Data Sheet. HSMx-C110/C170/C190/C191/C150 High Performance ChipLED

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HSMx-C11/C17/C19/C191/C15 High Performance ChipLED Data Sheet HSMA-C11/C17/C19/C191/C15 HSML-C11/C17/C19/C191/C15 HSMC-C11/C17/C19/C191/C15 HSMZ-C11/C17/C19 Description These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 65 nm Orange, 626/631 nm Red for. All packages are binned by both color and intensity, except for red color. These ChipLEDs come either in two top emitting packages (HSMx-C17/C19/C191/C15) or in a side emitting package (HSMx-C11). The right angle ChipLEDs are suitable for applications such as LCD backlighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4 units per reel for HSMx-C17/C19/C191 and 3 units per reel for HSMx-C11/C15. These packages are compatible with IR soldering process. Features High brightness AlInGaP material Small size Industry standard footprint Diffused optics Top emitting or right angle emitting Available in 3 colors (red, orange, amber) Compatible with IR soldering Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications LCD backlighting Push button backlighting Front panel indicator Symbol indicator Microdisplays Small message panel signage CAUTION: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMZ-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.1. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

Package Dimensions LED DIE 1. (.39) 1.25 (.49) 2.6 (.12 ) 3.2 (.126 ) 2. (.79 ) CLEAR EPOXY DIFFUSED EPOXY 1.4 (.55) 1.5 (.59).3 (.12) 1.6 (.63 ) 3.2 (.126 ) 3.2 (.126 ).5 (.2) LINE.4 ±.15 (.16 ±.6).8 (.31).3 (.12).4 ±.15 (.16 ±.6).9 (.35) 1. (.39) LINE HSMx-C11 HSMx-C17.8 (.31).8 (.31) 1.6 (.63 ) 1.6 (.63 ) 1. (.39) 1. (.39).3 (.12).3 (.12) DIFFUSED EPOXY DIFFUSED EPOXY LINE.8 (.31).3 (.12) LINE.6 (.23).3 (.12).3 ±.15 (.12 ±.6).3 ±.15 (.12 ±.6).3 ±.15 (.12 ±.6).3 ±.15 (.12 ±.6).7 (.28) MIN..7 (.28) MIN. HSMx-C19 HSMx-C191 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED 2

Package Dimensions, continued 1.6 (.63) 3.2 (.126 ) DIFFUSED EPOXY.6 (.24) 2. (.79) 1.1 (.43) LINE.5 ±.2 (.2 ±.8).5 (.2).5 ±.2 (.2 ±.8) HSMx-C15 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED Device Selection Guide Footprint Package (mm) [1,2] Amber Orange Red Red Description 1.6 x.8 x.8 HSMA-C19 HSML-C19 HSMC-C19 HSMZ-C19 Untinted, Diffused 2. x 1.25 x.8 HSMA-C17 HSML-C17 HSMC-C17 HSMZ-C17 Untinted, Diffused 3.2 x 1.5 x 1. HSMA-C11 HSML-C11 HSMC-C11 HSMZ-C11 Untinted, Non-diffused 1.6 x.8 x.6 HSMA-C191 HSML-C191 HSMC-C191 Untinted, Diffused 3.2 x 1.6 x 1.1 HSMA-C15 HSML-C15 HSMC-C15 Untinted, Diffused Notes: 1. Dimensions in mm. 2. Tolerance ±.1 mm unless otherwise noted. Absolute Maximum Ratings T A = 25 C Parameter HSMx-C1xx Units DC Forward Current [1,2] 25 ma Power Dissipation 6 mw Reverse Voltage (I R = 1 μa) 5 V LED Junction Temperature 95 C Operating Temperature Range 4 to +85 C Storage Temperature Range 4 to +85 C Soldering Temperature See reflow soldering profile (Figure 7 & 8) Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents above 5 ma are recommended for best long term performance. 3

Electrical Characteristics T A = 25 C Forward Voltage Reverse Breakdown Capacitance C Thermal V F (Volts) V R (Volts) (pf), V F =, Resistance @ I F = 2 ma @ I R = 1 μa f = 1 MHz R J-PIN = ( C/W) Parameter Number Typ. Max. Min. Typ. Typ. HSMA-C11 1.9 2.4 5 45 6 HSML-C11 1.9 2.4 5 45 6 HSMC-C11 1.9 2.4 5 45 6 HSMZ-C11 2.2 2.8 5 35 6 HSMA-C17/19/191/15 1.9 2.4 5 45 3 HSML-C17/19/191/15 1.9 2.4 5 45 3 HSMC-C17/19/191/15 1.9 2.4 5 45 3 HSMZ-C17/19 2.2 2.6 5 35 3 Optical Characteristics T A = 25 C Luminous Color, Viewing Luminous Intensity Peak Dominant Angle Efficacy I v (mcd) Wavelength Wavelength 2 1/2 v Part @ 2 ma [1] peak (nm) d [2] (nm) Degrees [3] (lm/w) Number Color Min. Typ. Typ. Typ. Typ. Typ. HSMA-C11 AS Amber 28.5 95 595 592 13 48 HSMA-C17/19/191/15 AS Amber 28.5 9 595 592 17 48 HSML-C11 AS Orange 28.5 95 69 65 13 37 HSML-C17/19/191/15 AS Orange 28.5 9 69 65 17 37 HSMC-C11 AS Red 28.5 95 637 626 13 155 HSMC-C17/19/191/15 AS Red 28.5 9 637 626 17 155 HSMZ-C11 AS Red 45 17 643 631 13 122 HSMZ-C17/19 AS Red 45 165 643 631 17 122 Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4

Color Bin Limits [1] Orange Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 597. 6. B 6. 63. C 63. 66. D 66. 69. E 69. 612. F 612. 615. Tolerance: ± 1 nm. Amber Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. A 582. 584.5 B 584.5 587. C 587. 589.5 D 589.5 592. E 592. 594.5 F 594.5 597. Tolerance: ± 1 nm. Red Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. - 62. 635. Tolerance: ±1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Light Intensity (Iv) Bin Limits [1] Intensity (mcd) Intensity (mcd) Bin ID Min. Max. Bin ID Min. Max. A.11.18 N 28.5 45. B.18.29 P 45. 71.5 C.29.45 Q 71.5 112.5 D.45.72 R 112.5 18. E.72 1.1 S 18. 285. F 1.1 1.8 T 285. 45. G 1.8 2.8 U 45. 715. H 2.8 4.5 V 715. 1125. J 4.5 7.2 W 1125. 18. K 7.2 11.2 X 18. 285. L 11.2 18. Y 285. 45. M 18. 28.5 Tolerance: ± 15%. Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits. 5

1. AMBER RED RELATIVE INTENSITY.5 ORANGE Red (HSMZ-Cxxx only) 5 55 6 65 7 75 Figure 1. Relative intensity vs. wavelength. I F FORWARD CURRENT ma 1 1 1 (HSMZ-Cxxx only).1 1.5 1.7 1.9 2.1 2.3 2.5 V F FORWARD VOLTAGE V Figure 2. Forward current vs. forward voltage. RELATIVE INTENSITY % RELATIVE INTENSITY % 1..9.8.7.6.5.4.3.2.1 1..9.8.7.6.5.4.3.2.1 WAVELENGTH nm LUMINOUS INTENSITY (NORMALIZED AT 2 ma) ANGLE Figure 5. Relative intensity vs. angle for HSMx-C11. 1.4 1.2 1..8.6.4.2 5 1 15 2 25 3 I F FORWARD CURRENT ma Figure 3. Luminous intensity vs. forward current. -9-8 -7-6 -5-4 -3-2 -1 1 2 3 4 5 6 7 8 9 ANGLE -9-8 -7-6 -5-4 -3-2 -1 1 2 3 4 5 6 7 8 9 I F MAX. MAXIMUM FORWARD CURRENT ma 3 25 2 15 1 5 HSMx-C11 HSMx-C15/17/ 199/191 2 4 6 8 1 T A AMBIENT TEMPERATURE C Figure 4. Maximum forward current vs. ambient temperature. 6

RELATIVE INTENSITY % 1..9.8.7.6.5.4.3.2.1-9 -8-7 -6-5 -4-3 -2-1 1 2 3 4 5 6 7 8 9 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C17, C19, C191, and C15. TEMPERATURE 14-16 C 4 C/SEC. MAX. OVER 2 MIN. 1 SEC. MAX. 23 C MAX. 4 C/SEC. MAX. 3 C/SEC. TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6-12 SEC. 1 SEC. MAX. 6 C/SEC. MAX. 6 SEC. MAX. TIME TIME Figure 7. Recommended reflow soldering profile. Figure 8. Recommended Pb-free reflow soldering profile. 5. (.2).9 (.35).9 (.35) 1. (.39) 1.2 (.47).2 (.8) 1.5 (.59) 2. (.79) 1.5 (.59) CENTERING BOARD 1.2 (.47).9 (.35) 1.2 (.47) Figure 9. Recommended soldering pattern for HSMx-C11. Figure 1. Recommended soldering pattern for HSMx-C17..8 (.31) 1.5 (.59).8 (.31).7 (.28).8 (.31) 1.5 (.59) 2. (.79) 1.5 (.59) Figure 11. Recommended soldering pattern for HSMx-C19 and C191. Figure 12. Recommended soldering pattern for HSMx-C15. Note: All dimensions in millimeters (inches). 7

USER FEED DIRECTION SIDE PRINTED LABEL Figure 13. Reeling orientation. 8. ± 1. (.315 ±.39) Ø 13.1 ±.5 (Ø.516 ±.2) 1.5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) 178.4 ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) Figure 14. Reel dimensions. Note: All dimensions in millimeters (inches). 8

4. (.157) 1.5 (.59) DIM. C.2 ±.5 (.8 ±.2) 1.75 (.69) DIM. A 3.5 ±.5 (.138 ±.2) 8. ±.3 (.315 ±.12) DIM. B 2. ±.5 (.79 ±.2) HSMx-C11 POSITION IN CARRIER TAPE DIM. A 4. (.157) PART NUMBER USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ±.1 (±.4) DIM. B ±.1 (±.4) COVER TAPE CARRIER TAPE DIM. C ±.1 (±.4) HSMx-C191 SERIES 1.85 (.73).88 (.35).85 (.33) HSMx-C19 SERIES 1.75 (.69).9 (.35).9 (.35) HSMx-C17 SERIES 2.3 (.91) 1.45 (.57).95 (.37) HSMx-C11 SERIES 3.4 (.134) 1.7 (.67) 1.2 (.47) HSMx-C15 SERIES 3.5 (.138) 1.88 (.74) 1.27 (.5) DIM. B Figure 15. Tape dimensions. R 1. ±.5 (.39 ±.2) END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 16, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS Figure 16. Tape leader and trailer dimensions. THERE SHALL BE A MINIMUM OF 16 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ±.1 mm (±.4 IN.) UNLESS OTHERWISE SPECIFIED. MINIMUM OF 23 mm (9.5 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 3 C @ 6% RH max. Baking is required under the condition: a) Humidity Indicator Card is >1% when read at 23±5 C. b) Device exposed to factory conditions <3 C/6% RH more than 672 hours. Baking recommended condition: 6 +/ 5 C for 2 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 25-21 Avago Technologies. All rights reserved. Obsoletes 5989-364EN AV2-112EN - September 29, 21