 11 deg 22 deg.5 45 deg 9 deg 18 deg 355 deg.5 45 deg 9 deg 18 deg 355 deg Current I REF (ma).4.3.2 Current I REF (ma).4.3.2.1.1.. Datasheet: Rev - 9-9 of 15 - Disclaimer: Subject to change without notice
Typical Performance Linearity Test conditions unless otherwise noted: 5V and 3V, Tone Spacing = 1 MHz, 25 C TGP219 ITOI vs. Freq. vs. Pin/Tone V REF = 5 V, 25 C, Phase State = deg ITOI vs. Freq. vs. Pin/Tone V REF = 3 V, 25 C, Phase State = deg 5 5 48 48 46 46 44 44 ITOI (dbm) 42 4 38 36 ITOI (dbm) 42 4 38 36 34 Pin/Tone = 16 dbm 34 Pin/Tone = 16 dbm 32 Pin/Tone = 6 dbm 32 Pin/Tone = 6 dbm 3 3 ITOI vs. Freq. vs. Major Phase States V REF = 5 V, Pin/Tone = 16 dbm, 25 C ITOI vs. Freq. vs. Major Phase States V REF = 3 V, Pin/Tone = 16 dbm, 25 C 5 5 48 48 46 46 44 44 ITOI (dbm) 42 4 38 36 ITOI (dbm) 42 4 38 36 34 32 3 deg 5 deg 11 deg 22 deg 45 deg 9 deg 18 deg 355 deg 34 32 3 deg 5 deg 11 deg 22 deg 45 deg 9 deg 18 deg 355 deg Datasheet: Rev - 9-1 of 15 - Disclaimer: Subject to change without notice
Typical Performance Linearity (Cont.) Test conditions unless otherwise noted: 5V and 3V, Tone Spacing = 1 MHz, 25 C TGP219 IM3 vs. Freq. vs. Pin/Tone V REF = 5 V, 25 C, Phase State = deg IM3 vs. Freq. vs. Pin/Tone V REF = 3 V, 25 C, Phase State = deg Pin/Tone = 16 dbm Pin/Tone = 16 dbm Pin/Tone = 6 dbm Pin/Tone = 6 dbm IM3 (dbc) IM3 (dbc) IM3 vs. Freq. vs. Major Phase States V REF = 5 V, Pin/Tone = 16 dbm, 25 C IM3 vs. Freq. vs. Major Phase States V REF = 3 V, Pin/Tone = 16 dbm, 25 C IM3 (dbc) IM3 (dbc) deg 5 deg 11 deg 22 deg deg 5 deg 11 deg 22 deg 45 deg 9 deg 18 deg 355 deg 45 deg 9 deg 18 deg 355 deg Datasheet: Rev - 9-11 of 15 - Disclaimer: Subject to change without notice
Mechanican Information and Bond Pad Description TGP219 2 3 4 5 1 6 1 9 8 7 Unit: millimeters Thickness:.1 Die x, y size tolerance: ±.5 Chip edge to bond pad dimensions are shown to center of pad Ground is backside of die Bond Pad Symbol Description Pad Size 1 RF In Input; matched to 5 Ω; DC blocked; interchangeable to RF Output.2 x.1 2 11 11 Bit.1 x.1 3, 9 REF Reference; VREF can be applied to either pad.1 x.1 4 45 45 Bit.1 x.1 5 22 22 Bit.1 x.1 6 RF Out Output; matched to 5 Ω; DC blocked; interchangeable to RF Input.2 x.1 7 5 5 Bit.1 x.1 8 18 18 Bit.1 x.1 1 9 9 Bit.1 x.1 Datasheet: Rev - 9-12 of 15 - Disclaimer: Subject to change without notice
TGP219 Applications Information 1. De-Quing network is not required; VREF can be applied to either side of the MMIC (pad # 3 or #9) 2. The spacing between MMIC and TFN at RF In and RF Out is <5 mils typical. 3. RF connections: Bond three 1-mil diameter, <2 mils length gold bond wires at RF In and RF Out for optimum RF performance. Datasheet: Rev - 9-13 of 15 - Disclaimer: Subject to change without notice
TGP219 Assembly Notes Component placement and adhesive attachment assembly notes: Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is critical during auto placement. Solder or Organic Adhesive attachment can be used for TGL225. Curing should be done in a convection oven; proper exhaust is a safety concern. Solder attachment reflow process assembly notes: Use AuSn (8/2) solder and limit exposure to temperatures above 3 C to 3 to 4 minutes, maximum. An alloy station or conveyor furnace with reducing atmosphere should be used. Do not use any kind of flux. Coefficient of thermal expansion matching is critical for long-term reliability. Devices must be stored in a dry nitrogen atmosphere. Organic adhesive attachment assembly notes: The organics such as epoxy or polyimide can be used. Epoxies cure at temperatures of 1 to 2 C. Interconnect process assembly notes: Thermosonic ball bonding is the preferred interconnect technique. Force, time, and ultrasonics are critical parameters. Aluminum wire should not be used. Devices with small pad sizes should be bonded with.7-inch wire. Datasheet: Rev - 9-14 of 15 - Disclaimer: Subject to change without notice
TGP219 Product Compliance Information ESD Sensitivity Ratings Caution! ESD-Sensitive Device ESD Rating: TBD Value: TBD Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 Solderability This part is compliant with EU 22/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br42) Free PFOS Free SVHC Free ECCN US Department of Commerce: EAR99 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Tel: +1.972.994.8465 Email: info-sales@triquint.com Fax: +1.972.994.854 For technical questions and application information: Email: info-products@triquint.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev - 9-15 of 15 - Disclaimer: Subject to change without notice