HSMx-A1x-xxxxx PLCC-2, Surface Mount LED Indicator Data Sheet Description This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. The super wide viewing angle at 12 makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. Features Industry standard PLCC-2 package High reliability LED package High brightness using AlInGaP and InGaN dice technologies Available in full selection of colors Super wide viewing angle at 12 Available in 8 mm carrier tape on 7 inch reel (2 pieces) Compatible with both IR and TTW soldering process Applications Interior automotive Instrument panel backlighting Central console backlighting Cabin backlighting Electronic signs and signals Interior full color sign Variable message sign Office automation, home appliances, industrial equipment Front panel backlighting Push button backlighting Display backlighting CAUTION: HSMN,M,K and E-A1x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions 2.8 ±.2 2.2 ±.2 1.9 ±.2.1 TYP..8 ±.1 3.2 ±.2 3.5 ±.2.8 ±.3 CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES).5 ±.1 TOP MOUNT 2.8 ±.2 2.2 ±.2 1.9 ±.2 3.2 ±.2 5.2 ±.2.1 TYP. CATHODE MARKING REVERSE MOUNT.5 ±.1 NOTE: ALL DIMENSIONS IN MILLIMETERS. 2
Table 1. Device Selection Guide Red HSMS-A1-JJ1 4.5 15. - 2 GaP HSMS-A1-LJ1 11.2 15. - 2 GaP HSMS-A1-J8J2 5.6-14. 1 GaP HSMH-A1-LJ1 11.2 15. - 2 AlGaAs HSMH-A1-NJ1 28.5 5. - 2 AlGaAs HSMC-A1-QJ1 71.5 1. - 2 AlInGaP HSMC-A1-RJ1 112.5 14. - 2 AlInGaP HSMC-A11-SJ1 18. 22. - 2 AlInGaP HSMZ-A1-TJ1 285. 35. - 2 AlInGaP Red Orange HSMJ-A1-QJ1 71.5 1. - 2 AlInGaP HSMJ-A11-SJ1 18. 2. - 2 AlInGaP HSMJ-A1-T4J1 285. - 715. 2 AlInGaP HSMV-A1-TJ1 285. 35. - 2 AlInGaP HSMJ-A1-R4J1 112.5-285. 2 AlInGaP Orange HSMD-A1-JJ1 4.5 15. - 2 GaP HSMD-A1-LJ1 11.2 15. - 2 GaP HSMD-A1-K4PJ2 7.2-18. 1 GaP HSML-A1-QJ1 71.5 1. - 2 AlInGaP HSML-A11-SJ1 18. 22. - 2 AlInGaP Yellow / Amber HSMY-A1-JJ1 4.5 12. - 2 GaP HSMY-A1-LJ1 11.2 12. - 2 GaP HSMA-A1-QJ1 71.5 1. - 2 AlInGaP HSMA-A11-SJ1 18. 22. - 2 AlInGaP HSMU-A1-SJ1 18. 32. - 2 AlInGaP HSMA-A11-R8WJ1 14. - 355. 2 AlInGaP 3
Table 1. Device Selection Guide (Cont.) Yellow Green HSMG-A1-J2J1 4.5 18. - 2 GaP HSMG-A1-K72J2 9. - 18. 1 GaP HSME-A1-M2J1 18. 7. - 2 AlInGaP HSME-A1-N82J1 35.5-9. 2 AlInGaP Emerald Green HSMG-A1-H1J1 2.8 8. - 2 GaP HSME-A1-L1J1 11.2 4. - 2 AlInGaP HSME-A1-M3PJ1 18. - 35.5 2 AlInGaP Green HSMM-A11-RJ1 112.5 2. - 2 InGaN HSMM-A1-SJ1 18. 35. - 2 InGaN HSMM-A1-U4PJ1 45. - 1125. 2 InGaN Blue HSMN-A11-NJ1 28.5 5. - 2 InGaN HSMN-A1-PJ1 45. 7. - 2 InGaN HSMN-A1-R4YJ1 112.5-285. 2 InGaN HSMN-A1-S4YJ1 18. - 45. 2 InGaN HSMN-A1-R8YJ1 14. - 355. 2 InGaN 4
Part Numbering System HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25 C) Parameters HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/N DC Forward Current [1] 3 ma 3 ma 3 ma [3,4] 2 ma [4] 3 ma [3,4] 3 ma Peak Forward Current [2] 1 ma 1 ma 1 ma 1 ma 1 ma 1 ma Power Dissipation 63 mw 6 mw 63 mw 48 mw 63 mw 114 mw Reverse Voltage Junction Temperature 11 C Operating Temperature Storage Temperature 5 V 55 C to +1 C 55 C to +1 C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty factor = 1%, Frequency = 1 khz. 3. Drive current between 1 ma and 3 ma is recommended for best long term performance. 4. Operation at current below 5 ma is not recommended. 5
Optical Characteristics (T A = 25 C) Color Part Number Dice Technology Peak Wavelength λ PEAK (nm) Typ. Dominant Wavelength [1] λd (nm) Typ. Viewing Angle 2 θ1/2 [2] (Degrees) Typ. Luminous Efficacy ηv [3] (lm/w) Typ. Luminous Intensity/ Total Flux Iv(mcd)/Φv(mlm) Typ. Red HSMS-A1 GaP 635 626 12 12.45 HSMH-A1 AlGaAs 645 637 12 63.45 HSMC-A1x AlInGaP 635 626 12 15.45 HSMZ-A1 AlInGaP 635 626 12 155.45 Red HSMJ-A1x AlInGaP 621 615 12 24.45 Orange HSMV-A1 AlInGaP 623 617 12 263.45 Orange HSMD-A1 GaP 6 62 12 38.45 HSML-A1x AlInGaP 69 65 12 32.45 Amber HSMY-A1 GaP 583 585 12 52.45 HSMA-A1x AlInGaP 592 59 12 48.45 HSMU-A1 AlInGaP 594 592 12 5.45 Yellow HSMG-A1 GaP 565 569 12 59.45 Green HSME-A1 AlInGaP 575 57 12 56.45 Emerald HSMG-A1 GaP 558 56 12 65.45 Green HSME-A1 AlInGaP 566 56 12 61.45 Green HSMM-A1x InGaN 523 525 12 5.45 Blue HSMN-A1x InGaN 468 47 12 75.45 Notes: 1. The dominant wavelength, λ D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, I e in watts/steradian, may be calculated from the equation I e = I v /η v, where I v is the luminous intensity in candelas and η v is the luminous efficacy in lumens/watt. Electrical Characteristics (T A = 25 C) Part Number Forward Voltage VF (Volts) @ I F = 2 ma Typ. Max. Reverse Voltage V R @ 1 μa Min. Reverse Voltage V R @ 1 μa Min. Thermal Resistance Rθ JP ( C/W) HSMS/D/Y/G 2.2 2.6 5 18 HSMH 1.9 2.6 5 18 HSMC/J/L/A/E 1.9 2.4 5 28 HSMZ/V/U 1.9 2.4 5 28 HSMM/N 3.4 4.5 5 28 6
RELATIVE INTENSITY 1..9.8.7.6.5.4.3.2.1 BLUE GREEN EMERALD GREEN YELLOW GREEN AMBER ORANGE RED ORANGE RED 38 43 48 53 58 63 68 73 78 WAVELENGTH nm RELATIVE INTENSITY 1..8.6.4.2 GaP EMERALD GREEN GaP YELLOW GREEN GaP YELLOW GaP ORANGE GaP RED 38 43 48 53 58 63 68 73 78 WAVELENGTH nm Figure 1. Relative intensity vs. wavelength. 35 1.8 FORWARD CURRENT ma 3 25 2 15 1 5 HSMS/D/Y/G HSMH HSMC/J/L/A/E/Z/V/U HSMM/N RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 1.6 1.4 1.2 1..8.6.4.2 AlInGaP AlGaAs Gap InGaN 1 2 3 4 FORWARD VOLTAGE V Figure 2. Forward current vs. forward voltage. 5 5 1 15 2 25 3 DC FORWARD CURRENT ma Figure 3. Relative intensity vs. forward current. 35 35 35 CURRENT - ma 3 25 2 15 1 HSME HSMS/D/G/ Y/H/Z/V/U HSMC/J/L/A HSMM/N CURRENT - ma 3 25 2 15 1 HSME HSMS/D/G/Y/H HSMC/J/L/A HSMZ/V/U HSMM/N 5 5 2 4 6 8 1 12 TEMPERATURE ( C) Figure 4. Maximum forward current vs. ambient temperature. Derated based on T J MAX = 11 C, Rθ JA = 5 C/W. 2 4 6 8 1 12 TEMPERATURE ( C) Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on T J MAX = 11 C, Rθ JP = 18 C/W or 28 C/W. 7
DOMINANT WAVELENGTH nm 54 53 GREEN 52 51 5 CYAN 49 48 47 BLUE 46 5 1 15 2 25 3 35 CURRENT ma Figure 5. Dominant wavelength vs. forward current InGaN devices. DELTA VF (NORMALIZED AT 25 C).5.4.3.2.1 -.1 -.2 -.3-1 GaP/AlGaAs/ AlInGaP InGaN/GaN -5 5 1 TEMPERATURE C Figure 6. Forward voltage shift vs. temperature. 15 1..8 NORMALIZED INTENSITY.6.4.2-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGULAR DISPLACEMENT DEGREES Figure 7. Radiation Pattern. 1 to 3 SEC. 25 TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6-12 SEC. 6 C/SEC. MAX. 1 SEC. MAX. TEMPERATURE C 2 15 1 5 3 FLUXING PREHEAT BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD TIME Figure 8. Recommended Pb-free reflow soldering profile. (Acc. to J-STD-2C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 16 Surface Mounting SMT LED Indicator Components. Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section. 1 2 3 4 5 6 7 8 9 1 TIME SECONDS CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 15C (1C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 39C AIR KNIFE DISTANCE = 1.91 mm (.25 IN.) AIR KNIFE ANGLE = 4 LEADED SOLDER: SN63; FLUX: RMA LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag,.5 wt% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. Figure 9. Recommended wave soldering profile. 8
1.5 4.5 2.6 SOLDER RESIST Figure 1. Recommended soldering pad pattern TRAILER COMPONENT LEADER 2 mm MIN. FOR Ø18 REEL. 2 mm MIN. FOR Ø33 REEL. 48 mm MIN. FOR Ø18 REEL. 96 mm MIN. FOR Ø33 REEL. C A Figure 11. Tape leader and trailer dimensions USER FEED DIRECTION 4 ±.1 4 ±.1 2 ±.5 1.75 ±.1 2.29 ±.1 Ø 1.5 +.1 C 3.5 ±.5 8 +.3.1 3.81 ±.1 A 3.5 ±.1 Ø1 +.1 8.229 ±.1 Figure 12. Tape dimensions 9
2 +.5 Ø 2.5 ±.3 18 62.5 + 2.5 Ø 13 ±.2 +1.5 8.4. (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (.25 mm) 7.9 (MIN.) 1.9 (MAX.) Figure 13. Reel dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. 1
Intensity Bin Select (X 5 X 6 ) Individual reel will contain parts from one half bin only. X 5 X 6 Min I v Bin Full Distribution 2 2 half bins starting from X 5 1 3 3 half bins starting from X 5 1 4 4 half bins starting from X 5 1 5 5 half bins starting from X 5 1 6 2 half bins starting from X 5 2 7 3 half bins starting from X 5 2 8 4 half bins starting from X 5 2 9 5 half bins starting from X 5 2 Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) G1 1.8 2.24 G2 2.24 2.8 H1 2.8 3.55 H2 3.55 4.5 J1 4.5 5.6 J2 5.6 7.2 K1 7.2 9. K2 9. 11.2 L1 11.2 14. L2 14. 18. M1 18. 22.4 M2 22.4 28.5 N1 28.5 35.5 N2 35.5 45. P1 45. 56. P2 56. 71.5 Q1 71.5 9. Q2 9. 112.5 R1 112.5 14. R2 14. 18. S1 18. 224. S2 224. 285. T1 285. 355. T2 355. 45. U1 45. 56. U2 56. 715. V1 715. 9. V2 9. 1125. W1 1125. 14. W2 14. 18. X1 18. 224. X2 224. 285. Tolerance of each bin limit = ± 12% 11
Color Bin Select (X 7 ) Individual reel will contain parts from one full bin only. X 7 Full Distribution Z Y W V U T S Q P N M L K A and B only B and C only C and D only D and E only E and F only F and G only G and H only A, B, and C only B, C, and D only C, D, and E only D, E, and F only E, F, and G only F, G, and H only 1 A, B, C, and D only 2 E, F, G, and H only 3 B, C, D, and E only 4 C, D, E, and F only 5 A, B, C, D, and E only 6 B, C, D, E, and F only Color Bin Limits Blue Min. (nm) Max. (nm) A 46. 465. B 465. 47. C 47. 475. D 475. 48. Cyan Min. (nm) Max. (nm) A 49. 495. B 495. 5. C 5. 55. D 55. 51. Green Min. (nm) Max. (nm) A 515. 52. B 52. 525. C 525. 53. D 53. 535. Emerald Green Min. (nm) Max. (nm) A 552.5 555.5 B 555.5 558.5 C 558.5 561.5 D 561.5 564.5 Color Bin Limits Amber Min. (nm) Max. (nm) A 582. 584.5 B 584.5 587. C 587. 589.5 D 589.5 592. E 592. 594.5 F 594.5 597. Orange Min. (nm) Max. (nm) A 597. 6. B 6. 63. C 63. 66. D 66. 69. E 69. 612. Red Orange Min. (nm) Max. (nm) A 611. 616. B 616. 62. Red Min. (nm) Max. (nm) Full Distribution Tolerance of each bin limit = ± 1 nm. Yellow Green Min. (nm) Max. (nm) E 564.5 567.5 F 567.5 57.5 G 57.5 573.5 H 573.5 576.5 12
Packaging Option (X 8 X 9 ) Option Test Current Package Type Reel Size J1 2 ma Top Mount 7 inch J4 2 ma Top Mount 13 inch H1 2 ma Reverse Mount 7 inch H4 2 ma Reverse Mount 13 inch J2 1 ma Top Mount 7 inch J5 1 ma Top Mount 13 inch H2 1 ma Reverse Mount 7 inch H5 1 ma Reverse Mount 13 inch L2 2 ma Top Mount 7 inch Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-2. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN535 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <4 C/9%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <3 C / 6%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - 1% is Not blue and 5% HIC indicator turns pink. - The LEDs are exposed to condition of >3 C / 6% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 6±5 C for 2 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 25-215 Avago Technologies. All rights reserved. Obsoletes AV1-4EN AV2-198EN - January 19, 215