Challenges for OLED Deposition by Vacuum Thermal Evaporation. D. W. Gotthold, M. O Steen, W. Luhman, S. Priddy, C. Counts, C.

Challenges for OLED Deposition by Vacuum Thermal Evaporation D. W. Gotthold, M. O Steen, W. Luhman, S. Priddy, C. Counts, C. Roth June 7, 2011

Outline Introduction to Veeco Methods of OLED Deposition Cost Challenges to OLED Technology Veeco s Source Technology Summary & Discussion Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 2

Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 3 3 Veeco Overview Products and markets LED & Solar BU MOCVD, MBE, CIGS systems OLED, CIGS sources Data Storage BU IBE, IBD, DLC, PVD Key facts: Founded in 1990 Over 300 patents Over 1000 employees worldwide Over 25 global locations 2010 Revenue >$900M

Veeco St Paul: >20 Years of Thermal Deposition Source Innovation OLED Solar MBE Reloading OLED Linear Metal Al PV-15L Valved Se PV-155cc SUMO-II PV-Linear Mark V P VC 1500cc OLED 15L Valved Se 725cc Production Cu Mark V As VC Mark V Corrosive Series VC 2005 2007 2009 2010 Mark V Valved Hg PV-1500cc SUMO Monte Carlo Uniformity Modeling R&D Cu Sources 2000 2001 Private MBE company acquired by Veeco 10,000g Ga Source 15L As VC Corrosive Series VC 1997 1996 UNI-Bulb RF Plasma Patented SUMO 1986 1992 1994 MBE Systems Patented As/P VC Material Specific Sources Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 4

OLED Deposition Technologies Method Advantages Disadvantages Thermal Evaporation Solution Processing Vapor Phase Deposition Device Performance & Lifetime Complex layer stacks Processing Cost Materials Utilization Morphology Control Large Area Potential Materials Utilization Material Degradation Substrate Heating Device Performance Solvent Management Orthogonal Solvent Compatibility Device Performance and Lifetime Material Degradation There are a variety of variations and hybrids of these basic technologies Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 6

Why VTE Advantages Best demonstrated efficiencies Best demonstrated lifetimes Compatible with almost all materials Not necessarily scalable Accurate film control for co-depositions and multilayered structure Challenges Materials Utilization Tradeoff with uniformity Material Degradation Thermal budget Substrate Heating Rate control Especially for long term operation Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 8

OLED Markets and Process Requirements Market Requirements Implication for OLED Process Scale Market Size ($) Area (m 2 ) Cost ($/m 2 ) TACT (min) Dynamic Rate (Åm/s) Utilization (%) Uptime R&D Millions 0.04 10k 10 0.33 <5 1 day Mobile Display 100s Millions 0.7 5.3k 3 5.2 20 3-5 days Large Display Billions 2.0 700 2 12.5 50 5-7 days SSL Billions 0.7+ <100 0.5 40 >70 >2 weeks Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 10

Technology Cost Requirements 12,000 10,000 Cost ($/m 2 ) 8,000 6,000 4,000 2,000 0 R&D Mobile Display Large Display Solid State Lighting Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 11

Relative Cost and Area of Systems $10,000 10,000,000 1,000,000 Cost/m 2 $1,000 $100 100,000 10,000 1,000 m 2/ year 100 $10 10 R&D 2G Display 4.5G inline 5.5G Display Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 12

Bigger Not Necessarily Better OLED G5.5 2 x4 TACT Time 1 min 1 min Uptime 85% 80% Yield 95% 90% Yielded Panel Area Per Year 925,000 m 2 250,000 m 2 System ASP $150M $20M 5 Yr Depreciation Cost ($/m 2 ) 30 16 OLED Chemical Cost ($/m 2 ) 10 20 Glass, ITO, Cathode, Encap 41 30 Operating Cost + Labor ($/m 2 ) 9 10 Total Cost ($/m 2 ) 90 76 Can achieve <$10/6 panel but each tool will produce 8M panels/year Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 13

OLED Markets and Process Requirements Market Requirements Implication for OLED Process Scale Market Size ($) Area (m 2 ) Cost ($/m 2 ) TACT (min) Dynamic Rate (Åm/s) Utilization (%) Uptime R&D Millions 0.04 10k 10 0.33 <5 1 day Mobile Display 100s Millions 0.7 5.3k 3 5.2 20 3-5 days Large Display Billions 2.0 700 2 12.5 50 5-7 days SSL 10s Billions 0.7+ <100 0.5 40 >70 >2 weeks Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 15

Veeco Organic Source Product Line Source Market Features Point Source R&D Low Cost Simple maintenance and material replacement Bulk Valved Source Re-loading Source R&D Medium volume production (Mobile Display) Medium volume production (Mobile Display, TV ) High volume production (TV, Lighting) Valve Nozzle Distribution Scanning & Fixed Flexible Geometry Valve Nozzle Distribution Re-loading for high uptime and minimized degradation Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 16

OLED Bulk Valved Source Linear nozzle Flux monitor port Cooled nozzle cover Valve actuator Removable material crucible Cable connections Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 17

Organic Reloading Source Separate vaporization and distribution zones for easy scaling Enables operation over a wide flux range (dopant to host) Bulkhead mounted for high speed in-line systems Closed loop valved flux control for rapid rate changes and precision control Low residence time of material in vaporizer to minimize degradation Source can be reloaded during normal operation Enables extended operating times between system maintenance Refill Assy Distribution Nozzle Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 18

Key Technologies for OLED Source Valve enables rapid flux control Compensate for evaporation rate variation Idle source between substrates Flux gauge provides feedback for valve Necessary for rapid flux control Requires much longer lifetime than conventional gauge technology Control algorithms - integrated control of flux Control software that can keep source in optimum operating range Enables reloading process, which causes large changes in rate Nozzle large area distribution Achieve high utilization and uniformity on large substrates Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 20

Key Technologies: Valve Valve Position Control of Rate Deposition Rate Vs. Time 25 14 Dep Rate Set Point Dep Rate (Actual) QCM Rate (Å/s) 12 10 8 6 4 2 Dep rate and % Valve open 20 15 10 5 0 0 50 100 Valve Opening (%) 0 0 200 400 600 800 1000 1200 1400 1600 Time (s) Large Dynamic Range Highly Reproducible 100x rate control < 2s response rate Valve reduces wasted source material. Allows rapid flux control to improve yield and CoO Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 21

Key Technologies: Flux Gauge QCM Rate (Å/s) Veeco In Situ Flux Gauge 14 12 10 8 6 4 2 R 2 = 0.9997 0 0.27 0.28 0.29 0.3 0.31 0.32 Gauge Reading (a.u.) Internally-developed in situ flux gauge integrates directly to sources Large linear range allows precise flux measurements Allows closed loop control of valve No lifetime error/drift issues as seen in QCMs Greatly improves flux stability Improves panel yield and CoO Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 22

Key Technologies: Flux Regulation 90 Valve 320 70 0.5 Valve Position (%) 80 70 60 50 Crucible Temp 310 300 290 280 Crucible Temperature (ºC) Measured Dep Rate (Å/s) 68 66 64 62 60 Samples In Situ Gauge 0.49 0.48 0.47 In Situ Gauge (a.u.) 0 10 20 30 0 10 20 30 40 Time (hr) Time (hr) Deposition Rate regulated to <±1% for >30 hours Crucible temperature deliberately changed by 18ºC during test. Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 23

Key Technologies: Flux Regulation 12 hrs flux control with material reloading in 3 hr intervals. Valve Position (%) 100 90 80 70 QCM Rate (Å/s) 30 25 20 15 10 5 QCM Rate In Situ Gauge 0.36 0.34 0.32 0.3 0.28 In Situ FLux Gauge (a.u.) 60 0 0.26 0 3 6 9 12 0 3 6 9 12 Time (hr) Time (hr) In Situ Gauge accurately controls over entire test. QCM readings develop errors and issues as material accumulates. Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 24

Key Technologies: Nozzle (Uniformity) 4G (0.73m) System Uniformity*=±0.72 to ±1.87% depending on rate 1 Valved Source with linear nozzle 37% material utilization Source-to-substrate distance = 300mm Material; multiple * Measured by ellipsometry Thickness (Å) 22000 20000 18000 16000 14000 12000 10000 8000 6000-600 -500-400 -300-200 -100 0 100 200 300 400 500 600 Position (mm) ±.72% @ 2.7 Åm/s ±1.80% @ 15 Åm/s ±1.87% @ 12 Åm/s Gen III, 730 mm nozzle Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 25

Key Technologies: Nozzle (Design) Material Utilization Glass Heating 100 3 120 Material Utilization (%) 90 80 70 60 50 40 30 20 10 0 0 100 200 300 400 500 Nozzle Working Distance (mm) Relative Heat Load (%) 2.5 2 1.5 1 0.5 0 0 100 200 300 400 500 Nozzle Working Distance (mm) 100 80 60 40 20 0 Relative Nozzle Aperature Strong tradeoff between material utilization and OLED/Glass heating Careful consideration must be given to impacts on nozzle conductance and uniformity. Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 26

Key Technologies: Nozzle (Heating) Heating of Static Glass by Nozzle Bonded Thermocouples Source Nozzle Static Glass Glass Temperature Increase (ºC) 12 TC1 TC2 10 TC3 8 6 4 2 0 250 300 350 400 450 500 550 Nozzle Temperature (ºC) Average temperature increase is less than 10ºC even for static glass. Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 27

Requirements for Roadmap 100 100 10 1 0.1 0.01 80 60 40 20 0 R&D Mobile Display Large Display R&D Mobile Display Large Display SSL Required Utilization (%) Dynamic Rate (Åm/s) SSL Reloading source has adequate dynamic rates for the MD and LD markets. Improvements are needed for SSL. Reloading source needs utilization improvements for LD and SSL markets. Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 28

Requirements for Roadmap Current Results 100 100 10 1 0.1 0.01 80 60 40 20 0 R&D Mobile Display Large Display R&D Mobile Display Large Display SSL Required Utilization (%) Dynamic Rate (Åm/s) SSL Reloading source has adequate dynamic rates for display markets. Improvements are needed for SSL. Utilization can be achieved, but requires system design optimization Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 29

Conclusions Manufacturing process for current OLED technologies is feasible, however targeted equipment required Need a target device structure Market entry size challenging Need R&D that is factoring in manufacturing needs Many aspects of device design still based on hero results Materials only have to last hours for R&D testing Lots of if we simply add, this will be manufacturable Veeco has developed thermal evaporation source technologies capable of large area displays and SSL Copyright 2010 Veeco Instruments. All rights Reserved. Veeco Confidential 30

Challenges for OLED Deposition by Vacuum Thermal Evaporation D. W. Gotthold, M. O Steen, W. Luhman, S. Priddy, C. Counts, C. Roth June 7, 2011