Typical Performance 1. 2 OIP3 _ measured on two tones with a output power 8 dbm/ tone, F2 F1 = 1 MHz. +5V. RFout. Absolute Maximum Ratings

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Device Features OIP3 = 41.5 dbm @ 500 MHz Gain = 27 db @ 140 MHz Output P1 db = 21 dbm @ 140 MHz NF = 2.7 @ 70MHz at Demo Board Product Description BeRex s BIG8 is a high performance InGaP/ GaAs HBT MMIC amplifier, internally matched to 50 Ohms. The BIG8 is designed for high linearity IF amplifier that require excellent gain,high OIP3 and flatness. It is packaged in a RoHS-compliant with SOT-89 surface mount package. Applications Base station Infrastructure/RFID Applications Circuit RFin C1 BOM 50~100MHz 100~300MHz 300~600MHz C1 1000pF 1000pF 100pF C2 1000pF 1000pF 100pF C3 100pF 100pF 100pF C4 1000pF 1000pF 1000pF C5 10uF 10uF 10uF L1 1uH 560nH 100nH R1 1.6ohm 1.6ohm 1.6ohm L1 BIG8 R1 C3 C4 C5 C2 +5V RFout Typical Performance 1 Parameter Frequency Unit 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system. 2 OIP3 _ measured on two tones with a output power 8 dbm/ tone, F2 F1 = 1 MHz. Absolute Maximum Ratings 70 140 200 500 MHz Gain 27.0 27.0 27.0 26.0 db S11-21.0-20.0-20.5-18.5 db S22-17.5-18.0-18.0-17.5 db OIP3 2 40.5 40.0 39.0 41.5 dbm P1dB 20.5 21.0 21.0 20.5 dbm Noise Figure 2.7 2.9 3.0 3.1 db Min. Typical Max. Unit Bandwidth 50 600 MHz I C @ (Vc = 5V) 85 100 115 ma V C 5 V dg/dt -0.004 db/ C R TH 66.6 C/W Parameter Rating Unit Operating Case Temperature -40 to +85 C Storage Temperature -55 to +155 C Junction Temperature +220 C Operating Voltage Supply Current Input RF Power +7 250 24 V ma dbm Operation of this device above any of these parameters may result in permanent damage. 1

V-I Characteristics BeRex SOT89 Evaluation Board BeRex Evaluation Board *Dielectric constant _ 4.2 *RF pattern width 52mil *31mil thick FR4 PCB Typical Device Data 2

S-Parameter (Vdevice = 5.0V, Icc = 94mA, T = 25 C, calibrated to device leads) Freq S11 [Mag] S11 [Ang] S21 [Mag] S21 [Ang] S12 [Mag] S12 [Ang] S22 [Mag] S22 [Ang] 10 0.09-162.49 23.38-179.10 0.023 2.97 0.19 4.87 50 0.09-173.26 23.23 176.20 0.024 2.42 0.17-14.29 100 0.09-173.63 23.07 171.97 0.024 2.27 0.15-22.65 150 0.09-173.14 22.84 167.99 0.025 1.63 0.14-26.46 200 0.10-173.82 22.54 164.17 0.025 1.14 0.14-29.49 250 0.10-173.69 22.22 160.50 0.025 0.99 0.14-32.38 300 0.10-172.72 21.80 156.86 0.025 0.76 0.14-36.27 350 0.10-174.64 21.47 153.48 0.024 0.66 0.14-38.76 400 0.11-176.60 21.09 150.24 0.024 0.93 0.15-41.05 450 0.11-177.87 20.65 146.99 0.024 0.92 0.15-44.18 500 0.11 179.34 20.27 144.05 0.024 1.25 0.15-46.40 550 0.11 175.61 19.86 140.85 0.023 1.48 0.16-48.84 600 0.11 172.99 19.39 137.92 0.023 1.79 0.17-51.58 3

Typical Performance (Vd = 5V, Ic = 94mA, T = 25 C) Application Circuit: 70-500 MHz Freq MHz 70 140 200 500 S21 db 27.0 27.1 26.9 26.0 S11 db -21.0-20.1-20.4-18.6 S22 db -17.5-17.8-18.6-17.7 P1 dbm 20.7 21 21 20.2 OIP3 dbm 40.5 40.2 39 41.6 NF db 2.7 2.9 3.0 3.2 Typical Performance (Vd = 4.7V, Ic = 78mA, T = 25 C) Freq MHz 70 140 200 500 S21 db 26.9 26.9 26.7 25.8 S11 db -21.8-21.6-21.8-20.0 S22 db -16.7-16.9-17.2-16.5 P1 dbm 20.0 20.1 20.1 19.4 OIP3 dbm 37.5 37.6 36.1 37.5 NF db 2.8 2.8 2.8 3.0 Typical Performance (Vd = 4.5V, Ic = 66mA, T = 25 C) Freq MHz 70 140 250 500 S21 db 26.7 26.7 26.5 25.7 S11 db -23.3-23.3-23.7-21.1 S22 db -15.8-15.9-16.2-15.6 P1 dbm 19.1 19.2 19.1 18.4 OIP3 dbm 34.8 34.9 33.7 34.5 NF db 2.8 2.8 2.8 2.9 Typical Performance (Vd = 4V, Ic = 40mA, T = 25 C) Freq MHz 70 140 250 500 S21 db 25.8 25.9 25.7 25.0 S11 db -26.8-29.8-33.7-26.9 S22 db -12.9-12.8-13.0-12.7 P1 dbm 16.2 16.2 15.5 14.5 OIP3 dbm 28.2 28.3 27.3 25.8 NF db 2.7 2.7 2.6 2.7 4

Device Performance Pin-Pout-Gain 70MHz, 5V/94mA 140MHz, 5V/94mA 200MHz, 5V/94mA 500MHz, 5V/94mA 5

OIP3 6

ACLR / LTE 7

S-Parameters over Temperature (70MHz) 8

Preliminary Datasheet BIG8 S-Parameters over Temperature (140MHz,200MHz) S-Parameters over Temperature (500MHz) 9

Package Outline Dimension Suggested PCB Land Pattern and PAD Layout PCB Land Pattern PCB Mounting 0.40 1.30 0.40 Ø0.40 0.40 0.75 1.20 2.15 1.20 1.20 1.50 1.00 0.45 1.20 0.50 2.80 0.65 0.35 Note : All dimension _ millimeters PCB lay out _ on BeRex website 10

Package Marking Tape & Reel SOT89 Packaging information: Tape Width (mm): 12 Reel Size (inches): 7 YY = Year, WW = Working Week, XX = Wafer No. Device Cavity Pitch (mm): 8 Devices Per Reel: 1000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 2 Passes <4000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Standard: Level 1 at +265 C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F 11